TF(X)
r/c
filter
netw
orks
features
•
Thin
film
construction
•
Surface
mount
package
•
Stable
resistor
technology
•
High
component
density
•
Products
with
lead-free
terminations
meet
EU
RoHS
and
China
RoHS
requirements
For
further
information
on
packaging,
please
refer
to
Appendix
A.
dimensions
and
construction
w
L
p
Lead
Die
Pad
Molded
Resin
Bonding
Wire
Si
W
afer
a
c
W
H
applications
•
Signal
termination
•
Signal
conditioning
•
Low
pass
filter
•
T
filter
ordering
information
New
P
art
#
P
a
c
k
a
ge
Code
W
±0.2
L
±0.2
Pins
Dimensions
inches
(mm)
20
.341
(8.66)
.236
(5.99)
Q20
24
.341
(8.66)
.236
(5.99)
Q24
T
otal
P
ower
1
watt
1
watt
w
±0.2
.150
(3.81)
.150
(3.81)
H
±0.2
.063
(1.60)
.063
(1.60)
p
±0.1
.025
(0.635)
.025
(0.635)
a
±0.1
.010
(0.25)
.010
(0.25)
c
±0.1
.026
(0.66)
.026
(0.66)
circuit
schematic
TF
A
:
20
pins
TFB
:
20
pins
TFB
:
24
pins
TF
A
TFB
Reference
above
table
T
:
Sn
(Other
termination
styles
available,
contact
factory
for
options)
2
significant
digits
+
number
of
zeros
2
significant
digits
+
number
of
zeros
TFB
Q20
T
TEB
250
T
ermination
Material
T
ype
Packa
ge
Code
Nominal
Capacitance
Pac
kaging
Nominal
Resistance
201
TEB:
13"
embossed
plastic
tape
K:
±
10%
K
T
olerance
M:
±
20%
M
T
olerance
/
EU
resistors
89
K
O
A
Sp
ee
r
E
le
c
tr
on
ic
s,
I
n
c.
•
1
99
B
ol
iv
a
r
Dr
i
v
e
•
Br
ad
f
or
d,
P
A
16
70
1
•
U
SA
•
8
14
-3
6
2-
5
53
6
•
F
a
x:
8
14
-
36
2
-8
8
83
•
w
w
w
.k
oa
sp
ee
r
.c
om
Sp
ec
if
ic
ati
on
s
gi
ve
n
he
rei
n
ma
y
be
c
han
ge
d
at
a
ny
t
im
e
wi
th
out
p
ri
or
n
ot
ic
e.
P
le
as
e
co
nfi
rm
t
ec
hn
ic
al
s
pe
cif
ic
at
io
ns
b
ef
or
e
y
ou
o
rd
er
a
nd
/o
r
use
.
1
1/
20
/0
8
90
K
O
A
Sp
ee
r
E
le
c
tr
on
ic
s,
I
n
c.
•
1
99
Bo
l
iv
ar
Dr
i
v
e
•
Br
ad
f
or
d,
P
A
16
70
1
•
U
SA
•
8
14
-3
6
2-
5
53
6
•
F
a
x:
8
14
-
36
2
-8
8
83
•
w
w
w
.k
oa
sp
ee
r
.c
om
Sp
ec
if
ic
ati
on
s
gi
ve
n
he
rei
n
ma
y
be
c
han
ge
d
at
a
ny
t
im
e
wi
th
out
p
ri
or
n
ot
ic
e.
P
le
as
e
co
nfi
rm
t
ec
hn
ic
al
s
pe
cif
ic
at
io
ns
b
ef
or
e
y
ou
o
rd
er
a
nd
/o
r
use
.
1
1/
19
/0
9
TF(X)
r/c
filter
netw
orks
environmental
applications
P
erformance
Characteristics
Parameter
MIL-R-55342
4.7.7
+0.25%
Maximum
∆
R
T
est
Method
Resistance
to
Soldering
Heat
MIL-R-55342
4.7.5
+0.50%
Short
T
ime
Overload
MIL-STD-202
method
103
+0.50%
Moisture
Resistance
MIL-STD-202
method
107
+0.50%
Thermal
Shock
2
Atm.,
121°C,
96
hrs
+1%
H.A.S.T
.
Parallel
T
ermination
Driver
Receiver
Gnd
25
ohms
200
pF
25
ohms
Part
De
sig
nat
ion
Capacitor
V
oltage
Rating
P
o
w
e
r
R
at
i
ng
@
7
0°
C
(
P
er
E
l
e
me
n
t)
T
.C.R.
(ppm/°C)
applications
and
ratings
TF
A
TFB
20V
±
200
100mW
Operating
T
e
m
pe
r
at
u
re
Range
-55°C
to
+155°C
Capacitor
Range
pF
(E-24)
Resistance
T
olerance
Capacitor
T
olerance
Resistance
Range
Ω
(E-24)
33
~
400pF
M:
±
20%
K:
±
10%
10
~
1,000
*
TFB
only
ESD*
Rating
IEC
61000-4-2
Di
ode
*
Br
eak
do
wn
V
ol
ta
ge
(@
1ma
)
8kV*
6.5v
Min.
resistors
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