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Xeon Processor D-1529 (6M Cache, 1.30 GHz} Compare + Specifications Specifications Related Products SSSEW MIELE | Essentials Intel Xeon Processor D la Pair ae Family Status Launched Memory Specifications Intel Seon Processor Graphics specifications raunen Date alae D-1900 Family Saer-Taei [olan ele) (inlet Processor Number D-12329 Products formerly Broadwell I, Specifications Cache 6 ME Package Specifications Instruction Set 64-bit Advanced Technologies Instruction Set Extensions AK 20 CONFLICT Intel Data Protection FREE Technology Embedded Options Available IQ) Yes Intel Platform Lithography T4nm Learn how Intel is pursuing Protection Technology ict- Recommended Customer Price Ph shy conflict-tree technology. > Networking Specifications Datasheet Link intel haa = Conflict Free Wes iii oo : oa t=]8) 9] [at =e Scalability 15 Only eee ais Visit the Embedded Design Center > # of Cores : ems # of Threads 5 Export Full Specifications > Processor Base Frequency 1.3 GHz SUPPOFT OVErViEw > Max Turbo Frequency 1.4 GHz search DIStributors > TOP 20 W PCN/MDDS Information SR2DR 9440173: PCN [MOOS Max Memory Size (dependent on memory type) 126 GB Memory Types DDR4, DDRS Max # of Memory Channels a ECC Memory Supported 4 [Q) ves 6 Graphics specifications Processor Graphics + None | palms [ele fe ee ener ae ane PC] Express Configurations + x4 x6 X16 Max # of PC] Express Lanes 26 6 I/O Specifications eae ai # of USB Ports 5 Total # of SATA Ports 2 Integrated LAN No General Purpose lo Wes UART WES | Package Specifications Max CPU Configuration 1 Qiperating Temperature Range -40C to 83C Package Size a7. 3mm xo / 5mm Sockets Supported FCBGA1667 Low Halogen Options Available see MDDS | Fateh g) 16 Mila w]e) ey Tre nrc HE Intel Hyper-Threading Technology 4 IQ | Wes Intel Virtualization Technology (T-x) 4 Wes Intel Virtualization Technology for Directed | /O (VT-c 4 FER EOR E ee eo eB Pe eS Q| Wes Intel T-x with Extended Page Tables (EPT) t [Q| Wes ae ea Intel 64 4 Q) ves eae eo Enhanced Intel speedstep Technology iQ | Wes Thermal Monitoring Technologies Wes | Intel? Data Protection Technology Intel AES New |mstructions IQ | Wes Secure Key Wes | Intel Platform Protection Technology Trusted Execution Technology 4 IQ] Yes Execute Disable Bit 4 ves OS Guard Wes | Networking Specifications SFI Interface No KR Interface No KR4 |nterface No KA [niterface No Kad [terface No {O00Base-T No {000Base-T No 1OGBase-T No All infarnmoation provided is subject to change at any time, without notice. Intel may make changes ta manufacturing life cycle, specifications, and product descriptions atany time, without notice. The information herein is provided "as-is" and Intel does not makeany representations or warranties whatsoever regarding accuracy of the information, noron the product features, availability, functionality, ar compatibility of the products listed. Please contact system vendor for more information on specific products orsystems. Intel classifications" consistat Export Gantral Classification Numbers |ECCH) and Harnonieed Tariff Schedule [HTS] numbers. Any us2 made of intel classifications are without recourse ta Intel and shall nat be CONStrued 35 4 representation of warranty regarding the proper ECCH ar HTS. Your company may Gethe es porter at record,and a6 such, your company is responsible far determining the correct classification of any item at the tine of 4 port. Refer to Datasheet for formal definitions af product properties and features. Announced SKUs are not yet available Please refer ta the Launch Date far market availability. Some product can suppoctAS Mew Instructhins with a Processor Gonfiguration update, in particular, i?-26300M/i77-26350M , 7-26 FOO MM Si?-2 bP SOM, 9-2-4509 -245 9h 15-2470 fi5-2-41 oh, Please contact OEM forthe BIOS that includes the latest Processor configuration update. + This feature may not be available an all computing systems. Please check with the system wendar ta determine f your aystem delivers this feature, or reference the system 3 Peciticatiana |matherboard, Processar, Chipset, Powersupply, HOO, sraphics controller, memory, BIOS, drivers, virtual machine manitar-VveM, plattorm software, andor operating ayatem)] far feature compatibility. Functionality, Pedormance, and other benefits of this feature may vary depending on system configuration. "Conflict free and contlictfree means "ORC conflict free, which 6 defined by the U5. Securities and Exchange Gommission rules ta mean products thatda notcantain conflict minerals |tin, tantaluro, tungsten andor gold) that directly ar indirectly finance or benefit armed groupe in the Democratic Republic af the Gonga |ORC) or adjoining countries. Intel ale0 uses the term conflict-free" ina broadersense to refer ta SUpPliers, supply chains, amelters and refiners whose sources of conflict minerals do nat finance conflict in the ORC or adpining countries. Intel processars manufactured before January 1, 2013 are nat confirmed conflict free. The conflict free designation refers any ta product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor anily, nottd any additional included accessories auch as heatsinks coolers. Gee Atte oa Cel co no Aco ent an OS fen farch ecto re-and-tech nology hy per-th read ing dy perth read ing-technolosy Ate wap hy per+th reading far mare information including details an which Processors support Intel HT Technology. Has Turbo Frequency refers ta the masimunm singlecore processar frequency that can Ge achieed with Intel Turbo Boost Technology. See wi intel com ftech nology turbo boost! far more information. The Recommended Customer Price |"RCP") is pricing suddance far Intel products. Prices are far direct Intel customers, typically represent 7 GO-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may wary for other package types and shipment quantities, and special promotional arrangements may apply. lfsald in bulk, price represents individual unit. Listing of these RCP does not constitute afarmal pricing offer fram Intel. Please work with your appropriate Intel representative ta abtain a formal price quotation. Systen and Maximum TOP 6 based on worst casescenarigs. Actual TOP may Ge lower f natal Os for chipsets are used. Low Halogen: Applies onhy ta brominated and chlorinated flare retardants |BFRs/CFRs) and PYCin the final product. Intel components as well as purchased components on the finighed assembly meet 15-700 requirements, and the PCB f substrate meet EC 61240-2-21 requirements. The replacement of halogenated flame retardants andjor PVC may not be better far the enviranment. For benchmarking data se Fite few intel con! Pert rriance. Intel processor numbers are nota measure of pertormance. Processor qumbers diterentiate features within each processar family, not across different processar families. Dee bttpy ann intel com fcontent Jann Us fen fprocessors {processar-numbers.htrol for details. Processars thatsuppon EE computing an Intel architecture require an Intel 4 architecture-enabled BIOS. } send us your feedback! (2) USA (English) Company Information OQurCommitment Communities Investor Relations Contact Us intel Newsroom Jobs f V in ow CG Gl intel Corporation | TermsofUse | *Trademarks | Privacy | Cookies | Supply Chain Transparency | Site Map