TELEDYNE COMPONENTS 24 D Mi 4917b0e2 ooob44Ns = TONEFAZ SD 5200 SEMICONDUCTOR N-CHANNEL ENHANCEMENT-MODE QUAD D-MOS FET DRIVER ARRAY ORDERING INFORMATION Sorted Chips in Waffle Pack __ SD5200CHP | 16-Pin Plastic Dual In-Line Package | SD5200N | Description gov, 80 ohm: FEATURES APPLICATIONS M@ Normally OFF configuration @ +30V Analog Switch Drivers @ Low Interelectrode capacitance @ Wide-Band Dual Differential Amplifiers @ High-speed switching ABSOLUTE MAXIMUM RATINGS (per channel, Ta = +25C unless otherwise noted) Vps Drain-Source Voltage ........2 200s +30Vdce Pp Total Package Power Dissipation Vsp Source-Drain Voltage ........eees . +0,5Vde (at or below Ta = +25C)...... reve B4OMW Vpp Drain-Body Voltage ........seceee es +30Vdc Linear Derating Factor.......... 10.7mMW/C Vsp Source-Body Voliage ....... cece ees +15Vde Pp Single Device Power Dissipation Vas Gate-Source Voltage ........6-5 ... +25Vde (at or below Ta = +25C) 0.0005 + 300mW Vap Gate-Body Voltage .......... scene 4+25Vdc Linear Derating Factor ........... 5.0mW/ C Gate-Body Voltage ...... cece scenes -0,3Vde Tj Operating Junction Temperature Vap Gate-Drain Voltage ....-.. cece eeu +25Vde RANGe oo. eee ce reece ees enes -56 to +85C Ip Continuous Drain Current ......-.665 50mA Ts Storage Temperature Range .. 55 to + 150C SCHEMATIC DIAGRAM CHIP CONFIGURATION PIN CONFIGURATION 1 -=7 os Nic. ae "omy | a Vo 10-00-01 rol [Eon Nic HOmm4 wot yt PAD PAD PAD PAD 63 y Tit NO. _ FUNCTIO! NO, _ FUNCTION TOP VIEW " @-ow wo {Pon ! 1 Gate No. i 7 Gate No. 3 J 2 Source No. 1 8 Source No. 3. g 3 Source No. 2 9 Source No. 4 DIMENSIONS suusTRATE 4 Gate No. 2 10 Gate No. 4 , 5 DrainNo.2 11._sODrain Nov 4: 16-Pin Plastic DIP Note: Pin numbers correspond to 6 Drain No. 3 12 Drain No. 1 See Package 10 mensions: .041 * .033 .013 inches Package Pin-out D 3-116 0-88-68 4250 c-03 UT eemeeee ie teliaenenate nd femme ae aTELEDYNE COMPONENTS ede D we 8907602 OOOL4SO 1 TOIFA Z4 SEMICONDUCTOR ELECTRICAL CHARACTERISTICS (Ta = +25C unless otherwise noted) $D5200 # CHARACTERISTIC UNITS TEST CONDITIONS MIN | TYP | MAX Drain-Source 1 BVps Breakdown Voltage 30 35 Vv Ip = 10nA, Vas = Ves = 0 Source-Substrate Ig = 102A, Van = 0 2 BVsp Breakdown Voltage 15 V Drain Open Gate-Body 3 2 laps Leakage Current 1.0 pA | Vag = 25V,Vpe = Vee = 0 < Gate-Source Vos = Vesilp = 1.024 41 @ | Vasith) Threshold Voltage 0.5 | 1.0 2.0 Vv Vsp =0 5 50 | 80 | ohms | Veg =5V 6 ros(on) Drain-Source 30 ohms | Vas = 10V Ip = 1MA 7 ON Resistance 23 ohms | Vag = 15V Vspg =0 8 19 ohms | Vas = 20V Common-Source Vpg = 10V, Ip = 20mMA 9 Sts Forward Transconductance | 10 12 mmhos | f = 1KHz,Vgp =0 Gate Node : 10 C(gs + gd + gb) Capacitance 24 | 35 pF Q = Drain Node 11] & | cgd + db) Capacitance 13] 15 pF | f= 1Mbz $ P Vps = 10V a Source Node Vas = Vas = 15V 12 igs + sb) Capacitance 3.5 | 4.0 pF Reverse Transfer 13 Cidg) Capacitance 03 | 05 pF 14 Cr Cross Talk -107 dB 3-117 4251 C-04 T-YB-AS $D5200TELEDYNE COMPONENTS - THHRAZ SEMICONDUCTOR Package 1 (TO-18) TO-206AA 0.1080.210 (4778=8.0) SEATING OGM--0 0448 ates. X ania All Dimenstons tn inches and (millimeters) Package 2 (TO-52) 4-Lead SEATING oits0.1s9 QR-i8H _ AilDimensions In Inches and (millimeters) Package3 (TO-72) TO-206AF 9.200 0.219 (6.200 8.68 0.i7e 0.181 0.100 0.210 All Dimenstons In Inches and (millimeters) 4296 F-07 28E D @@ 4917602 COOL49S 1 a PACKAGE DATA T-90-a0 = T-Fl-20 Package 4 (TO-78) 28S jose . Ti? 70) 0.336 (429) | 0308 (419) MIN C85) Lg 0.040 751 ~| 71021 r of tax 0370 BOTTOM VIEW All Dimensions in inches and (millimeters) Package 5 (TO-92) TO-226AA 0.1780.185 (4.445 = 4.000) LEADS FIT INTO U. 0.0160.018_ Hoe 08S} Mt DIA HOLE (TYP) 0.0450.058 ramsey | aoa 0.085=0.008 9 ~ 0,0480 085 F (13=1397) -B-t++ {ioc (2. Ris2ars 0.138 | 1343) 1 0.030.013 MIN (0.076=0.330) (4.458.21) All Dimensions In Inches and (millimeters) 7. Package 6 (TO-39) TO-205AF whell ! une ate | * 1 Alt Dimensions In Inches and (millimeters) 4-2 0-88-6- TELEDYNE COMPONENTS ade Dd TaFaz SEMICONDUCTOR Package7 (TO-237)- ass | (MR ae 4-8) All Dimensions In inches and (millimeters) Package 8 8-Pin Plastic Dip & 0.008 o =f 0.055 oy be (1.40) (oe) Ve my 8917602 OOOb4SL 3 mm T-90-26 = PACKAGE DATA |-a0 ; Package 10 16-Pin Plastic [ Dip 1 . 2310 (7.874) 1209 (7.112) 236 (6 969) 5 16 (215 (5.480) Le .770 (19,668) MAX HI a To 2 lL co Alo fa7eg 2060 (1528) 023 1.584) 096 sta! Os All Dimenstons In inches and (millimeters) Package 11 18-Pin Plastic Dip PARTE an Tne ey ee oe eT Tor viene 0.405 (10.29) MAX 0929 (8.13) are ee sd [rose ean 12346 MA sai MR 0.200 0x0 a at ae a Fe PLANE ta we TYP ti vse (p| | a laa 8 ap a a ee pe ga All bimenetons in Inches and (millimeters) All Dimensions in Inches and (millimeters) Package 9 14-Pin Plastic Dip Package 12 20-Pin Plastic Dip 1 q = owere 200 17.1721 0.260 0,005 TSS (6.380 .0.127) r 14 235 (5.960) i= 770 (19 56) MAX o aon 0.030 cab ts (ace) (0.7 am 0,130 0.08 0.040 2620) | _ 0, . ; 20) ; | (3.902 0,127) mt [riitene oes elt agdeeg aii cathy 015 ( 3810} All Dimensions In inches and (millimeters) 7 0.009 (0.229) ates 0.016 a ~ 0.125 sa ere (3.175) MIN 0.100 + 0.010 x 0.018+0,003__ |] _(2'540:.0.254) 0.075 0,008 (0.457 0.076) (1.905 0.127) All Dimensions in Inches and (millimeters) 4297 F-08 4-3TELEDYNE COMPONENTS 4298 eae D mm 8917602 GO06497 5 mm TORAZ SEMICONDUCTOR Package 13 8-Pin Ceramic Dip 9.320 (6,128) 0290 (7.388) F 0.200 + | (6.08) Lt oF 0.027 eed ve 165 (3 810) 280) 20 0.020 (0808) || toe gap sega (0223) 90 Gara 0.406 4~ 0.065 (2. 9410 zea) 0,048 (1.143) 9.976 (9.528 | All Dimensions In Inches and (millimeters) 1-90-20 Pale ac DATA Package 16 20-Pin Ceramic Dip 1 20 0.290 LJ id bs ot eb be a ba Ll pte $,025 (28.036) MAX 0.060 (4,524) 0.015 (0.381) > t |. Q.110 (2.794) 0.030 (0.762) 0.125 (3.175) (0.584) 9.090 2286) olla SS 6.015 a2 Gay All Dimensions in Inches and (millimeters) Package 14 (TO-116) 14-Pin Ceramic Dip 1 14 0.920 (8.128) 0.290 (7.368 po-0.785 (19.54) MAX: o3t0 7.874 9009 (ze 0.220 (8,098) i 175 (4.45 l ut 0.200 (5.08 . ese Gas |] 9a8 7 88 Oe sea ga (ogee All Dimensions In Inches and (millimeters) Package 17 NONE All Dimensions In Inches and (milllmeters) Package 15 16-Pin Ceramic Dip 0.329 (8.128) 0.290 (7.368) 0.016 (0.361) 0.175 645) TT Lt [vv Va Be 0.015 (0.381) 0.008 (0.203) 41 4 ee we ae ll fore oa) All Dimenstons In Inches and (millimeters) Package 18 PLCC-44 Res y a tH on (L FY qd q a q iH} ibd q 7 q q q q a ag oo 28 (eh 20 aa All Dimenstons In Inches and (millimeters) 4-4 F-09ge TELEDYNE COMPONENTS ToaHAZz SEMICONDUCTOR Package 19 (SO-8) 2 SE D M@@ 45917602 GOOL44S 7_ me T-FO0~26 PACKAGE DATA Ty 4-236 Package 22 (SOT-23) TO-236AA glee 0.020 (0.50) _ 0.0551 (1.40) AL q A 0.015 Gan + |e 0.0472 iy Oo __v. ; 3 FE 3 0.0984 (2,50) Qisa gag 1 2 0.0830 (2.10} 0150 O22 an ay GT] Oe ; 0. 1.02 : I | 9.0236 | + caso (85) ~ 0.0177 0.0807, (2.04 ; y Lo (oo) d.0701 ea ase ane Os) [oie a f 1 y_ 0.0236 SET! ti F O.oa7 >| fe 00180 os a He 0.0098 |g > (20) 0.0051 oy 0004 G19 9.089 9.09 9.09 (077) 0.0040 9.1197 (9.04) GC 0.0034 . ToS 0.028 (0.6 0.25) $7100 (0.85) ti een Gi 0.1102 (2,80) pa) All Dimenstons In Inches and (millimeters) All Dimensions tn Inches and (millimeters) Package 20 (SO-14) Package 23 (SOT-89) TO-243AA 0.181 (4,60 or 0.070 0.08: (4.80) ~ (80) (162) | (ia) LT ee 0.167 . 081 oes (2,89) (2.28) 35) } L238 | em em 3,94 } en | L f 0.018 (0,48) ed J lle 0.015 (0.38) | (1.04) 0.020 (0.53) 0.017 : (0.80) 0.018 (0.44) 0.014 oat Gay B09 Bae Oa (180) "Fo aie oy (as ae Bo 5] OBS om All Dimenstons in inches and (millimeters) Package 21 (SO-16) 9.030 2008 (020) o 0.004 (0.10) (0.19) All Dimensions In inches and (millimeters) 4299 F-10 All Dimenstons In inches and (millimeters) Package 24 (SOT-143) 9.080 (2.03) 0,070 (1.78) 0.055 (4.99) 0.047 (1,20) (0.38 00 (0.7 ) 0.003 (0. All Dimensions In Inches and (millimeters)