WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans™
1
FEATURES
APPLICATIONS
DESCRIPTION
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
16-A, 4.5-V to 14-V INPUT, NON-ISOLATED,
2
•Up to 16-A Output Current •TurboTrans™ Technology•4.5-V to 14-V Input Voltage •Designed to meet Ultra-Fast TransientRequirements up to 300 A/ µs•Wide-Output Voltage Adjust (0.69 V to 5.5 V)
•SmartSync Technology•± 1.5% Total Output Voltage Variation
•Auto-Track™ Sequencing•Efficiencies up to 96%•Output Overcurrent Protection(Nonlatching, Auto-Reset)
•Complex Multi-Voltage Systems•Operating Temperature: – 40 ° C to 85 ° C
•Microprocessors•Safety Agency Approvals:
•Bus Drivers– UL/IEC/CSA-C22.2 60950-1•Prebias Startup•On/Off Inhibit•Differential Output Voltage Remote Sense•Adjustable Undervoltage Lockout•Ceramic Capacitor Version (PTH08T221W)•POLA™ Compatible
The PTH08T220/221W is a high-performance 16-A rated, non-isolated power module. These modules representthe 2nd generation of the popular PTH series power modules and include a reduced footprint and improvedfeatures. The PTH08T221W is optimized to be used with all ceramic capacitors.
Operating from an input voltage range of 4.5 V to 14 V, the PTH08T220/221W requires a single resistor to setthe output voltage to any value over the range, 0.69 V to 5.5 V. The wide input voltage range makes thePTH08T220/221W particularly suitable for advanced computing and server applications that utilize a looselyregulated 8-V to 12-V intermediate distribution bus. Additionally, the wide input voltage range increases designflexibility by supporting operation with tightly regulated 5-V, 8-V, or 12-V intermediate bus architectures.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdownprotects against most load faults. A differential remote sense ensures tight load regulation. An adjustableunder-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™ sequencing is apopular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in apower system.
The PTH08T220/221W includes new patent pending technologies, TurboTrans™ and SmartSync. TheTurboTrans feature optimizes the transient response of the regulator while simultaneously reducing the quantityof external output capacitors required to meet a target voltage deviation specification. Additionally, for a targetoutput capacitor bank, TurboTrans can be used to significantly improve the regulators transient response byreducing the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiplemodules, thus simplifying EMI noise suppression tasks and reducing input capacitor RMS current requirements.The module uses double-sided surface mount construction to provide a low profile and compact footprint.Package options include both through-hole and surface mount configurations that are lead (Pb) - free and RoHScompatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TurboTrans, POLA, Auto-Track, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
RTT
1%
0.05 W
(Optional)
CO
220 µF
(Required)
VO
RSET [A]
1%
0.05 W
(Required)
CI
330 µF
(Required)
RUVLO
1%
0.05 W
(Opional)
VOAdj
TurboTranst
VI
PTH08T220W
CI2
22 µF
(Required)
VI2
5
9
+
8
Track
GND
TT
43
GND
GND
+Sense 6
L
O
A
D
−Sense
GND
+
11
Inhibit INH/UVLO
Track
10
7
−Sense
+Sense
Vo
SYNC
1
SmartSync
UDG−05098
RTT
1%
0.05 W
(Optional)
CO
300 µF
(Required)
VO
RSET [A]
1%
0.05 W
(Required)
CI
300 µF
(Required)
RUVLO
1%
0.05 W
(Opional)
VOAdj
TurboTranst
VO
VI
PTH08T221W 5
9
8
VI Track
GND
TT
43
GND
GND
+Sense 6
L
O
A
D
−Sense
GND
Inhibit INH/UVLO
Track
10
7
−Sense
+Sense
SYNC
1
SmartSync
2
11
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
PTH08T220W
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.
PTH08T221W - Ceramic Capacitor Version
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.B. 300 µ F of ceramic or 330 µ F of electrolytic input capacitance is required for proper operation.
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DATASHEET TABLE OF CONTENTS
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or seethe TI website at www.ti.com.
DATASHEET SECTION PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS 3
ELECTRICAL CHARACTERISTICS TABLE (PTH08T220W) 4
ELECTRICAL CHARACTERISTICS TABLE (PTH08T221W) 6
TERMINAL FUNCTIONS 8
TYPICAL CHARACTERISTICS (V
I
= 12V) 9
TYPICAL CHARACTERISTICS (V
I
= 5V) 10
ADJUSTING THE OUTPUT VOLTAGE 11
INPUT & OUTPUT CAPACITOR RECOMMENDATIONS 13
TURBOTRANS™ INFORMATION 17
UNDERVOLTAGE LOCKOUT (UVLO) 22
SOFT-START POWER-UP 23
OUTPUT INHIBIT 24
OVER-CURRENT PROTECTION 25
OVER-TEMPERATURE PROTECTION 25
REMOTE SENSE 25
SYCHRONIZATION (SMARTSYNC) 26
AUTO-TRACK SEQUENCING 27
PREBIAS START-UP 30
TAPE & REEL AND TRAY DRAWINGS 32
(Voltages are with respect to GND)
UNIT
V
track
Track pin voltage – 0.3 to V
I
+ 0.3 VT
A
Operating temperature range Over V
I
range – 40 to 85AH suffixSurface temperature of module body or pins forT
wave
Wave soldering temperature 2605 seconds maximum.
AD suffix
AS suffix 235
(1)
° CT
reflow
Solder reflow temperature Surface temperature of module body or pins
AZ suffix 260
(1)
T
stg
Storage temperature Storage temperature of module removed from shipping package – 55 to 125T
pkg
Packaging temperature Shipping Tray or Tape and Reel storage or bake temperature 45Mechanical shock Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 AH and AD suffix 500sine, mounted
AS and AZ suffix 125 GMechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20Weight 5 gramsFlammability Meets UL94V-O
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above thestated maximum.
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ELECTRICAL CHARACTERISTICS
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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PTH08T220W
T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µ F, C
I
2 = 22 µF, C
O
= 220 µ F, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T220W UNIT
MIN TYP MAX
I
O
Output current Over V
O
range 25 ° C, natural convection 0 16 A
0.69 ≤V
O
≤1.2 4.5 14
(1)
V
I
Input voltage range Over I
O
range 1.2 < V
O
≤3.6 4.5 14 V
3.6 < V
O
≤5.5 V
O
+ 2 14
V
OADJ
Output voltage adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 0.5 ± 1
(2)
%V
o
Temperature variation – 40 ° C < T
A
< 85 ° C ± 0.3 %V
o
V
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 ° C ≤T
A
≤85 ° C ± 1.5
(2)
%V
o
R
SET
= 171 Ω, V
I
= 8 V, V
O
= 5.0 V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 94%
R
SET
= 2.38 k Ω, V
O
= 2.5 V 91%
ηEfficiency I
O
= 16 A R
SET
= 4.78 k Ω, V
O
= 1.8 V 88%
R
SET
= 7.09 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V
(1)
84%
R
SET
= 20.8 k Ω, V
O
= 1.0 V
(1)
82%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 15
(1)
mV
PP
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 32 A
t
tr
Recovery time 70 µ sw/o TurboTrans
C
O
= 220 µF, TypeCΔV
tr
2.5 A/ µ s load step V
O
over/undershoot 150 mVTransient response 50 to 100% I
O
maxt
trTT
w/ TurboTrans Recovery time 130 µ sV
O
= 2.5 V
C
O
= 2000 µF, TypeC
mVΔV
trTT
V
O
over/undershoot 30R
TT
= short
I
IL
Track input current (pin 10) Pin to GND – 130
(3)
µ A
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 3.7 4.2 V(pin 11)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(4)
VInhibit control (pin 11) Input low voltage (V
IL
) -0.2 0.8
Input low current (I
IL
), Pin 11 to GND -235 µ A
I
in
Input standby current Inhibit (pin 11) to GND, Track (pin 10) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
Synchronization (SYNC)f
SYNC
240 400 kHzfrequency
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 V
V
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
Nonceramic 330
(5)C
I
External input capacitance µ FCeramic 22
(5)
(1) For output voltages ≤1.2 V, at nominal operating frequency, the output ripple may increase (typically 2 × ) when operating at inputvoltages greater than (V
O
× 11). When using the SmartSync feature to adjust the switching frequency, see the SmartSyncConsiderations section of the datasheet for further guidance.(2) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(3) A low-leakage ( < 100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. Theopen-circuit voltage is less than 8 V
dc
.(4) Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when input power is applied. A small,low-leakage ( < 100 nA) MOSFET is recommended for control. For additional information, see the related application section.(5) A 330 µ F electrolytic and a 22 µF ceramic input capacitor is required for proper operation. The electrolytic capacitor must be rated for aminimum of 700 mA rms of ripple current.
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS
PTH08T220W
(continued)
T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µ F, C
I
2 = 22 µF, C
O
= 220 µ F, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T220W UNIT
MIN TYP MAX
Capacitance Value Nonceramic 220
(6)
5000
(7)
µ Fw/o TurboTrans Ceramic 500
Equivalent series resistance (non-ceramic) 7 m ΩC
O
External output capacitance
see tableCapacitance Value µ F(6) (8)w/ TurboTrans
Capacitance × ESR product (C
O
× ESR) 1000 10000
(8)
µ F × m Ω
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.1
10
6
HrT
A
= 40 ° C, ground benign
(6) A 220 µ F external output capacitor is required for basic operation. The minimum output capacitance requirement increases whenTurboTrans™ (TT) technology is utilized. See related Application Information for more guidance.(7) This is the calculated maximum disregarding TurboTrans™ technology.(8) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESRcapacitors are required for proper operation. See the application notes for further guidance.
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ELECTRICAL CHARACTERISTICS
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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PTH08T221W (ceramic capacitors)T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 300 µ F ceramic, C
O
= 300 µ F ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T221W UNIT
MIN TYP MAX
I
O
Output current Over V
O
range 25 ° C, natural convection 0 16 A
0.69 ≤V
O
≤1.2 4.5 14
(1)
V
I
Input voltage range Over I
O
range 1.2 < V
O
≤3.6 4.5 14 V
3.6 < V
O
≤5.5 V
O
+ 2 14
V
OADJ
Output voltage adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 0.5 ± 1
(2)
%V
o
Temperature variation – 40 ° C < T
A
< 85 ° C ± 0.3 %V
o
V
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 ° C ≤T
A
≤85 ° C ± 1.5
(2)
%V
o
R
SET
= 171 Ω, V
I
= 8 V, V
O
= 5.0 V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 94%
R
SET
= 2.38 k Ω, V
O
= 2.5 V 91%
ηEfficiency I
O
= 16 A R
SET
= 4.78 k Ω, V
O
= 1.8 V 88%
R
SET
= 7.09 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V
(1)
84%
R
SET
= 20.8 k Ω, V
O
= 1.0 V
(1)
82%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 15
(1)
mV
PP
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 32 A
t
tr
Recovery time 70 µ sw/o TurboTrans
C
O
= 300 µF, TypeAΔV
tr
2.5 A/ µ s load step V
O
over/undershoot 150 mVTransient response 50 to 100% I
O
maxt
trTT
w/ TurboTrans Recovery time 200 µ sV
O
= 2.5 V
C
O
= 1500 µF, TypeA
mVΔV
trTT
V
O
over/undershoot 65R
TT
= short
I
IL
Track input current (pin 10) Pin to GND – 130
(3)
µ A
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 3.7 4.2 V(pin 11)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(4)
VInhibit control (pin 11) Input low voltage (V
IL
) -0.2 0.8
Input low current (I
IL
), Pin 11 to GND -235 µ A
I
in
Input standby current Inhibit (pin 11) to GND, Track (pin 10) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
Synchronization (SYNC)f
SYNC
240 400 kHzfrequency
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 V
V
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
C
I
External input capacitance 300
(5)
µ F
(1) For output voltages ≤1.2 V, at nominal operating frequency, the output ripple may increase (typically 2 × ) when operating at inputvoltages greater than (V
O
× 11). When using the SmartSync feature to adjust the switching frequency, see the SmartSyncConsiderations section of the datasheet for further guidance.(2) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(3) A low-leakage ( < 100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. Theopen-circuit voltage is less than 8 V
dc
.(4) Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when input power is applied. A small,low-leakage ( < 100 nA) MOSFET is recommended for control. For additional information, see the related application section.(5) 300 µ F of input capacitance is required for proper operation. 300 µ F of ceramic or 330 µ F of electrolytic input capacitance can be used.Electrolytic capacitance must be rated for a minimum of 700 mA rms of ripple current. An additional 22- µF ceramic input capacitor isrecommended to reduce rms ripple current.
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS
PTH08T221W (ceramic capacitors) (continued)T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 300 µ F ceramic, C
O
= 300 µ F ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T221W UNIT
MIN TYP MAX
w/o TurboTrans Capacitance Value Ceramic 300
(6)
3000
(7)
µ F
see tableC
O
External output capacitance Capacitance Value 5000 µ F(6)w/ TurboTrans
Capacitance × ESR product (C
O
× ESR) 100 1000 µ F × m Ω
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.1
10
6
HrT
A
= 40 ° C, ground benign
(6) A minimum of 300 µ F ceramic external output capacitance is required for basic operation. The minimum output capacitance requirementincreases when TurboTrans™ (TT) technology is utilized. See related Application Information section for more guidance.(7) This is the calculated maximum disregarding TurboTrans™ technology.
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1 10
9
7
6
5
432
11
8
PTH08T220W/221W
(Top View)
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
V
I
2 The positive input voltage power node to the module, which is referenced to common GND.V
O
5 The regulated positive power output with respect to GND.This is the common ground connection for the V
I
and V
O
power connections. It is also the 0 V
dc
reference for theGND 3, 4
control inputs.The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low levelground signal to this input disables the module ’ s output and turns off the output voltage. When the Inhibit controlis active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, theInhibit
(1)
and
module produces an output whenever a valid input source is applied.11UVLO
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin toGND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For moreinformation, see the Application Information section.A 0.05 W 1% resistor must be directly connected between this pin and pin7 ( – Sense) to set the output voltage toa value higher than 0.69V. The temperature stability of the resistor should be 100 ppm/ ° C (or better). Thesetpoint range for the output voltage is from 0.69V to 5.5V. If left open circuit, the output voltage will default to itsV
o
Adjust 8
lowest value. For further information, on output voltage adjustment see the related application note.The specification table gives the preferred resistor values for a number of standard output voltages.The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.+ Sense 6 The +Sense pin should always be connected to V
O
, either at the load for optimal voltage accuracy, or at themodule (pin 5).The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.– Sense 7
For optimal voltage accuracy – Sense must be connected to GND (pin4) very close to the module (within 10cm).This is an analog control input that enables the output voltage to follow an external voltage. This pin becomesactive typically 20 ms after the input voltage has been applied, and allows direct control of the output voltagefrom 0 V up to the nominal set-point voltage. Within this range the module ' s output voltage follows the voltage atTrack 10
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulatesat its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules poweredfrom the same input bus. If unused, this input should be connected to V
I
.NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltageduring power up. For more information, see the related application note.This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%, 50mWresistor, must be connected between this pin and pin 6 (+Sense) very close to the module. For a given value ofoutput capacitance, a reduction in peak output voltage deviation is achieved by utililizing this feature. If unused,TurboTrans™ 9
this pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans resistor tablein the Application Information section. External capacitance must never be connected to this pin unless theTurboTrans resistor value is a short, 0 Ω.This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSyncfeature can be used to sychronize the switching fequency of multiple PTH08T220/221W modules, aiding EMISmartSync 1
noise suppression efforts. If unused, this pin should be connected to GND (pin3). For more information, pleasereview the Application Information section.
(1) Denotes negative logic: Open = Normal operation, Ground = Function active
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 12 V)
VO − Output Voltage Ripple − VPP (mV)
IO − Output Current − A
0
0
10
20
40
50
30
2 4 6 8 10 12 14 16
VO = 1.2 V
VO = 5 V
VO = 3.3 V
VO = 1.8 V VO = 2.5 V
η − Efficiency − %
IO − Output Current − A
0
90
2
95
70
65
60
75
85
80
468
3.3 V
5 V
2.5 V
1.8 V
1.2 V
10 12 14 16
0
02
1
4
2
3
6
5
4 6 10 12 14 168
PD − OuPower Dissipation − W
IO − Output Current − A
VO = 1.2 V
VO = 5 V
VO = 3.3 V
VO = 1.8 V
VO = 2.5 V
TA − Ambient T emperature − °C
IO − Output Current − A
40
30
20
70
60
50
90
80
0 161284
VO = 3.3 V
Nat Conv
100 LFM
200 LFM
400 LFM
TA − Ambient T emperature − °C
IO − Output Current − A
20
30
40
50
60
70
80
90
0 4 12 168
Nat Conv
100 LFM
200 LFM
400 LFM
VO = 1.2 V
20
30
40
50
60
70
80
90
0 4 12 168
TA − AMbient T emperature − °C
IO − Output Current − A
VO = 5.0 V
Nat Conv
100 LFM
200 LFM
400 LFM
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 1. Figure 2. Figure 3.
AMBIENT TEMPERATURE AMBIENT TEMPERATURE AMBIENT TEMPERATUREvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 4. Safe Operating Area Figure 5. Safe Operating Area Figure 6. Safe Operating Area
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 1 ,Figure 2 , and Figure 3 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for moreinformation. Applies to Figure 5 .
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 5 V)
IO − Output Current − A
− Power Dissipation − W
PD
0
0.5
1
1.5
2
2.5
3
3.5
4
0 4 8 12 16
VO = 1.5 V
VO = 0.7 V
VO = 2.5 V
VO = 3.3 V
I − OutputCurrent − A
O
V OutputVoltageRipple − V (mV)
O PP
−
5
10
15
20
4812 16
0
0
VO=3.3V
VO=1.8V
VO=0.7V
VO=1.2V
VO=2.5V
TA − Ambient Temperature − °C
IO − Output Current − A
VO = 1.2 V
20
30
40
50
60
70
80
90
0 4 12 168
Nat Conv
100 LFM
200 LFM
400 LFM
TA − Ambient Temperature − °C
IO − Output Current − A
20
30
40
50
60
70
80
90
0 4 12 168
200 LFM
Nat Conv
VO = 3.3 V
100 LFM
400 LFM
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EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 7. Figure 8. Figure 9.
AMBIENT TEMPERATURE AMBIENT TEMPERATUREvs vsLOAD CURRENT LOAD CURRENT
Figure 10. Safe Operating Area Figure 11. Safe Operating Area
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 7 ,Figure 8 , and Figure 9 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for moreinformation. Applies to Figure 10 .
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APPLICATION INFORMATION
ADJUSTING THE OUTPUT VOLTAGE
R =10k x
SET W0.69
V -0.69
O
-1.43kW
(1)
5
3 4
6
7
GND GND
8
GND
+Sense
VO
−Sense
V Adj
O
PTH08T220W/221W
RSET
1%
0.05W
+Sense
VO
−Sense
CO
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
The V
o
Adjust control (pin 8) sets the output voltage of the PTH08T220/221W. The adjustment range of thePTH08T220/221W is 0.69 V to 5.5 V. The adjustment method requires the addition of a single external resistor,R
SET
, that must be connected directly between the V
o
Adjust and – Sense pins. Table 1 gives the standard valueof the external resistor for a number of standard voltages, along with the actual output voltage that this resistancevalue provides.
For other output voltages, the value of the required resistor can either be calculated using the following formula,or simply selected from the range of values given in Table 2 .Figure 12 shows the placement of the requiredresistor.
Table 1. Standard Values of R
SET
for Standard Output Voltages
V
O
(Standard) R
SET
(Standard Value) V
O
(Actual)
5.0 V
(1)
169 Ω5.005 V3.3 V 1.21 k Ω3.304 V2.5 V 2.37 k Ω2.506 V1.8 V 4.75 k Ω1.807 V1.5 V 6.98 k Ω1.510 V1.2 V
(2)
12.1 k Ω1.200 V1.0 V
(2)
20.5 k Ω1.004 V0.7 V
(2)
681 k Ω0.700 V
(1) For V
O
> 3.6 V, the minimum input voltage is (V
O
+ 2) V.(2) For output voltages ≤1.2V, at nominal operating frequency, the output ripple may increase (typically2 × ) when operating at input voltages greater than (V
O
× 11). When using the SmartSync feature,review the SmartSync application section for further guidance.
(1) R
SET
:Use a 0.05 W resistor with a tolerance of 1% and temperature stability of 100 ppm/ ° C (or better). Connect theresistor directly between pins 8 and 7, as close to the regulator as possible, using dedicated PCB traces.(2) Never connect capacitors from V
O
Adjust to either + Sense, GND, or V
O
. Any capacitance added to the V
O
Adjust pinaffects the stability of the regulator.
Figure 12. V
O
Adjust Resistor Placement
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Table 2. Output Voltage Set-Point Resistor Values (Standard Values)
V
O
Required R
SET
(Ω) V
O
Required (V) R
SET
(Ω)
0.70
(1)
681 k 2.50 2.37 k0.75
(1)
113 k 2.60 2.15 k0.80
(1)
61.9 k 2.70 2.00 k0.85
(1)
41.2 k 2.80 1.82 k0.90
(1)
31.6 k 2.90 1.69 k0.95
(1)
24.9 k 3.00 1.54 k1.00
(1)
20.5 k 3.10 1.43 k1.05
(1)
17.8 k 3.20 1.33 k1.10
(1)
15.4 k 3.30 1.21 k1.15
(1)
13.3 k 3.40 1.10 k1.20
(1)
12.1 k 3.50 1.02 k1.25 10.7 k 3.60 9311.30 9.88 k 3.70
(2)
8661.35 9.09 k 3.80
(2)
7871.40 8.25 k 3.90
(2)
7151.45 7.68 k 4.00
(2)
6491.50 6.98 k 4.10
(2)
5901.55 6.49 k 4.20
(2)
5361.60 6.04 k 4.30
(2)
4751.65 5.76 k 4.40
(2)
4321.70 5.36 k 4.50
(2)
3831.75 5.11 k 4.60
(2)
3321.80 4.75 k 4.70
(2)
2871.85 4.53 k 4.80
(2)
2491.90 4.22 k 4.90
(2)
2101.95 4.02 k 5.00
(2)
1692.00 3.83 k 5.10
(2)
1332.10 3.40 k 5.20
(2)
1002.20 3.09 k 5.30
(2)
66.52.30 2.87 k 5.40
(2)
34.82.40 2.61 k 5.50
(2)
4.99
(1) For output voltages ≤1.2V, at nominal operating frequency, the output ripple may increase (typically2 × ) when operating at input voltages greater than (V
O
× 11). When using the SmartSync feature,review the SmartSync application section for further guidance.(2) For V
O
> 3.6 V, the minimum input voltage is (V
O
+ 2) V.
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CAPACITOR RECOMMENDATIONS FOR THE PTH08T220/221W POWER MODULE
Capacitor Technologies
Input Capacitor (Required)
Input Capacitor Information
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Electrolytic CapacitorsWhen using electrolytic capacitors, high quality, computer-grade electrolytic capacitors are recommended.Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz,and are suitable when ambient temperatures are above -20 ° C. For operation below -20 ° C, tantalum,ceramic, or OS-CON type capacitors are required.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramiccapacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. Theycan be used to reduce the reflected ripple current at the input as well as improve the transient response ofthe output.
Tantalum, Polymer-Tantalum CapacitorsTantalum type capacitors may only used on the output bus, and are recommended for applications where theambient operating temperature is less than 0 ° C. The AVX TPS series and Kemet capacitor series aresuggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are notrecommended for power applications.
The PTH08T221W requires a minimum input capacitance of 300 µF of ceramic type.
The PTH08T220W requires a combination of one 22 µF X5R/X7R ceramic and 330 µF electrolytic type. The ripplecurrent rating of the electrolytic capacitor must be at least 950mArms. The ripple current rating must increase to1500mArms when V
O
>2.1 V and I
O
≥11A.
The size and value of the input capacitor is determined by the converter ’ s transient performance capability. Thisminimum value assumes that the converter is supplied with a responsive, low inductance input source. Thissource should have ample capacitive decoupling, and be distributed to the converter via PCB power and groundplanes.
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. Thiswill reduce the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripplecurrent reflected back to the input source. Additional ceramic capacitors can be added to further reduce the RMSripple current requirement for the electrolytic capacitor.
Increasing the minimum input capacitance to 680 µ F is recommended for high-performance applications, orwherever the input source performance is degraded.
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,and less than 100 m Ωof equivalent series resistance (ESR).
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommendedminimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability.No tantalum capacitors were found with a sufficient voltage rating to meet this requirement.
When the operating temperature is below 0 ° C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
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Output Capacitor (Required)
Output Capacitor Information
TurboTrans Output Capacitance
Non-TurboTrans Output Capacitance
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The PTH08T221W requires a minimum output capacitance of 300 µF of ceramic type.
The PTH08T220W requires a minimum output capacitance of 220 µF of aluminum, polymer-aluminum, tantulum,or polymer-tantalum type.
The required capacitance above the minimum will be determined by actual transient deviation requirements. Seethe TurboTrans Technology application section within this document for specific capacitance selection.
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.When using the TurboTrans feature, the capacitance X ESR product should also be considered (see thefollowing section).
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to theload to be effective. Ceramic capacitor values below 10 µF should not be included when calculating the totaloutput capacitance value.
When the operating temperature is below 0 ° C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
TurboTrans allows the designer to optimize the output capacitance according to the system transient designrequirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. Whenusing TurboTrans, the capacitor's capacitance ( µF) × ESR (m Ω) product determines its capacitor type; Type A,B, or C. These three types are defined as follows:
Type A = (100 ≤capacitance × ESR ≤1000) (e.g. ceramic)
Type B = (1000 < capacitance × ESR ≤5000) (e.g. polymer-tantalum)
Type C = (5000 < capacitance × ESR ≤10,000) (e.g. OS-CON)
When using more than one type of output capacitor, select the capacitor type that makes up the majority of yourtotal output capacitance. When calculating the C × ESR product, use the maximum ESR value from the capacitormanufacturer's datasheet.
The PTH08T221W should be used when only Type A (ceramic) capacitors are used on the output.
Working Examples:
A capacitor with a capacitance of 330 µF and an ESR of 5m Ω, has a C × ESR product of 1650 µFxm Ω(330 µF ×5m Ω). This is a Type B capacitor. A capacitor with a capacitance of 1000 µF and an ESR of 8m Ω, has a C × ESRproduct of 8000 µFxm Ω(1000 µF × 8m Ω). This is a Type C capacitor.
See the TurboTrans Technology application section within this document for specific capacitance selection.
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
If the TurboTrans feature is not used, minimum ESR and maximum capacitor limits must be followed. Systemstability may be effected and increased output capacitance may be required without TurboTrans.
When using the PTH08T220W, observe the minimum ESR of the entire output capacitor bank. The minimumESR limit of the output capacitor bank is 7m Ω. A list of preferred low-ESR type capacitors, are identified inTable 3 .
When using the PTH08T221W without the TurboTrans feature, the maximum amount of capacitance is 3000 µFof ceramic type. Large amounts of capacitance may reduce system stability.
Utilizing the TurboTrans feature improves system stability, improves transient response, and reduces theamount of output capacitance required to meet system transient design requirements.
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Designing for Fast Load Transients
Capacitor Table
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The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of2.5A/ µ s. The typical voltage deviation for this load transient is given in the Electrical Characteristics table usingthe minimum required value of output capacitance. As the di/dt of a transient is increased, the response of aconverter ’ s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherentlimitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met withadditional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100A/ µs, addingmultiple 10 µF ceramic capacitors plus 10 × 1 µF, and numerous high frequency ceramics ( ≤0.1 µF) is all that isrequired to soften the transient higher frequency edges. The PCB location of these capacitors in relation to theload is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required foroptimum performance. Low impedance buses, unbroken PCB copper planes, and components located as closeas possible to the high frequency devices are essential for optimizing transient performance.
Table 3 identifies the characteristics of acceptable capacitors from a number of vendors. The recommendednumber of capacitors required at both the input and output buses is identified for each capacitor.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparablespecifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are criticalparameters necessary to ensure both optimum regulator performance and long capacitor life.
Table 3. Input/Output Capacitors
(1)
Capacitor Characteristics Quantity
Max Output BusMax.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage ( µ F) at 100 Size (mm) Bus
Turbo- Transat 85 ° CkHz
Trans Cap Type
(2)(Irms)
Panasonic
FC (Radial) 25 V 1000 43m Ω1690mA 16 × 15 1 ≥2
(3)
N/R
(4)
EEUFC1E102S
FC (Radial) 25 V 820 38m Ω1655mA 12 × 20 1 ≥1
(3)
N/R
(4)
EEUFC1E821S
FC (SMD) 35 V 470 43m Ω1690mA 16 × 16,5 1 ≥1
(3)
N/R
(4)
EEVFC1V471N
FK (SMD) 35 V 1000 35m Ω1800mA 16 × 16,5 1 ≥2
(3)
N/R
(4)
EEVFK1V102M
United Chemi-Con
PTB, Poly-Tantalum(SMD) 6.3 V 330 25m Ω2600mA 7,3 × 4,3 × 2.8 N/R
(5)
1 ~ 4
(3)
C≥2
(2)
6PTB337MD6TER (V
O
≤5.1V)
(6)
LXZ, Aluminum (Radial) 35 V 680 38m Ω1660mA 12,5 × 20 1 1 ~ 3
(3)
N/R
(4)
LXZ35VB681M12X20LL
PS, Poly-Alum (Radial) 16 V 330 14m Ω5060mA 10 × 12,5 1 1 ~ 3 B ≥2
(2)
16PS330MJ12
PS, Poly-Alum (Radial) 6.3 V 390 12m Ω5500mA 8 × 12,5 N/R
(5)
1 ~ 2 B ≥1
(2)
6PS390MH11 (V
O
≤5.1V)
(6)
PXA, Poly-Alum (SMD) 16 V 330 14m Ω5050mA 10 × 12,2 1 1 ~ 3 B ≥2
(2)
PXA16VC331MJ12TP
PXA, Poly-Alum (Radial) 10 V 330 14m Ω4420mA 8 × 12,2 N/R
(5)
1 ~ 2 B ≥1
(2)
PXA10VC331MH12
(1) Capacitor Supplier VerificationPlease verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because oflimited availability or obsolete products.RoHS, Lead-free and Material DetailsSee the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.Component designators or part number deviations can occur when material composition or soldering requirements are updated.(2) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance × ESR ≤1000)b. Type B = (1,000 < capacitance × ESR ≤5,000)c. Type C = (5,000 < capacitance × ESR ≤10,000)(3) Total bulk nonceramic capacitors on the output bus with ESR ≥15m Ωto ≤30m Ωrequires an additional 200 µF of ceramic capacitance.(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(6) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
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Table 3. Input/Output Capacitors (continued)Capacitor Characteristics Quantity
Max Output BusMax.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage ( µ F) at 100 Size (mm) Bus
Turbo- Transat 85 ° CkHz
Trans Cap Type
(2)(Irms)
Nichicon, Aluminum
PM (Radial) 25 V 1000 43m Ω1520mA 18 × 15 1 ≥2
(7)
N/R
(8)
UPM1E102MHH6
HD (Radial) 35 V 470 23m Ω1820mA 10 × 20 1 ≥2
(7)
N/R
(8)
UHD1V471HR
Panasonic, Poly-Aluminum 2.0 V 390 5m Ω4000mA 7,3 × 4,3 × 4,2 N/R
(9)
N/R
(9)
B≥2
(10)
EEFSE0J391R(V
O
≤1.6V)
(11)
Sanyo
TPE, Poscap (SMD) 10 V 330 25m Ω3300mA 7,3 × 4,3 N/R
(9)
1 ~ 3 C ≥1
(10)
10TPE330MF
(11)
TPE, Poscap (SMD) 2.5 V 470 7m Ω4400mA 7,3 × 4,3 N/R
(9)
1 ~ 2 B ≥2
(10)
2R5TPE470M7(V
O
≤1.8V)
(11)
TPD, Poscap (SMD) 2.5 V 1000 5m Ω6100mA 7,3 × 4,3 N/R
(9)
1 B ≥1
(10)
2R5TPD1000M5(V
O
≤1.8V)
(11)
SEP, OS-CON (Radial) 16 V 330 16m Ω4700mA 10 × 13 1 1 ~ 2 B ≥1
(10)
16SEP330M
SEPC, OS-CON (Radial) 16 V 470 10m Ω6100mA 10 × 13 1 1 ~ 2 B ≥2
(10)
16SEPC470M
SVP, OS-CON (SMD) 16 V 330 16m Ω4700mA 10 × 12,6 1 1 ~ 2
(7)
B≥1
(10) (7)
16SVP330M
AVX, Tantalum
TPM Multianode 10 V 330 23m Ω3000mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 3
(7)
C≥2
(10)
TPME337M010R0035
TPS Series III (SMD) 10 V 330 40m Ω1830mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 6
(7)
N/R
(8)
TPSE337M010R0040 (V
O
≤5V)
(12)
TPS Series III (SMD) 4 V 1000 25m Ω2400mA 7,3 × 6,1 × 3.5 N/R
(9)
1 ~ 5
(7)
N/R
(8)
TPSV108K004R0035 (V
O
≤2.1V)
(12)
Kemet, Poly-Tantalum
T520 (SMD) 10 V 330 25m Ω2600mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 3
(7)
C≥2
(10)
T520X337M010ASE025
(11)
T530 (SMD) 6.3 V 330 15m Ω3800mA 7,3 × 4,3 × 4,1 N/R
(9)
2 ~ 3 B ≥2
(10)
T530X337M010ASE015
(11)
T530 (SMD) 4 V 680 5m Ω7300mA 7,3 × 4,3 × 4,1 N/R
(9)
1 B ≥1
(10)
T530X687M004ASE005 (V
O
≤3.5V)
(11)
T530 (SMD) 2.5 V 1000 5m Ω7300mA 7,3 × 4,3 × 4,1 N/R
(9)
1 B ≥1
(10)
T530X108M2R5ASE005 (V
O
≤2.0V)
(11)
Vishay-Sprague
597D, Tantalum (SMD) 10 V 330 35m Ω2500mA 7,3 × 5,7 × 4,1 N/R
(9)
1 ~ 5 N/R
(8)
597D337X010E2T
94SA, OS-CON (Radial) 16 V 470 20m Ω6080mA 12 × 22 1 1 ~ 3 C ≥2
(10)
94SA477X0016GBP
94SVP OS-CON(SMD) 16 V 330 17m Ω4500mA 10 × 12,7 2 2 ~ 3 C ≥1
(10)
94SVP337X06F12
Kemet, Ceramic X5R 16 V 10 2m Ω– 3225 1 ≥1
(13)
A
(10)
C1210C106M4PAC
(SMD) 6.3 V 47 2m ΩN/R
(9)
≥1
(13)
A
(10)
C1210C476K9PAC
Murata, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(13)
A
(10)
GRM32ER60J107M
(SMD) 6.3 V 47 N/R
(9)
≥1
(13)
A
(10)
GRM32ER60J476M
25 V 22 1 ≥1
(13)
A
(10)
GRM32ER61E226K
16 V 10 1 ≥1
(13)
A
(10)
GRM32DR61C106K
TDK, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(13)
A
(10)
C3225X5R0J107MT
(SMD) 6.3 V 47 N/R
(9)
≥1
(13)
A
(10)
C3225X5R0J476MT
16 V 10 1 ≥1
(13)
A
(10)
C3225X5R1C106MT0
16 V 22 1 ≥1
(13)
A
(10)
C3225X5R1C226MT
(7) Total bulk nonceramic capacitors on the output bus with ESR ≥15m Ωto ≤30m Ωrequires an additional 200 µF of ceramic capacitance.(8) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(9) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(10) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance × ESR ≤1000)b. Type B = (1,000 < capacitance × ESR ≤5,000)c. Type C = (5,000 < capacitance × ESR ≤10,000)(11) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.(12) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 50% of the working voltage.(13) Any combination of ceramic capacitor values is limited to 500 µF for PTH08T220W and 5000 µF for PTH08T221W. The totalcapacitance for PTH08T220W is limited to 10,000 µF which includes all ceramic and non-ceramic types.
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.TurboTrans optimizes the transient response of the regulator with added external capacitance using a singleexternal resistor. Benefits of this technology include reduced output capacitance, minimized output voltagedeviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. Theamount of output capacitance required to meet a target output voltage deviation will be reduced with TurboTransactivated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of thevoltage deviation following a load transient will be reduced. Applications requiring tight transient voltagetolerances and minimized capacitor footprint area will benefit greatly from this technology.
Utilizing TurboTrans requires connecting a resistor, R
TT
, between the +Sense pin (pin6) and the TurboTrans pin(pin9). The value of the resistor directly corresponds to the amount of output capacitance required. All T2products require a minimum value of output capacitance whether or not TurboTrans is utilized. For thePTH08T220W, the minimum required capacitance is 220 µF. The minimum required capacitance for thePTH08T221W is 300 µF of ceramic type. When using TurboTrans, capacitors with a capacitance × ESR productbelow 10,000 µF × m Ωare required. (Multiply the capacitance (in µF) by the ESR (in m Ω) to determine thecapacitance × ESR product.) See the Capacitor Selection section of the datasheet for a variety of capacitors thatmeet this criteria.
Figure 13 thru Figure 18 show the amount of output capacitance required to meet a desired transient voltagedeviation with and without TurboTrans for several capacitor types; TypeA (e.g. ceramic), TypeB (e.g.polymer-tantalum), and TypeC (e.g. OS-CON). To calculate the proper value of R
TT
, first determine your requiredtransient voltage deviation limits and magnitude of your transient load step. Next, determine what type of outputcapacitors will be used. (If more than one type of output capacitor is used, select the capacitor type that makesup the majority of your total output capacitance.) Knowing this information, use the chart in Figure 13 thruFigure 18 that corresponds to the capacitor type selected. To use the chart, begin by dividing the maximumvoltage deviation limit (in mV) by the magnitude of your load step (in Amps). This gives a mV/A value. Find thisvalue on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From thispoint, read down to the X-axis which lists the minimum required capacitance, C
O
, to meet that transient voltagedeviation. The required R
TT
resistor value can then be calculated using the equation or selected from theTurboTrans table. The TurboTrans tables include both the required output capacitance and the correspondingR
TT
values to meet several values of transient voltage deviation for 25%(4A), 50%(8A), and 75%(12A) outputload steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of outputcapacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans'curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance.The required R
TT
resistor value can be calculated using the equation or selected from the TurboTrans table.
As an example, let's look at a 12-V application requiring a 40 mV deviation during an 8A, 50% load transient. Amajority of 330 µF, 10m Ωouput capacitors will be used. Use the 12 V, Type B capacitor chart, Figure 15 . Dividing40mV by 8A gives 5mV/A transient voltage deviation per amp of transient load step. Select 5mV/A on the Y-axisand read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a minimumrequired output capacitance of approximately 800 µF. The required R
TT
resistor value for 800 µF can then becalculated or selected from Table 5 . The required R
TT
resistor is approximately 4.12k Ω.
To see the benefit of TurboTrans, follow the 5mV/A marking across to the 'Without TurboTrans' plot. Followingthat point down shows that you would need a minimum of 4500 µF of output capacitance to meet the sametransient deviation limit. This is the benefit of TurboTrans. A typical TurboTrans schematic and waveforms areshown in Figure 19 and Figure 20 .
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): PTH08T220W PTH08T221W
PTH08T221W Type A / Ceramic Capacitors
20
10
9
8
7
6
5
4
3
4000
3000
2000
1000
500
400
300
200
5000
900
600
700
800
Transient − mV/A
C − Capacitance − µF
Without TurboTrans
With TurboTrans
PTH08T221W
Type A Ceramic Capacitors
20
10
9
8
7
6
5
4
3
4000
3000
2000
1000
500
400
300
200
5000
900
600
700
800
Transient − mV/A
C − Capacitance − µF
Without TurboTrans
With TurboTrans
PTH08T221W
Type A Ceramic Capacitors
RTT +40 ƪ1*ǒCOń1500Ǔƫ
ƪǒ5 COń1500Ǔ*1ƫ(kW)
(2)
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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12-V INPUT 5-V INPUT
Figure 13. Capacitor Type A, Figure 14. Capacitor Type A,100 ≤C( µF) × ESR(m Ω)≤1000 (e.g. Ceramic) 100 ≤C( µF) × ESR(m Ω)≤1000 (e.g. Ceramic)
Table 4. Type A TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 Volt Input 5 Volt Input
25% load step 50% load step 75% load step C
O
R
TT
C
O
R
TT(4 A) (8 A) (12 A) Minimum Required Minimum RequiredRequired Output TurboTrans Required Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
75 150 225 300 open 300 open65 130 195 420 78.7 430 68.155 110 165 530 33.2 550 30.950 100 150 700 15.4 730 13.745 90 135 835 10.0 870 8.8740 80 120 1000 5.76 1050 4.8735 70 105 1250 2.10 1300 1.6230 60 90 1730 short 4200 short
R
TT
Resistor Selection
The TurboTrans resistor value, R
TT
can be determined from the TurboTrans programming Equation 2 .
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1500 µF require R
TT
to be ashort, 0 Ω.
To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. The valueof R
TT
must be calculated using the minimum required output capacitance determined from Figure 13 andFigure 14 .
18 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
PTH08T220W Type B Capacitors
Transient − mV/A
C − Capacitance − µF
2
7
3
4
5
20
9
8
6
10
Without TurboTrans
With TurboTrans
200
VI = 5 V
300
400
500
600
700
1000
800
900
2000
3000
4000
5000
6000
7000
10000
8000
9000
Transient − mV/A
C − Capacitance − µF
2
7
3
4
5
20
9
8
6
10
Without TurboTrans
With TurboTrans
VI = 12 V
200
300
400
500
600
700
1000
800
900
2000
3000
4000
5000
6000
7000
8000
9000
10000
RTT +40 ƪ1*ǒCOń1100Ǔƫ
ƪǒ5 COń1100Ǔ*1ƫ(kW)
(3)
PTH08T220W , PTH08T221W
www.ti.com
................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
12-V INPUT 5-V INPUT
Figure 15. Capacitor Type B, Figure 16. Capacitor Type B,1000 < C( µF) × ESR(m Ω)≤5000 (e.g. Polymer-Tantalum) 1000 < C( µF) × ESR(m Ω)≤5000 (e.g. Polymer-Tantalum)
Table 5. Type B TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 Volt Input 5 Volt Input
25% load step 50% load step 75% load step C
O
R
TT
C
O
R
TT(4 A) (8 A) (12 A) Minimum Required Minimum RequiredRequired Output TurboTrans Required Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
65 125 190 220 open 220 open50 100 150 270 132 270 13240 80 120 330 56 330 5630 60 90 470 20.5 500 17.425 50 75 600 10.5 650 8.2520 40 60 800 4.12 900 2.3215 30 45 1500 short 1700 short10 20 30 7000 short 10000 short
R
TT
Resistor Selection
The TurboTrans resistor value, R
TT
can be determined from the TurboTrans programming Equation 3 .
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1100 µF require R
TT
to be ashort, 0 Ω. (Equation 3 results in a negative value for R
TT
when C
O
> 1100 µF.)
To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. The valueof R
TT
must be calculated using the minimum required output capacitance determined from Figure 15 andFigure 16 .
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): PTH08T220W PTH08T221W
PTH08T220W Type C Capacitors
Transient − mV/A
C − Capacitance − µF
200
300
400
500
600
700
1000
800
900
2000
3000
4000
5000
6000
7000
8000
9000
10000
VI = 12 V
Without TurboTrans
With TurboTrans
2
7
3
4
5
9
8
6
10
20
Transient − mV/A
C − Capacitance − µF
VI = 5 V
200
300
400
500
600
700
1000
800
900
2000
3000
4000
5000
6000
7000
8000
9000
10000
Without TurboTrans
With TurboTrans
2
7
3
4
5
9
8
6
10
20
RTT +40 ƪ1*ǒCOń1980Ǔƫ
ǒǒ5 COǓ)880
1980 Ǔ*1
(kW)
(4)
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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12-V INPUT 5-V INPUT
Figure 17. Capacitor Type C, Figure 18. Capacitor Type C,5000 < C( µF) × ESR(m Ω)≤10,000(e.g. OS-CON) 5000 < C( µF) × ESR(m Ω)≤10,000(e.g. OS-CON)
Table 6. Type C TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 Volt Input 5 Volt Input
25% Load 50% Load 75% Load C
O
R
TT
C
O
R
TTStep Step Step Minimum Required Required Minimum Required Required(4 A) (8 A) (12 A) Output TurboTrans Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
65 125 190 220 open 220 open50 100 150 270 274 330 12140 80 120 330 121 550 34.830 60 90 470 48.7 630 26.125 50 75 600 28.7 800 16.220 40 60 800 16.2 1150 7.1515 30 45 1300 5.11 1700 1.5010 20 30 7500 short 10000 short
R
TT
Resistor Selection
For V
O
≤3.45V the TurboTrans resistor value, R
TT
can be determined from the TurboTrans programmingEquation 4 . For V
O
> 3.45 V please contact TI for C
O
and R
TT
values.
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1980 µF require R
TT
to be ashort, 0 Ω. (Equation 4 results in a negative value for R
TT
when C
O
> 1980 µF).To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. The valueof R
TT
must be calculated using the minimum required output capacitance determined from Figure 17 andFigure 18 .
20 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
2 5
3 4
6
7
10 9
11 Inhibit/
ProgUVLO
GND
TurboTransAutoTrack
8L
O
A
D
GNDGND
TurboTrans
+Sense
VO
−Sense
VOAdj
VI
VIVO
+Sense
RTT
0kW
C
330 F
I
m
(Required)
CO
1220 F
TypeB
m
RSET
1%
0.05W
PTH08T220W
−Sense
1Smart
Sync
C 2
22 F
I
m
(Required)
WithoutTurboTrans
100mV/div
WithTurboTrans
100mV/div
2.5 A/ s
50%LoadStep
m
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Figure 19. Typical TurboTrans™ Application
Figure 20. TurboTrans Waveform
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Product Folder Link(s): PTH08T220W PTH08T221W
ADJUSTING THE UNDERVOLTAGE LOCKOUT (UVLO)
RUVLO +9690 *ǒ137 VIǓ
ǒ137 VIǓ*585 (kW)
(5)
2
3 4
11
GND
GND
VI
VI
RUVLO
CI
PTH08T220W/221W
Inhibit/UVLO Prog
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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The PTH08T220/221W power modules incorporate an input undervoltage lockout (UVLO). The UVLO featureprevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. Thisenables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude ofcurrent drawn from the regulator ’ s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (V
THD
) voltage. Below the ON threshold, the Inhibitcontrol is overridden, and the module does not produce an output. The hysteresis voltage, which is the differencebetween the ON and OFF threshold voltages, is set at 500 mV. The hysteresis prevents start-up oscillations,which can occur if the input voltage droops slightly when the module begins drawing current from the inputsource.
The UVLO feature of the PTH08T220/221W module allows for limited adjustment of the ON threshold voltage.The adjustment is made via the Inhbit/UVLO Prog control pin (pin 11) using a single resistor (see Figure 21 ).When pin 11 is left open circuit, the ON threshold voltage is internally set to its default value, which is 4.3 volts.The ON threshold might need to be raised if the module is powered from a tightly regulated 12-V bus. Adjustingthe threshold prevents the module from operating if the input bus fails to completely rise to its specifiedregulation voltage.
Equation 5 determines the value of R
UVLO
required to adjust V
THD
to a new value. The default value is 4.3 V, andit may only be adjusted to a higher value.
Table 7 lists the standard resistor values for R
UVLO
for different values of the on-threshold (V
THD
) voltage.
Table 7. Standard R
UVLO
values for Various V
THD
values
V
THD
5.0 V 5.5 V 6.0 V 6.5 V 7.0 V 7.5 V 8.0 V 8.5 V 9.0 V 9.5 V 10.0 V 10.5 V 11.0 V
R
UVLO
88.7 k Ω52.3 k Ω37.4 k Ω28.7 k Ω23.2 k Ω19.6 k Ω16.9 k Ω14.7 k Ω13.0 k Ω11.8 k Ω10.5 k Ω9.76 k Ω8.87 k Ω
Figure 21. Undervoltage Lockout Adjustment Resistor Placement
22 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
Soft-Start Power Up
10
Track
GND
GND
3,4
VIVI
CI
PTH08T220W/221W
2
t − Time − 4ms/div
VO(2V/div)
V (5V/div)
I
II(2 A/div)
PTH08T220W , PTH08T221W
www.ti.com
................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from theTrack pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Trackpin should be directly connected to the input voltage, V
I
(see Figure 22 ).
Figure 22. Defeating the Auto-Track Function
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. Thisallows the module to power up entirely under the control of its internal soft-start circuitry. When power up isunder soft-start control, the output voltage rises to the set-point at a quicker and more linear rate.
From the moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically2 ms – 10 ms) before allowing the output voltage to rise.
Figure 23. Power-Up Waveform
The output then progressively rises to the module ’ s setpoint voltage. Figure 23 shows the soft-start power-upcharacteristic of the PTH08T220/221W operating from a 12-V input bus and configured for a 3.3-V output. Thewaveforms were measured with a 10-A constant current load and the Auto-Track feature disabled. The initial risein input current when the input voltage first starts to rise is the charge current drawn by the input capacitors.Power-up is complete within 15 ms.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Link(s): PTH08T220W PTH08T221W
On/Off Inhibit
11 Inhibit/
UVLO
GND
2
GND
3,4
VIVI
1 = Inhibit Q1
BSS 138
CI
PTH08T220W/221W
t − Time − 4ms/div
VO(2V/div)
II(2 A/div)
V (2V/div)
INH
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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For applications requiring output voltage on/off control, the PTH08T220/221W incorporates an Inhibit control pin.The inhibit feature can be used wherever there is a requirement for the output voltage from the regulator to beturned off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated outputwhenever a valid source voltage is connected to V
I
with respect to GND.
Figure 24 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit inputhas its own internal pull-up. An external pull-up resistor should never be used with the inhibit pin. The input is notcompatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended forcontrol.
Figure 24. On/Off Inhibit Control Circuit
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is thenturned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 15ms. Figure 25 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. Theturn off of Q1 corresponds to the rise in the waveform, V
INH
. The waveforms were measured with a 10-A constantcurrent load.
Figure 25. Power-Up Response from Inhibit Control
24 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
Overcurrent Protection
Overtemperature Protection (OTP)
Differential Output Voltage Remote Sense
PTH08T220W , PTH08T221W
www.ti.com
................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load thatexceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, themodule periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode ofoperation, whereby the module continues in a cycle of successive shutdown and power up until the load fault isremoved. During this period, the average current flowing into the fault is significantly reduced. Once the fault isremoved, the module automatically recovers and returns to normal operation.
A thermal shutdown mechanism protects the module ’ s internal circuitry against excessively high temperatures. Arise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If theinternal temperature exceeds the OTP threshold, the module ’ s Inhibit control is internally pulled low. This turnsthe output off. The output voltage drops as the external output capacitors are discharged by the load circuit. Therecovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreasesby about 10 ° C below the trip point.The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-termreliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits forthe worst-case conditions of ambient temperature and airflow.
Differential remote sense improves the load regulation performance of the module by allowing it to compensatefor any IR voltage drop between its output and the load in either the positive or return path. An IR drop is causedby the output current flowing through the small amount of pin and trace resistance. With the sense pinsconnected, the difference between the voltage measured directly between the V
O
and GND pins, and thatmeasured at the Sense pins, is the amount of IR drop being compensated by the regulator. This should belimited to a maximum of 0.3V. Connecting the +Sense (pin 6) to the positive load terminal improves the loadregulation at the connection point. For optimal behavior the – Sense (pin 7) must be connected to GND (pin 4)close to the module (within 10 cm).
If the remote sense feature is not used at the load, connect the +Sense pin to V
O
(pin5) and connect the – Sensepin to the module GND (pin 4).
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequencydependent components that may be placed in series with the converter output. Examples include OR-ingdiodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote senseconnection they are effectively placed inside the regulation control loop, which can adversely affect thestability of the regulator.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Link(s): PTH08T220W PTH08T221W
Smart Sync
C 2
i
C 1
i
R 1
SET
R 2
SET
PTH08T220W
VI
VI
VO
VO
INH/ UVLO
INH/ UVLO
+Sense
–Sense
GND
Track SYNC TT
V Adj
O
V Adj
O
V 1
O
V 2
O
VI= 5 V
0o
GND
PTH08T240W
+Sense
–Sense
GND
Track SYNC TT
180o
GND
Vcc
GND
Q
Q
PRE
CLR
CLK
D
fclock = 2 Xfmodules
SN74LVC2G74
C 1
o
C 2
o
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Drivingthe Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modulesto the selected frequency. The synchronization frequency can be higher or lower than the nominal switchingfrequency of the modules within the range of 240 kHz to 400 kHz. Synchronizing modules powered from thesame bus eliminates beat frequencies reflected back to the input supply, and also reduces EMI filteringrequirements. Eliminating the low beat frequencies (usually < 10kHz) allows the EMI filter to be designed toattenuate only the synchronization frequency. Power modules can also be synchronized out of phase to minimizeripple current and reduce input capacitance requirements. Figure 26 shows a standard circuit with two modulessyncronized 180 ° out of phase using a D flip-flop.
Figure 26. Smart Sync Schematic
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Product Folder Link(s): PTH08T220W PTH08T221W
Smart Sync Considerations
0.7 1.3 2.1 2.51.7 2.31.91.50.9 1.1
5
6
8
9
11
12
14
15
13
10
7
VI– Input Voltage – V
VO– Output Voltage – V
Meets VORipple
Specification
Increased VORipple
fSW = 300 kHz
0.7 1.3 2.1 2.51.7 2.31.91.50.9 1.1
5
6
8
9
11
12
14
15
13
10
7
VI– Input Voltage – V
VO– Output Voltage – V
fSW = 400 kHz
fSW = 350 kHz
fSW = 300 kHz
fSW = 240 kHz
Auto-Track™ Function
How Auto-Track™ Works
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Operating the PTH08T220W with a low duty cycle may increase the output voltage ripple due to pulse skippingof the PWM controller. When operating at the nominal switching frequency, input voltages greater than (V
O
× 11)may cause the output voltage ripple to increase (typically 2 × ).
Synchronizing to a higher frequency and operating with a low duty cycle may impact output voltage ripple. Whenoperating at 300 kHz, Figure 27 shows the operating region where the output voltage ripple meets the electricalspecifications and the operating region where the output voltage ripple may increase. Figure 28 shows theoperating regions for several switching frequencies. For example, a module operating at 400 kHz and an outputvoltage of 1.2 V, the maximum input voltage that meets the output voltage ripple specification is 10 V. Exceeding10 V may cause in an increase in output voltage ripple. As shown in Figure 28 , operating below 6V allowsoperation down to the minimum output voltage over the entire synchronization frequency range without affectingthe output voltage ripple. See the Electrical Characteristics table for the synchronization frequency range limits.
Figure 27. V
O
Ripple Regions at 300 kHz
(1) (2)
Figure 28. V
O
Ripple Regions
(1) (2)
(1) When operating at the nominal switching frequency refer to the 300 kHz plot.(2) Operation above a given curve may cause the output voltage ripple to increase (typically 2 × ).
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Trackwas designed to simplify the amount of circuitry required to make the output voltage from each module power upand power down in sequence. The sequencing of two or more supply voltages during power up is a commonrequirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSPfamily, microprocessors, and ASICs.
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin
(1)
.This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage israised above the set-point voltage, the module output remains at its set-point
(2)
. As an example, if the Track pinof a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulatedoutput does not go higher than 2.5 V.
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 27
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Typical Application
Notes on Use of Auto-Track™
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages followa common signal during power up and power down. The control signal can be an externally generated masterramp waveform, or the output voltage from another power supply circuit
(3)
. For convenience, the Track inputincorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable risingwaveform at power up.
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Trackcompliant modules. Connecting the Track inputs of two or more modules forces their track input to follow thesame collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a commonTrack control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltagesupervisor IC. See U3 in Figure 29 .
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should bedone at or before input power is applied to the modules. The ground signal should be maintained for at least20 ms after input power has been applied. This brief period gives the modules time to complete their internalsoft-start initialization
(4)
, enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at powerup.
Figure 29 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequencedpower up of PTH08T220/221W modules. The output of the TL7712A supervisor becomes active above an inputvoltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltagehas reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28ms after the input voltage has risen above U3's voltage threshold, which is 4.3 V. The 28-ms time period iscontrolled by the capacitor C
T
. The value of 2.2 µ F provides sufficient time delay for the modules to completetheir internal soft-start initialization. The output voltage of each module remains at zero until the track controlvoltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. Thiscauses the output voltage of each module to rise simultaneously with the other modules, until each reaches itsrespective set-point voltage.
Figure 30 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, V
O
1and V
O
2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.V
TRK
, V
O
1, and V
O
2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltagethreshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,forcing the output of each module to follow, as shown in Figure 31 . Power down is normally complete before theinput voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once themodules recognize that an input voltage is no longer present, their outputs can no longer follow the voltageapplied at their track input. During a power-down sequence, the fall in the output voltage from the modules islimited by the Auto-Track slew rate capability.
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the moduleregulates at its adjusted set-point voltage.2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with rampspeeds of up to 1 V/ms.3. The absolute maximum voltage that may be applied to the Track pin is the input voltage V
I
.4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, itis recommended that the Track pin be held at ground potential.5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (V
I
). When Auto-Track isdisabled, the output voltage rises according to its softstart rate after input power has been applied.6. The Auto-Track pin should never be used to regulate the module's output voltage for long-term, steady-stateoperation.
28 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
+
GND
SENSE
REF
CT
RESET
8
7
2
1
3
5
6
4
U1
U2
U3
+
UVLOProg
Inhibit/
GND
UVLOProg
Inhibit/
GND
AutoTrack TurboTrans
TurboTrans
RTT2
RTT1
AutoTrack
Smart
Sync
+Sense
VO
−Sense
VOAdj
VIPTH08T210W
VO1=3.3V
C 1
O
CO2
RSET1
1.62kW
VI=12V
VCC
RESET
RESIN
TL7712A
RRST
10kW
CT
2.2 Fm
CREF
0.1 Fm
C 1
I
+Sense
VO
−Sense
VOAdj
VI
C 2
I
VO2=1.8V
RSET2
4.75kW
PTH08T220W
t − Time − 20ms/div
VTRK (1V/div)
VO1(1V/div)
VO2(1V/div)
t − Time − 400 s/divm
VTRK (1V/div)
VO1(1V/div)
VO2(1V/div)
PTH08T220W , PTH08T221W
www.ti.com
................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Figure 29. Sequenced Power Up and Power Down Using Auto-Track
Figure 30. Simultaneous Power Up Figure 31. Simultaneous Power DownWith Auto-Track Control With Auto-Track Control
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 29
Product Folder Link(s): PTH08T220W PTH08T221W
Prebias Startup Capability
t-Time-4ms/div
V (1V/div)
O
I (2 A/div)
O
V (1V/div)
IN
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
www.ti.com
A prebias startup condition occurs as a result of an external voltage being present at the output of a powermodule prior to its output becoming active. This often occurs in complex digital systems when current fromanother power source is backfed through a dual-supply logic component, such as an FPGA or ASIC. Anotherpath might be via clamp diodes as part of a dual-supply power-up sequencing arrangement. A prebias can causeproblems with power modules that incorporate synchronous rectifiers. This is because under most operatingconditions, these types of modules can sink as well as source output current.
The PTH family of power modules incorporate synchronous rectifiers, but does not sink current during startup
(1)
,or whenever the Inhibit pin is held low. However, to ensure satisfactory operation of this function, certainconditions must be maintained
(2)
.Figure 33 shows an application demonstrating the prebias startup capability.The startup waveforms are shown in Figure 32 . Note that the output current (I
O
) is negligible until the outputvoltage rises above the voltage backfed through the intrinsic diodes.
The prebias start-up feature is not compatible with Auto-Track. When the module is under Auto-Track control, itsinks current if the output voltage is below that of a back-feeding source. To ensure a pre-bias hold-off one oftwo approaches must be followed when input power is applied to the module. The Auto-Track function musteither be disabled
(3)
, or the module ’ s output held off (for at least 50 ms) using the Inhibit pin. Either approachensures that the Track pin voltage is above the set-point voltage at start up.1. Startup includes the short delay (approximately 10 ms) prior to the output voltage rising, followed by the riseof the output voltage under the module ’ s internal soft-start control. Startup is complete when the outputvoltage has risen to either the set-point voltage or the voltage at the Track pin, whichever is lowest.2. To ensure that the regulator does not sink current when power is first applied (even with a ground signalapplied to the Inhibit control pin), the input voltage must always be greater than the output voltage throughoutthe power-up and power-down sequence.3. The Auto-Track function can be disabled at power up by immediately applying a voltage to the module ’ sTrack pin that is greater than its set-point voltage. This can be easily accomplished by connecting the Trackpin to V
I
.
Figure 32. Prebias Startup Waveforms
30 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
ASIC
+
+
Vo=2.5V
3.3V
VI=5V
R
2.37kW
SET
VCORE VCCIO
Io
PTH08T220W
Track
VIVO
GNDInhibit Vadj
+Sense
CI
+
CO
-Sense
PTH08T220W , PTH08T221W
www.ti.com
................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Figure 33. Application Circuit Demonstrating Prebias Startup
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 31
Product Folder Link(s): PTH08T220W PTH08T221W
Tape & Reel and Tray Drawings
PTHXXT2XX
PTH08T220/221
"X" "Y"
4.38 mm 23.12 mm
DEVICE SUFFIX INFO
TAPE WIDTH 44 mm (1.732")
PITCH 32 mm (1.260")
REEL SIZE 13" DIA.
DEVICES/REEL 250
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
www.ti.com
32 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): PTH08T220W PTH08T221W
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
PTH08T220WAD ACTIVE Through-
Hole Module EAS 11 42 Pb-Free (RoHS) SN N / A for Pkg Type
PTH08T220WAH ACTIVE Through-
Hole Module EAS 11 42 Pb-Free (RoHS) SN N / A for Pkg Type
PTH08T220WAS ACTIVE Surface
Mount Module EAT 11 42 TBD SNPB Level-1-235C-UNLIM/
Level-3-260C-168HRS
PTH08T220WAST ACTIVE Surface
Mount Module EAT 11 250 TBD SNPB Level-1-235C-UNLIM/
Level-3-260C-168HRS
PTH08T220WAZ ACTIVE Surface
Mount Module BAT 11 42 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR
PTH08T220WAZT ACTIVE Surface
Mount Module BAT 11 250 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR
PTH08T221WAD ACTIVE Through-
Hole Module EAS 11 42 Pb-Free (RoHS) SN Level-1-235C-UNLIM/
Level-3-260C-168HRS
PTH08T221WAS ACTIVE Surface
Mount Module EAT 11 42 TBD SNPB Level-1-235C-UNLIM/
Level-3-260C-168HRS
PTH08T221WAST ACTIVE Surface
Mount Module EAT 11 250 TBD SNPB Level-1-235C-UNLIM/
Level-3-260C-168HRS
PTH08T221WAZ ACTIVE Surface
Mount Module BAT 11 42 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR
PTH08T221WAZT ACTIVE Surface
Mount Module BAT 11 250 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2011
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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