www.ti.com
FEATURES
SN74LVC138A . . . RGY PACKAGE
(TOP VIEW)
1 16
8 9
2
3
4
5
6
7
15
14
13
12
11
10
Y0
Y1
Y2
Y3
Y4
Y5
B
C
G2A
G2B
G1
Y7
A
Y6 V
GND
CC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A
B
C
G2A
G2B
G1
Y7
GND
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
SN54LVC138A . . . J OR W PACKAGE
SN74LVC138A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
Y1
Y2
NC
Y3
Y4
C
G2A
NC
G2B
G1
B
A
NC
Y6
Y5 V
Y0
Y7
GND
NC
SN54LVC138A . . . FK PACKAGE
(TOP VIEW)
CC
NC - No internal connection
DESCRIPTION/ORDERING INFORMATION
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
•Operate From 1.65 V to 3.6 V •Latch-Up Performance Exceeds 250 mA PerJESD 17•Inputs Accept Voltages to 5.5 V
•ESD Protection Exceeds JESD 22•Max t
pd
of 5.8 ns at 3.3 V
– 2000-V Human-Body Model (A114-A)•Typical V
OLP
(Output Ground Bounce)< 0.8 V at V
CC
= 3.3 V, T
A
= 25 °C – 200-V Machine Model (A115-A)•Typical V
OHV
(Output V
OH
Undershoot) – 1000-V Charged-Device Model (C101)> 2 V at V
CC
= 3.3 V, T
A
= 25 °CBRK
BRK
The SN54LVC138A 3-line to 8-line decoder/demultiplexer is designed for 2.7-V to 3.6-V V
CC
operation, and theSN74LVC138A 3-line to 8-line decoder/demultiplexer is designed for 1.65-V to 3.6-V V
CC
operation.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 SN74LVC138ARGYR LC138ATube of 40 SN74LVC138ADSOIC – D Reel of 2500 SN74LVC138ADR LVC138AReel of 250 SN74LVC138ADTSOP – NS Reel of 2000 SN74LVC138ANSR LVC138ASSOP – DB Reel of 2000 SN74LVC138ADBR LC138A–40 °C to 85 °C
Tube of 90 SN74LVC138APWTSSOP – PW Reel of 2000 SN74LVC138APWR LC138AReel of 250 SN74LVC138APWTTVSOP – DGV Reel of 2000 SN74LVC138ADGVR LC138AVFBGA – GQN SN74LVC138AGQNR
Reel of 1000 LC138AVFBGA – ZQN (Pb-free) SN74LVC138AZQNRCDIP – J Tube of 25 SNJ54LVC138AJ SNJ54LVC138AJ–55 °C to 125 °C CFP – W Tube of 150 SNJ54LVC138AW SNJ54LVC138AWLCCC – FK Tube of 55 SNJ54LVC138AFK SNJ54LVC138AFK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1993–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas
On products compliant to MIL-PRF-38535, all parameters areInstruments standard warranty. Production processing does not
tested unless otherwise noted. On all other products, productionnecessarily include testing of all parameters.
processing does not necessarily include testing of all parameters.
www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
GQN OR ZQN PACKAGE
(TOP VIEW)
1 2 3 4
A
B
C
D
E
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
The 'LVC138A devices are designed for high-performance memory-decoding or data-routing applicationsrequiring very short propagation delay times. In high-performance memory systems, these decoders minimize theeffects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, delay timesof these decoders and the enable time of the memory usually are less than the typical access time of thememory. This means that the effective system delay introduced by the decoders is negligible.
The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Twoactive-low enable inputs and one active-high enable input reduce the need for external gates or inverters whenexpanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires onlyone inverter. An enable input can be used as a data input for demultiplexing applications.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translatorsin a mixed 3.3-V/5-V system environment.
TERMINAL ASSIGNMENTS
1 2 3 4
AB A V
CC
Y0
BC NC
(1)
NC
(1)
Y1
CG2B G2A Y3 Y2
DG1 NC
(1)
NC
(1)
Y4
EGND Y7 Y6 Y5
(1) NC - No internal connectionSDFGDFGDFG
FUNCTION TABLE
ENABLE INPUTS SELECT INPUTS OUTPUTS
G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X H X X X X H H H H H H H HX X H X X X H H H H H H H HL X X X X X H H H H H H H HH L L L L L L H H H H H H HH L L L L H H L H H H H H HH L L L H L H H L H H H H HH L L L H H H H H L H H H HH L L H L L H H H H L H H HH L L H L H H H H H H L H HH L L H H L H H H H H H L HHLLHHHHHHHHHHL
2
www.ti.com
G2B
G2A
G1
C
B
A
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Data
Outputs
Select
Inputs
Enable
Inputs
1
2
3
6
4
5
15
14
13
12
11
10
9
7
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
3
www.ti.com
Absolute Maximum Ratings
(1)
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Output voltage range
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mAD package
(4)
73DB package
(4)
82DGV package
(4)
120θ
JA
Package thermal impedance GQN/ZQN package
(4)
78 °C/WNS package
(4)
64PW package
(4)
108RGY package
(5)
39T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.
4
www.ti.com
Recommended Operating Conditions
(1)
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
SN54LVC138A SN74LVC138A
UNITMIN MAX MIN MAX
Operating 2 3.6 1.65 3.6V
CC
Supply voltage VData retention only 1.5 1.5V
CC
= 1.65 V to 1.95 V 0.65 ×V
CC
V
IH
High-level input voltage V
CC
= 2.3 V to 2.7 V 1.7 VV
CC
= 2.7 V to 3.6 V 2 2V
CC
= 1.65 V to 1.95 V 0.35 ×V
CC
V
IL
Low-level input voltage V
CC
= 2.3 V to 2.7 V 0.7 VV
CC
= 2.7 V to 3.6 V 0.8 0.8V
I
Input voltage 0 5.5 0 5.5 VV
O
Output voltage 0 V
CC
0 V
CC
VV
CC
= 1.65 V –4V
CC
= 2.3 V –8I
OH
High-level output current mAV
CC
= 2.7 V –12 –12V
CC
= 3 V –24 –24V
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current mAV
CC
= 2.7 V 12 12V
CC
= 3 V 24 24∆t/ ∆v Input transition rise or fall rate 10 10 ns/VT
A
Operating free-air temperature –55 125 -40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5
www.ti.com
Electrical Characteristics
Switching Characteristics
Switching Characteristics
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
over recommended operating free-air temperature range (unless otherwise noted)
SN54LVC138A SN74LVC138APARAMETER TEST CONDITIONS V
CC
UNITMIN TYP
(1)
MAX MIN TYP
(1)
MAX
1.65 V to 3.6 V V
CC
– 0.2I
OH
= –100 µA
2.7 V to 3.6 V V
CC
– 0.2I
OH
= –4 mA 1.65 V 1.2V
OH
I
OH
= –8 mA 2.3 V 1.7 V2.7 V 2.2 2.2I
OH
= –12 mA
3 V 2.4 2.4I
OH
= –24 mA 3 V 2.2 2.21.65 V to 3.6 V 0.2I
OL
= 100 µA
2.7 V to 3.6 V 0.2I
OL
= 4 mA 1.65 V 0.45V
OL
VI
OL
= 8 mA 2.3 V 0.7I
OL
= 12 mA 2.7 V 0.4 0.4I
OL
= 24 mA 3 V 0.55 0.55I
I
V
I
= 5.5 V or GND 3.6 V ±5±5µAI
CC
V
I
= V
CC
or GND, I
O
= 0 3.6 V 10 10 µAOne input at V
CC
– 0.6 V,∆I
CC
2.7 V to 3.6 V 500 500 µAOther inputs at V
CC
or GNDC
i
V
I
= V
CC
or GND 3.3 V 5 5 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25 °C.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
SN54LVC138A
FROM TO V
CC
= 3.3 VPARAMETER V
CC
= 2.7 V UNIT(INPUT) (OUTPUT) ±0.3 V
MIN MAX MIN MAX
A or B or C 7.9 1 6.7t
pd
G2A or G2B Y 7.4 1 6.5 nsG1 6.4 1 5.8
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
SN74LVC138A
FROM TO V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 VPARAMETER V
CC
= 2.7 V UNIT(INPUT) (OUTPUT) ±0.15 V ±0.2 V ±0.3 V
MIN MAX MIN MAX MIN MAX MIN MAX
A or B or C 1 22 1 9.9 1 7.9 1 6.7t
pd
G2A or G2B Y 1 21 1 9.4 1 7.4 1 6.5 nsG1 1 20.3 1 8.4 1 6.4 1 5.8t
sk(o)
1 ns
6
www.ti.com
Operating Characteristics
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
T
A
= 25 °C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 VTESTPARAMETER UNITCONDITIONS
TYP TYP TYP
C
pd
Power dissipation capacitance f = 10 MHz 25 26 27 pF
7
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE W AVEFORMS
SETUP AND HOLD TIMES
VOLTAGE W AVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE W AVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VOH − V∆≈0 V
VI
VOLTAGE W AVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
6 V
6 V
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
2.7 V
2.7 V
VI
VCC/2
VCC/2
1.5 V
1.5 V
VM
tr/tf
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
INPUTS
SN54LVC138A, SN74LVC138A3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCAS291T – MARCH 1993 – REVISED JULY 2005
Figure 1. Load Circuit and Voltage Waveforms
8
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9752601Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9752601QEA ACTIVE CDIP J 16 1 TBD Call TI Call TI
5962-9752601QFA ACTIVE CFP W 16 1 TBD Call TI Call TI
5962-9752601V2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9752601VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
5962-9752601VFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN74LVC138AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
SN74LVC138ADBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC138ADTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ADTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138AGQNR LIFEBUY BGA
MICROSTAR
JUNIOR
GQN 20 1000 TBD SNPB Level-1-240C-UNLIM
SN74LVC138ANSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
SN74LVC138APWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138APWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC138ARGYR ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC138ARGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC138AZQNR ACTIVE BGA
MICROSTAR
JUNIOR
ZQN 20 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
SNJ54LVC138AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LVC138AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LVC138AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LVC138A, SN54LVC138A-SP, SN74LVC138A :
•Catalog: SN74LVC138A, SN54LVC138A
•Automotive: SN74LVC138A-Q1, SN74LVC138A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 4
•Enhanced Product: SN74LVC138A-EP, SN74LVC138A-EP
•Military: SN54LVC138A
•Space: SN54LVC138A-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC138ADBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LVC138ADGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LVC138ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LVC138AGQNR BGA MI
CROSTA
R JUNI
OR
GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1
SN74LVC138ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LVC138APWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC138APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC138APWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC138APWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC138ARGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
SN74LVC138AZQNR BGA MI
CROSTA
R JUNI
OR
ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC138ADBR SSOP DB 16 2000 367.0 367.0 38.0
SN74LVC138ADGVR TVSOP DGV 16 2000 367.0 367.0 35.0
SN74LVC138ADR SOIC D 16 2500 333.2 345.9 28.6
SN74LVC138AGQNR BGA MICROSTAR
JUNIOR GQN 20 1000 340.5 338.1 20.6
SN74LVC138ANSR SO NS 16 2000 367.0 367.0 38.0
SN74LVC138APWR TSSOP PW 16 2000 364.0 364.0 27.0
SN74LVC138APWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74LVC138APWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
SN74LVC138APWT TSSOP PW 16 250 367.0 367.0 35.0
SN74LVC138ARGYR VQFN RGY 16 3000 367.0 367.0 35.0
SN74LVC138AZQNR BGA MICROSTAR
JUNIOR ZQN 20 1000 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
