SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 D D D D D D D D D D Members of the Texas Instruments Widebus Family State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Dissipation ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015 Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25C High-Impedance State During Power Up and Power Down Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout High-Drive Outputs (-32-mA IOH, 64-mA IOL) Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings SN54ABT16374A . . . WD PACKAGE SN74ABT16374A . . . DGG OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE description The 'ABT16374A are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1CLK 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2CLK These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT16374A is characterized for operation over the full military temperature range of -55C to 125C. The SN74ABT16374A is characterized for operation from -40C to 85C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus and EPIC-B are trademarks of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L H H L L L L H or L X Q0 H X X Z logic symbol 1OE 1CLK 2OE 2CLK 1D1 1D2 1D3 1D4 1D5 1D6 1D7 1D8 2D1 2D2 2D3 2D4 2D5 2D6 2D7 2D8 1 1EN 48 C1 24 2EN 25 C2 47 1D 2 1 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 13 2D 2 35 14 33 16 32 17 30 19 29 20 27 22 26 23 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 1Q8 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 2Q8 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE 1CLK 1D1 1 2OE 48 47 2CLK C1 2 1D 1Q1 24 25 C1 2D1 36 To Seven Other Channels To Seven Other Channels 2 POST OFFICE BOX 655303 1D * DALLAS, TEXAS 75265 13 2Q1 SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . -0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT16374A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT16374A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51. recommended operating conditions (see Note 3) SN54ABT16374A MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current t/v Input transition rise or fall rate t/VCC TA Power-up ramp rate 200 Operating free-air temperature -55 High-level input voltage SN74ABT16374A MIN 2 2 0.8 Input voltage 0 Low-level output current Outputs enabled VCC -24 V V 0.8 0 UNIT VCC -32 V V mA 48 64 mA 10 10 ns/V s/V 200 125 -40 85 C NOTE 3: Unused inputs must be held high or low to prevent them from floating. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = -18 mA IOH = -3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V Vhys II MIN TA = 25C TYP MAX SN54ABT16374A MIN -1.2 MAX SN74ABT16374A MIN -1.2 MAX -1.2 2.5 2.5 2.5 IOH = -3 mA IOH = -24 mA 3 3 3 2 2 IOH = -32 mA IOL = 48 mA 2* V V 2 0.55 IOL = 64 mA 0.55 0.55* 0.55 100 VCC = 0 to 5.5 V, VI = VCC or GND VCC = 0 to 2.1 V, VO = 0.5 to 2.7 V, OE = X IOZPU UNIT V mV 1 1 1 A 50 50 50 A 50 50 50 A IOZPD VCC = 2.1 V to 0, VO = 0.5 to 2.7 V, OE = X IOZH VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE 2 V 10 10 10 A IOZL VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE 2 V -10 -10 -10 A 100 A 50 A -180 mA Ioff ICEX IO Outputs high VCC = 0, VCC = 5.5 V, VI or VO 4.5 V VO = 5.5 V VCC = 5.5 V, VO = 2.5 V 100 50 -50 -100 -180 Outputs high ICC Outputs low Outputs disabled VCC = 5.5 V, IO = 0, VI = VCC or GND ICC VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Ci VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V Co 50 -50 -180 -50 2 2 2 72 72 72 2 2 2 1.5 1.5 1.5 mA mA 3.5 pF 9.5 pF * On products compliant to MIL-PRF-38535, this parameter does not apply. All typical values are at VCC = 5 V. This parameter is characterized, but not production tested. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) VCC = 5 V, TA = 25C# MIN MAX 0 150 MIN MAX 0 150 SN74ABT16374A MIN MAX 0 150 UNIT fclock tw Clock frequency Pulse duration, CLK high or low 3.3 3.3 3.3 ns tsu th Setup time, data before CLK 1.1 1.3 1.1 ns Hold time, data after CLK 1.3 1.5 1.3 ns # These values apply only to the SN74ABT16374A. 4 SN54ABT16374A POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MHz SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABT16374A PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25C MIN fmax tPLH tPHL tPZH tPZL tPHZ tPLZ MIN TYP MAX 1.8 4.3 5.7 1.5 6.9 2.7 4.7 6.1 2.2 6.9 1.2 3.4 4.8 0.8 6.1 1.6 3.5 4.9 1.2 5.5 2.2 5.5 8.6 1.8 9.6 2.2 4.3 6.2 1.8 7.2 150 CLK Q OE Q OE Q MAX 150 UNIT MHz ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN74ABT16374A PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25C MIN fmax tPLH tPHL tPZH tPZL tPHZ tPLZ TYP MIN Q OE Q OE Q POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT MAX 150 CLK MAX 150 MHz 1.8 4.3 5.4 1.8 6.2 2.7 4.7 5.6 2.7 5.9 1.2 3.4 4.8 1.2 5.6 1.6 3.5 4.7 1.6 5.3 2.2 5.5 7.1 2.2 8.2 2.2 4.3 5.8 2.2 6.6 ns ns ns 5 SN54ABT16374A, SN74ABT16374A 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS205C - MARCH 1993 - REVISED MAY 1997 PARAMETER MEASUREMENT INFORMATION 7V S1 500 From Output Under Test Open GND CL = 50 pF (see Note A) 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open LOAD CIRCUIT 3V Timing Input 1.5 V 0V tw tsu 3V Input 1.5 V 1.5 V th 3V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH Output 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL 1.5 V tPZL tPHL tPLH 3V Output Control Output Waveform 2 S1 at Open (see Note B) 1.5 V tPZH 3.5 V VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish Call TI MSL Peak Temp Samples (Requires Login) 5962-9320101MXA ACTIVE CFP WD 48 1 TBD 74ABT16374ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABT16374ADGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16374ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16374ADL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16374ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16374ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16374ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ABT16374AWD ACTIVE CFP WD 48 1 TBD A42 (3) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ABT16374A, SN74ABT16374A : * Catalog: SN74ABT16374A * Military: SN54ABT16374A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT16374ADGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN74ABT16374ADLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT16374ADGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74ABT16374ADLR SSOP DL 48 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MCFP010B - JANUARY 1995 - REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated