CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Series/Type: Ordering code: 0.25 F, 900 V Z63000Z2910Z 1Z21 Date: Version: 2015-07-27 1.0 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 CeraLinkTM capacitor for fast-switching semiconductors (header 1 + top left bar): Identification/Classification 2 Low profile (LP) series (header 2 + bottom left header bar): Ordering code: (top right header bar) Z63000Z2910Z 1Z21 Series/Type: (bottom right header bar) 0.25 F, 900 V Preliminary data (optional): Preliminary data Department: PPD PI C Date: 2015-07-27 Version: 1.0 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Applications * Designed for 1200 V semiconductor modules * Power converters and inverters * DC link/ snubber capacitor for power converters and inverters Features * * * * * * * * * * * High ripple current capability Low equivalent serial inductance (ESL) Low equivalent serial resistance (ESR) Low power loss Low dielectric absorption Optimized for high frequencies up to several MHz Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high temperatures High reliability For reflow soldering only Construction * * * * * RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated copper-invar lead frame Epoxy resin adhesive PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 2 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Dimensional drawings Recommended solder pad: Polarity: Dimensions in mm PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 3 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Electrical specifications Operating voltage at maximum attenuation capability Vop = 800 V Rated voltage VR = 900 V Withstand voltage (@ Vws, 25 C, 7 s) Vws = 1300 V Initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 C) C0 = 0.07 F 20% Typical effective capacitance (@ Vop, 0.5 VRMS, 1 kHz, 25 C) Ceff,typ = 0.13 F Typical nominal capacitance* (@ Vop, quasistatic, 25 C) Cnom,typ > 0.25 F Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 C) tan < 0.02 Insulation resistance (@ Vop, t > 240 s, 25 C) Rins,typ > 1 G Operating device temperature Tdevice -40 C... +125 C Temperature range (limited time excursion 5% of operating time) Tdevice +125 C... +150 C * See glossary (page 12) for definition of the nominal capacitance approx. 1.2 g Weight of device Typical values 1) ESL Iop 1) Iop 1) ESR ESR 0 VDC, 0.5 VRMS, 0 VDC, 0.5 VRMS, 100 kHz 100 kHz 25 C, 1 MHz 25 C, 1 kHz TA = 85 C TA = 105 C m nH ARMS ARMS 43.5 10.8 2.5 3.6 2.9 Normal operating current without forced cooling at Tdevice = 125 C. Higher values permissible at reduced life time. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 4 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Typical characteristics as a function of temperature and voltage (VAC = 0.5 VRMS, frequency = 1 kHz) All given temperatures are device temperatures. The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100% values correspond to Ceff,typ and tan which are given on page 4 of this data sheet. 140 100 80 Bias [V] 0 800 900 120 110 Capacitance [%] 120 Capacitance [%] 130 T/C -25 25 75 125 100 90 80 70 60 60 50 0 100 200 300 400 500 Voltage [VDC] 600 700 800 T/C -25 25 75 125 600 500 400 300 200 50 Temperature [C] 100 150 Bias [V] 0 800 900 600 500 400 300 200 100 100 0 0 700 700 Dissipation Factor [%] 40 -50 900 Dissipation Factor [%] 40 0 100 200 300 400 500 Voltage [VDC] 600 700 800 0 -50 900 500 50 Temperature [C] 100 150 600 T/C -25 25 75 125 400 0 Bias [V] 0 800 900 500 ESR [%] ESR [%] 400 300 200 300 200 100 100 0 0 100 200 300 400 500 Voltage [VDC] 600 700 800 900 0 -50 PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 0 50 Temperature [C] 100 150 2015-07-27 Page 5 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Typical capacitance values as a function of voltage Small signal capacitance: 0.5 VRMS, 1 kHz, 25 C Variable large signal small signal 200 175 Capacitance [%] Large signal capacitance: Quasistatic (slow variation of the voltage), 25 C The nominal capacitance is defined as the large signal capacitance at Vop. See glossary for further information. 150 125 100 75 50 The effective capacitance is defined as the small signal capacitance at Vop. 0 100 200 300 400 500 600 Voltage [VDC] 700 800 900 Typical impedance and ESR as a function of frequency VDC = 0 V, VAC = 0.5 VRMS, Tdevice = 25 C 10000 Variable |Z| [Ohm] ESR [Ohm] 1000 |Z|, ESR [Ohm] 100 10 1 0.1 0.01 1000 10000 100000 1000000 Frequency [Hz] 10000000 Typical permissible current as a function of frequency Tamb [C] 85 105 Measurement performed at Vop. The values correspond to a device temperature of 125 C. No active cooling was used. Normal operation current [Arms] 3.5 3.0 2.5 2.0 1.5 1.0 0 20 40 60 Frequency [kHz] 80 100 Aging The capacitance has an aging behavior which shows a decrease of capacitance with time. The typical aging rate is about 2.5% per logarithmic decade in hours. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 6 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Marking of components Manufacturer's logo CeraLinkTM type Nominal capacitance Rated voltage Lot number, 9 digits PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 7 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Packaging The CeraLinkTM will be delivered in a blister tape and will be packed in a cardboard box. Part orientation: Dimensions in mm PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 8 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Recommended reflow soldering profile Profile feature SAC Sn95.5Ag3.8Cu0.7 N2 atmosphere Preheat and soak - Temperature min - Temperature max - Time Tsmin Tsmax tsmin to tsmax 150 C 200 C 60 ... 180 seconds Average ramp-up rate TSmax to Tp 3 C/ second max. Liquidus temperature Time at liquidus temperature TL tL 217 C 60 ... 150 seconds Peak package body temperature Tp 1) 3) Time (tp) within 5 C of specified classification temperature (Tc) Average ramp-down rate Time 25 C to peak temperature 245 C ... 260 C max. 30 seconds Tp to TSmax 2) 3) 6 C/ second max. maximum 8 minutes 1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (t p) is defined as a supplier minimum and a user maximum. Notes: All temperatures refer to topside of the package, measured on the package body surface. Max. number of reflow cycles: 3 After the soldering process, the capacitance is lowered. Applying V R to the device will re-establish the capacitance. The components are suitable for reflow soldering to JEDEC J-STD-020D. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 9 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data General technical information Storage Only store CeraLinkTM capacitors in their original packaging. Do not open the package prior to processing. Storage conditions in original packaging: temperature -25 C to +45 C, relative humidity 75% annual average, maximum 95%, dew precipitation is inadmissible. Do not store CeraLinkTM capacitors where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CeraLinkTM may stick together, causing problems during mounting. Avoid contamination of the CeraLinkTM surface during storage, handling and processing. Avoid storing CeraLinkTM devices in harmful environments where they are exposed to corrosive gases (e.g. SOx, Cl). Use CeraLinkTM as soon as possible after opening factory seals such as polyvinyl-sealed packages. Solder CeraLinkTM components within 6 months after shipment from EPCOS. Handling Do not drop CeraLinkTM components or allow them to be chipped. Do not touch CeraLinkTM with your bare hands - gloves are recommended. Avoid contamination of the CeraLinkTM surface during handling. The CeraLinkTM was tested to withstand the board flex test defined in the AEC-Q200 Rev. D, method 005. The CeraLinkTM uses copper lead frames to prevent mechanical stress to the ceramic. Too much bending causes open mode. Avoid high mechanical stress like twisting after soldering on a PCB. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 10 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Mounting Do not subject CeraLinkTM devices to mechanical stress when encapsulating them with sealing material or overmolding with plastic material. Encapsulation may lead to worse heat dissipation too. Please ask for further information. Do not scratch the electrodes before, during or after the mounting process. Make sure contacts and housings used for assembly with CeraLinkTM components are clean before mounting. The surface temperature of an operating CeraLinkTM can be higher than the ambient temperature. Ensure that adjacent components are placed at a sufficient distance from a CeraLinkTM to allow proper cooling. Avoid contamination of the CeraLinkTM surface during processing. Soldering guidelines The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. Use resin-type or non-activated flux. Bear in mind that insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack. Excessive usage of solder paste can reduce the mechanical robustness of the device, whereas insufficient solder may cause the CeraLinkTM to detach from the PCB. Use an adequate amount of solder paste, but on the landing pads only. If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the CeraLinkTM surface and deteriorate its insulation resistance. Insufficient or improper cleaning of the CeraLinkTM may cause damage to the component. Excessive washing like ultrasonic cleaning, can affect the connection between the ceramic chip and the outer electrode. To avoid this, we give the following recommendation: o Power: 20 W/l max. o Frequency: 40 kHz max. o Washing time: 5 minutes max. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 11 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Glossary Initial capacitance C0: Effective capacitance Ceff: Nominal capacitance Cnom: is the value at the origin of the hysteresis without any applied direct voltage. occurs at Vop and is measured with an applied ripple voltage of 0.5 VRMS and 1 kHz. The CeraLinkTM is designed to have its highest capacitance value at the operating voltage Vop. is the value derived by the tangent of the mean hysteresis as the derivation of the mean hysteresis is dQ/dV ~ C. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 12 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Symbols and terms AC C0 Ceff,typ Cnom,typ DC ESL ESR Iop LP PCB PLZT Rins SAC TA tan Alternating current Initial capacitance Typical effective capacitance Typical nominal capacitance Direct current Equivalent serial inductance Equivalent serial resistance Operating ripple current, root mean square value of sinusoidal AC current Low profile Printed circuit board Lead lanthanum zirconium titanate Insulation resistance Tin silver copper alloy; lead-free solder paste Ambient temperature Dissipation factor Tdevice Device temperature. Tdevice = TA + T (T defines the self-heating of the device due to applied current). Vop VR VRMS Vws T Operating voltage Rated voltage Root mean square value of sinusoidal AC voltage Withstand voltage Increase of temperature during operation PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 13 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Cautions and warnings General Not for use in resonant circuits, where a voltage of alternating polarity occurs. Not for AC applications. Consult your EPCOS representative for further details. If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity. Some parts of this publication contain statements about the suitability of our CeraLinkTM components for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CeraLinkTM devices in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CeraLinkTM components for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CeraLinkTM devices with the properties described in the product specification are suitable for use in a particular customer application. Do not use EPCOS CeraLinkTM components for purposes not identified in our specifications. Ensure the suitability of a CeraLinkTM in particular by testing it for reliability during design-in. Always evaluate a CeraLinkTM component under worst-case conditions. Pay special attention to the reliability of CeraLinkTM devices intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). Design notes Consider derating at higher operating temperatures. As a rule, lower temperatures and voltages increase the life time of CeraLinkTM devices. If steep surge current edges are to be expected, make sure your design is as low-inductive as possible. In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. Specified values only apply to CeraLinkTM components that have not been subject to prior electrical, mechanical or thermal damage. The use of CeraLinkTM devices in line-to-ground applications is therefore not advisable, and it is only allowed together with safety countermeasures such as thermal fuses. PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 14 of 16 CeraLinkTM capacitor for fast-switching semiconductors Low profile (LP) series Z63000Z2910Z 1Z21 0.25 F, 900 V Preliminary data Operation Use CeraLinkTM only within the specified operating temperature range. Use CeraLinkTM only within specified voltage and current ranges. The CeraLink has to be operated in a dry atmosphere, which must not contain any additional chemical vapors or substances. Environmental conditions must not harm the CeraLinkTM. Use the capacitors under normal atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not permissible. Prevent a CeraLinkTM from contacting liquids and solvents. Avoid dewing and condensation. During operation, the CeraLinkTM can produce audible noise due to its piezoelectric characteristic. EPCOS CeraLinkTM components are mainly designed for encased applications. Under all circumstances avoid exposure to: o direct sunlight o rain or condensation o steam, saline spray o corrosive gases o atmosphere with reduced oxygen content This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. Display of ordering codes for EPCOS products The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes PPD PI C Please read Cautions and warnings and Important notes at the end of this document. 2015-07-27 Page 15 of 16 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 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