TMS320VC5510/5510A Fixed-Point
Digital Signal Processors
Data M anual
Literature Number: SPRS076O
June 2000 − Revised September 2007
Literature Number: SPRS076O
June 2000 − Revised September 2007
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Revision History
3
June 2000 − Revised July 2006 SPRS076N
REVISION HISTORY
This data sheet revision history highlights the technical changes made to the SPRS076N device-specific data
sheet to make it an SPRS076O revision.
PAGE(s)
NO. ADDITIONS/CHANGES/DELETIONS
27 Section 3.2.1 System Register (SYSR), Table 3−5, System Register (SYSR) Bit Functions:
Added HDS1 and HDS2 to “Enables the internal pullups on the . . .” sentence in the HPE function description.
Revision History
4June 2000 − Revised July 2006SPRS076N
Contents
5
June 2000 − Revised September 2007 SPRS076O
Contents
Section Page
1 Features 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Introduction 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Description 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Pin Assignments 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Signal Descriptions 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 Functional Overview 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Memory 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.1 On-Chip Dual-Access RAM (DARAM) 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.2 On-Chip Single-Access RAM (SARAM) 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.3 On-Chip ROM 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.4 Instruction Cache 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.5 Memory Map 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.6 Bootloader 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Peripherals 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1 System Register (SYSR) 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2 Direct Memory Access (DMA) 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3 Enhanced Host Port Interface (EHPI) 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.4 General-Purpose Input/Output Port (GPIO) 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 CPU Register Description 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 Peripheral Register Description 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Interrupts 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1 IFR and IER Registers 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.2 Interrupt Timing 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Notices Concerning CLKOUT Operation 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1 CLKOUT Voltage Level 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.2 CLKOUT Value During Reset 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4 Support 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability 47. . . . . . . . . . . . . . . . .
4.1.1 Initialization Requirements for Boundary Scan Test 47. . . . . . . . . . . . . . . . . . . . . . . . . .
4.1.2 Boundary Scan Description Language (BSDL) Model 47. . . . . . . . . . . . . . . . . . . . . . . .
4.2 Documentation Support 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Device and Development-Support Tool Nomenclature 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 TMS320VC5510/5510A Device Nomenclature 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5 Electrical Specifications 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Absolute Maximum Ratings 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 Electrical Specifications 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Recommended Operating Conditions 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Electrical Characteristics Over Recommended Operating Case Temperature Range 51. . . . . . .
5.5 Timing Parameter Symbology 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
6June 2000 − Revised September 2007SPRS076O
Section Page
5.6 Clock Options 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.1 Clock Generation in Bypass Mode (DPLL Disabled) 53. . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.2 Clock Generation in Lock Mode (DPLL Synthesis Enabled) 54. . . . . . . . . . . . . . . . . . .
5.7 Memory Timing 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.1 Asynchronous Memory Timing 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.2 Synchronous-Burst SRAM (SBSRAM) Timing 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.3 Synchronous DRAM (SDRAM) Timing 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8 HOLD and HOLDA Timings 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.9 Reset Timings 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.10 External Interrupt Timings 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.11 XF Timings 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.12 General-Purpose Input/Output (IOx) Timings 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.13 TIN/TOUT Timings 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14 Multichannel Buffered Serial Port (McBSP) Timings 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14.1 McBSP Transmit and Receive Timings 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14.2 McBSP General-Purpose I/O Timing 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14.3 McBSP as SPI Master or Slave Timing 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15 Enhanced Host-Port Interface (EHPI) Timing 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6 Mechanical Data 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Package Thermal Resistance Characteristics 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 Packaging Information 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
7
June 2000 − Revised September 2007 SPRS076O
List of Figures
Figure Page
2−1 TMS320VC5510/5510A GGW and ZGW MicroStar BGA Packages (Bottom View) 13. . . . . . . . . . . .
3−1 TMS320VC5510/5510A Functional Block Diagram 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−2 TMS320VC5510/5510A Memory Map 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−3 System Register (SYSR) Bit Layout 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−4 EHPI Memory Map 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−5 I/O Direction Register (IODIR) Bit Layout 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−6 I/O Data Register (IODATA) Bit Layout 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−7 IFR0, IER0, DBIFR0, and DBIER0 Bit Locations 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−8 IFR1, IER1, DBIFR1, and DBIER1 Bit Locations 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4−1 Device Nomenclature for the TMS320VC5510/5510A 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1 3.3-V Test Load Circuit 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−2 Bypass Mode Clock Timing 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−3 External Multiply-by-N Clock Timing 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−4 Asynchronous Memory Read Timing 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−5 Asynchronous Memory Write Timing 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−6 SBSRAM Read Timing 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−7 SBSRAM Write Timing 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−8 Two SDRAM Read Commands (Active Row) 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−9 Two SDRAM WRT Commands (Active Row) 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−10 SDRAM ACTV Command 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−11 SDRAM DCAB Command 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−12 SDRAM REFR Command 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−13 SDRAM MRS Command 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−14 HOLD/HOLDA Timing 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−15 Reset Timing 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−16 External Interrupt Timing 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−17 XF Timing 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−18 General-Purpose Input/Output (IOx) Signal Timings 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−19 TIN/TOUT Timing When Configured as Inputs 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−20 TIN/TOUT Timing When Configured as Outputs 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−21 McBSP Receive Timings 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−22 McBSP Transmit Timings 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−23 McBSP General-Purpose I/O Timings 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−24 McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 75. . . . . . . . . . . . . . . . . . . . . . . .
5−25 McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 76. . . . . . . . . . . . . . . . . . . . . . . .
Figures
8June 2000 − Revised September 2007SPRS076O
Figure Page
5−26 McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 77. . . . . . . . . . . . . . . . . . . . . . . .
5−27 McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 78. . . . . . . . . . . . . . . . . . . . . . . .
5−28 EHPI Nonmultiplexed Read/Write Timings 80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−29 EHPI Multiplexed Memory (HPID) Access Read/Write Timings Without Autoincrement 81. . . . . . . . .
5−30 EHPI Multiplexed Memory (HPID) Access Read Timings With Autoincrement 82. . . . . . . . . . . . . . . . .
5−31 EHPI Multiplexed Memory (HPID) Access Write Timings With Autoincrement 83. . . . . . . . . . . . . . . . .
5−32 EHPI Multiplexed Register Access Read/Write Timings 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
9
June 2000 − Revised September 2007 SPRS076O
List of Tables
Table Page
2−1 Pin Assignments 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2−2 Signal Descriptions 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−1 DARAM Blocks 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−2 SARAM Blocks 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−3 Standard On-Chip ROM Contents 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−4 TMS320VC5510/5510A Boot Configurations 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−5 System Register (SYSR) Bit Functions 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−6 DMA Sync Events 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−7 I/O Direction Register (IODIR) Bit Functions 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−8 I/O Data Register (IODATA) Bit Functions 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−9 CPU Registers 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−10 Peripheral Bus Controller Configuration Registers 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−11 Instruction Cache Registers 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−12 External Memory Interface Registers 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−13 DMA Configuration Registers 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−14 Clock Generator Registers 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−15 Timer Registers 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−16 Multichannel Serial Port #0 Registers 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−17 Multichannel Serial Port #1 Registers 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−18 Multichannel Serial Port #2 Registers 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−19 GPIO Registers 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−20 Device Revision ID Registers 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−21 Interrupt Table 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1 CLKIN in Bypass Mode Timing Requirements 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−2 CLKOUT in Bypass Mode Switching Characteristics 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−3 CLKIN in Lock Mode Timing Requirements 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−4 CLKOUT in Lock Mode Switching Characteristics 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−5 Asynchronous Memory Cycles Timing Requirements 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−6 Asynchronous Memory Cycles Switching Characteristics 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−7 Synchronous-Burst SRAM Cycle Timing Requirements 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−8 Synchronous-Burst SRAM Cycle Switching Characteristics 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−9 Synchronous DRAM Cycle Timing Requirements 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−10 Synchronous DRAM Cycle Switching Characteristics 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−11 HOLD and HOLDA Timing Requirements 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−12 HOLD and HOLDA Switching Characteristics 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−13 Reset Timing Requirements 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−14 Reset Switching Characteristics 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−15 External Interrupt Timing Requirements 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−16 XF Switching Characteristics 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−17 General-Purpose Input/Output (GPIO) Pins Configured as Inputs Timing Requirements 68. . . . . . .
5−18 General-Purpose Input/Output (GPIO) Pins Configured as Inputs Switching Characteristics 68. . . .
5−19 TIN/T OUT Pins Configured as Inputs Timing Requirements 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−20 TIN/T OUT Pins Configured as Outputs Switching Characteristics 69. . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
10 June 2000 − Revised September 2007SPRS076O
Table Page
5−21 McBSP Timing Requirements 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−22 McBSP Switching Characteristics 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−23 McBSP General-Purpose I/O Timing Requirements 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−24 McBSP General-Purpose I/O Switching Characteristics 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−25 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) 74. . . . . . . . . .
5−26 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) 74. . . . . .
5−27 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) 76. . . . . . . . . .
5−28 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) 76. . . . . . .
5−29 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) 77. . . . . . . . . .
5−30 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) 77. . . . . .
5−31 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) 78. . . . . . . . . .
5−32 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) 78. . . . . . .
5−33 EHPI Timing Requirements 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−34 EHPI Switching Characteristics 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6−1 Thermal Resistance Characteristics (Ambient) 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6−2 Thermal Resistance Characteristics (Case) 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features
11
June 2000 − Revised September 2007 SPRS076O
1 Features
DHigh-Performance, Low-Power,
Fixed-Point TMS320C55x
Digital Signal Processor (DSP)
− 6.25-/5-ns Instruction Cycle Time
− 160-/200-MHz Clock Rate
− One/Two Instructions Executed per Cycle
− Dual Multipliers (Up to 400 Million
Multiply-Accumulates Per Second
(MMACS))
− Two Arithmetic/Logic Units
− One Internal Program Bus
− Three Internal Data/Operand Read Buses
− Two Internal Data/Operand Write Buses
DInstruction Cache (24K Bytes)
D160K x 16-Bit On-Chip RAM Composed of:
− Eight Blocks of 4K × 16-Bit
Dual-Access RAM (DARAM) (64K Bytes)
− 32 Blocks of 4K × 16-Bit
Single-Access RAM (SARAM)
(256K Bytes)
D16K × 16-Bit On-Chip ROM (32K Bytes)
D8M × 16-Bit Maximum Addressable
External Memory Space
D32-Bit External Memory Interface (EMIF)
With Glueless Interface to:
− Asynchronous Static RAM (SRAM)
− Asynchronous EPROM
− Synchronous DRAM (SDRAM)
− Synchronous Burst SRAM (SBSRAM)
DProgrammable Low-Power Control of Six
Device Functional Domains
DOn-Chip Peripherals
− Two 20-Bit T imers
− Six-Channel Direct Memory Access
(DMA) Controller
− Three Multichannel Buffered Serial Ports
(McBSPs)
− 16-Bit Parallel Enhanced Host-Port
Interface (EHPI)
− Programmable Digital Phase-Locked
Loop (DPLL) Clock Generator
− Eight General-Purpose I/O (GPIO) Pins
and Dedicated General-Purpose
Output (XF)
DOn-Chip Scan-Based Emulation Logic
DIEEE Std 1149.1† (JTAG) Boundary Scan
Logic
D240-Terminal MicroStar BGA
(Ball Grid Array) (GGW Suffix)
D240-Terminal MicroStar BGA
(Ball Grid Array) (ZGW Suffix) [Lead-Free]
D3.3-V I/O Supply Voltage
D1.6-V Core Supply Voltage
TMS320C55x and MicroStar BGA are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.
†IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Introduction
12 June 2000 − Revised September 2007SPRS076O
2 Introduction
This section describes the main features of the TMS320VC5510/5510A digital signal processors (DSPs), lists
the pin assignments, and describes the function of each pin. This data manual also provides a detailed
description section, electrical specifications, parameter measurement information, and mechanical data
about the available packaging.
NOTE: This data manual is designed to be used in conjunction with the TMS320C55x DSP
Functional Overview (literature number SPRU312).
2.1 Description
The TMS320VC5510/5510A (5510/5510A) fixed-point digital signal processors (DSPs) are based on the
TMS320C55x DSP generation CPU processor core. The C55xDSP architecture achieves high performance
and low power through increased parallelism and total focus on reduction in power dissipation. The CPU
supports an internal bus structure composed of one program bus, three data read buses, two data write buses,
and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform
up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up
to two data transfers per cycle independent of the CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication
in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use
of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power
consumption. These resources are managed in the address unit (AU) and data unit (DU) of the C55x CPU.
The C55x DSP generation supports a variable byte width instruction set for improved code density. The
instruction unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions
for the program unit (PU). The program unit decodes the instructions, directs tasks to AU and DU resources,
and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution
of conditional instructions. The 5510/5510A also includes a 24K-byte instruction cache to minimize external
memory accesses, improving data throughput and conserving system power.
The 5510/5510A peripheral set includes an external memory interface (EMIF) that provides glueless access
to asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such
as synchronous DRAM and synchronous burst SRAM. Three full-duplex multichannel buffered serial ports
(McBSPs) provide glueless interface to a variety of industry-standard serial devices, and multichannel
communication with up to 128 separately enabled channels. The enhanced host-port interface (EHPI) is a
16-bit parallel interface used to provide host processor access to internal memory on the 5510/5510A. The
EHPI can be configured in either multiplexed or non-multiplexed mode to provide glueless interface to a wider
variety of host processors. The DMA controller provides data movement for six independent channel contexts
without CPU intervention, providing DMA throughput of up to two 16-bit words per cycle. Two general-purpose
timers, eight general-purpose I/O (GPIO) pins, and digital phase-locked loop (DPLL) clock generation are also
included.
The 5510/5510A is supported by the industry’s leading eXpressDSP software environment including the
Code Composer Studiointegrated development environment, DSP/BIOS software kernel foundation, the
TMS320 DSP Algorithm Standard, and the industry’s largest third-party network. Code Composer Studio
features code generation tools including a C-Compiler, Visual Linker, simulator, Real-Time Data Exchange
(RTDX), XDS510 emulation device drivers, and Chip Support Libraries (CSL). DSP/BIOS is a scalable
real-time software foundation available for no cost to users of Texas Instruments’ DSP products providing a
pre-emptive task scheduler and real-time analysis capabilities with very low memory and megahertz
overhead. The TMS320 DSP Algorithm Standard is a specification of coding conventions allowing fast
integration of algorithms from different teams, sites, or third parties into the application framework. Texas
Instruments’ extensive DSP third-party network of over 400 providers brings focused competencies and
complete solutions to customers.
C55x, eXpressDSP, Code Composer Studio, DSP/BIOS, TMS320, RTDX, and XDS510 are trademarks of Texas Instruments.
Introduction
13
June 2000 − Revised September 2007 SPRS076O
Texas Instruments (TI) has also developed foundation software available for the 5510/5510A. The C55x DSP
Library (DSPLIB) features over 50 C-callable software kernels (FIR/IIR filters, Fast Fourier Transforms (F F Ts),
and various computational functions). The DSP Image/Video Processing Library (IMGLIB) contains over
20 software kernels highly optimized for C55x DSPs and is compiled with the latest revision of the C55x DSP
code generation tools. These imaging functions support a wide range of applications that include
compression, video processing, machine vision, and medical imaging.
The TMS320C55x DSP core was created with an open architecture that allows the addition of
application-specific hardware to boost performance on specific algorithms. The hardware extensions on the
5510/5510A strike the perfect balance of fixed function performance with programmable flexibility, while
achieving low-power consumption, and cost that traditionally has been difficult to find in the video-processor
market. The extensions allow the 5510/5510A to deliver exceptional video codec performance with more than
half its bandwidth available for performing additional functions such as color space conversion, user-interface
operations, security, TCP/IP, voice recognition, and text-to-speech conversion. As a result, a single
5510/5510A DSP can power most portable digital video applications with processing headroom to spare. For
more information, see the TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s
Reference (literature number SPRU098). For more information on using the the DSP Image Processing
Library, see the TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number
SPRU037).
2.2 Pin Assignments
Figure 2−1 illustrates the ball locations for the 240-pin GGW and ZGW ball grid array (BGA) packages and
is used in conjunction with Table 2−1 to locate signal names and ball grid numbers.
15 1613 141110978 12
U
T
P
M
N
L
K
J
R
56324
G
E
F
D
B
C
1
A
H
17
Figure 2−1. TMS320VC5510/5510A GGW and ZGW MicroStar BGA Packages (Bottom View)
Introduction
14 June 2000 − Revised September 2007SPRS076O
Table 2−1. Pin Assignments
BGA BALL # SIGNAL BGA BALL # SIGNAL BGA BALL # SIGNAL BGA BALL # SIGNAL
A1 VSS A2 A9 A3 DVDD A4 A8
A5 CVDD A6 A4 A7 DVDD A8 D2
A9 VSS A10 VSS A11 SDRAS A12 DVDD
A13 SDCAS A14 CVDD A15 HD10 A16 VSS
A17 VSS B1 VSS B2 XF B3 D9
B4 D7 B5 D5 B6 D3 B7 A2
B8 A0 B9 CLKMEM B10 SDA10 B11 HD2
B12 SDWE B13 HD1 B14 HDRY B15 HD3
B16 HD0 B17 HDS1 C1 A10 C2 D13
C3 D10 C4 A6 C5 A7 C6 A5
C7 A3 C8 D0 C9 HD4 C10 HD5
C11 HD6 C12 HD7 C13 HD8 C14 HD9
C15 HR/W C16 HCS C17 TRST D1 DVDD
D2 D14 D3 D11 D4 D8 D5 D6
D6 D4 D7 D1 D8 A1 D9 HD15
D10 HD14 D11 HD13 D12 HD12 D13 HD11
D14 HDS2 D15 HA11 D16 HA0 D17 DVDD
E1 A11 E2 D15 E3 D12 E4 CE3
E5 BOOTM3 E6 CVDD E7 CVDD E8 NC
E9 NC E10 CVDD E11 NC E12 NC
E13 RSVD9 E14 HA12 E15 HA10 E16 HA1/HCNTL1
E17 RST_MODE F1 DVDD F2 A13 F3 A12
F4 A16 F5 CVDD F13 RSVD8 F14 HA9
F15 HA2/HAS F16 CLKIN F17 CVDD G1 CE2
G2 A17 G3 A15 G4 A14 G5 NC
G13 RSVD7 G14 HA8 G15 HA3 G16 RESET
G17 HA13 H1 VSS H2 CE1 H3 A19
H4 A18 H5 NC H13 RSVD6 H14 HA4
H15 CLKOUT H16 HA14 H17 VSS J1 VSS
J2 CE0 J3 A21 J4 A20 J5 NC
J13 RSVD5 J14 HA5 J15 HA15 J16 HA7
J17 VSS K1 IO7 K2 BE0 K3 BE1
K4 IO0 K5 CVDD K13 RSVD4 K14 TMS
K15 HBE0 K16 HA16 K17 HA6 L1 CVDD
L2 IO6 L3 BE2 L4 BE3 L5 NC
L13 RSVD3 L14 EMU1/OFF L15 TDO L16 TDI
L17 TCK M1 IO5 M2 SSWE M3 SSOE
M4 IO1/BOOTM0 M5 NC M13 RSVD2 M14 HA18
M15 HA17 M16 HBE1 M17 DVDD N1 DVDD
N2 IO4 N3 D16 N4 SSADS N5 NC
N6 CVDD N7 NC N8 NC N9 NC
N10 CVDD N11 NC N12 NC N13 RSVD1
N14 HINT N15 HCNTL0 N16 HMODE N17 HA19
P1 IO3/BOOTM2 P2 CLKS1 P3 DR1 P4 D19
P5 D22 P6 D23 P7 D24 P8 CLKS2
P9 FSX0 P10 D31 P11 D28 P12 INT4
P13 ARDY P14 HOLDA P15 TIN/TOUT0 P16 CLKMD
Introduction
15
June 2000 − Revised September 2007 SPRS076O
Table 2−1. Pin Assignments (Continued)
BGA BALL # SIGNALBGA BALL #SIGNALBGA BALL #SIGNALBGA BALL #SIGNAL
P17 CVDD R1 CVDD R2 FSR1 R3 D18
R4 D20 R5 CLKR2 R6 FSR2 R7 DR2
R8 D26 R9 FSX2 R10 DX0 R11 INT5
R12 INT0 R13 INT2 R14 ARE R15 CLKX1
R16 EMU0 R17 TIN/TOUT1 T1 D17 T2 IO2/BOOTM1
T3 CLKR1 T4 D21 T5 FSR0 T6 DR0
T7 D25 T8 D27 T9 D29 T10 D30
T11 NC T12 NMI T13 AWE T14 INT3
T15 FSX1 T16 DX1 T17 VSS U1 VSS
U2 VSS U3 CLKR0 U4 CVDD U5 CLKS0
U6 DVDD U7 CLKX0 U8 CLKX2 U9 VSS
U10 VSS U11 DX2 U12 CVDD U13 INT1
U14 DVDD U15 AOE U16 HOLD U17 VSS
Introduction
16 June 2000 − Revised September 2007SPRS076O
2.3 Signal Descriptions
Table 2−2 lists each signal, function, and operating mode(s) grouped by function. See Section 2.2 for exact
pin locations based on package type.
Table 2−2. Signal Descriptions
SIGNAL
NAME TYPE†OTHER‡DESCRIPTION
EMIF - ADDRESS BUS
A[21:0] O/Z E,F External memory address bus (byte address). Address all external memory (program and
data). Since A[23:22] are redundant to the CE[3:0] memory space selects in terms of memory
addressing capability, A[23:22] are not externally provided.
EMIF - CONTROL SIGNALS COMMON TO ALL MEMORY TYPES
CE0
CE1
CE2
CE3 O/Z E,F External memory space enables. Select one of four external memory ranges based on the
address.
BE0
BE1
BE2
BE3 O/Z E,F
Byte-enable control. Can be used as chip selects for external memory. These signals respond
according to the data width of the memory access. 8-bit accesses cause a single byte enable to
respond. 16-bit accesses cause two byte enables to respond. 32-bit accesses cause all four byte
enables to respond.
CLKMEM O/Z E,F Memory interface clock (for SDRAM / SBSRAM). Clock for synchronizing the external
synchronous memories to the C55x external memory interface.
EMIF - DATA BUS
D[31:0] I/O/Z D,E,F External data bus. Provides data exchange between external memories and the C55x external
memory interface.
The bus holders on D[31:0] are controlled by the BH bit in the system register (SYSR).
EMIF - BUS ARBITRATION
HOLD I − Hold request. HOLD is asserted by an external host to request control of the address, data and
control signals.
HOLDA O/Z F Hold acknowledge. HOLDA is asserted by the DSP to indicate that the DSP is in the HOLD state
and that the EMIF address, data and control signals are in a high-impedance state, allowing the
external memory interface to be accessed by other devices.
EMIF - ASYNCHRONOUS MEMORY CONTROL SIGNALS
ARE Asynchronous memory read enable. ARE acts as a strobe during asynchronous memory reads
only.
AOE O/Z E,F Asynchronous memory output enable. AOE indicates whether a memory access is a read
(low) or a write (high).
AWE Asynchronous memory write enable. AWE acts as a strobe during asynchronous memory
writes only.
ARDY I
Asynchronous memory ready input. ARDY indicates that an external device is ready for a bus
transaction to be completed. If the device is not ready (ARDY is low), the processor extends the
memory access by one cycle and checks ARDY again. The ARDY signal is sampled at the end
of the STROBE period in the memory access.
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Introduction
17
June 2000 − Revised September 2007 SPRS076O
Table 2−2. Signal Descriptions (Continued)
SIGNAL
NAME DESCRIPTIONOTHER‡
TYPE†
EMIF - SYNCHRONOUS BURST SRAM CONTROL SIGNALS
SSADS
O/Z
E,F
SBSRAM address strobe. SSADS is active (low) during the period of the SBSRAM access when
the address is made available to the external memory by the DSP.
SSOE O/Z E,F SBSRAM output enable. SSOE is active (low) during read accesses to SBSRAM.
SSWE SBSRAM write enable. SSWE is active (low) during write accesses to SBSRAM.
EMIF - SYNCHRONOUS DRAM CONTROL SIGNALS
SDRAS SDRAM row address strobe. SDRAS is active (low) during the ACTV, DCAB, REFR, and MRS
commands.
SDCAS
O/Z
E,F
SDRAM address column strobe. SDCAS is active (low) during reads, writes, and the REFR and
MRS commands.
SDWE
O/Z
E,F
SDRAM write enable. SDWE is active (low) during writes, and the DCAB and MRS commands.
SDA10 SDRAM A10 address (address/autoprecharge disable). SDA10 is used during reads, writes,
and all commands.
MULTICHANNEL BUFFERED SERIAL PORT SIGNALS
CLKR0
CLKR1
CLKR2 I/O/Z C,F,G,H Serial shift clock reference for the receiver
DR0
DR1
DR2 I G Serial receive data input
FSR0
FSR1
FSR2 I/O/Z F,G,H Frame synchronization signal for the receiver
CLKX0
CLKX1
CLKX2 I/O/Z C,F,G,H Serial shift clock reference for the transmitter
DX0
DX1
DX2 O/Z F,H Serial transmit data output
FSX0
FSX1
FSX2 I/O/Z F,G,H Frame synchronization signal for the transmitter
CLKS0
CLKS1
CLKS2 I G External clock source to the sample rate generator
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Introduction
18 June 2000 − Revised September 2007SPRS076O
Table 2−2. Signal Descriptions (Continued)
SIGNAL
NAME DESCRIPTIONOTHER‡
TYPE†
ENHANCED HOST-PORT INTERFACE (EHPI)
HA[19:3]
HA2/HAS
HA1/HCNTL1
HA0 I J
Host address bus:
In non-multiplexed mode (HMODE pin high):
HA[19:0] functions as the host address bus only
In multiplexed mode (HMODE pin low):
HA[19:3] are disabled
HA2/HAS functions as HAS (Host Address Strobe). Hosts with multiplexed address and data pins
may require HAS to latch the address in the HPIA register.
HA1/HCNTL1 functions as HCNTL1 (Host Control Input) and with HCNTL0 determines the type
of transaction being performed.
HD[15:0] I/O/Z D,F Host data bus. Provides data exchange between the host and C55x EHPI.
The bus holders on HD[15:0] are controlled by the HBH bit in the system register (SYSR).
HCS I
ËËËËË
Ë
ËËË
Ë
ËËËËË
JHost chip select. HCS is the select input for the EHPI and must be driven low during accesses.
If the EHPI is not used, HCS must be driven high.
HA2/HAS I
ËËËËË
ËËËËË
JHost address strobe. Operates as HAS when HMODE is low (multiplexed mode). Hosts with
multiplexed address and data pins may require HAS to latch the address in the HPIA register.
HR/W I J Host read or write select. Controls the direction of the EHPI transfer.
HDS1
I
J
Host data strobes. HDS1 and HDS2 are driven by the host read and write strobes to control data
HDS2 I J
Host data strobes. HDS1 and HDS2 are driven by the host read and write strobes to control data
transfers.
HRDY O/Z F,J Host ready (from DSP to host). HRDY informs the host when the EHPI is ready for the next
transfer.
HBE0
I
K
EHPI byte enables. HBE0 and HBE1 are driven low selectively by the host to indicate whethe
r
the transaction involves the lower byte only, the upper byte only, or both.
HBE1
I K As of revision 2.1, the byte-enable function on the EHPI will no longer be supported. These pin
s
must be driven low by an external device, by external pulldown resistors or by the interna
l
pulldown circuit controlled by the HPE bit in the SYSR register.
HMODE I J Host multiplexed/non-multiplexed mode select. When HMODE is high, the EHPI operates in
nonmultiplexed mode. When HMODE is low, the EHPI operates in multiplexed mode.
HCNTL0
I
J
Host control selects. HCNTL0 and HCNTL1 select host accesses to EHPI address, data or
HA1/HCNTL1 I J
Host control selects. HCNTL0 and HCNTL1 select host accesses to EHPI address, data or
control registers. HA1/HCNTL operates as HCNTL when HMODE is low (multiplexed mode).
HINT O/Z F Host interrupt (from DSP to host). This output is used to interrupt the host. HINT is high
following reset.
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Introduction
19
June 2000 − Revised September 2007 SPRS076O
Table 2−2. Signal Descriptions (Continued)
SIGNAL
NAME DESCRIPTIONOTHER‡
TYPE†
INTERRUPT AND RESET SIGNALS
RESET I C Device reset. RESET causes the DSP to terminate execution and causes reinitialization of the
CPU and peripherals. The response of the DSP after reset is determined by the RST_MODE pin.
RST_MODE I
Device reset mode control. RST_MODE controls how a device reset is handled.
As of revision 2.1, the RST_MODE function will no longer be supported. RST_MODE will be
driven low internally. After reset, the CPU will branch to the reset vector and begin execution.
The external state of the RST_MODE pin will have no effect on device operation.
INT0
INT1
INT2
INT3
INT4
INT5
I C Maskable external interrupts. INT0−INT5 are prioritized and are maskable via the interrupt
enable registers (IER0 and IER1) and the Interrupt Mode bit (INTM in ST1_55). INT0−INT5 can
be polled and reset via the Interrupt Flag Registers (IFR0 and IFR1).
NMI I C Nonmaskable external interrupt. NMI is an external interrupt that cannot be masked by the
interrupt enable registers (IER0 and IER1). When NMI is activated, the interrupt is always
performed.
JTAG EMULATION
TCK I A,C
IEEE Standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty
cycle. The changes on the test access port (TAP) of input signals TDI and TMS are clocked into
the TAP controller, instruction register, or selected test data register on the rising edge of TCK.
Changes at the TAP output signal TDO occur on the falling edge of TCK.
TDI I A IEEE Standard 1149.1 test data input. TDI is clocked into the selected register (instruction or
data) on the rising edge of TCK.
TDO O − IEEE Standard 1149.1 test data output. The contents of the selected register (instruction or
data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except
when the scanning of data is in progress.
TMS I A IEEE Standard 1149.1 test mode select. This serial control input is clocked into the TAP
controller on the rising edge of TCK.
TRST I B
IEEE Standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system
control o f the operations of the device. If TRST is not connected, or driven low, the device operates
in its functional mode, and the IEEE standard 1149.1 signals are ignored.
This pin has an on-chip pulldown circuit to provide control of the pin when it is not externally
connected. An external pullup resistor should not be connected to this pin.
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Introduction
20 June 2000 − Revised September 2007SPRS076O
Table 2−2. Signal Descriptions (Continued)
SIGNAL
NAME DESCRIPTIONOTHER‡
TYPE†
JTAG EMULATION (CONTINUED)
EMU0 I/O/Z A Emulation pin 0. When TRST is driven low, EMU0 must be high for activation of the OFF
condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system
and is defined as input/output by way of the IEEE standard 1449.1 scan system.
EMU1/OFF I/O/Z A
Emulation pin 1 / disable all outputs. When TRST is driven high, EMU1/OFF is used as an
interrupt t o o r from the emulator system and is defined as input/output by way of the IEEE standard
1149.1 scan system. When TRST is driven low , EMU1/OFF is configured as OFF. The EMU1/OFF
signal, when active low, puts all output drivers into the high-impedance state. Note that OFF is
used exclusively for testing and emulation purposes (not for multiprocessing applications).
Therefore, for the OFF feature, the following apply:
TRST = low
EMU0 = high
EMU1/OFF = low
RSVD[1:9] I/O Reserved. Reserved for future emulation purposes. These pins should be left unconnected.
CLOCK SIGNALS
CLKIN I C Clock input
CLKOUT O/Z F Clock output. CLKOUT can represent the internal CPU clock or can be divided down to generate
a slower clock by programming the CLKDIV field in the system register (SYSR).
CLKMD I C
Clock mode select. CLKMD selects the mode of the clock generator after reset. When CLKMD
is low after reset, the clock generator will run at the same frequency as CLKIN. If CLKMD is high
after reset, the clock generator will run at one-half of the frequency of CLKIN. The clock generator
can later be reprogrammed in software.
TIMERS
TIN/TOUT0
I/O/Z
F,H
Timer 0 input/output. When configured as an output, TIN/TOUT0 generates a pulse or toggles
when on-chip Timer 0 counts down to zero. When configured as an input, TIN/TOUT0 is used
as a clock reference for Timer 0. The operation of this pin is configured in the timer control register
(TCR0).
TIN/TOUT1
I/O/Z
F,H
Timer 1 input/output. When configured as an output, TIN/TOUT1 generates a pulse or toggles
when on-chip Timer 1 counts down to zero. When configured as an input, TIN/TOUT1 is used
as a clock reference for Timer 1. The operation of this pin is configured in the timer control register
(TCR1).
GENERAL-PURPOSE I/O SIGNALS
IO7
IO6
IO5
IO4
IO3/BOOTM2
IO2/BOOTM1
IO1/BOOTM0
IO0
I/O/Z F,G,H
General-purpose configurable inputs/outputs. IO[7:0] can be individually configured as inputs
or outputs via the GPIO direction register (IODIR). Data can be read from inputs or data written
to outputs via the GPIO Data Register (IODATA). In addition, the bootloader uses IO4 as an output
during the boot process. For detailed information on the operation of the bootloader, see the Using
the TMS320VC5510 Bootloader application report (literature number SPRA763).
Boot Mode Selection signals. BOOTM[2:0] are sampled following reset to configure the boot
mode for the DSP. These signals are shared with IO[3:1]. After boot is complete, these signals
can be used as general-purpose inputs/outputs.
BOOTM3 I A Boot Mode Selection signal. BOOTM3 is sampled during the operation of the on-chip
bootloader in conjunction with BOOTM[2:0] to configure the boot mode.
XF O/Z F,H External flag output
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Introduction
21
June 2000 − Revised September 2007 SPRS076O
Table 2−2. Signal Descriptions (Continued)
SIGNAL
NAME DESCRIPTIONOTHER‡
TYPE†
SUPPLY VOLTAGE PINS
CVDD SDedicated power supply for the internal logic (CPU and peripherals)
DVDD SDedicated power supply for the I/O pins
VSS SGround
MISCELLANEOUS PINS
NC No connection − do not connect
†I = Input, O = Output, S = Supply, Z = High impedance
‡Other Pin Characteristics:
A − Internal pullup (always enabled) E − Pin is high impedance in HOLD mode (due to HOLD pin).
B − Internal pulldown (always enabled) F − Pin is high impedance in OFF mode (due to EMU1/OFF pin).
C − Hysteresis input G − Pin can be configured as a general-purpose input.
D − Pin has bus holder H − PIn can be configured as a general-purpose output.
J − Internal pullup enabled by the HPE bit in the system register (SYSR)
K − Internal pulldown enabled by the HPE bit in the system register (SYSR)
Functional Overview
22 June 2000 − Revised September 2007SPRS076O
3 Functional Overview
The following functional overview is based on the block diagram in Figure 3−1.
EMIF
CE[3:0]
BE[3:0]
HOLD
HOLDA
A[21:0]
D[31:0]
ARE
AOE
AWE
ARDY
SSADS
SSOE
SSWE
CLKMEM
SDRAS
SDCAS
SDWE
SDA10
HBE[1:0]
HDS[2:1]
HCS
HAS
HINT
HR/W
RESET
NMI
INT[5:0]
EMU1/OFF
TRST
Figure 3−1. TMS320VC5510/5510A Functional Block Diagram
Functional Overview
23
June 2000 − Revised September 2007 SPRS076O
3.1 Memory
The 5510/5510A supports a unified memory map (program and data accesses are made to the same physical
space). The total on-chip memory is 352K bytes (176K 16-bit words).
3.1.1 On-Chip Dual-Access RAM (DARAM)
The DARAM is located in the byte address range 000000h−00FFFFh and is composed of eight blocks of
8K-bytes each (see Table 3−1). Each DARAM block can perform two accesses per cycle (two reads, two
writes, or a read and a write). DARAM can be accessed by the internal program, data, or DMA buses.
Table 3−1. DARAM Blocks
BYTE ADDRESS RANGE MEMORY BLOCK
000000h − 001FFFh DARAM 0†
002000h − 003FFFh DARAM 1
004000h − 005FFFh DARAM 2
006000h − 007FFFh DARAM 3
008000h − 009FFFh DARAM 4
00A000h − 00BFFFh DARAM 5
00C000h − 00DFFFh DARAM 6
00E000h − 00FFFFh DARAM 7
†First 192 bytes are reserved for Memory-Mapped Registers (MMRs).
3.1.2 On-Chip Single-Access RAM (SARAM)
The SARAM is located at the byte address range 010000h−04FFFFh and is composed of 32 blocks of
8K-bytes each (see Table 3−2). Each SARAM block can perform one access per cycle (one read or one write).
SARAM can be accessed by the internal program, data, or DMA buses.
Table 3−2. SARAM Blocks
BYTE ADDRESS RANGE MEMORY BLOCK BYTE ADDRESS RANGE MEMORY BLOCK
010000h − 011FFFh SARAM 0 030000h − 031FFFh SARAM 16
012000h − 013FFFh SARAM 1 032000h − 033FFFh SARAM 17
014000h − 015FFFh SARAM 2 034000h − 035FFFh SARAM 18
016000h − 017FFFh SARAM 3 036000h − 037FFFh SARAM 19
018000h − 019FFFh SARAM 4 038000h − 039FFFh SARAM 20
01A000h − 01BFFFh SARAM 5 03A000h − 03BFFFh SARAM 21
01C000h − 01DFFFh SARAM 6 03C000h − 03DFFFh SARAM 22
01E000h − 01FFFFh SARAM 7 03E000h − 03FFFFh SARAM 23
020000h − 021FFFh SARAM 8 040000h − 041FFFh SARAM 24
022000h − 023FFFh SARAM 9 042000h − 043FFFh SARAM 25
024000h − 025FFFh SARAM 10 044000h − 045FFFh SARAM 26
026000h − 027FFFh SARAM 11 046000h − 047FFFh SARAM 27
028000h − 029FFFh SARAM 12 048000h − 049FFFh SARAM 28
02A000h − 02BFFFh SARAM 13 04A000h − 04BFFFh SARAM 29
02C000h − 02DFFFh SARAM 14 04C000h − 04DFFFh SARAM 30
02E000h − 02FFFFh SARAM 15 04E000h − 04FFFFh SARAM 31
Functional Overview
24 June 2000 − Revised September 2007SPRS076O
3.1.3 On-Chip ROM
The ROM is located at the byte address range FF8000h−FFFFFFh when MPNMC = 0 at reset. The ROM is
composed of a single block of 32K bytes. When MPNMC = 1 at reset, the on-chip ROM is disabled and not
present in the memory map, and byte address range FF8000h−FFFFFFh is directed to external memory
space. MPNMC is a bit located in the ST3 status register, and its status is determined by the logic level on
the BOOTM[2:0] pins when sampled at reset. If BOOTM[2:0] are all logic 0 at reset, the MPNMC bit is set to 1
and the on-chip ROM is disabled; otherwise, the MPNMC bit is cleared to 0 and the on-chip ROM is enabled.
These pins are not sampled again until the next hardware reset. The software reset instruction does not af fect
the MPNMC bit. Software can also be used to set or clear the MPNMC bit. ROM can be accessed by the
program, data, or DMA buses. The first 16-bit word access to ROM requires three cycles. Subsequent
accesses require two cycles per 16-bit word.
The standard on-chip ROM contains a bootloader which provides a variety of methods to load application code
automatically after power up or a hardware reset. For more information, see Section 3.1.5 of this document.
The vector table associated with the bootloader is also contained in the ROM.
A sine look-up table is provided containing 256 values (crossing 360 degrees) expressed in Q15 format.
The remaining components are used during factory testing purposes.
Table 3−3. Standard On-Chip ROM Contents
BYTE ADDRESS RANGE DESCRIPTION
FF8000h − FF8FFFh Bootloader
FF9000h − FFF9FFh Reserved
FFFA00h − FFFBFFh Sine look-up table
FFFC00h − FFFEFFh Factory Test Code
FFFF00h − FFFFFBh Vector Table
FFFFFCh − FFFFFFh ID Code
3.1.4 Instruction Cache
The 24K-byte instruction cache provides three configurations:
•One 2-way cache block only
•One 2-way cache block plus one RAMSET block
•One 2-way cache block plus two RAMSET blocks
The 2-way cache uses 2-way set associative mapping and holds up to 16K bytes. It is organized as 512 sets
of two cache lines per set. Each cache line contains 16 bytes. Each tag has two corresponding cache lines,
providing two opportunities for a hit on a given tag. The 2-way cache is updated based on a least-recently-used
algorithm.
Each RAMSET block provides a 4K-byte bank of memory to hold a continuous image of code. Each RAMSET
is composed of 256 lines with 16 bytes per line. Each RAMSET uses a single tag to define a continuous
memory image in the RAMSET. The tag defines the start address of the RAMSET. Once the TAG is loaded,
the RAMSET is filled. The RAMSET contents remain constant until the tag is changed. The RAMSETs provide
an efficient method to cache frequently used functions.
Control bits in CPU status register ST3_55 provide the ability to enable, freeze, and flush the cache.
For more information on the instruction cache, see the TMS320VC5510 DSP Instruction Cache Reference
Guide (literature number SPRU576).
Functional Overview
25
June 2000 − Revised September 2007 SPRS076O
3.1.5 Memory Map
000000
010000
050000
400000
800000
C00000
FF8000
Memory Blocks Block Length
65,536 Bytes
262,144 Bytes
3,866,624 Bytes
4,194,304 Bytes
4,194,304 Bytes
4,161,536 Bytes
32,768 Bytes
DARAM‡
(8 Blocks)
SARAM§
(32 Blocks)
External¶ − CE0
ROM#
if MPNMC=0
(1 Block)
†Address shown represents the first byte address in each block.
‡Dual-access RAM (DARAM): two accesses per cycle per block, 8 blocks of 8K bytes.
§Single-access RAM (SARAM): one access per cycle per block, 32 blocks of 8K bytes.
¶External memory spaces are selected by the chip-enable signal shown (CE[0:3]).
Supported memory types include: asynchronous, synchronous DRAM (SDRAM), and
synchronous burst SRAM (SBSRAM).
#Read-only memory (ROM): one access every two cycles, one block of 32K bytes.
External¶ − CE1
External¶ − CE2
External¶ − CE3
External¶ − CE3
if MPNMC=1
Byte Address† (Hex)
FFFFFF
Figure 3−2. TMS320VC5510/5510A Memory Map
3.1.6 Bootloader
The on-chip bootloader provides a method to transfer application code and tables from an external source to
the on-chip RAM at power up. The 5510/5510A provides several options to download the code to
accommodate varying system requirements. These options include:
•Enhanced Host-Port Interface (EHPI) boot
•External memory boot from 8-/16-/32-bit-wide asynchronous memory
•Serial slave boot from McBSP0 with 8- or 16-bit element length
•Serial EEPROM boot from McBSP0 in 8-bit SPI format
External pins BOOTM3, BOOTM2, BOOTM1, and BOOTM0 select the boot configuration. The values of
BOOTM[2:0] are latched with the rising edge of the RESET input. BOOTM[0] is shared with general-purpose
IO1. BOOTM[1] is shared with general-purpose IO2. BOOTM[2] is shared with general-purpose IO3.
The boot configurations available are summarized in Table 3−4. For detailed information on the bootloader
functions, refer to the Using the TMS320VC5510 Bootloader Application Report (literature number
SPRA763).
Functional Overview
26 June 2000 − Revised September 2007SPRS076O
Table 3−4. TMS320VC5510/5510A Boot Configurations
BOOTM[3:0] BOOT PROCESS EXECUTION START BYTE ADDRESS
AFTER BOOT IS COMPLETE
0000 No boot FFFF00h (reset vector)
0001 Serial SPI EEPROM boot from McBSP0 supporting 24-bit address Destination specified in the boot table
0010 Reserved −
0011 Reserved −
0100 Reserved −
0101 Reserved −
0110 Reserved −
0111 Reserved −
1000 No boot FFFF00h (reset vector)
1001 Serial SPI EEPROM boot from McBSP0 supporting 16-bit address Destination specified in the boot table
1010 Parallel EMIF boot from 8-bit asynchronous memory Destination specified in the boot table
1011 Parallel EMIF boot from 16-bit asynchronous memory Destination specified in the boot table
1100 Parallel EMIF boot from 32-bit asynchronous memory Destination specified in the boot table
1101 EHPI boot 010000h (on-chip SARAM)
1110 Standard serial boot from McBSP0, 16-bit element length Destination specified in the boot table
1111 Standard serial boot from McBSP0, 8-bit element length Destination specified in the boot table
3.2 Peripherals
The 5510/5510A supports the following peripherals:
•An external memory interface (EMIF)
•A six-channel direct memory access (DMA) controller
•16-bit parallel Enhanced Host-Port Interface (EHPI)
•A digital phase-locked loop (DPLL) clock generator
•Two timers
•Three multichannel buffered serial ports (McBSPs)
•Eight configurable general-purpose I/O pins
Peripheral information specific to the 5510/5510A peripherals is included in the following sections. For detailed
information on the C55x DSP peripherals, see the following documents:
•TMS320C55x DSP Functional Overview (literature number SPRU312)
•TMS320C55x DSP Peripherals Overview Reference Guide (literature number SPRU317)
•TMS320VC5510 DSP Instruction Cache Reference Guide (literature number SPRU576)
•TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide (literature number SPRU592)
•TMS320VC5503/5507/5509/5510 DSP Direct Memory Access (DMA) Controller Reference Guide
(literature number SPRU587)
•TMS320VC5510 DSP Host Port Interface (HPI) Reference Guide (literature number SPRU588)
•TMS320VC5503/5507/5509/5510 DSP Timers Reference Guide (literature number SPRU595)
Functional Overview
27
June 2000 − Revised September 2007 SPRS076O
3.2.1 System Register (SYSR)
The 5510/5510A system register (SYSR) provides control over certain device-specific functions. SYSR is
located at port address 07FDh.
15 10 9 8 7 6 5 4 3 2 0
Reserved HPE BH HBH BOOTM3 Reserved Reserved Reserved CLKDIV
R−000000 R/W−1 R/W−0 R/W−0 R−0 R−0 R/W−0 R/W−0 R/W−000
LEGEND: R = Read, W = Write, n = value after reset
Figure 3−3. System Register (SYSR) Bit Layout
Table 3−5. System Register (SYSR) Bit Functions
BIT
NO. BIT
NAME RESET
VALUE FUNCTION
15−10 Reserved 000000 These bits are reserved and are unaffected by writes.
9 HPE 1
EHPI pullup/pulldown enable. Enables the internal pullups on the EHPI control pins HDS1, HDS2, HCS,
HAS, HR/W, HMODE, HCNTL0, and HA1/HCNTL1. Enables the internal pulldowns on EHPI control pins
HBE0 and HBE1.
HPE = 0 Pullups and pulldowns disabled
HPE = 1 Pullups and pulldowns enabled.
8 BH 0 EMIF data bus holder enable. Enables internal bus holders on D[31:0].
BH = 0 EMIF data bus holders disabled.
BH = 1 EMIF data bus holders enabled.
7 HBH 0 EHPI data bus holder enable. Enables internal bus holders on HD[15:0].
HBH = 0 EHPI data bus holders disabled.
HBH = 1 EHPI data bus holders enabled.
6 BOOTM3 0 BOOTM3 status. This read-only bit represents the state of the BOOTM3 pin.
5 Reserved 0 This bit is reserved and is unaffected by writes.
4 Reserved 0 This bit is reserved and must be written as 0.
3 Reserved 0 This bit is reserved and is unaffected by writes.
2−0 CLKDIV 000
CLKOUT divide factor. Allows the clock present on the CLKOUT pin to be a divided-down version of the
internal CPU clock. This field does not affect the programming of the PLL
CLKDIV = 000 CLKOUT represents the CPU clock divided by 1
CLKDIV = 001 CLKOUT represents the CPU clock divided by 2
CLKDIV = 010 CLKOUT represents the CPU clock divided by 4
CLKDIV = 011 CLKOUT represents the CPU clock divided by 6
CLKDIV = 100 CLKOUT represents the CPU clock divided by 8
CLKDIV = 101 CLKOUT represents the CPU clock divided by 10
CLKDIV = 110 CLKOUT represents the CPU clock divided by 12
CLKDIV = 111 CLKOUT represents the CPU clock divided by 14
Functional Overview
28 June 2000 − Revised September 2007SPRS076O
3.2.2 Direct Memory Access (DMA)
The 5510/5510A DMA provides the following features:
•Four standard ports, one for each of the following data resources: DARAM, SARAM, Peripherals, and
External Memory
•Six channels, which allow the DMA controller to track the context of six independent DMA channels
•Programmable low/high priority for each DMA channel
•One interrupt for each DMA channel
•Event synchronization. DMA transfers in each channel can be dependent on the occurrence of selected
events.
•Programmable address modification for source and destination addresses
•Dedicated Idle Domain allows the DMA controller to be placed in a low-power (idle) state under software
control.
•DMA controller supports EHPI accesses to internal/external memory
The 5510/5510A DMA controller allows transfers to be synchronized to selected events. The 5510/5510A
supports 14 separate sync events and each channel can be tied to separate sync events independent of the
other channels. Sync events are selected by programming the SYNC field in the channel-specific DMA
Channel Control Register (DMA_CCR). The sync events available on the 5510/5510A are shown in Table 3−6.
For more information on the 5510/5510A DMA, see the TMS320VC5503/5507/5509/5510 DSP Direct
Memory Access (DMA) Controller Reference Guide (literature number SPRU587).
Table 3−6. DMA Sync Events
SYNC FIELD IN DMA_CCR SYNC EVENT
00000b No sync event
00001b McBSP0 receive event (REVT0)
00010b McBSP0 transmit event (XEVT0)
00101b McBSP1 receive event (REVT1)
00110b McBSP1 transmit event (XEVT1)
01001b McBSP2 receive event (REVT2)
01010b McBSP2 transmit event (XEVT2)
01101b T imer 0 event
01110b Timer 1 event
01111b External Interrupt 0
10000b External Interrupt 1
10001b External Interrupt 2
10010b External Interrupt 3
10011b External Interrupt 4
10100b External Interrupt 5
Other values Reserved (do not use these values)
Functional Overview
29
June 2000 − Revised September 2007 SPRS076O
3.2.3 Enhanced Host Port Interface (EHPI)
The 5510/5510A EHPI provides a 16-bit parallel interface to a host with the following features:
•20-bit host address bus
•16-bit host data bus
•Multiplexed and non-multiplexed bus modes
•Host access to on-chip SARAM, on-chip DARAM, and external memory
•20-bit address register (in multiplexed mode) with autoincrement capability for faster transfers
•Multiple address/data strobes provide a glueless interface to a variety of hosts
•HRDY signal for handshaking with host
The 5510/5510A EHPI can access internal DARAM, internal SARAM and a portion of the external memory
space. The EHPI cannot directly access the on-chip peripherals and cannot access the memory-mapped
registers below word address 000060h in DARAM. Note that all memory accesses made though the EHPI are
word-addressed. A map of the memory space accessible by the EHPI is shown in Figure 3−4. The EHPI can
access from word address 000060h to 0FFFFFh. The shaded areas of the memory map are not accessible
by the EHPI.
000000h
000060h
008000h
028000h
100000h
200000h
400000h
Memory Blocks
Memory Mapped
Registers (DARAM)
DARAM
External − CE0
Word Address
600000h
SARAM
External − CE0
External − CE1
External − CE2
External − CE3
Memory Accessible
Through the EHPI
NOTE A: The shaded areas of the memory map are not accessible by the EHPI.
Figure 3−4. EHPI Memory Map
Functional Overview
30 June 2000 − Revised September 2007SPRS076O
When the EHPI inputs are uncontrolled, noise on the inputs can cause spurious accesses that may corrupt
internal memory. If the EHPI is not driven by a host, the HCS pin should be driven high by one of the following
methods:
•An external device
•External pullup resistor, or
•The on-chip pullup circuit controlled by the HPE bit in the System Register (SYSR). See Section 3.2.1
for more information on how to configure this control.
As of revision 2.1, the byte-enable function of the EHPI is no longer supported. Pins HBE0 and HBE1 must
be driven low at all times.
For more information on the 5510/5510A EHPI, see the TMS320VC5510 DSP Host Port Interface (HPI)
Reference Guide (literature number SPRU588).
Functional Overview
31
June 2000 − Revised September 2007 SPRS076O
3.2.4 General-Purpose Input/Output Port (GPIO)
The 5510/5510A provides eight dedicated general-purpose input/output pins, IO0−IO7. Each pin can be
independently configured as an input or an output using the I/O Direction Register (IODIR). The I/O Data
Register (IODATA) is used to monitor the logic state of pins configured as inputs and control the logic state
of pins configured as outputs. IODIR and IODATA are accessible to the CPU and to the DMA controller at
addresses in I/O space. See Table 3−19 for address information. The description of the IODIR is shown in
Figure 3−5 and Table 3−7. The description of IODATA is shown in Figure 3−6 and Table 3−8.
To configure a GPIO pin as an input, clear the direction bit that corresponds to the pin in IODIR to 0. To read
the logic state of the input pin, read the corresponding bit in IODATA.
To configure a GPIO pin as an output, set the direction bit that corresponds to the pin in IODIR to 1. To control
the logic state of the output pin, write to the corresponding bit in IODATA.
15 876543210
Reserved IO7DIR IO6DIR IO5DIR IO4DIR IO3DIR IO2DIR IO1DIR IO0DIR
R−00000000 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0
LEGEND: R = Read, W = Write, n = value after reset
Figure 3−5. I/O Direction Register (IODIR) Bit Layout
Table 3−7. I/O Direction Register (IODIR) Bit Functions
BIT
NO. BIT
NAME RESET
VALUE FUNCTION
15−8 Reserved 0 These bits are reserved and are unaffected by writes.
7−0 IOxDIR 0 IOx Direction Control Bit. Controls whether IOx operates as an input or an output.
IOxDIR = 0 IOx is configured as an input.
IOxDIR = 1 IOx is configured as an output.
15 876543210
Reserved IO7D IO6D IO5D IO4D IO3D IO2D IO1D IO0D
R−00000000 R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin
LEGEND: R = Read, W = Write, pin = value present on the pin (IO7−IO0 default to inputs after reset)
Figure 3−6. I/O Data Register (IODATA) Bit Layout
Table 3−8. I/O Data Register (IODATA) Bit Functions
BIT
NO. BIT
NAME RESET
VALUE FUNCTION
15−8 Reserved 0 These bits are reserved and are unaffected by writes.
7−0 IOxD pin†
IOx Data Bit.
If IOx is configured as an input (IOxDIR = 0 in IODIR):
IOxD = 0 The signal on the IOx pin is low.
IOxD = 1 The signal on the IOx pin is high.
If IOx is configured as an output (IOxDIR = 1 in IODIR):
IOxD = 0 Drive the signal on the IOx pin low.
IOxD = 1 Drive the signal on the IOx pin high.
†pin = value present on the pin (IO7−IO0 default to inputs after reset)
Functional Overview
32 June 2000 − Revised September 2007SPRS076O
3.3 CPU Register Description
The 5510/5510A CPU registers are shown in Table 3−9. For code compatibility, many TMS320C55x (C55x)
CPU registers map to comparable TMS320C54x (C54x) CPU register addresses. The corresponding
TMS320C54x (C54x) CPU registers are indicated in these instances.
Table 3−9. CPU Registers
C54X
REGISTER VC5510/5510A
REGISTER WORD ADDRESS
(HEX) DESCRIPTION
IMR IER0 00 Interrupt Mask Register 0
IFR IFR0 01 Interrupt Flag Register 0
− ST0_55 02 Status Register 0 for C55x
− ST1_55 03 Status Register 1 for C55x
− ST3_55 04 Status Register 3 for C55x
− − 05 Reserved
ST0 ST0 06 Status Register ST0 (for 54x compatibility)
ST1 ST1 07 Status Register ST1 (for 54x compatibility)
AL AC0L 08
AH AC0H 09 Accumulator 0 (equivalent to Accumulator A on C54x)
AG AC0G 0A
Accumulator 0 (equivalent to Accumulator A on C54x)
BL AC1L 0B
BH AC1H 0C Accumulator 1 (equivalent to Accumulator A on C54x)
BG AC1G 0D
Accumulator 1 (equivalent to Accumulator A on C54x)
TREG T3 0E Temporary Register
TRN TRN0 0F Transition Register
AR0 AR0 10 Auxiliary Register 0
AR1 AR1 11 Auxiliary Register 1
AR2 AR2 12 Auxiliary Register 2
AR3 AR3 13 Auxiliary Register 3
AR4 AR4 14 Auxiliary Register 4
AR5 AR5 15 Auxiliary Register 5
AR6 AR6 16 Auxiliary Register 6
AR7 AR7 17 Auxiliary Register 7
SP SP 18 Stack Pointer Register
BK BK03 19 Circular Buffer Size Register
BRC BRC0 1A Block Repeat Counter
RSA RSA0L 1B Block Repeat Start Address
REA REA0L 1C Block Repeat End Address
PMST PMST 1D Processor Mode Status Register
XPC XPC 1E Program Counter Extension Register
− − 1F Reserved
− T0 20 Temporary Data Register 0
− T1 21 Temporary Data Register 1
− T2 22 Temporary Data Register 2
− T3 23 Temporary Data Register 3
TMS320C54x and C54x are trademarks of Texas Instruments.
Functional Overview
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June 2000 − Revised September 2007 SPRS076O
Table 3−9. CPU Registers (Continued)
C54X
REGISTER DESCRIPTION
WORD ADDRESS
(HEX)
VC5510/5510A
REGISTER
− AC2L 24
− AC2H 25 Accumulator 2
− AC2G 26
Accumulator 2
− CDP 27 Coefficient Data Pointer
− AC3L 28
− AC3H 29 Accumulator 3
− AC3G 2A
Accumulator 3
− DPH 2B Extended Data Page Pointer
− MDP05 2C Reserved
− MDP67 2D Reserved
− DP 2E Memory Data Page Start Address
− PDP 2F Peripheral Data Page Start Address
− BK47 30 Circular Buffer Size Register for AR[4−7]
− BKC 31 Circular Buffer Size Register for CDP
− BSA01 32 Circular Buffer Start Address Register for AR[0−1]
− BSA23 33 Circular Buffer Start Address Register for AR[2−3]
− BSA45 34 Circular Buffer Start Address Register for AR[4−5]
− BSA67 35 Circular Buffer Start Address Register for AR[6−7]
− BSAC 36 Circular Buffer Coefficient Start Address Register
− BIOS 37 Data Page Pointer Storage Location for 128-word Data Table
− TRN1 38 Transition Register 1
− BRC1 39 Block Repeat Counter 1
− BRS1 3A Block Repeat Save 1
− CSR 3B Computed Single Repeat
− RSA0H 3C
Repeat Start Address 0
− RSA0L 3D
Repeat Start Address 0
− REA0H 3E
Repeat End Address 0
− REA0L 3F
Repeat End Address 0
− RSA1H 40
Repeat Start Address 1
− RSA1L 41
Repeat Start Address 1
− REA1H 42
Repeat End Address 1
− REA1L 43
Repeat End Address 1
− RPTC 44 Repeat Counter
− IER1 45 Interrupt Mask Register 1
− IFR1 46 Interrupt Flag Register 1
− DBIER0 47 Debug IER0
− DBIER1 48 Debug IER1
− IVPD 49 Interrupt Vector Pointer DSP
− IVPH 4A Interrupt Vector Pointer HOST
− ST2_55 4B Status Register 2 for C55x
− SSP 4C System Stack Pointer
− SP 4D User Stack Pointer
− SPH 4E Extended Data Page Pointer for the SP and the SSP
− CDPH 4F Main Data Page Pointer for the CDP
Functional Overview
34 June 2000 − Revised September 2007SPRS076O
3.4 Peripheral Register Description
Peripheral registers on the 5510/5510A are accessed using the port qualifier. For more information on the
use of the port qualifier, see the TMS320C55x Assembly Language Tools User’s Guide (literature number
SPRU280). For detailed information on the operation of the peripherals and the functions of each of the
peripheral registers, refer to the TMS320C55x DSP Peripherals Overview Reference Guide (literature
number SPRU317).
NOTE: The CPU access latency to the peripheral memory-mapped registers is 6 CPU cycles.
Following peripheral register update(s), the CPU must wait at least 6 CPU cycles before
attempting to use that peripheral. When more than one peripheral register is updated in a
sequence, the CPU only needs to wait following the final register write. For example, if the
EMIF is being reconfigured, the CPU must wait until the very last EMIF register update takes
effect before trying to access the external memory. The users should consult the respective
peripheral user’s guide to determine if a peripheral requires additional time to initialize itself
to the new configuration after the register updates take effect.
Table 3−10. Peripheral Bus Controller Configuration Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x0001 ICR Idle Control Register
0x0002 ISTR Idle Status Register
0x000F BOOT_MOD Boot Mode Register (read only)
Table 3−11. Instruction Cache Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x1400 ICGC I-Cache Global Control Register
0x1401 ICFL0 I-Cache Flush Line Address Register 0
0x1402 ICFL1 I-Cache Flush Line Address Register 1
0x1403 ICWC I-Cache N-Way Control Register
0x1404 ICSTAT I-Cache Status Register
0x1405 ICRC1 I-Cache Ramset 1 Control Register
0x1406 ICRTAG1 I-Cache Ramset 1 Tag Register
0x1407 ICRC2 I-Cache Ramset 2 Control Register
0x1408 ICRTAG2 I-Cache Ramset 2 Tag Register
Functional Overview
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June 2000 − Revised September 2007 SPRS076O
Table 3−12. External Memory Interface Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x0800 EGCR EMIF Global Control Register
0x0801 EMIRST EMIF Global Reset Register
0x0802 EMIBE EMIF Bus Error Status Register
0x0803 CE01 EMIF CE0 Space Control Register 1
0x0804 CE02 EMIF CE0 Space Control Register 2
0x0805 CE03 EMIF CE0 Space Control Register 3
0x0806 CE11 EMIF CE1 Space Control Register 1
0x0807 CE12 EMIF CE1 Space Control Register 2
0x0808 CE13 EMIF CE1 Space Control Register 3
0x0809 CE21 EMIF CE2 Space Control Register 1
0x080A CE22 EMIF CE2 Space Control Register 2
0x080B CE23 EMIF CE2 Space Control Register 3
0x080C CE31 EMIF CE3 Space Control Register 1
0x080D CE32 EMIF CE3 Space Control Register 2
0x080E CE33 EMIF CE3 Space Control Register 3
0x080F SDC1 EMIF SDRAM Control Register 1
0x0810 SDPER EMIF SDRAM Period Register
0x0811 SDCNT EMIF SDRAM Counter Register
0x0812 INIT EMIF SDRAM Init Register
0x0813 SDC2 EMIF SDRAM Control Register 2
Functional Overview
36 June 2000 − Revised September 2007SPRS076O
Table 3−13. DMA Configuration Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
GLOBAL REGISTER
0x0E00 DMAGCR DMA Global Control Register
0x0E02 DMAGSCR DMA Software Compatibility Register
0x0E03 DMAGTCR DMA Timeout Control Register
CHANNEL #0 REGISTERS
0x0C00 DMACSDP0 DMA Channel 0 Source / Destination Parameters Register
0x0C01 DMACCR0 DMA Channel 0 Control Register
0x0C02 DMACICR0 DMA Channel 0 Interrupt Control Register
0x0C03 DMACSR0 DMA Channel 0 Status Register
0x0C04 DMACSSAL0 DMA Channel 0 Source Start Address Register (lower bits)
0x0C05 DMACSSAU0 DMA Channel 0 Source Start Address Register (upper bits)
0x0C06 DMACDSAL0 DMA Channel 0 Source Destination Address Register (lower bits)
0x0C07 DMACDSAU0 DMA Channel 0 Source Destination Address Register (upper bits)
0x0C08 DMACEN0 DMA Channel 0 Element Number Register
0x0C09 DMACFN0 DMA Channel 0 Frame Number Register
0x0C0A DMACFI0/
DMACSFI0†DMA Channel 0 Frame Index Register/
DMA Channel 0 Source Frame Index Register†
0x0C0B DMACEI0/
DMACSEI0‡DMA Channel 0 Element Index Register/
DMA Channel 0 Source Element Index Register‡
0x0C0C DMACSAC0 DMA Channel 0 Source Address Counter
0x0C0D DMACDAC0 DMA Channel 0 Destination Address Counter
0x0C0E DMACDEI0 DMA Channel 0 Destination Element Index Register
0x0C0F DMACDFI0 DMA Channel 0 Destination Frame Index Register
CHANNEL #1 REGISTERS
0x0C20 DMACSDP1 DMA Channel 1 Source / Destination Parameters Register
0x0C21 DMACCR1 DMA Channel 1 Control Register
0x0C22 DMACICR1 DMA Channel 1 Interrupt Control Register
0x0C23 DMACSR1 DMA Channel 1 Status Register
0x0C24 DMACSSAL1 DMA Channel 1 Source Start Address Register (lower bits)
0x0C25 DMACSSAU1 DMA Channel 1 Source Start Address Register (upper bits)
0x0C26 DMACDSAL1 DMA Channel 1 Source Destination Address Register (lower bits)
0x0C27 DMACDSAU1 DMA Channel 1 Source Destination Address Register (upper bits)
0x0C28 DMACEN1 DMA Channel 1 Element Number Register
0x0C29 DMACFN1 DMA Channel 1 Frame Number Register
0x0C2A DMACFI1/
DMACSFI1†DMA Channel 1 Frame Index Register/
DMA Channel 1 Source Frame Index Register†
0x0C2B DMACEI1/
DMACSEI1‡DMA Channel 1 Element Index Register/
DMA Channel 1 Source Element Index Register‡
0x0C2C DMACSAC1 DMA Channel 1 Source Address Counter
0x0C2D DMACDAC1 DMA Channel 1 Destination Address Counter
0x0C2E DMACDEI1 DMA Channel 1 Destination Element Index Register
0x0C2F DMACDFI1 DMA Channel 1 Destination Frame Index Register
†On revision 1.x, the channel frame index applies to both source and destination and this register behaves as DMACFIn. On revision 2.0 and
later, DMACSFIn and DMACDFIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
‡On revision 1.x, the channel element index applies to both source and destination and this register behaves as DMACEIn. On revision 2.0 and
later, DMACSEIn and DMACDEIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
Functional Overview
37
June 2000 − Revised September 2007 SPRS076O
Table 3−13. DMA Configuration Registers (Continued)
PORT ADDRESS DESCRIPTIONREGISTER NAME
CHANNEL #2 REGISTERS
0x0C40 DMACSDP2 DMA Channel 2 Source / Destination Parameters Register
0x0C41 DMACCR2 DMA Channel 2 Control Register
0x0C42 DMACICR2 DMA Channel 2 Interrupt Control Register
0x0C43 DMACSR2 DMA Channel 2 Status Register
0x0C44 DMACSSAL2 DMA Channel 2 Source Start Address Register (lower bits)
0x0C45 DMACSSAU2 DMA Channel 2 Source Start Address Register (upper bits)
0x0C46 DMACDSAL2 DMA Channel 2 Source Destination Address Register (lower bits)
0x0C47 DMACDSAU2 DMA Channel 2 Source Destination Address Register (upper bits)
0x0C48 DMACEN2 DMA Channel 2 Element Number Register
0x0C49 DMACFN2 DMA Channel 2 Frame Number Register
0x0C4A DMACFI2/
DMACSFI2†DMA Channel 2 Frame Index Register/
DMA Channel 2 Source Frame Index Register†
0x0C4B DMACEI2/
DMACSEI2‡DMA Channel 2 Element Index Register/
DMA Channel 2 Source Element Index Register‡
0x0C4C DMACSAC2 DMA Channel 2 Source Address Counter
0x0C4D DMACDAC2 DMA Channel 2 Destination Address Counter
0x0C4E DMACDEI2 DMA Channel 2 Destination Element Index Register
0x0C4F DMACDFI2 DMA Channel 2 Destination Frame Index Register
CHANNEL #3 REGISTERS
0x0C60 DMACSDP3 DMA Channel 3 Source / Destination Parameters Register
0x0C61 DMACCR3 DMA Channel 3 Control Register
0x0C62 DMACICR3 DMA Channel 3 Interrupt Control Register
0x0C63 DMACSR3 DMA Channel 3 Status Register
0x0C64 DMACSSAL3 DMA Channel 3 Source Start Address Register (lower bits)
0x0C65 DMACSSAU3 DMA Channel 3 Source Start Address Register (upper bits)
0x0C66 DMACDSAL3 DMA Channel 3 Source Destination Address Register (lower bits)
0x0C67 DMACDSAU3 DMA Channel 3 Source Destination Address Register (upper bits)
0x0C68 DMACEN3 DMA Channel 3 Element Number Register
0x0C69 DMACFN3 DMA Channel 3 Frame Number Register
0x0C6A DMACFI3/
DMACSFI3†DMA Channel 3 Frame Index Register/
DMA Channel 3 Source Frame Index Register†
0x0C6B DMACEI3/
DMACSEI3‡DMA Channel 3 Element Index Register/
DMA Channel 3 Source Element Index Register‡
0x0C6C DMACSAC3 DMA Channel 3 Source Address Counter
0x0C6D DMACDAC3 DMA Channel 3 Destination Address Counter
0x0C6E DMACDEI3 DMA Channel 3 Destination Element Index Register
0x0C6F DMACDFI3 DMA Channel 3 Destination Frame Index Register
†On revision 1.x, the channel frame index applies to both source and destination and this register behaves as DMACFIn. On revision 2.0 and
later, DMACSFIn and DMACDFIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
‡On revision 1.x, the channel element index applies to both source and destination and this register behaves as DMACEIn. On revision 2.0 and
later, DMACSEIn and DMACDEIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
Functional Overview
38 June 2000 − Revised September 2007SPRS076O
Table 3−13. DMA Configuration Registers (Continued)
PORT ADDRESS DESCRIPTIONREGISTER NAME
CHANNEL #4 REGISTERS
0x0C80 DMACSDP4 DMA Channel 4 Source / Destination Parameters Register
0x0C81 DMACCR4 DMA Channel 4 Control Register
0x0C82 DMACICR4 DMA Channel 4 Interrupt Control Register
0x0C83 DMACSR4 DMA Channel 4 Status Register
0x0C84 DMACSSAL4 DMA Channel 4 Source Start Address Register (lower bits)
0x0C85 DMACSSAU4 DMA Channel 4 Source Start Address Register (upper bits)
0x0C86 DMACDSAL4 DMA Channel 4 Source Destination Address Register (lower bits)
0x0C87 DMACDSAU4 DMA Channel 4 Source Destination Address Register (upper bits)
0x0C88 DMACEN4 DMA Channel 4 Element Number Register
0x0C89 DMACFN4 DMA Channel 4 Frame Number Register
0x0C8A DMACFI4/
DMACSFI4†DMA Channel 4 Frame Index Register/
DMA Channel 4 Source Frame Index Register†
0x0C8B DMACEI4/
DMACSEI4‡DMA Channel 4 Element Index Register/
DMA Channel 4 Source Element Index Register‡
0x0C8C DMACSAC4 DMA Channel 4 Source Address Counter
0x0C8D DMACDAC4 DMA Channel 4 Destination Address Counter
0x0C8E DMACDEI4 DMA Channel 4 Destination Element Index Register
0x0C8F DMACDFI4 DMA Channel 4 Destination Frame Index Register
CHANNEL #5 REGISTERS
0x0CA0 DMACSDP5 DMA Channel 5 Source / Destination Parameters Register
0x0CA1 DMACCR5 DMA Channel 5 Control Register
0x0CA2 DMACICR5 DMA Channel 5 Interrupt Control Register
0x0CA3 DMACSR5 DMA Channel 5 Status Register
0x0CA4 DMACSSAL5 DMA Channel 5 Source Start Address Register (lower bits)
0x0CA5 DMACSSAU5 DMA Channel 5 Source Start Address Register (upper bits)
0x0CA6 DMACDSAL5 DMA Channel 5 Source Destination Address Register (lower bits)
0x0CA7 DMACDSAU5 DMA Channel 5 Source Destination Address Register (upper bits)
0x0CA8 DMACEN5 DMA Channel 5 Element Number Register
0x0CA9 DMACFN5 DMA Channel 5 Frame Number Register
0x0CAA DMACFI5/
DMACSFI5†DMA Channel 5 Frame Index Register/
DMA Channel 5 Source Frame Index Register†
0x0CAB DMACEI5/
DMACSEI5‡DMA Channel 5 Element Index Register/
DMA Channel 5 Source Element Index Register‡
0x0CAC DMACSAC5 DMA Channel 5 Source Address Counter
0x0CAD DMACDAC5 DMA Channel 5 Destination Address Counter
0x0CAE DMACDEI5 DMA Channel 5 Destination Element Index Register
0x0CAF DMACDFI5 DMA Channel 5 Destination Frame Index Register
†On revision 1.x, the channel frame index applies to both source and destination and this register behaves as DMACFIn. On revision 2.0 and
later, DMACSFIn and DMACDFIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
‡On revision 1.x, the channel element index applies to both source and destination and this register behaves as DMACEIn. On revision 2.0 and
later, DMACSEIn and DMACDEIn provide separate source and destination frame indexing. Revision 2.0 and later can be programmed for
software compatibility with revision 1.x through the Software Compatibility Register (DMAGSCR).
Functional Overview
39
June 2000 − Revised September 2007 SPRS076O
Table 3−14. Clock Generator Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x1C00 CLKMD Clock Mode Register
Table 3−15. Timer Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x1000 TIM0 Timer 0 Count Register
0x1001 PRD0 Timer 0 Period Register
0x1002 TCR0 Timer 0 Timer Control Register
0x1003 PRSC0 Timer 0 Timer Prescaler Register
0x2400 TIM1 Timer 1 Timer Count Register
0x2401 PRD1 Timer 1 Period Register
0x2402 TCR1 Timer 1 Timer Control Register
0x2403 PRSC1 Timer 1 Timer Prescaler Register
Functional Overview
40 June 2000 − Revised September 2007SPRS076O
Table 3−16. Multichannel Serial Port #0 Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x2800 DRR20 McBSP 0 Data Receive Register 2
0x2801 DRR10 McBSP 0 Data Receive Register 1
0x2802 DXR20 McBSP 0 Data Transmit Register 2
0x2803 DXR10 McBSP 0 Data Transmit Register 1
0x2804 SPCR20 McBSP 0 Serial Port Control Register 2
0x2805 SPCR10 McBSP 0 Serial Port Control Register 1
0x2806 RCR20 McBSP 0 Receive Control Register 2
0x2807 RCR10 McBSP 0 Receive Control Register 1
0x2808 XCR20 McBSP 0 Transmit Control Register 2
0x2809 XCR10 McBSP 0 Transmit Control Register 1
0x280A SRGR20 McBSP 0 Sample Rate Generator Register 2
0x280B SRGR10 McBSP 0 Sample Rate Generator Register 1
0x280C MCR20 McBSP 0 Multichannel Control Register 2
0x280D MCR10 McBSP 0 Multichannel Control Register 1
0x280E RCERA0 McBSP 0 Receive Channel Enable Register Partition A
0x280F RCERB0 McBSP 0 Receive Channel Enable Register Partition B
0x2810 XCERA0 McBSP 0 Transmit Channel Enable Register Partition A
0x2811 XCERB0 McBSP 0 Transmit Channel Enable Register Partition B
0x2812 PCR0 McBSP 0 Pin Control Register
0x2813 RCERC0 McBSP 0 Receive Channel Enable Register Partition C
0x2814 RCERD0 McBSP 0 Receive Channel Enable Register Partition D
0x2815 XCERC0 McBSP 0 Transmit Channel Enable Register Partition C
0x2816 XCERD0 McBSP 0 Transmit Channel Enable Register Partition D
0x2817 RCERE0 McBSP 0 Receive Channel Enable Register Partition E
0x2818 RCERF0 McBSP 0 Receive Channel Enable Register Partition F
0x2819 XCERE0 McBSP 0 Transmit Channel Enable Register Partition E
0x281A XCERF0 McBSP 0 Transmit Channel Enable Register Partition F
0x281B RCERG0 McBSP 0 Receive Channel Enable Register Partition G
0x281C RCERH0 McBSP 0 Receive Channel Enable Register Partition H
0x281D XCERG0 McBSP 0 Transmit Channel Enable Register Partition G
0x281E XCERH0 McBSP 0 Transmit Channel Enable Register Partition H
Functional Overview
41
June 2000 − Revised September 2007 SPRS076O
Table 3−17. Multichannel Serial Port #1 Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x2C00 DRR21 McBSP 1 Data Receive Register 2
0x2C01 DRR11 McBSP 1 Data Receive Register 1
0x2C02 DXR21 McBSP 1 Data Transmit Register 2
0x2C03 DXR11 McBSP 1 Data Transmit Register 1
0x2C04 SPCR21 McBSP 1 Serial Port Control Register 2
0x2C05 SPCR11 McBSP 1 Serial Port Control Register 1
0x2C06 RCR21 McBSP 1 Receive Control Register 2
0x2C07 RCR11 McBSP 1 Receive Control Register 1
0x2C08 XCR21 McBSP 1 Transmit Control Register 2
0x2C09 XCR11 McBSP 1 Transmit Control Register 1
0x2C0A SRGR21 McBSP 1 Sample Rate Generator Register 2
0x2C0B SRGR11 McBSP 1 Sample Rate Generator Register 1
0x2C0C MCR21 McBSP 1 Multichannel Control Register 2
0x2C0D MCR11 McBSP 1 Multichannel Control Register 1
0x2C0E RCERA1 McBSP 1 Receive Channel Enable Register Partition A
0x2C0F RCERB1 McBSP 1 Receive Channel Enable Register Partition B
0x2C10 XCERA1 McBSP 1 Transmit Channel Enable Register Partition A
0x2C11 XCERB1 McBSP 1 T ransmit Channel Enable Register Partition B
0x2C12 PCR1 McBSP 1 Pin Control Register
0x2C13 RCERC1 McBSP 1 Receive Channel Enable Register Partition C
0x2C14 RCERD1 McBSP 1 Receive Channel Enable Register Partition D
0x2C15 XCERC1 McBSP 1 Transmit Channel Enable Register Partition C
0x2C16 XCERD1 McBSP 1 Transmit Channel Enable Register Partition D
0x2C17 RCERE1 McBSP 1 Receive Channel Enable Register Partition E
0x2C18 RCERF1 McBSP 1 Receive Channel Enable Register Partition F
0x2C19 XCERE1 McBSP 1 Transmit Channel Enable Register Partition E
0x2C1A XCERF1 McBSP 1 Transmit Channel Enable Register Partition F
0x2C1B RCERG1 McBSP 1 Receive Channel Enable Register Partition G
0x2C1C RCERH1 McBSP 1 Receive Channel Enable Register Partition H
0x2C1D XCERG1 McBSP 1 Transmit Channel Enable Register Partition G
0x2C1E XCERH1 McBSP 1 Transmit Channel Enable Register Partition H
Functional Overview
42 June 2000 − Revised September 2007SPRS076O
Table 3−18. Multichannel Serial Port #2 Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x3000 DRR22 McBSP 2 Data Receive Register 2
0x3001 DRR12 McBSP 2 Data Receive Register 1
0x3002 DXR22 McBSP 2 Data Transmit Register 2
0x3003 DXR12 McBSP 2 Data Transmit Register 1
0x3004 SPCR22 McBSP 2 Serial Port Control Register 2
0x3005 SPCR12 McBSP 2 Serial Port Control Register 1
0x3006 RCR22 McBSP 2 Receive Control Register 2
0x3007 RCR12 McBSP 2 Receive Control Register 1
0x3008 XCR22 McBSP 2 Transmit Control Register 2
0x3009 XCR12 McBSP 2 Transmit Control Register 1
0x300A SRGR22 McBSP 2 Sample Rate Generator Register 2
0x300B SRGR12 McBSP 2 Sample Rate Generator Register 1
0x300C MCR22 McBSP 2 Multichannel Control Register 2
0x300D MCR12 McBSP 2 Multichannel Control Register 1
0x300E RCERA2 McBSP 2 Receive Channel Enable Register Partition A
0x300F RCERB2 McBSP 2 Receive Channel Enable Register Partition B
0x3010 XCERA2 McBSP 2 Transmit Channel Enable Register Partition A
0x3011 XCERB2 McBSP 2 Transmit Channel Enable Register Partition B
0x3012 PCR2 McBSP 2 Pin Control Register
0x3013 RCERC2 McBSP 2 Receive Channel Enable Register Partition C
0x3014 RCERD2 McBSP 2 Receive Channel Enable Register Partition D
0x3015 XCERC2 McBSP 2 Transmit Channel Enable Register Partition C
0x3016 XCERD2 McBSP 2 Transmit Channel Enable Register Partition D
0x3017 RCERE2 McBSP 2 Receive Channel Enable Register Partition E
0x3018 RCERF2 McBSP 2 Receive Channel Enable Register Partition F
0x3019 XCERE2 McBSP 2 Transmit Channel Enable Register Partition E
0x301A XCERF2 McBSP 2 Transmit Channel Enable Register Partition F
0x301B RCERG2 McBSP 2 Receive Channel Enable Register Partition G
0x301C RCERH2 McBSP 2 Receive Channel Enable Register Partition H
0x301D XCERG2 McBSP 2 Transmit Channel Enable Register Partition G
0x301E XCERH2 McBSP 2 Transmit Channel Enable Register Partition H
Functional Overview
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June 2000 − Revised September 2007 SPRS076O
Table 3−19. GPIO Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x3400 IODIR General-purpose I/O Direction Register
0x3401 IODATA General-purpose I/O Data Register
Table 3−20. Device Revision ID Registers
PORT ADDRESS REGISTER NAME DESCRIPTION
0x3800 − 0x3803 DieID[63:0] Factory Die Identification†
0x3804 RevID[15:0] Identifies silicon revision
Revision 2.1: 0x6511
Revision 2.2: 0x6512
†The Die_ID register contains factory identification information and does not require any intervention from the user. When the DIE_ID register is
used, at least 3 TCK clocks after reset are required to properly initialize the register contents.
Functional Overview
44 June 2000 − Revised September 2007SPRS076O
3.5 Interrupts
Vector-relative locations and priorities for all internal and external interrupts are shown in Table 3−21. The
locations of the interrupt vectors are defined as an offset from the location defined in the interrupt vector
pointers (IVPD and IVPH). For more detailed information about the interrupt vector pointers and interrupts,
see the TMS320C55x DSP CPU Reference Guide (literature number SPRU371).
Table 3−21. Interrupt Table
NAME SOFTWARE
(TRAP)
EQUIVALENT
OFFSET LOCATION
(HEX BYTES) PRIORITY FUNCTION
RESET SINT0 0 0 Reset (hardware and software)
NMI SINT1 8 1 Nonmaskable interrupt
INT0 SINT2 10 3 External interrupt #0
INT2 SINT3 18 5 External interrupt #2
TINT0 SINT4 20 6 Timer #0 interrupt
RINT0 SINT5 28 7 McBSP #0 receive interrupt
RINT1 SINT6 30 9 McBSP #1 receive interrupt
XINT1 SINT7 38 10 McBSP #1 transmit interrupt
− SINT8 40 11 Software interrupt #8
DMAC1 SINT9 48 13 DMA Channel #1 interrupt
DSPINT SINT10 50 14 Interrupt from host (EHPI)
INT3 SINT11 58 15 External interrupt #3
RINT2 SINT12 60 17 McBSP #2 receive interrupt
XINT2 SINT13 68 18 McBSP #2 transmit interrupt
DMAC4 SINT14 70 21 DMA Channel #4 interrupt
DMAC5 SINT15 78 22 DMA Channel #5 interrupt
INT1 SINT16 80 4 External interrupt #1
XINT0 SINT17 88 8 McBSP #0 transmit interrupt
DMAC0 SINT18 90 12 DMA Channel #0 interrupt
INT4 SINT19 98 16 External interrupt #4
DMAC2 SINT20 A0 19 DMA Channel #2 interrupt
DMAC3 SINT21 A8 20 DMA Channel #3 interrupt
TINT1 SINT22 B0 23 Timer #1 interrupt
INT5 SINT23 B8 24 External interrupt #5
BERR SINT24 C0 2 Bus Error interrupt
DLOG SINT25 C8 25 Data Log interrupt
RTOS SINT26 D0 26 Real-time Operating System interrupt
− SINT27 D8 27 Software interrupt #27
− SINT28 E0 28 Software interrupt #28
− SINT29 E8 29 Software interrupt #29
− SINT30 F0 30 Software interrupt #30
SINT31 F8 31 Software interrupt #31
Functional Overview
45
June 2000 − Revised September 2007 SPRS076O
3.5.1 IFR and IER Registers
The Interrupt Enable Registers (IER0 and IER1) control which interrupts will be masked or enabled during
normal operation. The Interrupt Flag Registers (IFR0 and IFR1) contain flags that indicate interrupts that are
currently pending.
The Debug Interrupt Enable Registers (DBIER0 and DBIER1) are used only when the CPU is halted in the
real-time emulation mode. If the CPU is running in real-time mode, the standard interrupt processing (IER0/1)
is used and DBIER0/1 are ignored.
A maskable interrupt enabled in a DBIER0/1 is defined as a time-critical interrupt. When the CPU is halted
in the real-time mode, the only interrupts that are serviced are time-critical interrupts that are also enabled in
an interrupt enable register (IER0 or IER1)
Write the DBIER0/1 to enable or disable time-critical interrupts. To enable an interrupt, set its corresponding
bit. To disable an interrupt, clear its corresponding bit. Note that DBIER0/1 are not affected by a software reset
instruction or by a DSP hardware reset. Initialize these registers before using the real-time emulation mode.
The bit layouts of these registers for each interrupt are shown in Figure 3−7.
15 14 13 12 11 10 9 8
DMAC5 DMAC4 XINT2 RINT2 INT3 DSPINT DMAC1 Reserved
7654321 0
XINT1 RINT1 RINT0 TINT0 INT2 INT0 Reserved
Figure 3−7. IFR0, IER0, DBIFR0, and DBIER0 Bit Locations
The IFR1 (Interrupt Flag Register 1) and IER1 (Interrupt Enable Register 1) bit layouts are shown in
Figure 3−8.
15 11 10 9 8
Reserved RTOS DLOG BERR
76543210
INT5 TINT1 DMAC3 DMAC2 INT4 DMAC0 XINT0 INT1
Figure 3−8. IFR1, IER1, DBIFR1, and DBIER1 Bit Locations
3.5.2 Interrupt Timing
The external interrupts (NMI and INTx) are automatically synchronized to the CPU. The interrupt inputs are
sampled on the falling edges of the CPU clock. A sequence on the interrupt pin of 1-0-0-0 on consecutive
cycles is required for an interrupt to be detected. Therefore, the minimum low pulse duration on the external
interrupts on the 5510/5510A is three CPU clock periods.
Functional Overview
46 June 2000 − Revised September 2007SPRS076O
3.6 Notices Concerning CLKOUT Operation
3.6.1 CLKOUT Voltage Level
On the TMS320VC5510/5510A, CLKOUT is driven at CVDD supply voltage. This voltage level may be too low
to interface to some devices. In that event, buffers may need to be employed to support interfacing CLKOUT.
3.6.2 CLKOUT Value During Reset
During reset, the CLKOUT pin is driven to a logic 1.
Support
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June 2000 − Revised September 2007 SPRS076O
4 Support
4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability
4.1.1 Initialization Requirements for Boundary Scan Test
The TMS320VC5510/5510A uses the JTAG port for boundary scan tests, emulation capability and factory test
purposes. To use boundary scan test, the EMU0 and EMU1/OFF pins must be held LOW through a rising edge
of the TRST signal prior to the first scan. This operation selects the appropriate TAP control for boundary scan.
If at any time during a boundary scan test a rising edge of TRST occurs when EMU0 or EMU1/OFF are not
low, a factory test mode may be selected preventing boundary scan test from being completed. For this
reason, it is recommended that EMU0 and EMU1/OFF be pulled or driven low at all times during boundary
scan test.
4.1.2 Boundary Scan Description Language (BSDL) Model
BSDL models are available on the web in the TMS320VC5510/5510A product folder under the “simulation
models” section.
4.2 Documentation Support
Extensive documentation supports all TMS320 DSP family of devices from product announcement through
applications development. The following types of documentation are available to support the design and use
of the TMS320C5000 platform of DSPs:
•TMS320C55x DSP Functional Overview (literature number SPRU312)
•TMS320C55x DSP Peripherals Overview Reference Guide (literature number SPRU317)
•TMS320C55x DSP CPU Reference Guide (literature number SPRU371)
•TMS320C55x DSP CPU Programmer’s Reference Supplement (literature number SPRU652)
•TMS320C55x Assembly Language Tools User’s Guide (literature number SPRU280)
•TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s Reference
(literature number SPRU098)
•TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number SPRU037)
•TMS320VC5510 DSP Instruction Cache Reference Guide (literature number SPRU576)
•TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide (literature number SPRU592)
•TMS320VC5503/5507/5509/5510 DSP Direct Memory Access (DMA) Controller Reference Guide
(literature number SPRU587)
•TMS320VC5510 DSP Host Port Interface (HPI) Reference Guide (literature number SPRU588)
•TMS320VC5503/5507/5509/5510 DSP Timers Reference Guide (literature number SPRU595)
•Using the TMS320VC5510 Bootloader application report (literature number SPRA763)
•TMS320VC5510/5510A Hardware Designer’s Resource Guide (literature number SPRAA43)
•TMS320VC5510/5510A Digital Signal Processors Silicon Errata (literature number SPRZ008)
•Device-specific data sheets
•Complete user’s guides
•Development support tools
•Hardware and software application reports
The reference set describes in detail the TMS320C55x DSP products currently available and the hardware
and software applications, including algorithms, for fixed-point TMS320 DSP family of devices.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published
quarterly and distributed to update TMS320 DSP customers on product information.
Information regarding Texas Instruments (TI) DSP products is also available on the Worldwide Web at
http://www.ti.com uniform resource locator (URL).
TMS320 and TMS320C5000 are trademarks of Texas Instruments.
Support
48 June 2000 − Revised September 2007SPRS076O
4.3 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, o r T MS
(e.g., TMS320VC5510A). Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device’ s electrical specifications
TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification
TMS Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
Support
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June 2000 − Revised September 2007 SPRS076O
4.4 TMS320VC5510/5510A Device Nomenclature
PREFIX
DEVICE TEMP. RANGE
TMS 320 VC 5510 GGW (A)
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-STD-883C
SM = High Rel (non-883C)
DEVICE FAMILY
320 = TMS320 family
TECHNOLOGY
(no suffix) = 0° to 85°C
A = −40° to 85°C
PACKAGE TYPE†
GGW = 240-pin plastic BGA
ZGW = 240-pin plastic BGA [Lead-free]
VC = Dual-Supply CMOS
DEVICE
55x DSP: 5510
†BGA = Ball Grid Array
(A) 2
DEVICE SPEED RANGE
1 = 160 MHz
2 = 200 MHz
DEVICE REVISION
(no suffix) = Revision 2.1
A = Revision 2.2
Figure 4−1. Device Nomenclature for the TMS320VC5510/5510A
Electrical Specifications
50 June 2000 − Revised September 2007SPRS076O
5 Electrical Specifications
This section provides the absolute maximum ratings and the recommended operating conditions for the
TMS320VC5510/5510A DSPs.
All electrical and switching characteristics in this data manual are valid over the recommended operating
conditions unless otherwise specified.
5.1 Absolute Maximum Ratings
The list of absolute maximum ratings are specified over operating case temperature. Stresses beyond those
listed under “absolute maximum ratings” (Section 5.2) may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated under “recommended operating conditions” (Section 5.3) is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability. All supply voltage
values (core and I/O) are with respect to VSS. Figure 5−1 provides the test load circuit values for a 3.3-V
device. Measured timing information contained in this data manual is based on the test load setup and
conditions shown in Figure 5−1.
5.2 Electrical Specifications
This section provides the absolute maximum ratings for the TMS320VC5510/5510A DSPs.
Supply voltage I/O range, DVDD − 0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage core range, CVDD − 0.3 V to 2.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, TC: (Commercial) 0°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(Extended) − 40_C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range Tstg − 55_C to 150_C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Recommended Operating Conditions MIN NOM MAX UNIT
DVDD Device supply voltage, I/O 3.0 3.3 3.6 V
CVDD Device supply voltage, core Prototype revisions 2.1 and 2.2 and
production silicon†1.55 1.6 1.65 V
VSS Supply voltage, GND 0 V
V
IH
High-level input voltage, I/O
Hysteresis inputs
DVDD = 3.3 ±0.3 V 2.4 DVDD + 0.3 V
VIH
High-level input voltage, I/O
All other inputs 2.0 DVDD + 0.3
V
V
IL
Low-level input voltage, I/O
Hysteresis inputs
DVDD = 3.3 ±0.3 V −0.3 0.8 V
VIL
Low-level input voltage, I/O
All other inputs −0.3 0.8
V
IOH High-level output current All outputs −8 mA
IOL Low-level output current All outputs 8 mA
TC
Operating case temperature
Prototype (TMX) and Commercial
Temperature Range Production
Devices 0 85
°
C
TC
Operating case temperature
Extended Temperature Range
Production (TMS) devices −40 85
C
†See the TMS320VC5510/5510A Digital Signal Processors Silicon Errata (literature number SPRZ008) for further clarification and distinguishing
markings.
Electrical Specifications
51
June 2000 − Revised September 2007 SPRS076O
5.4 Electrical Characteristics Over Recommended Operating Case Temperature
Range (Unless Otherwise Noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH
High-level output
All output except CLKOUT DVDD = 3.3 ±0.3 V,
IOH = MAX 2.4
V
VOH
High-level output
voltage CLKOUT CVDD = 1.6 ±0.05 V,
IOH = MAX 1.24 V
VOL Low-level output voltage IOL = MAX 0.4 V
IIZ
Input current for outputs
Output-only or input/output pins with
bus holders
Bus holders enabled
CVDD = MAX,
VO = VSS to VDD − 275 275
A
IIZ
Input current for outputs
in high impedance All other output-only or input/output
pins
Bus holders disabled
CVDD = MAX,
VO = VSS to VDD − 5 5
µA
Input pins with internal pulldown CVDD = MAX,
VI = VSS to VDD − 5 300
IIInput current Input pins with internal pullup Pullup enabled
CVDD = MAX,
VI = VSS to VDD − 300 5µA
All other input-only pins or input-only
pins with pullup/pulldown disabled CVDD = MAX,
VI = VSS to VDD − 5 5
IDDC CVDD supply current, CPU + internal memory access †CVDD = 1.6 V,
CPU clock = 200 MHz
TC = 25°C112 mA
IDDP DVDD supply current, pins active ‡DVDD = 3.3 V
CPU clock = 100 MHz
TC = 25°C8 mA
IDDC CVDD supply current, standby
Only CLKGEN domain enabled, PLL enabled.
CVDD = 1.6 V
10-MHz clock input,
DPLL mode = x 20
TC = 25°C
32 mA
CVDD = 1.6 V
input clock stopped,
TC = 25°C69 µA
IDDC CVDD supply current, standby
All domains idled.
CVDD = 1.6 V
input clock stopped,
TC = 55°C374 µA
CVDD = 1.6 V
input clock stopped,
TC = 85°C976 µA
DVDD = 3.3 V
no pin activity,
TC = 25°C10 µA
IDDP DVDD supply current, standby
All domains idled.
DVDD = 3.3 V
no pin activity,
TC = 55°C10 µA
DVDD = 3.3 V
no pin activity,
TC = 85°C10 µA
CiInput capacitance 3 pF
CoOutput capacitance 3 pF
†Test Condition: CPU executing 75% Dual-MAC / 25% ADD with moderate data bus activity (table of sine values). CPU and CLKGEN domains
are active. All other domains are idled. The DPLL is enabled.
‡Test Condition: One word of a table of 16-bit sine values is written to the EMIF each microsecond (16 Mbps). Each EMIF output pin is connected
to a 10-pF load capacitance.
Electrical Specifications
52 June 2000 − Revised September 2007SPRS076O
Tester Pin
Electronics VLoad
IOL-test
CT
IOH-test
Output
Under
Test
50 Ω
Where: IOL-test =+2 mA (all outputs)
IOH-test =−2 mA (all outputs)
VLoad =50% of DVdd
CT=15 pF typical load circuit capacitance.
Figure 5−1. 3.3-V Test Load Circuit
5.5 Timing Parameter Symbology
Timing parameter symbols used in the timing requirements and switching characteristics tables are created
in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related
terminology have been abbreviated as follows:
Lowercase subscripts and their meanings: Letters and symbols and their meanings:
a access time H High
c cycle time (period) L Low
d delay time V Valid
dis disable time Z High impedance
en enable time
f fall time
h hold time
r rise time
su setup time
t transition time
v valid time
w pulse duration (width)
X Unknown, changing, or don’t care level
Electrical Specifications
53
June 2000 − Revised September 2007 SPRS076O
5.6 Clock Options
This section provides the timing requirements and switching characteristics for the various clock options
available on the 5510/5510A.
5.6.1 Clock Generation in Bypass Mode (DPLL Disabled)
The frequency of the reference clock provided at the CLKIN pin can be divided by a factor of one, two, or four
to generate the internal CPU clock cycle. The divide factor (D) is set in the BYPASS_DIV field of the clock mode
register. The contents of this field only af fect clock generation while the device is in bypass mode. In this mode,
the digital phase-locked loop (DPLL) clock synthesis is disabled.
Table 5−1 and Table 5−2 assume testing over recommended operating conditions and H = 0.5tc(CO) (see
Figure 5−2).
Table 5−1. CLKIN in Bypass Mode Timing Requirements
NO.
VC5510/5510A-160 VC5510/5510A-200
UNIT
NO.
MIN MAX MIN MAX
UNIT
C7 tc(CI) Cycle time, CLKIN 20 † 20 † ns
C8 tf(CI) Fall time, CLKIN 6 6 ns
C9 tr(CI) Rise time, CLKIN 6 6 ns
C10 tw(CIL) Pulse duration, CLKIN low 4 4 ns
C11 tw(CIH) Pulse duration, CLKIN high 4 4 ns
†This device utilizes a fully static design and therefore can operate with tc(CI) approaching ∞. The device is characterized at frequencies
approaching 0 Hz.
Table 5−2. CLKOUT in Bypass Mode Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160 VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN TYP MAX MIN TYP MAX
UNIT
C1 tc(CO) Cycle time, CLKOUT 20 tc(CI)/N‡20 tc(CI)/N‡ns
C2 td(CI-CO) Delay time, CLKIN high/low to CLKOUT high/low 1 7 14 1 7 14 ns
C3 tf(CO) Fall time, CLKOUT 1 1 ns
C4 tr(CO) Rise time, CLKOUT 1 1 ns
C5 tw(COL) Pulse duration, CLKOUT low H−1 H+1 H−1 H+1 ns
C6 tw(COH) Pulse duration, CLKOUT high H−1 H+1 H−1 H+1 ns
‡N = Clock frequency synthesis factor
C4
C3
CLKOUT
CLKIN
C5
C2
C8
C9
C1
C7
C6
C11
C10
NOTE A: The relationship of CLKIN to CLKOUT depends on the divide factor chosen. The waveform relationship shown in Figure 5−2 is intended
to illustrate the timing parameters only and may differ based on configuration.
Figure 5−2. Bypass Mode Clock Timing
Electrical Specifications
54 June 2000 − Revised September 2007SPRS076O
5.6.2 Clock Generation in Lock Mode (DPLL Synthesis Enabled)
The frequency of the reference clock provided at the CLKIN pin can be multiplied by a synthesis factor of N
to generate the internal CPU clock cycle. The synthesis factor is determined by:
N+M
DL
where: M = the multiply factor set in the PLL_MULT field of the clock mode register,
DL = the divide factor set in the PLL_DIV field of the clock mode register
Valid values for M are (multiply by) 2 to 31. Valid values for DL are (divide by) 1, 2, 3, and 4.
For detailed information on clock generation configuration, see the TMS320C55x DSP Peripherals Overview
Reference Guide (literature number SPRU317).
Table 5−3 and Table 5−4 assume testing over recommended operating conditions and H = 0.5tc(CO) (see
Figure 5−3).
Table 5−3. CLKIN in Lock Mode Timing Requirements
NO.
VC5510/5510A-160 VC5510/5510A-200
UNIT
NO.
MIN MAX MIN MAX
UNIT
C7 tc(CI) Cycle time, CLKIN DPLL synthesis enabled 20†400 20†400 ns
C8 tf(CI) Fall time, CLKIN 6 6 ns
C9 tr(CI) Rise time, CLKIN 6 6 ns
C10 tw(CIL) Pulse duration, CLKIN low 4 4 ns
C11 tw(CIH) Pulse duration, CLKIN high 4 4 ns
†The clock frequency synthesis factor and minimum CLKIN cycle time should be chosen such that the resulting CLKOUT cycle time is within the
specified range (tc(CO)).
Table 5−4. CLKOUT in Lock Mode Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160 VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN TYP MAX MIN TYP MAX
UNIT
C1 tc(CO) Cycle time, CLKOUT 6.25 tc(CI)/N‡5 tc(CI)/N‡ns
C2 td(CI-CO) Delay time, CLKIN high/low to CLKOUT high/low 1 7 14 1 7 14 ns
C3 tf(CO) Fall time, CLKOUT 1 1 ns
C4 tr(CO) Rise time, CLKOUT 1 1 ns
C5 tw(COL) Pulse duration, CLKOUT low H−1 H+1 H−1 H+1 ns
C6 tw(COH) Pulse duration, CLKOUT high H−1 H+1 H−1 H+1 ns
‡N = Clock frequency synthesis factor
C1
C7
C5 C3
C4
C8
CLKIN
CLKOUT
C2
C6
C9
Bypass Mode
C10
C11
NOTE A: The waveform relationship of CLKIN to CLKOUT depends on the multiply and divide factors chosen. The waveform relationship shown
in Figure 5−3 is intended to illustrate the timing parameters only and may differ based on configuration.
Figure 5−3. External Multiply-by-N Clock Timing
Electrical Specifications
55
June 2000 − Revised September 2007 SPRS076O
5.7 Memory Timing
5.7.1 Asynchronous Memory Timing
Table 5−5 and Table 5−6 assume testing over recommended operating conditions (see Figure 5−4 and
Figure 5−5). Note that the asynchronous memory interface is read-only when configured as 8-bit mode.
Asynchronous writes in 8-bit mode are not supported.
Table 5−5. Asynchronous Memory Cycles Timing Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
A6 tsu(DV-COH) Setup time, read data valid before CLKOUT high†6 ns
A7 th(COH-DV) Hold time, read data valid after CLKOUT high 0 ns
A10 tsu(ARDY-COH) Setup time, ARDY valid before CLKOUT high 7 ns
A11 th(COH-ARDY) Hold time, ARDY valid after CLKOUT high 0 ns
†To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. If ARDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, ARDY can be an asynchronous input.
Table 5−6. Asynchronous Memory Cycles Switching Characteristics‡§
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
A1 td(COH-CEV) Delay time, CLKOUT high to CEx transition −2 4 ns
A2 td(COH-BEV) Delay time, CLKOUT high to BEx valid 4 ns
A3 td(COH-BEIV) Delay time, CLKOUT high to BEx invalid −2 ns
A4 td(COH-AV) Delay time, CLKOUT high to address valid 4 ns
A5 td(COH-AIV) Delay time, CLKOUT high to address invalid −2 ns
A8 td(COH-AOEV) Delay time, CLKOUT high to AOE valid −2 4 ns
A9 td(COH-AREV) Delay time, CLKOUT high to ARE valid −2 4 ns
A12 td(COH-DV) Delay time, CLKOUT high to data valid (write) 4 ns
A13 td(COH-DIV) Delay time, CLKOUT high to data invalid (write) −2 ns
A14 td(COH-AWEV) Delay time, CLKOUT high to A WE valid −2 4 ns
‡The minimum delay is also the minimum output hold after CLKOUT high.
§All timings referenced to CLKOUT assume CLKOUT represents the internal CPU clock (divide-by-1 mode).
Electrical Specifications
56 June 2000 − Revised September 2007SPRS076O
Extended
Hold = 2†‡
Hold = 1†
A11A11
A10 A10
A9A9
A8A8
A7
A6
A5A4
A3A2
A1A1
CLKOUT§
CEx¶
BE[3:0]
A[21:0]
D[31:0]
AOE
ARE
AWE
ARDY#
Setup = 1†Strobe = 5†Not ready = 2
†Setup, Strobe, Hold, and Extended Hold are programmable in the EMIF. The programmable Hold period is not associated with the activity of
the HOLD and HOLDA signals.
‡The extended hold time is programmable in the EMIF and is only present when consecutive memory accesses are made to different CEx spaces,
or are of different types (read/write).
§All timings referenced to CLKOUT assume CLKOUT is the same frequency as the internal CPU clock (divide-by-1 mode).
¶The chip enable that becomes active depends on the address.
#ARDY is synchronized internally. If the setup time shown is not met, ARDY will be recognized on the next clock cycle.
Figure 5−4. Asynchronous Memory Read Timing
Electrical Specifications
57
June 2000 − Revised September 2007 SPRS076O
Extended
Hold = 2†‡
Hold = 1†
A11
A10
A11
A10
A14
A14
A13
A12
A5
A4
A3
A2
A1
A1
CLKOUT§
CEx¶
BE[3:0]
A[21:0]
D[31:0]
AOE
ARE
AWE
ARDY#
Setup = 1†Strobe = 5†Not ready = 2
†Setup, Strobe, Hold, and Extended Hold are programmable in the EMIF. The programmable Hold period is not associated with the activity of
the HOLD and HOLDA signals.
‡The extended hold time is programmable in the EMIF and is only present when consecutive memory accesses are made to different CEx spaces,
or are of different types (read/write).
§All timings referenced to CLKOUT assume CLKOUT is the same frequency as the internal CPU clock (divide-by-1 mode).
¶The chip enable that becomes active depends on the address.
#ARDY is synchronized internally. If the setup time shown is not met, ARDY will be recognized on the next clock cycle.
Figure 5−5. Asynchronous Memory Write Timing
Electrical Specifications
58 June 2000 − Revised September 2007SPRS076O
5.7.2 Synchronous-Burst SRAM (SBSRAM) Timing
Table 5−7 and Table 5−8 assume testing over recommended operating conditions (see Figure 5−6 and
Figure 5−7).
Table 5−7. Synchronous-Burst SRAM Cycle T iming Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
SB7 tsu(DV-CLKMEMH) Setup time, read data valid before CLKMEM high 5 ns
SB8 th(CLKMEMH-DV) Hold time, read data valid after CLKMEM high 2 ns
Table 5−8. Synchronous-Burst SRAM Cycle Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
SB1 td(CLKMEMH-CEL) Delay time, CLKMEM high to CEx low 3 6 ns
SB2 td(CLKMEMH-CEH) Delay time, CLKMEM high to CEx high 3 6 ns
SB3 td(CLKMEMH-BEV) Delay time, CLKMEM high to BEx valid 3 6 ns
SB4 td(CLKMEMH-BEIV) Delay time, CLKMEM high to BEx invalid 3 6 ns
SB5 td(CLKMEMH-AV) Delay time, CLKMEM high to address valid 3 6 ns
SB6 td(CLKMEMH-AIV) Delay time, CLKMEM high to address invalid 3 6 ns
SB9 td(CLKMEMH-ADSL) Delay time, CLKMEM high to SSADS low 3 6 ns
SB10 td(CLKMEMH-ADSH) Delay time, CLKMEM high to SSADS high 3 6 ns
SB11 td(CLKMEMH-OEL) Delay time, CLKMEM high to SSOE low 3 6 ns
SB12 td(CLKMEMH-OEH) Delay time, CLKMEM high to SSOE high 3 6 ns
SB13 td(CLKMEMH-DV) Delay time, CLKMEM high to data valid 3 6 ns
SB14 td(CLKMEMH-DIV) Delay time, CLKMEM high to data invalid 3 6 ns
SB15 td(CLKMEMH-WEL) Delay time, CLKMEM high to SSWE low 3 6 ns
SB16 td(CLKMEMH-WEH) Delay time, CLKMEM high to SSWE high 3 6 ns
Electrical Specifications
59
June 2000 − Revised September 2007 SPRS076O
Q1 Q2 Q3 Q4
SB2
CLKMEM
CEx†
BE[3:0]
A[21:0]
D[31:0]
SSOE
SSWE
BE1 BE2 BE3 BE4
A1 A2 A3 A4
SB1
SB3 SB4
SB5
SB9
SB7
SB10
SB11 SB12
SB6
Q1 Q2 Q3 Q4
SSADS
SB8
†The chip enable that becomes active depends on the address.
Figure 5−6. SBSRAM Read Timing
CLKMEM
CEx†
BE[3:0]
A[21:0]
D[31:0]
SSADS
SSOE
SSWE
D1
A1 A2 A3 A4
D2 D3 D4
SB1
SB3 SB4
SB5
SB9 SB10
SB16
SB14
SB6
SB2
SB13
SB15
BE1 BE2 BE3 BE4
†The chip enable that becomes active depends on the address.
Figure 5−7. SBSRAM Write Timing
Electrical Specifications
60 June 2000 − Revised September 2007SPRS076O
5.7.3 Synchronous DRAM (SDRAM) Timing
Table 5−9 and Table 5−10 assume testing over recommended operating conditions (see Figure 5−8 through
Figure 5−13).
Table 5−9. Synchronous DRAM Cycle T iming Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
SD7 tsu(DV-CLKMEMH) Setup time, read data valid before CLKMEM high 5 ns
SD8 th(CLKMEMH-DV) Hold time, read data valid after CLKMEM high 2 ns
Table 5−10. Synchronous DRAM Cycle Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
SD1 td(CLKMEMH-CEL) Delay time, CLKMEM high to CEx low 3 6 ns
SD2 td(CLKMEMH-CEH) Delay time, CLKMEM high to CEx high 3 6 ns
SD3 td(CLKMEMH-BEV) Delay time, CLKMEM high to BEx valid 3 6 ns
SD4 td(CLKMEMH-BEIV) Delay time, CLKMEM high to BEx invalid 3 6 ns
SD5 td(CLKMEMH-AV) Delay time, CLKMEM high to address valid 3 6 ns
SD6 td(CLKMEMH-AIV) Delay time, CLKMEM high to address invalid 3 6 ns
SD9 td(CLKMEMH-SDCASL) Delay time, CLKMEM high to SDCAS low 3 5 ns
SD10 td(CLKMEMH-SDCASH) Delay time, CLKMEM high to SDCAS high 3 5 ns
SD11 td(CLKMEMH-DV) Delay time, CLKMEM high to data valid 3 5 ns
SD12 td(CLKMEMH-DIV) Delay time, CLKMEM high to data invalid 3 5 ns
SD13 td(CLKMEMH-SDWEL) Delay time, CLKMEM high to SDWE low 3 5 ns
SD14 td(CLKMEMH-SDWEH) Delay time, CLKMEM high to SDWE high 3 5 ns
SD15 td(CLKMEMH-SDA10V) Delay time, CLKMEM high to SDA10 valid 3 5 ns
SD16 td(CLKMEMH-SDA10IV) Delay time, CLKMEM high to SDA10 invalid 3 5 ns
SD17 td(CLKMEMH-SDRASL) Delay time, CLKMEM high to SDRAS low 3 5 ns
SD18 td(CLKMEMH-SDRASH) Delay time, CLKMEM high to SDRAS high 3 5 ns
Electrical Specifications
61
June 2000 − Revised September 2007 SPRS076O
CLKMEM
CEx†
BE[3:0]‡
A[15:2]§
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
CA1 CA2
D1 D2
SD10
SD16
SD6
SD2
SD1
SD8
SD7
READ
READ
SD3
SD15
SD9
SD5
†The chip enable that becomes active depends on the address.
‡All BE[3:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain
active until the next access that is not an SDRAM read occurs.
§The number of address signals used depends on the SDRAM size and width.
Figure 5−8. Two SDRAM Read Commands (Active Row)
CLKMEM
CEx†
BE[3:0]
A[15:2]‡
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
BE1 BE2
CA1 CA2
D1 D2
SD14
SD10
SD16
SD12
SD6
SD4
SD2
SD1
WRITE
WRITE
SD3
SD5
SD11
SD15
SD9
SD13
†The chip enable that becomes active depends on the address.
‡The number of address signals used depends on the SDRAM size and width.
Figure 5−9. Two SDRAM WRT Commands (Active Row)
Electrical Specifications
62 June 2000 − Revised September 2007SPRS076O
CLKMEM
CEx†
BE[3:0]
A[15:2]‡
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
Bank Activate/Row Address
Row Address
SD18
SD2
SD1
ACTV
SD5
SD15
SD17
†The chip enable that becomes active depends on the address.
‡The number of address signals used depends on the SDRAM size and width.
Figure 5−10. SDRAM ACTV Command
CLKMEM
CEx†
BE[3:0]
A[15:2]‡
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
SD14
SD18
SD16
SD2
SD1
DCAB
SD15
SD17
SD13
†The chip enable that becomes active depends on the address.
‡The number of address signals used depends on the SDRAM size and width.
Figure 5−11. SDRAM DCAB Command
Electrical Specifications
63
June 2000 − Revised September 2007 SPRS076O
CLKMEM
CEx†
BE[3:0]
A[15:2]‡
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
SD10
SD18
SD2SD1
REFR
SD17
SD9
SD15 SD16
†The chip enable that becomes active depends on the address.
‡The number of address signals used depends on the SDRAM size and width.
Figure 5−12. SDRAM REFR Command
CLKMEM
CEx†
BE[3:0]
A[15:2]‡
D[31:0]
SDA10
SDRAS
SDCAS
SDWE
MRS Value 0x30
SD14
SD10
SD18
SD6
SD2
SD1
MRS
SD5
SD17
SD9
SD13
SD16
SD15
†The chip enable that becomes active depends on the address.
‡The number of address signals used depends on the SDRAM size and width.
Figure 5−13. SDRAM MRS Command
Electrical Specifications
64 June 2000 − Revised September 2007SPRS076O
5.8 HOLD and HOLDA Timings
Table 5−11 and Table 5−12 assume testing over recommended operating conditions (see Figure 5−14).
Table 5−11. HOLD and HOLDA Timing Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
H1 tsu(HOLDH-COH) Setup time, HOLD high before CLKOUT high†7 ns
†HOLD is synchronized internally. If the setup time shown is not met, HOLD will be recognized on the next clock cycle.
Table 5−12. HOLD and HOLDA Switching Characteristics‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
H2 tR(COH-BHZ) Response time, CLKOUT high to EMIF Bus high impedance (HZ)¶4P §ns
H3 tR(COH-HOLDAL) Response time, CLKOUT high to HOLDA low 5P−1 ns
H4 tR(COH-HOLDAH) Response time, CLKOUT high to HOLDA high 4P−1 4P+5 ns
H5 tR(COH-BLZ) Response time, CLKOUT high to EMIF Bus low impedance (LZ) (active)¶4P−1 4P+5 ns
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the minimum delay
time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
¶EMIF Bus consists of CE[3:0], BE[3:0], D[31:0], A[21:0], ARE, AOE, AWE, SSADS, SSOE, SSWE, CLKMEM, SDA10, SDRAS, SDCAS, and
SDWE.
CLKOUT
HOLD
HOLDA
EMIF BUS†
H1 H1
H3 H4
H2 H5
†EMIF Bus consists of CE[3:0], BE[3:0], D[31:0], A[21:0], ARE, AOE, AWE, SSADS, SSOE, SSWE, SDA10, SDRAS, SDCAS, SDWE, and
CLKMEM.
Figure 5−14. HOLD/HOLDA Timing
Electrical Specifications
65
June 2000 − Revised September 2007 SPRS076O
5.9 Reset Timings
Table 5−13 and Table 5−14 assume testing over recommended operating conditions (see Figure 5−15).
Table 5−13. Reset Timing Requirements†
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
R1 tw(RSL) Pulse width, reset low 2P + 5 ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−14. Reset Switching Characteristics†
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
R3 td(RSL-EMIFHZ) Delay time, reset low to EMIF group high impedance‡19 ns
R4 td(RSL-EMIFV) Delay time, reset low to EMIF group valid‡38P + 19 ns
R5 td(RSL-LOWIV) Delay time, reset low to low group invalid§17 ns
R6 td(RSL-LOWV) Delay time, reset low to low group valid§38P + 17 ns
R7 td(RSL-HIGHIV) Delay time, reset low to high group invalid§9 ns
R8 td(RSL-HIGHV) Delay time, reset low to high group valid§38P + 9 ns
R9 td(RSL-ZHZ) Delay time, reset low to Z group high impedance¶18 ns
R10 td(RSL-ZV) Delay time, reset low to Z group valid¶39P + 18 ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡EMIF group: CE[0:3], BE[0:3], CLKMEM, ARE, AOE, AWE, SSADS, SSOE, SSWE, SDRAS, SDCAS, SDWE, and SDA10
§High group: HINT
Low group: HOLDA
¶Z group: A[21:0], D[31:0], CLKR[2:0], CLKX[2:0], FSR[2:0], FSX[2:0], DX[2:0], IO[7:0], XF, and TIN/TOUT[1:0]
R1
R3
R5
R7
R9
R4
R6
R8
R10
RESET
EMIF Group†
Low Group‡
High Group‡
Z Group§
†EMIF group: CE[0:3], BE[0:3], CLKMEM, ARE, AOE, AWE, SSADS, SSOE, SSWE, SDRAS, SDCAS, SDWE, and SDA10
‡High group: HINT
Low group: HOLDA
§Z group: A[21:0], D[31:0], CLKR[2:0], CLKX[2:0], FSR[2:0], FSX[2:0], DX[2:0], IO[7:0], XF, and TIN/TOUT[1:0]
Figure 5−15. Reset Timing
Electrical Specifications
66 June 2000 − Revised September 2007SPRS076O
5.10 External Interrupt Timings
Table 5−15 assumes testing over recommended operating conditions (see Figure 5−16).
Table 5−15. External Interrupt Timing Requirements†
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
I1 tw(INTH)A Pulse width, interrupt high, CPU active 2P ns
I2 tw(INTL)A Pulse width, interrupt low, CPU active 3P ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
I1
I2
INTn
Figure 5−16. External Interrupt Timings
Electrical Specifications
67
June 2000 − Revised September 2007 SPRS076O
5.11 XF Timings
Table 5−16 assumes testing over recommended operating conditions (see Figure 5−17).
Table 5−16. XF Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
X1
td(XF)
Delay time, CLKOUT high to XF high 0 4
ns
X1
td(XF) Delay time, CLKOUT high to XF low 0 4 ns
XF
CLKOUT
X1
Figure 5−17. XF Timing
Electrical Specifications
68 June 2000 − Revised September 2007SPRS076O
5.12 General-Purpose Input/Output (IOx) Timings
Table 5−17 and Table 5−18 assume testing over recommended operating conditions (see Figure 5−18).
Table 5−17. General-Purpose Input/Output (GPIO) Pins Configured as Inputs Timing Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
G2 tsu(GPIO-COH) Setup time, IOx input valid before CLKOUT high 8 ns
G3 th(COH-GPIO) Hold time, IOx input valid after CLKOUT high 0 ns
Table 5−18. General-Purpose Input/Output (GPIO) Pins Configured as Inputs Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
G1 td(COH-GPIO) Delay time, CLKOUT high to IOx output change 0 6 ns
IOx Input Mode
CLKOUT
G3
IOx Output Mode
G2
G1
Figure 5−18. General-Purpose Input/Output (IOx) Signal Timings
Electrical Specifications
69
June 2000 − Revised September 2007 SPRS076O
5.13 TIN/TOUT Timings
Table 5−19 and Table 5−20 assume testing over recommended operating conditions (see Figure 5−19 and
Figure 5−20).
Table 5−19. TIN/TOUT Pins Configured as Inputs Timing Requirements†
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
T4 tw(TIN/TOUTL) Pulse width, TIN/TOUT low 2P + 1 ns
T5 tw(TIN/TOUTH) Pulse width, TIN/TOUT high 2P + 1 ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−20. TIN/T OUT Pins Configured as Outputs Switching Characteristics†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
T1 td(COH-TIN/TOUTH) Delay time, CLKOUT high to TIN/TOUT high 0 2 ns
T2 td(COH-TIN/TOUTL) Delay time, CLKOUT high to TIN/TOUT low 0 2 ns
T3 tw(TIN/TOUT) Pulse duration, TIN/TOUT (output) P ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡For proper operation of the TIN/TOUT pin configured as an output, the timer period must be configured for at least 4 cycles.
TIN/TOUT
as Input
T4
T5
Figure 5−19. TIN/TOUT Timing When Configured as Inputs
TIN/TOUT
as Output
CLKOUT
T2
T1 T3
Figure 5−20. TIN/TOUT Timing When Configured as Outputs
Electrical Specifications
70 June 2000 − Revised September 2007SPRS076O
5.14 Multichannel Buffered Serial Port (McBSP) Timings
5.14.1 McBSP Transmit and Receive Timings
Table 5−21 and Table 5−22 assume testing over recommended operating conditions (see Figure 5−21 and
Figure 5−22).
Table 5−21. McBSP Timing Requirements†‡
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
M11 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 2P ns
M12 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext P−1 ns
M13 tr(CKRX) Rise time, CLKR/X CLKR/X ext 5 ns
M14 tf(CKRX) Fall time, CLKR/X CLKR/X ext 5 ns
M15
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
CLKR int 5
ns
M15
tsu(FRH-CKRL) Setup time, external FSR high before CLKR low CLKR ext 1ns
M16
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
CLKR int 0
ns
M16
th(CKRL-FRH) Hold time, external FSR high after CLKR low CLKR ext 2ns
M17
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
CLKR int 4
ns
M17
tsu(DRV-CKRL) Setup time, DR valid before CLKR low CLKR ext 1ns
M18
th(CKRL-DRV)
Hold time, DR valid after CLKR low
CLKR int 0
ns
M18
th(CKRL-DRV) Hold time, DR valid after CLKR low CLKR ext 2ns
M19
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
CLKX int 5
ns
M19
tsu(FXH-CKXL) Setup time, external FSX high before CLKX low CLKX ext 1ns
M20
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
CLKX int 0
ns
M20
th(CKXL-FXH) Hold time, external FSX high after CLKX low CLKX ext 2ns
†Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are
also inverted.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Electrical Specifications
71
June 2000 − Revised September 2007 SPRS076O
Table 5−22. McBSP Switching Characteristics†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
M1 tc(CKRX) Cycle time, CLKR/X CLKR/X int 2P ns
M2 tw(CKRXH) Pulse duration, CLKR/X high CLKR/X int D−1§D+1§ns
M3 tw(CKRXL) Pulse duration, CLKR/X low CLKR/X int C−1§C+1§ns
M4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int −2 2 ns
M4
td(CKRH-FRV) Delay time, CLKR high to internal FSR valid CLKR ext 3 7 ns
M5
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
CLKX int −2 2
ns
M5
td(CKXH-FXV) Delay time, CLKX high to internal FSX valid CLKX ext 3 7 ns
M6
tdis(CKXH-DXHZ)
Disable time, CLKX high to DX high impedance following last data bit
CLKX int 0 2
ns
M6
tdis(CKXH-DXHZ
)
Disable time, CLKX high to DX high impedance following last data b
it
CLKX ext 111 ns
Delay time, CLKX high to DX valid.
CLKX int 6
Delay time, CLKX high to DX valid.
This applies to all bits except the first bit transmitted. CLKX ext 9
M7
t
¶
DXENA = 0
CLKX int 6
ns
M7 td(CKXH-DXV) Delay time, CLKX high to DX valid¶DXENA = 0 CLKX ext 9ns
Only applies to first bit transmitted when in Data
DXENA = 1
CLKX int 2P+6
Only applies to first bit transmitted when in Data
Delay 1 or 2 (XDATDLY=01b or 10b) modes DXENA = 1 CLKX ext 2P+9
¶
DXENA = 0
CLKX int 0
M8
ten(CKXH-DX)
Enable time, CLKX high to DX driven¶DXENA = 0 CLKX ext 6
ns
M8
ten(CKXH-DX)
Only applies to first bit transmitted when in Data
DXENA = 1
CLKX int Pns
Only applies to first bit transmitted when in Data
Delay 1 or 2 (XDATDLY=01b or 10b) modes DXENA = 1 CLKX ext P+6
¶
DXENA = 0
FSX int 5
M9
td(FXH-DXV)
Delay time, FSX high to DX valid¶DXENA = 0 FSX ext 9
ns
M9
td(FXH-DXV)
Only applies to first bit transmitted when in Data
DXENA = 1
FSX int 2P+5 ns
Only applies to first bit transmitted when in Data
Delay 0 (XDATDLY=00b) mode. DXENA = 1 FSX ext 2P+9
¶
DXENA = 0
FSX int 0
M10
ten(FXH-DX)
Enable time, FSX high to DX driven¶DXENA = 0 FSX ext 6
ns
M10
ten(FXH-DX)
Only applies to first bit transmitted when in Data
DXENA = 1
FSX int Pns
Only applies to first bit transmitted when in Data
Delay 0 (XDATDLY=00b) mode DXENA = 1 FSX ext P+6
†Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal ar e
also inverted.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§T=CLKRX period = (1 + CLKGDV) * P
C=CLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D=CLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
¶See the TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number
SPRU592) for a description of the DX enable (DXENA) and data delay features of the McBSP.
Electrical Specifications
72 June 2000 − Revised September 2007SPRS076O
(n−2)Bit (n−1)
(n−3)(n−2)Bit (n−1)
(n−4)(n−3)(n−2)Bit (n−1)
M18
M17
M18
M17
M17 M18
M16
M15
M4
M4 M14
M13
M3, M12
M1, M11
M2, M12
(RDATDLY=10b)
DR
(RDATDLY=01b)
DR
(RDATDLY=00b)
DR
FSR (ext)
FSR (int)
CLKR
Figure 5−21. McBSP Receive Timings
M8
M7
M7
M8
M6
M7
M9
M10
(XDATDLY=10b)
DX
(XDATDLY=01b)
DX
(XDATDLY=00b)
DX
(n−2)Bit (n−1)Bit 0
(n−4)Bit (n−1) (n−3)(n−2)
Bit 0
(n−3)(n−2)Bit (n−1)
Bit 0
M20
M14
M13
M3, M12
M1, M11
M2, M12
FSX (ext)
FSX (int)
CLKX
M5
M5
M19
Figure 5−22. McBSP Transmit Timings
Electrical Specifications
73
June 2000 − Revised September 2007 SPRS076O
5.14.2 McBSP General-Purpose I/O Timing
Table 5−23 and Table 5−24 assume testing over recommended operating conditions (see Figure 5−23).
Table 5−23. McBSP General-Purpose I/O Timing Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
M22 tsu(MGPIO-COH) Setup time, MGPIOx input mode before CLKOUT high†7 ns
M23 th(COH-MGPIO) Hold time, MGPIOx input mode after CLKOUT high†0 ns
†MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.
Table 5−24. McBSP General-Purpose I/O Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
M21 td(COH-MGPIO) Delay time, CLKOUT high to MGPIOx output mode‡0 3 ns
‡MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.
M22
M23
M21
CLKOUT
MGPIOx Input
Mode†
MGPIOx Output
Mode‡
†MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.
‡MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.
Figure 5−23. McBSP General-Purpose I/O T imings
Electrical Specifications
74 June 2000 − Revised September 2007SPRS076O
5.14.3 McBSP as SPI Master or Slave Timing
Table 5−25 to Table 5−32 assume testing over recommended operating conditions (see Figure 5−24 through
Figure 5−27).
Table 5−25. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)†‡
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. MASTER SLAVE UNIT
MIN MAX MIN MAX
M30 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 43 − 6P ns
M31 th(CKXL-DRV) Hold time, DR valid after CLKX low 11 + 6P ns
M32 tsu(BFXL-CKXH) Setup time, FSX low before CLKX high 10 ns
M33 tc(CKX) Cycle time, CLKX 2P 16P ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−26. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. PARAMETER MASTER§SLAVE UNIT
MIN MAX MIN MAX
M24 td(CKXL-FXL) Delay time, FSX low to CLKX low¶T − 1 T + 3 ns
M25 td(FXL-CKXH) Delay time, FSX low to CLKX high#C − 2 C + 2 ns
M26 td(CKXH-DXV) Delay time, CLKX high to DX valid −2 4 3P + 2 5P+ 8 ns
M27 tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit
from CLKX low C − 2 C ns
M28 tdis(FXH-DXHZ) Disable time, DX high impedance following last data bit
from FSX high 3P + 8 3P + 20 ns
M29 td(FXL-DXV) Delay time, FSX low to DX valid 3P − 3 3P + 20 ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§T = CLKX period = (1 + CLKGDV) * P
C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
Electrical Specifications
75
June 2000 − Revised September 2007 SPRS076O
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
CLKX
FSX
DX
DR
M30
M26
M31
M28
M27
M24
M29
M25
LSB MSB
M32 M33
Figure 5−24. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
Electrical Specifications
76 June 2000 − Revised September 2007SPRS076O
Table 5−27. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)†‡
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. MASTER SLAVE UNIT
MIN MAX MIN MAX
M39 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 43 − 6P ns
M40 th(CKXH-DRV) Hold time, DR valid after CLKX high 11 +6P ns
M41 tsu(FXL-CKXH) Setup time, FSX low before CLKX high 10 ns
M42 tc(CKX) Cycle time, CLKX 2P 16P ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−28. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. PARAMETER MASTER§SLAVE UNIT
MIN MAX MIN MAX
M34 td(CKXL-FXL) Delay time, FSX low to CLKX low¶C − 1 C + 3 ns
M35 td(FXL-CKXH) Delay time, FSX low to CLKX high#T − 2 T + 2 ns
M36 td(CKXL-DXV) Delay time, CLKX low to DX valid −2 4 3P + 2 5P + 8 ns
M37 tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit from
CLKX low −2 0 3P + 8 3P + 21 ns
M38 td(FXL-DXV) Delay time, FSX low to DX valid D − 2 D +10 3P − 3 3P + 21 ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§T = CLKX period = (1 + CLKGDV) * P
C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
CLKX
FSX
DX
DR
M35
M37 M36
M40
M39
M38
M34
LSB MSB
M41 M42
Figure 5−25. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
Electrical Specifications
77
June 2000 − Revised September 2007 SPRS076O
Table 5−29. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)†‡
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. MASTER SLAVE UNIT
MIN MAX MIN MAX
M49 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 43 − 6P ns
M50 th(CKXH-DRV) Hold time, DR valid after CLKX high 11 + 6P ns
M51 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 10 ns
M52 tc(CKX) Cycle time, CLKX 2P 16P ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−30. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. PARAMETER MASTER§SLAVE UNIT
MIN MAX MIN MAX
M43 td(CKXH-FXL) Delay time, FSX low to CLKX high¶T − 1 T + 3 ns
M44 td(FXL-CKXL) Delay time, FSX low to CLKX low#D − 2 D + 2 ns
M45 td(CKXL-DXV) Delay time, CLKX low to DX valid −2 4 3P + 2 5P + 8 ns
M46 tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from
CLKX high D − 2 D ns
M47 tdis(FXH-DXHZ) Disable time, DX high impedance following last data bit from
FSX high 3P + 8 3P + 20 ns
M48 td(FXL-DXV) Delay time, FSX low to DX valid 3P − 3 3P + 20 ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§T = CLKX period = (1 + CLKGDV) * P
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
M51
M50
M47
M46
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
CLKX
FSX
DX
DR
M44
M48 M45
M49
M43
LSB MSB M52
Figure 5−26. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
Electrical Specifications
78 June 2000 − Revised September 2007SPRS076O
Table 5−31. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)†‡
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. MASTER SLAVE UNIT
MIN MAX MIN MAX
M58 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 43 − 6P ns
M59 th(CKXL-DRV) Hold time, DR valid after CLKX low 11 + 6P ns
M60 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 10 ns
M61 tc(CKX) Cycle time, CLKX 2P 16P ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−32. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)†‡
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO. PARAMETER MASTER§SLAVE UNIT
MIN MAX MIN MAX
M53 td(CKXH-FXL) Delay time, FSX low to CLKX high¶D − 1 D + 3 ns
M54 td(FXL-CKXL) Delay time, FSX low to CLKX low#T − 2 T + 2 ns
M55 td(CKXH-DXV) Delay time, CLKX high to DX valid −2 4 3P + 2 5P + 8 ns
M56 tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from
CLKX high −2 0 3P + 8 3P + 21 ns
M57 td(FXL-DXV) Delay time, FSX low to DX valid C − 2 C +10 3P − 3 3P + 21 ns
†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
‡P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§T = CLKX period = (1 + CLKGDV) * P
C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
CLKX
FSX
DX
DR
M54
M58
M56
M53
M55
M59
M57
LSB MSB
M60 M61
M54
Figure 5−27. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
Electrical Specifications
79
June 2000 − Revised September 2007 SPRS076O
5.15 Enhanced Host-Port Interface (EHPI) Timing
Table 5−33 and Table 5−34 assume testing over recommended operating conditions (see Figure 5−28
through Figure 5−32).
Table 5−33. EHPI Timing Requirements
NO.
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
MIN MAX
UNIT
E11 tsu(HASL-HDSL) Setup time, HAS low before HDS low 4 ns
E12 th(HDSL-HASL) Hold time, HAS low after HDS low 3 ns
E13 tsu(HCNTLV-HDSL) Setup time, (HR/W, HA[19:0], HCNTL[1:0]) valid before HDS low 4 ns
E14 th(HDSL-HCNTLIV) Hold time, (HR/W, HA[19:0], HCNTL[1:0]) invalid after HDS low 4 ns
E15 tw(HDSL) Pulse duration, HDS low 4P†ns
E16 tw(HDSH) Pulse duration, HDS high 4P†ns
E17 tsu(HDV-HDSH) Setup time, HD bus write data valid before HDS high 5 ns
E18 th(HDSH-HDIV) Hold time, HD bus write data invalid after HDS high 3 ns
E19 tsu(HCNTLV-HASL) Setup time, (HR/W, HCNTL[1:0]) valid before HAS low 5 ns
E20 th(HASL-HCNTLIV) Hold time, (HR/W, HCNTL[1:0]) valid after HAS low 3 ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−34. EHPI Switching Characteristics
NO.
PARAMETER
VC5510/5510A-160
VC5510/5510A-200
UNIT
NO.
PARAMETER
MIN MAX
UNIT
E1 td(HDSL-HDD)M Delay time, HDS low to HD bus read data driven (memory access) 6 16 ns
E2 td(HDSL-HDV1)M Delay time, HDS low to HD bus read data valid (memory access) 14P+10†‡ ns
E4 td(HDSL-HDD)R Delay time, HDS low to HD bus read data driven (register access) 6 16 ns
E5 td(HDSL-HDV)R Delay time, HDS low to HD bus read data valid (register access) 16 ns
E6 tdis(HDSH-HDIV) Disable time, HDS high to HD bus read data invalid 6 16 ns
E7 td(HDSL-HRDYL) Delay time, HDS low to HRDY low (during reads) P+10†ns
E8 td(HDV-HRDYH) Delay time, HD bus valid to HRDY high (during reads) 2 ns
E9 td(HDSH-HRDYL) Delay time, HDS high to HRDY low (during writes) 16 ns
E10 td(HDSH-HRDYH) Delay time, HDS high to HRDY high (during writes) 14P+10†ns
†P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡EHPI latency is dependent on the number of DMA channels active, their priorities and their source/destination ports. The latency shown assumes
no competing CPU or DMA activity to the memory resource being accessed by the EHPI.
Electrical Specifications
80 June 2000 − Revised September 2007SPRS076O
E16
HCNTL[1:0]
HR/W
Read Data
Valid
HRDY
HA[19:0]
HDS
HCS
HD[15:0]
(read)
Valid
E14
E13
E1
E10
E2
Valid Valid
Write Data
HD[15:0]
(write)
E15
E17 E18
Read Write
E6
E8E7 E9
E13 E14
E15
NOTES: A. As of revision 2.1, the byte-enable function on the EHPI (as controlled by pins HBE0 and HBE1) is no longer supported. These pins
must always be driven low either by an external device, by external pulldown resistors or by using the on-chip pulldown circuitry
controlled by the HPE bit in the System Register (SYSR).
B. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent
with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied low and HCS is used as a strobe, the timing requirements shown
for HDS apply to HCS . Operation with HCS as a strobe is not recommended because HCS gates output of HRDY (when HCS is
high HRDY is not driven).
Figure 5−28. EHPI Nonmultiplexed Read/W rite Timings
Electrical Specifications
81
June 2000 − Revised September 2007 SPRS076O
HR/W
Read Data
HRDY
HCNTL[1:0]
HAS
HCS
HD[15:0]
(read)
E11
E13
E1
E2
Valid (11)
Write Data
HD[15:0]
(write)
E12
E13
E17 E18
Read Write
HDS
E15 E16 E15
E12 E11
E20
E19
E14
E20
E19
Valid (11)
E10
E6
E14
E8E7 E9
NOTES: A. As of revision 2.1, the byte-enable function on the EHPI (as controlled by pins HBE0 and HBE1) is no longer supported. These pins
must always be driven low either by an external device, by external pulldown resistors or by using the on-chip pulldown circuitry
controlled by the HPE bit in the System Register (SYSR).
B. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent
with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied low and HCS is used as a strobe, the timing requirements shown
for HDS apply to HCS . Operation with HCS as a strobe is not recommended because HCS gates output of HRDY (when HCS is
high HRDY is not driven).
Figure 5−29. EHPI Multiplexed Memory (HPID) Access Read/Write Timings Without Autoincrement
Electrical Specifications
82 June 2000 − Revised September 2007SPRS076O
HR/W
Read Data
n
HRDY
HCNTL[1:0]
HDS
HAS
HCS
HD[15:0]
(read)
H
PIA contents
Valid (01) Valid (01)
n + 1 n + 2
E11 E12
E15 E16
E20
E1
E2
E19
E14
E6
E8E7
Read Data
E1
E2 E6
E8E7
E13
NOTES: A. As of revision 2.1, the byte-enable function on the EHPI (as controlled by pins HBE0 and HBE1) is no longer supported. These pins
must always be driven low either by an external device, by external pulldown resistors or by using the on-chip pulldown circuitry
controlled by the HPE bit in the System Register (SYSR).
B. During autoincrement mode, although the EHPI internally increments the memory address, reads of the HPIA register by the host
will always indicate the base address.
C. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent
with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied low and HCS is used as a strobe, the timing requirements shown
for HDS apply to HCS . Operation with HCS as a strobe is not recommended because HCS gates output of HRDY (when HCS is
high HRDY is not driven).
Figure 5−30. EHPI Multiplexed Memory (HPID) Access Read Timings With Autoincrement
Electrical Specifications
83
June 2000 − Revised September 2007 SPRS076O
HR/W
Write DataWrite Data
n
HRDY
HCNTL[1:0]
HDS
HAS
HCS
HD[15:0]
(write)
H
PIA contents
Valid (01) Valid (01)
n + 1
E11 E12
E15 E16
E20
E13
E17 E18
E9 E10 E10
E19
E14
E9
NOTES: A. As of revision 2.1, the byte-enable function on the EHPI (as controlled by pins HBE0 and HBE1) is no longer supported. These pins
must always be driven low either by an external device, by external pulldown resistors or by using the on-chip pulldown circuitry
controlled by the HPE bit in the System Register (SYSR).
B. During autoincrement mode, although the EHPI internally increments the memory address, reads of the HPIA register by the host
will always indicate the base address.
C. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent
with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied low and HCS is used as a strobe, the timing requirements shown
for HDS apply to HCS . Operation with HCS as a strobe is not recommended because HCS gates output of HRDY (when HCS is
high HRDY is not driven).
Figure 5−31. EHPI Multiplexed Memory (HPID) Access Write Timings With Autoincrement
Electrical Specifications
84 June 2000 − Revised September 2007SPRS076O
HR/W
Read Data
HRDY
HCNTL[1:0]
HAS
HCS
HD[15:0]
(read)
E11
E13
E4
E5
Valid (10 or 00)
Write Data
HD[15:0]
(write)
E12
E13
E17 E18
Read Write
HDS
E15 E16 E15
E12 E11
E20
E19
E14
E20
E19
Valid (10 or 00)
E14
E6
NOTES: A. As of revision 2.1, the byte-enable function on the EHPI (as controlled by pins HBE0 and HBE1) is no longer supported. These pins
must always be driven low either by an external device, by external pulldown resistors or by using the on-chip pulldown circuitry
controlled by the HPE bit in the System Register (SYSR).
B. During auto-increment mode, although the EHPI internally increments the memory address, reads of the HPIA register by the host
will always indicate the base address.
C. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent
with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied low and HCS is used as a strobe, the timing requirements shown
for HDS apply to HCS . Operation with HCS as a strobe is not recommended because HCS gates output of HRDY (when HCS is
high HRDY is not driven).
Figure 5−32. EHPI Multiplexed Register Access Read/Write Timings
Mechanical Data
85
June 2000 − Revised September 2007 SPRS076O
6 Mechanical Data
6.1 Package Thermal Resistance Characteristics
Table 6−1 and Table 6−2 provide the thermal resistance characteristics for the recommended package types
used on the TMS320VC5510/5510A DSPs.
Table 6−1. Thermal Resistance Characteristics (Ambient)
RΘJA (°C/W) BOARD TYPE†AIRFLOW (LFM)
26 High-K 0
22 High-K 150
20 High-K 250
50 Low-K 0
35 Low-K 150
29 Low-K 250
†Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal
Measurements.
Table 6−2. Thermal Resistance Characteristics (Case)
RΘJC (°C/W) BOARD TYPE†
62s JEDEC Test Card
†Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal
Measurements.
6.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TMS320VC5510AGGW1 ACTIVE BGA
MICROSTAR GGW 240 126 TBD SNPB Level-3-220C-168 HR
TMS320VC5510AGGW2 ACTIVE BGA
MICROSTAR GGW 240 126 TBD SNPB Level-3-220C-168 HR
TMS320VC5510AGGWA1 ACTIVE BGA
MICROSTAR GGW 240 126 TBD SNPB Level-3-220C-168 HR
TMS320VC5510AGGWA2 ACTIVE BGA
MICROSTAR GGW 240 126 TBD SNPB Level-3-220C-168 HR
TMS320VC5510AZGW1 ACTIVE BGA
MICROSTAR ZGW 240 126 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
TMS320VC5510AZGW2 ACTIVE BGA
MICROSTAR ZGW 240 126 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
TMS320VC5510AZGWA1 ACTIVE BGA
MICROSTAR ZGW 240 126 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
TMS320VC5510AZGWA2 ACTIVE BGA
MICROSTAR ZGW 240 126 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
TMS320VC5510GGW1 OBSOLETE BGA
MICROSTAR GGW 240 TBD Call TI Call TI
TMS320VC5510GGW21 OBSOLETE BGA
MICROSTAR GGW 240 TBD Call TI Call TI
TMS320VC5510GGWA1 OBSOLETE BGA
MICROSTAR GGW 240 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2011
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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