THIN FILM CHIP RESISTORS
68 Series 0.020”x0.020”
Spectrum Microwave 68 Series 0.020” x 0.020” Thin-film Chip Resistors are available in both
top-contact and back-contact versions in several resistances and tolerances. Values are available
from 1 ohm to 500 Kohms. Both passivated nichrome and tantalum-nitride resistor versions are
available. Nichrome provides excellent stability and temperature coefficient in hermetic applications
while tantalum-nitride provides superior moisture-resistance for non-hermetic applications.
Spectrum Microwave
Tel: 508-485-6350 Fax : 508-485-5168
165 Cedar Hill Street, Marlborough, Ma 01752
www.SpectrumMicrowave.com
Electrical Specifications
Parameter Limit Test conditions
Power Rating 100 mW (derated at 70° to 0 mW @ 150°)
Life ±0.2% max 1000 hours @ 125° C
Noise -35 dB typ MIL-STD-202 method 308
High Temp Exposure ±0.2% max 100 hours at 150° C
TCR (68AL, 68BCN) ±50 ppm/°C -55° to 125° C
TCR (68ALT, 68BCR) -50 to -120 ppm/°C -55° to 125° C
Operating voltage 100 VDC max
Moisture resistance ±0.5% max MIL-STD-202 method 106
Thermal shock ±0.5% max MIL-STD-202 method 107
Values from 20 to 200 ohmsValues below 20 oh ms Values above 200 ohms
Mechanical Specifications
Substrate Silicon with 1 micron thermal oxide
Bond pad metalization Gold, 100 microinches
Size 0.021 x .021 ±0.002 (0.53 x 0.53 mm ±0.05 mm)
Thickness 0.013 ±0.003 (0.33 ±0.07 mm)
Bond pad dimensions 0.004 x .004 minimum (0.1 x 0.1 mm)
Protective overcoat (passivation) 0.6 microns SiO2 (68AL & 68BCN versions only)
Back side Lapped silicon (68AL, 68ALT), Gold (68BCN, 68BCR)
Typical Configurations
On back--Contact versions, pad without bevel is connected to back side. 0.005
0.020