General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
© IRC Wirewound and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
• 1/2 watt in 1/8 watt package
• 1 watt in 1/2 watt package (2010 footprint)
• MRC1/2: 0.05 Ω to 1.0 Ω
(contact factory for higher values)
• 150°C maximum operating temperature
• Superior surge handling capability
MRC Series
Metal Glaze™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
Environmental Data
Metal Glaze™ High Power
Density Surface Mount
Power Resistor
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on
a 2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due
to high power density and superior surge handling capability, it is also recommended as a direct replacement on
existing board designs where standard 1206 and 2010 resistors are marginal or failing.
Characteristics Maximum Change Test Method
Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock ±(0.5% + 0.01Ω)MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation ±(0.25% + 0.01Ω)MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±(1.0% + 0.01Ω)MIL-R-55342E Par 4.7.5
2.5 x PxR for 5 seconds
High Temperature Exposure ±(0.5% + 0.01Ω)MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±(0.25% + 0.01Ω)MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±(0.5% + 0.01Ω)MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±(1.0% + 0.01Ω)MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±(1% + 0.01Ω)
no mechanical damage
1200 gram push from underside of mounted chip
for 60 seconds
Resistance to Board Bending ±(1% + 0.01Ω)
no mechanical damage
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
√
Size
Code1
Industry
Footprint
IRC
Type
Max.
Power Rating
Working
Voltage2
Max.
Voltage
Resistance
Range (ohms)3
Tolerance
(±%)3
TCR
(ppm/°C)3
Product
Catagory
C1206 MRC1/2 1/2W @ 70°C 200 400
0.1 to 0.99 1,2,5 100 Low Range
1.0 to 10K 1,2,5 50,100 Standard
20 to 10K 0.25, 0.5 50,100 Tight Tolerance
E2010 MRC1 1W @ 70°C 350 700
0.05 to 0.099 2,5 200 Low Range
0.10 to 1.0 1,2,5 100 Low Range
Environmental Data
MRC Series Issue June 2008 Sheet 1 of 2