TMA166BI - Sanken Electric Co., Ltd.

SANKEN ELECTRIC CO., LTD.

http://www.sanken-ele.co.jp/en/

TMA16xB Series

Features and Benefits

▪ Exceptional reliability

▪ Small fully-molded SIP package with heatsink mounting

for high thermal dissipation and long life

▪ VDRM of 400 or 600 V

▪ 16 ARMS on-state current

▪ Uniform switching

▪ UL Recognized Component (File No.: E118037) (suffix I)

Triac (Bidirectional Triode Thyristor)

Typical Applications

Package: 3-pin SIP (TO-3PF)

Not to scale

Applications

▪ Residential and commercial appliances: vacuum cleaners,

rice cookers, TVs, home entertainment

▪ White goods: washing machines

▪ Office automation power control, photocopiers

▪ Motor control for small tools

▪ Temperature control, light dimmers, electric blankets

▪ General use switching mode power supplies (SMPS)

Description

This Sanken triac (bidirectional triode thyristor) is designed

for AC power control, providing reliable, uniform switching

for full-cycle AC applications.

In comparison with other products on the market, the TMA16x

series provides increased isolation voltage (2000 VACRMS),

guaranteed for up to 1 minute, and greater peak nonrepetitive

off-state voltage, VDSM (700 V). In addition, commutation

dv/dt and (dv/dt)c are improved.

Halogen

Lamp

Gate

Controller

Heater control

(for example, LBP. PPC, MFP)

Two-phase motor control

(for example, washing machine)

In-rush current control

(for example, SMPS)

28105.07

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

Absolute Maximum Ratings

Characteristic Symbol Notes Rating Units

Peak Repetitive Off-State Voltage VDRM

TMA164Bx RGREF = ∞

400 V

TMA166Bx 600 V

Peak Non-Repetitive Off-State Voltage VDSM

TMA164Bx RGREF = ∞

500 V

TMA166Bx 700 V

Isolation Voltage VISO AC RMS applied for 1 minute between lead and case 2000 V

RMS On-State Current IT(RMS)

50/60 Hz full cycle sine wave,

total Conduction angle (α+) + (α–) = 360°,

TC = 98°C

16 A

Surge On-State Current ITSM

f = 60 Hz Full cycle sine wave, peak value, non-repetitive,

initial TJ = 125°C

190 A

f = 50 Hz 180 A

I2t Value for Fusing I2t Value for 50 Hz half cycle sine wave, 1 cycle, ITSM = 180 A 160 A2

• s

Peak Gate Current IGM f ≥ 50 Hz, duty cycle ≤ 10% 2 A

Peak Gate Power Dissipation PGM f ≥ 50 Hz, duty cycle ≤ 10% 5 W

Average Gate Power Dissipation PGM(AV) TJ < TJ(max) 0.5 W

Junction Temperature TJ–40 to 125 ºC

Storage Temperature Tstg –40 to 125 ºC

Terminal List Table

Number Name Function

1 T1 Main terminal, gate referenced

2 T2 Main terminal connect to signal side

3 G Gate control

Pin-out Diagram

Thermal Characteristics May require derating at maximum conditions

Characteristic Symbol Test Conditions Value Units

Package Thermal Resistance

(Junction to Case) RθJC For AC 1.6 ºC/W

All performance characteristics given are typical values for circuit or

system baseline design only and are at the nominal operating voltage and

an ambient temperature, TA, of 25°C, unless oth er wise stated.

123

Selection Guide

Part Number VDRM

(V) UL-Recognized

Component Package Packing

TMA164B(I) 400 Yes

3-pin fully molded SIP with

heatsink mount 30 pieces per tube

TMA164B-L 400 –

TMA166B(I) 600 Yes

TMA166B-L 600 –

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

ELECTRICAL CHARACTERISTICS

Characteristics Symbol Test Conditions Min. Typ. Max. Unit

Off-State Leakage Current IDRM

VD = VDRM, TJ = 125°C, RGREF = ∞ using test circuit 1 – – 2.0 mA

VD = VDRM, TJ = 25°C, RGREF = ∞ using test circuit 1 – – 100 μA

On-State Voltage VTM IT = 20 A, TJ = 25°C – – 1.4 V

Gate Trigger Voltage VGT

Quadrant I: T2+, G+

VD = 12 V, RL = 20 Ω, TJ = 25°C

– – 1.5 V

Quadrant II: T2+, G– – – 1.5 V

Quadrant III: T2–, G– – – 1.5 V

Gate Trigger Current IGT

Quadrant I: T2+, G+

VD = 12 V, RL = 20 Ω, TJ = 25°C

– – 30 mA

Quadrant II: T2+, G– – – 30 mA

Quadrant III: T2–, G– – – 30 mA

Gate Non-trigger Voltage VGD VD = VDRM × 0.5, RL = 4 kΩ, TJ = 125°C 0.2 – – V

Critical Rising Rate of

Off-State Voltage during

Commutation*

(dv/dt)c TJ = 125°C, VD = 400 V, (di/dt)c = –8 A/ms, ITP = 2 A 10 – – V/μs

*Where ITP is the peak current through T2 to T1.

Test Circuit 1 Gate Trigger Characteristics

RGREF = ∞

GT1 [ – ]

T2 [ + ]

G [ – ]

T1 [ – ]

T2 [ + ]

G [ + ]

T1 [ + ]

T2 [ – ]

G [ – ]

T1 [ + ]

T2 [ – ]

G [ + ]

Quadrant II Quadrant I

+IGT

+T2

–T2

Polarities referenced to T1

–IGT

Quadrant III Quadrant IV

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

AA = Conduction angle

Supply VAC

On-State

Currrent

VGATE

VGT

ITSM

Commutation Timing Diagrams

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

Performance Characteristics at TA = 25°C

100

0.6 1.0 1.4 1.8 2.2 2.6

(max) (V)

(max) (A)

150

125

100

240

220

200

180

160

140

120

100

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

1 10 100

TSM

(A)

0 5 10 15 20 0 5 10 15 20

0.1

100

10 100 1000 10 000 –60 –40 –20 20 40 60 80 100 120 1400

0.1

Maximum On-State

Current versus

Maximum On-State

Voltage

Gate Voltage

versus

Gate Current

Surge On-State

Current versus

Quantity of

Cycles

Case Temperature

versus On-State

RMS Current

On-State Average

Power Dissipation

versus Maximum

On-State

RMS Current

Proportional Change

of Typical

Trigger Voltage

versus

Junction Temperature

TJ = 125°C

f = 50 Hz

full cycle sine wave

total Conduction angle

(A+) + (A–) = 360°

initial TJ = 125°C

full cycle sine wave

total Conduction angle

(A+) + (A–) = 360°

full cycle sine wave

total Conduction angle

(A+) + (A–) = 360°

TJ = 25°C

T(AV)

(W)

T(RMS)

(A)

(V)

(mA)

Quantity of Cycles

(°C)

GT (TJ)

(V) / V

GT (TJ = 25°C )

(V)

Proportional Change

of Typical

Trigger Current

versus

Junction Temperature

GT (TJ)

(A) / I

GT (TJ = 25°C )

(A)

0.1

Proportional Change

of Typical

Holding Current

versus

Junction Temperature

H (TJ)

(A) / I

H (TJ = 25°C )

(A)

TJ (°C)

–60 –40 –20 20 40 60 80 100 120 1400

TJ (°C)

–60 –40 –20 20 40 60 80 100 120 1400

TJ (°C)

Quadrant I (T2+, G+) and

Quadrant II (T2+, G–)

Quadrant III (T2–, G–)

RGREF = 1 kΩ

98°C

VGM = 10 V

VGT (–40°C)

= 2 V VGT (25°C)

= 1.5 V

VGD = 0.2 V

IGM = 2 A

IGT (–40°C)

= 100 mA

IGT (25°C) = 30 mA

5 W

G(AV)

0.5 W

T(RMS)

(max) (A)

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

0.1

0.001 0.01 0.1 1 10 100

(°C/W)

Transient Thermal Impedence versus Triac Voltage Pulse Duration

For AC

(s)

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

Leadframe plating Pb-free. Device

meets RoHS requirements.

15.6 ±0.2

Ø3.2 ±0.2

4.4

1.5

5.5 ±0.2

3.45 ±0.2

3.35 ±0.2

Terminal dimension at case surface

1.05 +0.2

–0.1

1.75 +0.2

–0.1

2.15 +0.2

–0.1 0.65 +0.2

–0.1

23 ±0.3

9.5 ±0.2

5.5 ±0.2

3.3

(16.2)

1.6

Branding

Area

XXXXXXXX

XXXXX XXXXX

Branding codes (exact appearance at manufacturer discretion):

1st line, type: MA16xB

2nd line left, lot: YM

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

2nd line right, lot: DD

Where: DD is the date

12 3

5.45 ±0.1

Gate burr: 0.3 mm (max.), mold flash may appear at opposite side

Terminal core material: Cu

Terminal treatment: Ni plating and Pb-free solder dip

Leadform: 700

Package: TO-3PF (FM100)

Dimensions in millimeters

View A

0.7 MAX

View B

0.7 MAX

View A View B

Gate protrusion

TO-3PF Package Outline Drawing

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

Because reliability can be affected adversely by improper

storage environments and handling methods, please observe

the following cautions.

Cautions for Storage

• Ensure that storage conditions comply with the standard

temperature (5°C to 35°C) and the standard relative

humidity (around 40% to 75%); avoid storage locations

that experience extreme changes in temperature or

humidity.

• Avoid locations where dust or harmful gases are present

and avoid direct sunlight.

• Reinspect for rust on leads and solderability of the

products that have been stored for a long time.

Cautions for Testing and Handling

When tests are carried out during inspection testing and

other standard test periods, protect the products from

power surges from the testing device, shorts between

the product pins, and wrong connections. Ensure all test

parameters are within the ratings specified by Sanken for

the products.

Remarks About Using Silicone Grease with a Heatsink

• When silicone grease is used in mounting the products on

a heatsink, it shall be applied evenly and thinly. If more

silicone grease than required is applied, it may produce

excess stress.

• Volatile-type silicone greases may crack after long periods

of time, resulting in reduced heat radiation effect. Silicone

greases with low consistency (hard grease) may cause

cracks in the mold resin when screwing the products to a

heatsink.

Our recommended silicone greases for heat radiation

purposes, which will not cause any adverse effect on the

product life, are indicated below:

Type Suppliers

G746 Shin-Etsu Chemical Co., Ltd.

YG6260 Momentive Performance Materials Inc.

SC102 Dow Corning Toray Co., Ltd.

Cautions for Mounting to a Heatsink

• When the flatness around the screw hole is insufficient, such

as when mounting the products to a heatsink that has an

extruded (burred) screw hole, the products can be damaged,

even with a lower than recommended screw torque. For

mounting the products, the mounting surface flatness should

be 0.05 mm or less.

• Please select suitable screws for the product shape. Do not

use a flat-head machine screw because of the stress to the

products. Self-tapping screws are not recommended. When

using self-tapping screws, the screw may enter the hole

diagonally, not vertically, depending on the conditions of hole

before threading or the work situation. That may stress the

products and may cause failures.

• Recommended screw torque: 0.490 to 0.686 N●m (5 to 7

kgf●cm).

• For tightening screws, if a tightening tool (such as a driver)

hits the products, the package may crack, and internal

stress fractures may occur, which shorten the lifetime of

the electrical elements and can cause catastrophic failure.

Tightening with an air driver makes a substantial impact.

In addition, a screw torque higher than the set torque can

be applied and the package may be damaged. Therefore, an

electric driver is recommended.

When the package is tightened at two or more places, first

pre-tighten with a lower torque at all places, then tighten

with the specified torque. When using a power driver, torque

control is mandatory.

Soldering

• When soldering the products, please be sure to minimize

the working time, within the following limits:

260±5°C 10±1 s (Flow, 2 times)

380±10°C 3.5±0.5 s (Soldering iron, 1 time)

• Soldering should be at a distance of at least 1.5 mm from

the body of the products.

Electrostatic Discharge

• When handling the products, the operator must be

grounded. Grounded wrist straps worn should have at

least 1 MΩ of resistance from the operator to ground to

prevent shock hazard, and it should be placed near the

operator.

• Workbenches where the products are handled should be

grounded and be provided with conductive table and floor

mats.

• When using measuring equipment such as a curve tracer,

the equipment should be grounded.

• When soldering the products, the head of soldering irons

or the solder bath must be grounded in order to prevent

leak voltages generated by them from being applied to the

products.

• The products should always be stored and transported in

Sanken shipping containers or conductive containers, or

be wrapped in aluminum foil.

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

Typical Mounting

Configuration

M3 Screw

Device

Heatsink

Flat Washer

Split Washer

M3 Nut

SANKEN ELECTRIC CO., LTD.

Triac (Bidirectional Triode Thyristor)

TMA16xB Series

28105.07

• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the

latest revision of the document before use.

• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-

ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or

any other rights of Sanken or any third party which may result from its use.

• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-

ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures

including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device

failure or malfunction.

• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-

ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).

When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and

its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever

long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales

representative to discuss, prior to the use of the products herein.

The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required

(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.

• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the

degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the

load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,

derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such

as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,

instantaneous values, maximum values and minimum values must be taken into consideration.

In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of

derating of junction temperature affects the reliability significantly.

• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically

or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance

and proceed therewith at your own responsibility.

• Anti radioactive ray design is not considered for the products listed herein.

• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-

tion network.

• The contents in this document must not be transcribed or copied without Sanken's written consent.