W83L761G
WINBOND
H/W MONITORING IC
W83L761G Preliminary
Publication Release Date: April 18, 2005
- I - Revision 1.0
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 1
2. FEATURES ................................................................................................................................. 1
3. KEY SPECIFICATIONS ..............................................................................................................2
4. BLOCK DIAGRAM ...................................................................................................................... 2
5. PIN CONFIGURATION ...............................................................................................................3
6. PIN DESCRIPTION..................................................................................................................... 3
7. FUNCTIONAL DESCRIPTION.................................................................................................... 4
7.1 General Description ........................................................................................................... 4
7.2 Access Interface ................................................................................................................4
7.3 Temperature Measurement Machine ................................................................................ 5
8. CONTROL AND STATUS REGISTER ....................................................................................... 6
8.1 Configuration Register (Write Only)................................................................................... 6
8.2 Temperature Register Return Format (Read at Normal Mode, Read Only) ..................... 6
8.3 Manufacturer’s / Device ID Register Return Format (Read at Power-Down Mode, Read Only) .. 6
9. ELECTRICAL CHARACTERISTIC ............................................................................................. 7
9.1 Absolute Maximum Ratings............................................................................................... 7
9.2 DC Characteristics............................................................................................................. 7
9.3 AC Characteristics ............................................................................................................. 7
10. THE TOP MARKING................................................................................................................... 9
11. PACKAGE SPECIFICATION .................................................................................................... 10
12. APPLICATION CIRCUITS ........................................................................................................ 11
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 1 - Revision 1.0
1. GENERAL DESCRIPTION
W83L761G is a hardware monitoring IC with high temperature accuracy, low-power consumption, and
SPI (Serial Peripheral Interface) interface. W83L761G has an on-chip thermal sensor and an 8–bits
ADC (Analog to Digital Converter) to convert the monitored temperature values. The temperature
resolution and accuracy is 0.5 °C and ±3 °C, respectively, and the operation temperature is from -20°C
to + 120°C.
W83L761G is available in SOT23-5 package. The working voltage ranges from 3V to 5.5V. Small
package dimension, 2.9mm × 2.8mm (including the pin length), low power consumption and simple
SPI interface make W83L761G easy to use in every application filed.
2. FEATURES
Monitoring Items - Temperature
• Measure the temperature with high accuracy.
• One on-chip thermal sensor.
General
• Interface: SPI control.
• 3V~5.5V VCC operation.
Package
• 5-pin SOT-23-5.
• Dimension: 2.9mm × 2.8mm.
W83L761G Preliminary
- 2 -
3. KEY SPECIFICATIONS
Monitoring temperature range and accuracy:
-20 °C ~ +120 °C ± 3°C(@70°C)
Supply voltage 3V~5.5V
Operating supply current 3V: 2 mA typ.
5V: 2.8 mA typ.
Power down supply current 3V: 300 uA typ.
5V: 900 uA typ.
ADC resolution 8 Bits
4. BLOCK DIAGRAM
Serial Peripheral Interface
Control Logic Temperature
Register
8-Bit ADC
GND
Vcc
W83L761G
SI/O
SC
CS#
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 3 - Revision 1.0
5. PIN CONFIGURATION
761G
54
123
Vcc SC
CS# GND SI/O
6. PIN DESCRIPTION
I/O12ts TTL level and schmitt trigger with 12 mA source-sink capability
INts TTL level input pin and schmitt trigger
PIN NAME NO PIN TYPE DESCRIPTION
CS# 1 IN
ts Chip select input from Controller.
GND 2 - System ground.
SI/O 3 I/O
12ts Slave input/output – Serial bus bidirectional data line – from and
to Controller.
SC 4 IN
ts Slave clock from controller.
VCC 5 Power
3.0V ~ 5.5 V power supply. Bypass with 0.1 µF ceramic
capacitors.
W83L761G Preliminary
- 4 -
7. FUNCTIONAL DESCRIPTION
7.1 General Description
W83L761G is a hardware monitoring IC with high temperature accuracy. W83L761G will be accessed
by SPI (Serial Peripheral Interface) interface. An 8-bit analog-to-digital converter (ADC) is built inside
W83L761G for monitored temperature converting. Shutdown mode is enabled by writing XXFF to
W83L761G, and will always output 800Fh.
7.2 Access Interface
W83L761G acts as a slave device on SPI compatible bus. CS# acts as the trigger of the W83L761G.
W83L761G would not response to the serial interface bus unless CS# acts low. SC is the serial clock
issued by the host. The data is received at the rising edge of the SC, and transmitted at the falling
edge of the SC.
There are three kinds of access types. Figure 1 shows the first access type, continuous reading 8-bit
frame from 761G. Here, “continuous” means the CS# does not de-asserted while reading out data. At
the end of last bit, host must output high on CS# to terminate the cycle. This access type is used to
readout W83L761G 8-bit temperature.
Figure 1 Continuous Reading 8 bit frame
The second access type is continuous reading 16-bit frame from W83L761G, and is illustrated in
figure 2. After first byte readout, host will not de-assert CS#, but will continue to send SC until next
byte is read out and then de-assert CS#.
Figure 2 Continuous Reading 16 bit frame
18
SC
#CS
SO
SI/O
181 8
SC
#CS
SO
Driver Tri-state
SI/O
SC
#CS
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 5 - Revision 1.0
The last access type, used for host to issue shut-down command, is shown in figure 3. After reading 2
bytes temperature from W83L761G, host continues to send clock and 2 more bytes command. During
all 4 bytes, the CS# never de-asserts.
Figure 3 Shutdown Control
7.3 Temperature Measurement Machine
W83L761G temperature data format is 8-bit/10-bit complement. The 8-bit/10-bit temperature data can
be obtained by reading the temperature register return format (section 8.2). The format of temperature
data is shown in Table 1.
8-BIT DIGITAL OUTPUT 10-BIT DIGITAL OUTPUT
TEMPERATURE
8-BIT BINARY 8-BIT HEX 10-BIT BINARY 10-BIT HEX
+125°C 0011,1110 3Eh 00,1111,1010 0FAh
+25°C 0000,1100 0Ch 00,0011,0010 032h
+1°C 0000,0000 00h 00,0000,0010 002h
+0.5°C - - 00,0000,0001 001h
+0°C 0000,0000 00h 00,0000,0000 000h
-0.5°C - - 11,1111,1111 3FFh
-1°C 1111,1111 FFh 11,1111,1110 3FFh
-25°C 1111,0011 F3h 11,1100,1110 3CEh
-55°C 1110,0100 E4h 11,1001,0010 392h
Table 1
Tem
p
erature readout from 761G Host writes in commands
SC
#CS
SO
SI/O
#CS
SC
W83L761G Preliminary
- 6 -
8. CONTROL AND STATUS REGISTER
8.1 Configuration Register (Write Only)
(Selects shutdown or continuous conversion mode)
D15 D14 D13 D12 D11 D10 D9 D8
X X X X X X X X
D7 D6 D5 D4 D3 D2 D1 D0
Command
D15-D0 set to XX FF hexes enables shutdown mode.
D15-D0 set to XX 00 hexes enables continuous conversion mode.
Note: Setting D15-D0 to any other values may place the W83L761G into a manufacturer’s test mode. These test modes are
used for Winbond production testing only.
8.2 Temperature Register Return Format (Read at Normal Mode, Read Only)
D15 D14 D13 D12 D11 D10 D9 D8
MSB Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2
D7 D6 D5 D4 D3 D2 D1 D0
Bit1 Bit0 0 0 0 0 1 1
D15-D6: Temperature data. One LSB=0.5 ºC. Two`s complement format
D5-D2: Logic 0 will be output on SI/O.
D1-D0: Logic 1 will be output on SI/O.
8.3 Manufacturer’s / Device ID Register Return Format (Read at Power-Down
Mode, Read Only)
D15 D14 D13 D12 D11 D10 D9 D8
1 0 0 0 0 0 0 0
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 1 1 1 1
D15-D2: Manufacturer’s / Device ID data. This register accessed whenever the W83L761G is in shutdown mode.
D1-D0: Logic 1 will be output on SI/O.
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 7 - Revision 1.0
9. ELECTRICAL CHARACTERISTIC
9.1 Absolute Maximum Ratings
PARAMETER RATING UNIT
Power Supply Voltage -0.5 to 7.0 V
Input Voltage 3 to 5.5 V
Operating Temperature -20 to + 125 ° C
Storage Temperature -50 to +150 ° C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
9.2 DC Characteristics
(Ta = 0° C to 70° C, VDD = 3.3V ± 10%, VSS = 0V)
PARAMETER SYM. MIN. TYP. MAX. UNIT CONDITIONS
I/O12ts – TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level
input
Input Low Threshold Voltage Vt- 0.5 0.8 1.1 V VDD = 3.3 V
Input High Threshold Voltage Vt+ 1.6 2.0 2.4 V VDD = 3.3 V
Hysteresis VTH 0.5 1.2 V VDD = 3.3 V
Output Low Voltage VOL 0.4 V IOL = 12 mA
Output High Voltage VOH 2.4 V IOH = - 12 mA
Input High Leakage ILIH +10 µA VIN = VDD
Input Low Leakage ILIL -10 µA VIN = 0V
INts - TTL level Schmitt-triggered input pin
Input Low Threshold Voltage Vt- 0.5 0.8 1.1 V VDD = 3.3 V
Input High Threshold Voltage Vt+ 1.6 2.0 2.4 V VDD = 3.3 V
Hysteresis VTH 0.5 1.2 V VDD = 3.3 V
Input High Leakage ILIH +10 µA VIN = VDD
Input Low Leakage ILIL -10 µA VIN = 0 V
9.3 AC Characteristics
PARAMETER SYMBOL TYP. UNITS
SC (Clock) Period T1 0.16 µs
CS# to SC (Clock) High Set-Up Time T2 100 ns
CS# to Data Out (SO) Delay T3 70 ns
SC (Clock) Low to Data Out (SO) Delay T4 70 ns
CS# High to Data Out (SO) TRI-STATE T5 200 ns
SC and SI/O Rise Time TR 10 ns
SC and SI/O Fall Time TF 10 ns
W83L761G Preliminary
- 8 -
SC
#CS
t5
SO
SC
#CS
t5
SO
SC (Clock) High to Data in (SI) Hold Time T6 50 ns
Data In (SI) Set-Up Time to SC (Clock) High T7 30 ns
SC
CS#
SO
T3
T4
T1
T4 TR TF
T2
Data Output Timing Diagram
TRI-STATE Data Output Timing Diagram
T5 T5
SC
t7
#CS t6
SO
SC
t7
#CS t6
SO
T7
T7
T6 T6
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 9 - Revision 1.0
Data Input Timing Diagram
10. THE TOP MARKING
The top marking of W83L761G
W83L761G
443OB
2826978Y-61
Left: Winbond logo
1st line: Winbond logo and the type number: W83L761G
2nd line: Tracking code 2 826978Y-61
3rd line: Tracking code 443 O B
443: packages made in '04, week 43
O: assembly house ID; A means ASE, S means SPIL, O means OSE
B: IC revision
W83L761G Preliminary
- 10 -
11. PACKAGE SPECIFICATION
SOT23-5
L1
L
H
e
D
E
e1
b
Y
E
W83L761G Preliminary
Publication Release Date: April 18, 2005
- 11 - Revision 1.0
12. APPLICATION CIRCUITS
C1
0.1u
C1
0.1u
R1 10k
®
W83761 Application Circuit 0.2
Winbond Hardware
A
1 1Monday, November 24,
Title
Size Document Rev
Date: Sheet of
168
Intel
GPI/O
RXD
TXD
G
ND
68HC11 Micro
GPI/O1
GPI/O2
MISO
SC
G
ND
5V
W83761
1
3
4
5
2
/CS
SI/O
SC
V+
GND
W83761
1
3
4
5
2
/CS
SI/O
SC
V+
GND
5V
W83L761G Preliminary
- 12 -
REVISION HISTORY
VERSION DATE PAGE DESCRIPTION
1.0 April 18, 2005 12 ADD Important Notice
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (H.K.) Ltd.
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
FAX: 852-27552064
Unit 9-15, 22F, Millennium City,
TEL: 852-27513100
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Winbond Electronics (Shanghai) Ltd.
200336 China
FAX: 86-21-62365998
27F, 2299 Yan An W. Rd. Shanghai,
TEL: 86-21-62365999
Winbond Electronics Corporation Japan
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
FAX: 81-45-4781800
7F Daini-ueno BLDG, 3-7-18
TEL: 81-45-4781881
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
