PIC24HJ32GP202T-H/PT - Microchip Technology, Inc.

 2009 Microchip Technology Inc. Preliminary DS70289F

PIC24HJ32GP202/204 and

PIC24HJ16GP304

Data Sheet

High-Performance,

16-bit Microcontrollers

DS70289F-page 2 Preliminary  2009 Microchip Technology Inc.

Information contained in this publication regarding device

applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce

and may be supers eded by up dates. I t is you r r es ponsibil it y to

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conveyed, implicitly or otherwise, under any Microchip

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Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

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and India. The Company’s quality system processes and procedures

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devices, Serial EEPROMs, microperiph erals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 3

PIC24HJ32GP202/204 and

PIC24HJ16GP304

Operating Range:

• Up to 40 MIPS operation (@ 3.0-3.6V):

- Industrial tempera ture range (-40°C to +85°C)

- Extended temperature range (-40°C to +125°C)

• Up to 20 MIPS operation (@ 3.0-3.6V):

- High temperature range (-40°C to +140°C)

High-Performance CPU:

• Modified Harvard architecture

• C compiler opt imized inst ruction se t

• 16-bit wide data path

• 24-bit wide instructions

• Linear program memory addressing up to 4M

instruction words

• Linear data memory addressing up to 64 Kbytes

• 71 base instructions, mostly 1 word/1 cycle

• Sixteen 16-bit General Purpose Registers

• Flexible and powerful addressing modes

• Software stack

• 16 x 16 multiply operations

• 32/16 and 16/16 divide operations

• Up to ±16-bit shifts for up to 40-bit data

Interrupt Controller:

• 5-cycle latency

• Up to 21 available interrupt so urces

• Up to 3 external interrupts

• Seven programmable priority levels

• Four processor exceptions

On-Chip Flash and SRAM:

• Flash program memory (up to 32 Kbytes)

• Data SRAM (2 Kbytes)

• Boot and General Security for Program Flash

Digi tal I/O:

• Per ipheral Pin Select Functionality

• Up to 35 pro grammable digital I/O pins

• Wake-up/Interrupt-on-Change for up to 31 pins

• Output pins can drive from 3.0V to 3.6V

• Up to 5V output with open drain configuration

• All digital i nput pins are 5V to lerant

• 4 mA sink on all I/O pins

System Management:

• Flexible clock options:

- External, crystal, resonator, internal RC

- Fully integrated Phase-Locked Loop (PLL)

- Extremely low jitter P LL

• Power-up Timer

• Oscillator Start-up Timer/Stabilizer

• Watchdog Timer with its own RC oscillator

• Fail- Safe C loc k Mo nito r

• Reset by multiple sources

Power Management:

• On-chip 2.5V voltage regulator

• Switch between clock sources in real time

• Idle, Sleep and Doze modes with fast wake-up

Timers/Capture/Compare:

• Timer/Counters, up to three 16-bit timers:

- Can pair up to make one 32-bit timer

- One timer runs as Real-Time Clock with

external 32.768 kHz oscillator

- Programmable prescaler

• Input Capture (up to four channels):

- Capture on up, down or both edges

- 16-bit capture input functions

- 4-deep FIFO on each capture

• Output Compare (up to two channels):

- Single or Dual 16-Bit Compare mode

- 16-bit Glitchless PWM Mode

High-Performance, 16-bit Microcontrollers

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 4 Preliminary  2009 Microchip Technology Inc.

Communication Modules:

• 4-wire SPI

- Framing supports I/O interface to simple

codecs

- Supports 8-bit and 16-bit data

- Supports all serial clock formats and

sampling modes

•I

2C™

- Full Multi-Mast er Slave m ode suppor t

- 7-bit and 10-bit addressing

- Bus collision detection and arbitration

- Integrated signal conditioning

- Slave address masking

•UART

- Interrupt on address bit detect

- Interrupt on UART error

- Wake-up on Start bit from Sleep mode

- 4-character TX and RX FIFO buffers

- LIN bus support

-IrDA

® encoding and decoding in hardware

- High-Speed Baud mode

- Hardware Flow Control with CTS and RTS

Analog-to-Di gital Converters (ADCs):

• 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion:

- Two and four simultaneous samples (10-bit ADC)

- Up to 13 input channels with auto-scanning

- Conversion start can be manual or

synchronized with one of four trigger sources

- Conversion possible in Sleep mode

- ±2 LSb max integral nonlinearity

- ±1 LSb max differential nonlinearity

CMOS Flash Technology:

• Low-power, high-speed Flash technology

• Fully static design

• 3.3V (±10%) operating voltage

• Industrial and extended temperature

• Low-power consumption

Packaging:

• 28-pin SDIP/SOIC/QFN-S

• 44-pin QFN/TQFP

Note: See Table 1 for the exact peripheral

features per device.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 5

PIC24HJ32GP202/204 and PIC24HJ16GP304

PIC24HJ32GP202/204 and

PIC24HJ16GP304 Product Families

The device names, pin counts, memory sizes and

peripheral availability of each family are listed below,

followed by their pinout diagrams.

TABLE 1: PIC24HJ32GP202/204 AND PIC24HJ16GP304 CONTROLLER FAMILIES

Device

Pins

Program Flash Memory

(Kbyte)

RAM

Remapp a ble Peripherals

10-Bit/12-Bit ADC

I2C™

I/O Pins (Max)

Packages

Remappable Pins

16-bit Timer

Input Capture

Output Compare

Std. PWM

UART

External Interrupt s(2)

SPI

PIC24HJ32GP202 28 32 2 16 3(1) 421311 ADC,

10 ch 121SDIP

SOIC

QFN-S

PIC24HJ32GP204 44 32 2 26 3(1) 421311 ADC,

13 ch 135 QFN

TQFP

PIC24HJ16GP304 44 16 2 26 3(1) 421311 ADC,

13 ch 135 QFN

TQFP

Note 1: Only two out of three timers are remappable.

2: Only two out of three interrupts are remappable.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 6 Preliminary  2009 Microchip Technology Inc.

Pin Diagrams

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

2: The metal plane at the bottom of the device is not connected to any pins and is recommended to

be connected to VSS externall y.

PIC24HJ32GP202

MCLR

VSS

VDD

AN0/VREF+/CN2/RA0

AN1/VREF-/CN3/RA1

AVDD

AVSS

PGED1/AN2/C2IN-/RP0(1)/CN4/RB0

PGEC3/ASCL1/RP6(1)/CN24/RB6

SOSCO/T1CK/CN0/RA4

SOSCI/RP4(1)/CN1/RB4 VSSOSC2/CLKO/CN29/RA3

OSC1/CLKI/CN30/RA2 VCAP/VDDCORE

INT0/RP7/CN23/RB7

TDO/SDA1/RP9(1)/CN21/RB9

TCK/SCL1/RP8(1)/CN22/RB8

AN5/RP3(1)/CN7/RB3

AN4/RP2(1)/CN6/RB2

PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1

AN9/RP15(1)/CN11/RB15

AN10/RP14(1)/CN12/RB14

AN11/RP13(1)/CN13/RB13

AN12/RP12(1)/CN14/RB12

PGED2/TDI/RP10(1)/CN16/RB10

PGEC2/TMS/RP11(1)/CN15/RB11

PGED3/ASDA1/RP5(1)/CN27/RB5

28-Pin SDIP, SOIC = Pins are up t o 5V tolerant

28-Pin QFN-S(2)

10 11

12 13 14 15

716

232425262728

PIC24HJ32GP202

MCLR

VSS

VDD AN0/VREF+/CN2/RA0

AN1/VREF-/CN3/RA1

AVDD

AVSS

PGED1/AN2/C2IN-/RP0(1)/CN4/RB0

PGEC3/ASCL1/RP6/CN24/RB6

SOSCO/T1CK/CN0/RA4

SOSCI/RP4/CN1/RB4

Vss

OSC2/CLKO/CN29/RA3

OSC1/CLKI/CN30/RA2 VCAP/VDDCORE

INT0/RP7(1(1))/CN23/RB7

TDO/SDA1/RP9(1)/CN21/RB9

TCK/SCL1/RP8(1)/CN22/RB8

AN5/RP3(1)/CN7/RB3

AN4/RP2(1)/CN6/RB2

PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1

AN9/RP15(1)/CN11/RB15

AN10/RP14(1)/CN12/RB14

AN11/RP13(1)/CN13/RB13

AN12/RP12(1)/CN14/RB12

PGED2/TDI/RP10/CN16/RB10

PGEC2/TMS/RP11(1)(1)/CN15/RB11

PGED3/ASDA1/RP5(1)/CN27/RB5

= Pins are up to 5V tolerant

 2009 Microchip Technology Inc. Preliminary DS70289F-page 7

PIC24HJ32GP202/204 and PIC24HJ16GP304

Pin Diagrams (Continued)

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

2: The metal plane at the bottom of the device is not connected to any pins and is recommended to

be connected to VSS externall y.

SCL1/RP8(1)/CN22/RB8

INT0/RP7(1)/CN23/RB7

PGEC3/ASCL1/RP6(1)/CN24/RB6

PGED3/ASDA1/RP5(1)/CN27/RB5

VDD

TDI/RA9

SOSCO/T1CK/CN0/RA4

VSS

RP21(1)/CN26/RC5

RP20(1)/CN25/RC4

RP19(1)/CN28/RC3

PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1

PGED1/AN2/C2IN-/RP0(1)/CN4/RB0

AN1/VREF-/CN3/RA1

AN0/VREF+/CN2/RA0

MCLR

TMS/RA10

AVDD

AVSS

AN9/RP15(1)/CN11/RB15

AN10/RP14(1)/CN12/RB14

AN12/RP12(1)/CN14/RB12

PGEC2/RP11(1)/CN15/RB11

PGED2/RP10(1)/CN16/RB10

VCAP/VDDCORE

RP25(1)/CN19/RC9

RP24(1)/CN20/RC8

RP23(1)/CN17/RC7

RP22(1)/CN18/RC6

SDA1/RP9(1)/CN21/RB9

AN4/RP2(1)/CN6/RB2

AN5/RP3(1)/CN7/RB3

AN6/RP16(1)/CN8/RC0

AN7/RP17(1)/CN9/RC1

AN8/RP18(1)/CN10/RC2

SOSCI/RP4(1)/CN1/RB4

VDD

VSS

OSC1/CLKI/CN30/RA2

OSC2/CLKO/CN29/RA3

TDO/RA8

44-Pin QFN(2)

AN11/RP13(1)/CN13/RB13

TCK/RA7

PIC24HJ32GP204

PIC24HJ16GP304

232

VSS

= Pins are up to 5V tolerant

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 8 Preliminary  2009 Microchip Technology Inc.

Pin Diagrams (Continued)

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

39 16

SCL1/RP8(1)/CN22/RB8

INT0/ RP7(1)/CN23/RB7

PGEC3/ASCL1/RP6(1)/CN24/RB6

PGED3/ASDA1/RP5(1)/CN27/RB5

VDD

TDI/RA9

SOSCO/T1CK/CN0/RA4

VSS

RP21(1)/CN26/RC5

RP20(1)/CN25/RC4

RP19(1)/CN28/RC3

PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1

PGED1/AN2/C2IN-/RP0(1)/CN4/RB0

AN1/VREF-/CN3/RA1

AN0/VREF+/CN2/RA0

MCLR

TMS/RA10

AVDD

AVSS

AN9/RP15(1)/CN11/RB15

AN10/RP14(1)/CN12/RB14

AN12/RP12(1)/CN14/RB12

PGEC2/RP11(1)/CN15/RB11

PGED2/RP10(1)/CN16/RB10

VCAP/VDDCORE

VSS

RP25(1)/CN19/RC9

RP24(1)/CN20/RC8

RP23(1)/CN17/RC7

RP22/CN18/RC6

SDA1(1)/RP9(1)/CN21/RB9

AN4/RP2(1)/CN6/RB2

AN5/RP3(1)/CN7/RB3

AN6/RP16(1)/CN8/RC0

AN7/RP17(1)/CN9/RC1

AN8/RP18(1)/CN10/RC2

SOSCI/RP4(1)/CN1/RB4

VDD

VSS

OSC1/CLKI/CN30/RA2

OSC2/CLKO/CN29/RA3

TDO/RA8

44-Pin TQFP

AN11/RP13(1)/CN13/RB13

TCK/RA7

PIC24HJ32GP204

PIC24HJ16GP304

= Pins are up to 5V tolerant

 2009 Microchip Technology Inc. Preliminary DS70289F-page 9

PIC24HJ32GP202/204 and PIC24HJ16GP304

Table of Contents

1.0 Device Overview ........................................................................................................................................................................ 11

2.0 Guidelines for Ge tting Started with 16- b it Microco n trollers.................. ............... ............... ............... ......................................... 15

3.0 CPU............................................................................................................................................................................................ 19

4.0 Memory O rganization................................................................................................................................................................. 25

5.0 Flash Pro g ram Memory..... ............... ................... ................... ....................... ................... .......................................................... 47

6.0 Resets ....................................................................................................................................................................................... 53

7.0 Inter rupt Cont r o lle r............ ............... ................... ............... .................. ............... ....................................................................... 61

8.0 Oscillator Configuration.............................................................................................................................................................. 89

9.0 Power-Savin g Features..... ............... ................... ....................... ................... ................... .......................................................... 99

10.0 I/O Ports........................ ................... ....................... ....................... ................... ....................................................................... 103

11.0 Timer1...................................................................................................................................................................................... 125

12.0 Timer2/3 Fe a tu re....... ............... .............. ................... ................... ................... .............. ........................................................... 127

13.0 Input Capture................... .. .... ....... .. .... .. .... .. ....... .... .. .... .. .. ......... .. .. .... .. ......... .. .. .... .. .... ............................................................... 133

14.0 Output Compa re........ ............... .............. ................... ................... ................... ......................................................................... 135

15.0 Serial Peripheral Interf ace (SP I)............................................................................................................................................... 139

16.0 Inter-I ntegrated Circuit (I2C™) ................................................................................................................................................. 145

17.0 U nivers al Asynchr onous Receiver Transmi tter (UART)........................................................................................................... 153

18.0 10-bit/12-bi t An a log-t o -Digital Con verter (ADC)........ ........... .............. ............... ............... ........................................................ 159

19.0 Special Features ...................................................................................................................................................................... 173

20.0 Instruction Set Summary.......................................................................................................................................................... 181

21.0 Developm ent Suppor t. .............................................................................................................................................................. 189

22.0 Electrical Characteristics.......................................................................................................................................................... 193

23.0 High Temperature Electri cal Charact e ristics........... ................... ............... ................... .............. .............................................. 227

24.0 Packagin g In formatio n. ............... ................... .................. ................... ................... ................................................................... 237

Appendix A: Revision History . ............................................................................................................................................................ 247

Index ................................................................................................................................................................................................. 253

The Micro chip Web Site......................... ....................... ................... ....................... ........................................................................... 257

Customer Change Notification Service..................................... ................... ................... ................................................................... 257

Customer Support..................................................................................................... ........ ................................................................. 257

Reader Response.............................................................................................................................................................................. 258

Product Identification System ............................................................................................................................................................ 259

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Customer No tific atio n Syst em

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 10 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 11

PIC24HJ32GP202/204 and PIC24HJ16GP304

1.0 DEVICE OVERVIEW

This docu ment contains dev ice -specifi c info rm atio n for

the following devices:

• PIC24HJ32GP202

• PIC24HJ32GP204

• PIC24HJ16GP304

Figure 1-1 shows a general block diagram of the core

and peripheral modules in the PIC24HJ32GP202/204

and PIC24HJ16GP304 family of devices. Table 1-1

lists the functions of the various pins shown in the

pinout diagrams.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 devices. It is not

intended to be a comprehensive refer-

ence sou rce. To compl ement the inform a-

tion in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 12 Preliminary  2009 Microchip Technology Inc.

FIGURE 1-1: PIC24HJ32GP 202 /204 AND PIC24HJ16GP304 BLOCK DIAGRAM

OSC1/CLKI

OSC2/CLKO

VDD, VSS

Timing

Generation

MCLR

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

Brown-out

Reset

Precision

Reference

Band Gap

FRC/LPRC

Oscillators

Regulator

Voltage

VCAP/VDDCORE

UART1

IC1,2,7,8 OC/ SPI1 I2C1

PORTA

Note: Not all pins or features are implemented on all device pinout configurations. See pinout diagrams for the specif ic pins

and features present on each device.

PWM1,2 CNx

Instruction

Decode and

Control

PCH PCL

Program Counter

16-bit ALU

Instruction Reg

PCU

16 x 16

W Register Array

ROM Latch

EA MUX

Interrupt

Controller

PSV and Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Address Latch

Program Memory

Data Latch

Literal Data

16 16

Data Latch

Address

Latch

X RAM

Data Bus

17 x 17 Multiplier

Divide Support

Control Signals

to Various Blocks

ADC1

Timers

PORTB

Remappable

Address Generator Units

1-3

Pins

PORTC

 2009 Microchip Technology Inc. Preliminary DS70289F-page 13

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 1-1: PINOUT I/O DESCRIPTIONS

Pin Name Pin

Type Buffer

Type PPS Description

AN0-AN12 I Analog No Analog input channels.

CLKI

CLKO I

OST/CMOS

—No

No External clock source input. Always associated with OSC1 pin function.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator crystal input. ST buffer when configured in RC mode; CMOS

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

SOSCI

SOSCO I

OST/CMOS

—No

No 32.768 kHz low-power oscillator crystal input; CMOS otherwise.

32.768 kHz low-power osc illator crystal output.

CN0-CN30 I ST No Change notification inputs.

Can be software programmed for internal weak pull-ups on all inputs.

IC1-IC2

IC7-IC8 ISTYes

Yes Capture inputs 1/2.

Capture inputs 7/8.

OCFA

OC1-OC2 I

OST

—Yes

Yes Comp are Fault A input (for Com p are Channels 1 and 2).

Compare outputs 1 through 2.

INT0

INT1

INT2

Yes

External interrupt 0.

External interrupt 1.

External interrupt 2.

RA0-RA4

RA7-RA10 I/O ST No

No PORTA is a bidirectional I/O port.

RB0-RB15 I/O ST No PORTB is a bidirectional I/O port.

RC0-RC9 I/O ST No PORTC is a bidirectional I/O port.

T1CK

T2CK

T3CK

Yes

Timer1 external clock input.

Timer2 external clock input.

Timer3 external clock input.

U1CTS

U1RTS

U1RX

U1TX

—

Yes

UART1 clear to send.

UART1 ready to send.

UART1 receive.

UART1 transmit.

SCK1

SDI1

SDO1

SS1

I/O

—

Yes

Synchronous serial clock input/output for SPI1.

SPI1 data in.

SPI1 data out.

SPI1 slave synchronization or frame pulse I/O.

SCL1

SDA1

ASCL1

ASDA1

I/O

Synchronous serial clock input/output for I2C1.

Synchronous serial data input/output for I2C1.

Alternate synchronous serial clock input/output for I2C1.

Alternate synchronous serial data input/output for I2C1.

TMS

TCK

TDI

TDO

—

JTAG Test mode sele ct pin .

JTAG test clock input pin.

JTAG test dat a inp ut pin.

JTAG test data output pin .

PGED

PGEC1

PGED2

PGEC2

PGED3

PGEC3

I/O

Data I/O pin for programming/debugging communication channel 1.

Clock input pin for programming/debugging communication channel 1.

Data I/O pin for programming/debugging communication channel 2.

Clock input pin for programming/debugging communication channel 2.

Data I/O pin for programming/debugging communication channel 3.

Clock input pin for programming/debugging communication channel 3.

Legend: CMOS = CMOS compatible input or output Analog = Analog input O = Output

ST = Schmitt Trigger input with CMOS levels I = Input P = Power

PPS = Peripheral Pin Select

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 14 Preliminary  2009 Microchip Technology Inc.

VCAP/VDDCORE P — No CPU logic filter capacitor connection.

VSS P — No Ground reference for logic and I/O pins.

VREF+ I Analog No Analog voltage reference (high) input.

VREF- I Analog No Analog voltage reference (low) input.

AVDD P P No Positive supply for analog modules. This pin must be connected at all

times.

MCLR I/P ST No Mas ter Clea r (Reset) inp ut. Thi s pin is an act iv e-lo w Reset to the devi ce .

AVSS P P No Ground reference for analog modules.

VDD P — No Positive supply for peripheral logic and I/O pins.

TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type PPS Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input O = Output

ST = Schmitt Trigger input with CMOS levels I = Input P = Power

PPS = Peripheral Pin Select

 2009 Microchip Technology Inc. Preliminary DS70289F-page 15

PIC24HJ32GP202/204 and PIC24HJ16GP304

2.0 GUIDELINES FOR GETTING

STARTED WITH 16-BIT

MICROCONTROLLERS

2.1 Basic Connection Requirements

Getting started with the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of 16-bit microcontrollers

requires attention to a minimal set of device pin

connections before proceeding with development. The

following is a list of pin names, which must always be

connected:

•All V

DD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

•All AV

DD and AVSS pins (even if ADC module is not

used)

(see Section 2.2 “Decoupling Capacitors”)

•VCAP/VDDCORE

(see Section 2.3 “Capacitor on Internal Voltage

Regulator (Vcap/Vddcore)”)

•MCLR

(see Section 2.4 “Master Clear (MCLR) Pin”)

• PGECx/PGEDx pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.5 “ICSP Pins”)

• OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillator Pins”)

Additionally, the following pins may be required:

•V

REF+/VREF- pins used when external voltage

reference for ADC module is implemented

2.2 Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

AVSS is required.

Consider the following criteria when using decoupling

capacitors:

•Value and type of capa cito r: Reco mm endat ion

of 0.1 µF (100 nF), 10-20V. This capacitor should

be a lo w-ESR and h ave a res onanc e freq uency in

the range of 20 MHz and higher. It is

recommended that ceramic capacitors b e used .

•Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the microcontroller. If space is con-

stricted, the capacitor can be placed on another

lay er on the PCB using a v ia; however, ensure

that the trace length from the pin to the capacitor

is within one-quarter inch (6 mm) in length.

•Handling high frequency n oise: If the board is

experiencing high frequency noise, upward of

tens of MHz, ad d a second c eramic-type capac itor

in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 µF to 0.001 µF. Place this

second capacito r next to the primary decoupli ng

capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible.

For example, 0.1 µF in parallel with 0.001 µF.

•Maximiz ing perform anc e: On the board layout

from the power supply circuit, run the power and

return traces to the decou pli ng ca p ac ito rs first,

and then to the m icroc ontroll er pins. Thi s ensures

that the decoupling capacitors are first in the

power chain. Equally important is to keep the

trace length between the capacitor and the power

pins to a minimum thereby reducing PCB track

inductance.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices. It is

not inte nded to be a co mprehensive refer-

ence sou rce. To compl ement the inform a-

tion in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: The AVDD and AVSS pins must be

connected independent of the ADC

voltage reference source.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 16 Preliminary  2009 Microchip Technology Inc.

FIGURE 2-1: RECOMMENDE D

MINIMUM CONNECTION

2.2. 1 TANK CAPACITORS

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits including microcontrollers to

supply a local power source. The value of the tank

capacitor should be determined based on the trace

resistance that connects the power supply source to

the mic rocontroller , and the ma ximum current dr awn by

the microcontroller in the application. In other words,

select the tank capacitor so that it meets the acceptable

voltage sag at the device. Typical values range from

4.7 µF to 47 µF.

2.3 Capacitor on Internal Voltage

Regulator (VCAP/VDDCORE)

A low-ESR (<5 Ohms) capacitor is required on the

VCAP/VDDCORE pin, which is used to stabilize the

voltage regulator output voltage. The VCAP/VDDCORE

pin must not be connected to VDD, and must have a

cap acitor betw een 4.7 µF and 10 µF, 16V co nnect ed to

ground. The type can be ceramic or tantalum. Refer to

Section 22.0 “Electrical Characteristics” for

additional information.

The placement of this capacitor should be close to the

VCAP/VDDCORE. It is recommended that the trace

length not exceed one-quarter inch (6 mm). Refer to

Section 19.2 “On-Chip Voltage Regulator” for

details.

2.4 Master Clear (MCLR) Pin

The MCLR pin provides for two specific device

functions:

• Device Reset

• Device programming and debugging

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers drive the MCLR pin. Consequently,

specific voltage levels (VIH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application and PCB requirements.

For example, as shown in Figure 2-2, it is

recommended that capacitor C is isolated from the

MCLR pin during programming and debugging

operations.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

FIGURE 2-2: EXAMPLE OF MCLR PIN

CONNECTIONS

PIC24H

VDD

VSS

VDD

VSS

VDD

AVDD

AVSS

VDD

VSS

0.1 µF

Ceramic 0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

VDD

MCLR

0.1 µF

Ceramic

VCAP/VDDCORE

10 

Note 1: R 10 k is recommended. A suggested

starting value is 10 k. Ensure that the MCLR

pin VIH and VIL specifications are met.

2: R1  470W will limit any current f lowing into

MCLR from the external capacitor C, in the

event of MCLR pin breakdown, due to Elec-

trostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

VDD

MCLR

PIC24H

 2009 Microchip Technology Inc. Preliminary DS70289F-page 17

PIC24HJ32GP202/204 and PIC24HJ16GP304

2.5 ICSP Pins

The PGECx and PGEDx pins are used for In-Circuit

Serial Programming (ICSP) and debugging purposes.

It is recommended to keep the trace length between

the ICSP connector and the ICSP pins on the micro-

controll er as sh ort as possibl e. I f the I CSP co nnect or is

expect ed to experience an ESD eve nt, a series resistor

is recommended, with the value in the range of a few

tens of Ohms, not to exceed 100 Ohms.

Pull-up resistors, series diodes and capacitors on the

PGECx and PGEDx pins are not recommended as they

will interfere with the programmer/debugger communi-

cations to the device. If such discrete components are

an application requirement, they should be removed

from the circuit during programming and debugging.

Alternatively, refer to the AC/DC characteristics and

timing requirements information in the respective

device Flash programming specification for information

on capacitive loading limits and pin input voltage high

(VIH) and input low (VIL) requiremen t s .

Ensure that the “Communication Channel Select” (i.e.,

PGECx/PGEDx pins) programmed into the device

matches the physical connections for the ICSP to

MPLAB® ICD 2, MPLAB ICD 3, or MPLAB REAL ICE™

in-circ uit emulator

For more in formati on on MPL AB ICD 2, MP LAB ICD 3,

or MPLAB REAL ICE in-circuit emulator connection

requirem ent s, refer t o the fol lowing docum ent s that a re

ava i lable on the M i crochip website.

•“MPLAB® ICD 2 In-Circuit Debugger User’s

Guide” DS51331

•“Using MPLAB® ICD 2” (poster) DS51265

•“MPLAB® ICD 2 Design Advisory” DS51566

•“Using MPLAB® ICD 3” (poster) DS51765

•“MPLAB® ICD 3 Design Advisory” DS51764

•“MPLAB® REAL ICE™ I n-Circui t Emula tor User’s

Guide” DS51616

•“Using MPL AB® REAL ICE™ In -Circuit Emula tor”

(poster) DS51749

2.6 External Oscillator Pins

Many microcontrollers have options for at least two

oscillators: a high-frequency primary oscillator and a

low-frequency secondary oscillator (refer to

Section 8.0 “Oscillator Configuration” for details).

The oscillator circuit should be placed on the same

side of the board as the microcontroller. Also, place

the oscillator circuit close to the respective oscillator

pins, not exceeding one-half inch (12 mm) distance

between them. The load capacitors should be placed

next to the oscillator itself, on the same side of the

board. Use a grounded copper pour around the

oscillator circuit to isolate them from surrounding

circuits. The grounded copper pour should be routed

directly to the MCU ground. Do not run any signal

traces or power traces inside the ground pour. Also, if

using a two-sided board, avoid any traces on the

other side of the board where the crystal is placed. A

suggested layout is shown in Figure 2-3.

FIGURE 2-3: SUGGESTED PLACEMENT

OF THE OSCILLATOR

CIRCUIT

Main Oscillator

Guard Ring

Guard Trace

Secondary

Oscillator

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 18 Preliminary  2009 Microchip Technology Inc.

2.7 Oscillator Value Conditions on

Device Start-up

If the PLL of the target device is enabled and

configured for the device start-up oscillator, the

maximum oscillator source frequency must be limited

to 4 MH z < FIN < 8 MHz. This means that if the external

oscillator frequency is outside this range, the

application must start-up in FRC mode first. The default

PLL settings after a POR with an oscillator frequency

outside this range will violate the device operating

speed.

Once the device powers up, the application firmware

can initi ali ze the PLL SFRs, CLKDIV an d PLLDBF to a

suitable value, and then perform a clock switch to the

Oscillator + PLL clock source. Note that clock switching

must be enabled in the device Configuration word.

2.8 Configurati on of Analog and

Digital Pins During ICSP

Operations

If MPLAB ICD 2, MPLAB ICD 3, or MPLAB REAL ICE

in-circuit emulator is selected as a debugger, it

automatically initializes all of the A/D input pins (ANx)

as “digital” pins, by setting all bits in the AD1PCFGL

registers.

The bit s in th e register s that correspond to the A/D pins

that are initialized by MPLAB ICD 2, MPLAB ICD 3 or

MPLAB REAL ICE in-circuit emulator, must not be

cleared by the user application firmware; otherwise,

commu nication errors will result betw een the deb ugger

and the device.

If your application needs to use certain A/D pins as

analog input pins during the debug session, the user

application must clear the corresponding bits in the

AD1PCFGL register during initialization of the ADC

module.

When MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL

ICE in-circuit emulator is used as a programmer, the

user application firmware must correctly configure the

AD1PCFGL register. Automatic initialization of this

Failure to correctly configure the register(s) will result in

all A/D pins being recognized as analog input pins,

resulting in the port value being read as a logic ‘0’,

which may affect user application functionality.

2.9 Unused I/Os

Unused I/O pins should be configured as outputs and

driven to a logic low state.

Alternatively, connect a 1k to 10k resistor to VSS on

unused pins and drive the output to logic low.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 19

PIC24HJ32GP202/204 and PIC24HJ16GP304

3.0 CPU

The PIC24HJ32GP202/204 and PIC24HJ16GP304

CPU modules have a 16-bit (data) modified Harvard

architecture with an enhanced instruction set and

addressing modes. The CPU has a 24-bit instruction

word with a variable length opcode field. The Program

Counter (PC) is 23 bits wide and addresses up to

4M x 24 bits of user program memory space. The

actual am ount of progra m memory im plement ed varies

by device. A single-cycle instruction prefetch

mechanism is used to help maintain throughput and

provides predictable execution. All instructions execute

in a single cycle, with the exception of instructions that

change the program flow, the double word move

(MOV.D) instruction and the table instructions.

Overhead-free, single-cycle program loop constructs

are supported using the REPEAT instruction, which is

interruptible at any point.

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices have sixteen, 16-bit working registers in the

progr amme r ’s mod el. Ea ch of the wo rki ng re gister s can

serve as a data, address or address offset register. The

16th working register (W15) operates as a software

Stack P oi nter (SP) for interrup ts a nd c alls .

The PIC24HJ32GP202/204 and PIC24HJ16GP304

instruc tion s et inc ludes many a ddress ing m odes an d is

designed for optimum C compiler efficiency. For most

instructions, the PIC24HJ32GP202/204 and

PIC24HJ16GP304 is capable of executing a data (or

program data) memory read, a working register (data)

read , a data memo ry wri te an d a progr am (in str uct ion)

memory read per instruction cycle. As a result, three

parameter instructions can be supported, allowing

A + B = C operations to be executed in a single cycle.

A block diagram of t he CPU is shown in F igure 3-1. The

programmer’s model for the PIC24HJ32GP202/204

and PIC24HJ16GP304 is shown in Figure 3-2.

3.1 Data Addressing Overvi ew

The data space can be linearly addressed as 32K words

or 64 Kbytes using an Address Generation Unit (AGU).

The up per 32 Kby tes of the data sp ace memor y map ca n

optionally be mapped into program space at any 16K

program word boundary defined by the 8-bit Program

S pace V isibility Page register (PSVPAG). The program to

data space mapping feature lets any instruction access

program s pace as if i t w e re da ta s p a ce .

The data space also includes 2 Kbytes of DMA RAM,

which is primarily used for DMA data transfers, but this

may be used as general purpose RAM.

3.2 Special MCU Features

The PIC24HJ32GP202/204 and PIC24HJ16GP304

feature a 17-bit by 17-bit, single-cycle multiplier. The

multiplier can perform signed, unsigned and

mixed-sign multiplication. Using a 17-bit by 17-bit

multiplier for 16-bit by 16-bit multiplication makes

mixed-sign multiplication possible.

The PIC24HJ32GP202/204 and PIC24HJ16GP304

support s 16/1 6 and 3 2/1 6 integer d iv ide o pera tions. Al l

divide instructions are iterative operations. They must

be executed within a REPEAT loop, resulting in a total

execution time of 19 instruction cycles. The divide

operation can be interrupted during any of those

19 cycles without loss of data.

A multi-bit data shifter is used to perform up to a 16-bit,

left or right shift in a single cycle.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 2. CPU” (DS70204) of

the ”dsPIC 33F/PIC24H Fam ily Refer ence

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 20 Preliminary  2009 Microchip Technology Inc.

FIGURE 3-1: PIC24HJ32GP202/204 AND PIC24HJ16GP304 CPU CORE BLOCK DIAGRAM

Instruction

Decode and

Control

PCH PCL

Program Counter

16-bit ALU

Instruction Reg

PCU

16 x 16

W Register Array

ROM Latch

EA MUX

Interrupt

Controller

Stack

Control

Logic

Loop

Control

Logic

Control Signals

to V a rious Blocks

Literal Data

16 16

To Pe ripheral Modu l es

Data Latch

Address

Latch

X RAM

Address Gen era tor Units

X Data Bus

17 x 17

Divide Support

PSV and Table

Data Access

Control Block

Program Memory

Data Latch

Address Latch

Multiplier

 2009 Microchip Technology Inc. Preliminary DS70289F-page 21

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 3-2: PIC24HJ32GP 202 /204 AND PIC24HJ16GP304 PROGRAMMER’S MODEL

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

STATUS Register

Working Registers

W10

W11

W12

W13

W14/Frame Pointer

W15/Stack Pointe r

7 0Program Space Visibility Page Address

— — ——

RCOUNT

15 0REPEAT Loop Counter

IPL2 IPL1

SPLIM Stack Pointer Limit Register

SRL

PUSH.S Shadow

DO Shadow

——

15 0Core Configuration Register

Legend

CORCON

— DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 22 Preliminary  2009 Microchip Technology Inc.

3.3 CPU Control Registers

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —DC

bit 15 bit 8

R/W-0(1) R/W-0(2) R/W-0(2) R-0 R/W-0 R/W-0 R/W-0 R/W-0

IPL<2:0>(2) RA N OV Z C

bit 7 bit 0

Legend:

C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’

S = Set only bit W = Writable bit -n = Value at POR

‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-9 Unimplemented: Read as ‘0’

bit 8 DC: MCU ALU Half Carry/Borrow bit

1 = A carry-o ut from the 4th low- order bit (for by te sized dat a) or 8th lo w-order bit (for word sized data)

of the result occurred

0 = No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized

data) of the result occurred

bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)

111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110 = CPU Interrupt Priority Level is 6 (14)

101 = CPU Interrupt Priority Level is 5 (13)

100 = CPU Interrupt Priority Level is 4 (12)

011 = CPU Interrupt Priority Level is 3 (11)

010 = CPU Interrupt Priority Level is 2 (10)

001 = CPU Interrupt Priori ty Level is 1 (9)

000 = CPU Interrupt Priori ty Level is 0 (8)

bit 4 RA: REPEAT Loop Active bit

1 = REPEAT loop in progress

0 = REPEAT loop not in progress

bit 3 N: MCU ALU Negative bit

1 = Result was neg ative

0 = Result was non-negative (zero or positive)

bit 2 OV: MCU ALU Overflow bit

This bit is use d for signed arithm etic (2’s com plement). It indic ates an overflow of th e magnit ude which

causes the sign bit to change state.

1 = Overflow occurred for signed arithmetic (in this arithmetic operatio n)

0 = No overflow occurred

bit 1 Z: MCU ALU Zero bit

1 = An operation which affects the Z bit has set it at some time in the past

0 = The most recent operation which affects the Z bit has cleared it (i.e., a non-zero result)

bit 0 C: MCU ALU Carry/Borrow bit

1 = A carry-out from the Most Significant bit (MSb) of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note 1: The IPL<2: 0> b it s are con ca ten ated with the IPL<3 > bi t (CORCON<3 >) to form the CPU Interrup t Prio rity

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

2: The IPL<2 :0> Status bit s are read -on ly when NSTDIS = 1 (INTCON1<15>).

 2009 Microchip Technology Inc. Preliminary DS70289F-page 23

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0

— — — —IPL3

(1) PSV — —

bit 7 bit 0

Legend: C = Clea r only bit

R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set

0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’

bit 15-4 Unimplemented: Read as ‘0’

bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(1)

1 = CPU interrupt priority level is greater than 7

0 = CPU interrupt priority level is 7 or less

bit 2 PSV: Program Space Visibility in Data Space Enable bit

1 = Pr ogram space v isible in data space

0 = Program space not visible in data space

bit 1-0 Unimplemented: Read as ‘0’

Note 1: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 24 Preliminary  2009 Microchip Technology Inc.

3.4 Arithmetic Logic Unit (ALU)

The PIC24HJ32GP202/204 and PIC24HJ16GP304

Arithmetic Logic Unit (ALU) is 16 bits wide and is

capable of addition, subtraction, bit shifts and logic

operations. Unless otherwise mentioned, arithmetic

operatio ns are 2’ s complem ent in nature . The ALU may

affect the values of the Carry (C), Zero (Z), Negative

(N), Overflow (OV) and Digit Carry (DC) Status bits in

the SR regi ster depen ding on the op eration. The C and

DC Status b its op erat e as Borrow and Digi t Borrow bits

respectively, for subtraction operations.

The ALU can perform 8-bit or 16-bit operations

depending on the mode of the instruction that is used.

Data for the ALU operation can come from the W

addressing mode of the instruction. Likewise, output

data from the AL U can be written to the W register array

or a data memory location.

Refer to the “16-bit MCU and DSC Programmer’s Ref-

erenc e Manual” (DS701 57) for m ore informati on on the

SR bi ts affected by each instruction.

The PIC24HJ32GP202/204 and PIC24HJ16GP304

CPU incorporates hardware support for both

multiplication and division. This includes a dedicated

hardware multiplier and a support hardware for

16-bit-divisor division.

3.4.1 MULTIPLIER

Using the high-speed 17-bit x 17-bit multiplier, the ALU

supports unsigned, signed or mixed-sign operation in

several multiplication modes:

• 16-bit x 16-bit signed

• 16-bit x 16-bit unsigned

• 16-bit signed x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit unsigned

• 16-bit unsigned x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit signed

• 8-bit unsigned x 8-bit unsigned

3.4.2 DIVIDER

The divide block supports 32-bit/16-bit and 16-b it/16-bit

signed and unsigne d in teger div ide ope rati ons wit h th e

foll owing data sizes.

1. 32-bit signed/16-bit signed divide

2. 32-bit unsigned/16-bit unsigned divide

3. 16-bit signed/16-bit signed divide

4. 16-bit unsigned/16-bit unsigned divide

The quotient for all divide instructions ends up in W0

and the remainder in W1. A 16-bit signed and

unsigned DIV instructions can specify any W register

for both the 16-bit divisor (Wn) and any W register

(aligned) pair (W(m + 1):Wm) for the 32-bit dividend.

The divide algorithm takes one cycle per bit of

divisor, so both 32-bit/16-bit and 16-bit/16-bit

instructions take the same number of cycles to

execute.

3.4.3 MULTI-BIT DATA SHIFTER

The mult i-bi t da ta shi f ter i s c apable of performing up to

16-bit arithmetic or logic right shifts, or up to 16-bit left

shifts in a single cycle. The source can be either a

working register or a memory location.

The shi f ter requires a signed b ina ry value to determ in e

both the magnitude (numbe r of bits) and dir ection of the

shif t operation. A positive value shifts the operand right.

and a negative value shifts the operand left. A value of

‘0’ does not modify the operand.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 25

PIC24HJ32GP202/204 and PIC24HJ16GP304

4.0 MEMORY ORGANIZATION

The PIC24HJ32GP202/204 and PIC24HJ16GP304

architecture features separate program and data

memory spaces and buses. This architecture also

allows the direct access of program memory from the

data s pac e during code executio n.

4.1 Program Address Space

The program address memory space of the

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices is 4M instructions. The space is addressable

by a 24 -bit value de rived either fr om the 23-bit P rogram

Counter (PC) during program execution, or from table

operation or data space remapping as described in

Section 4.4 “Interfacing Program a nd Dat a Mem ory

Spaces”.

User ap plication acces s to the progr am mem ory spac e

is restricted to the lower half of the address range

(0x000000 to 0x7FFFFF). The exception is the use of

TBLRD/TBLWT operations, which use TBLPAG<7> to

permit access to the Configuration bits and Device ID

sections of the configuration memory space.

The memory maps for the PIC24HJ32GP202/204 and

PIC24HJ16GP304 devices are shown in Figure 4-1.

FIGURE 4-1: PROGRAM MEMORY FOR PIC24HJ32GP202/204 AND PIC24HJ16GP304 DEVICES

Note: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a

comprehensive reference source. To

complement the information in this data

sheet, refer to the “dsPIC33F/PIC24H

Family Reference Manual”, “Section 4.

Program Memory” (DS70202), which is

available from the Microchip website

(www.microchip.com).

Reset A ddress

0x000000

0x0000FE

0x000002

0x000100

Device Configuration

User P r ogr a m

Flash Memory

0x005800

0x0057FE

(11264 instructions)

0x800000

0xF80000

Registers

0xF80017

0xF80018

DEVID (2)

0xFEFFFE

0xFF0000

0xFFFFFE

0xF7FFFE

Unimplemented

(Read ‘

’s)

GOTO

Instruction

0x000004

Reserved

0x7FFFFE

Reserved

0x000200

0x0001FE

0x000104

Alternate Vector Table

Reserved

Interrupt Vector Table

PIC24HJ32GP202/204

Config uration Memory Space User Memory Space

Reset Addr e ss

0x000000

0x0000FE

0x000002

0x000100

Device Configuration

User Program

Flas h Me mory

0x002C00

0x002BFE

(5632 instructions)

0x800000

0xF80000

Registers

0xF80017

0xF80018

DEVID (2)

0xFEFFFE

0xFF0000

0xFFFFFE

0xF7FFFE

Unimplemented

(Rea d ‘

’s)

GOTO

Instruction

0x000004

Reserved

0x7FFFFE

Reserved

0x000200

0x0001FE

0x000104

Alternate Vector Table

Reserved

Interrupt Vector Table

PIC24HJ16GP304

Config uration Memory Space User Memory Space

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 26 Preliminary  2009 Microchip Technology Inc.

4.1.1 PROGRAM MEMORY

ORGANIZATION

The program memory space is organized in

word-addressable blocks. Although it is treated as

24 bits wide, it is more appropriate to think of each

address of the program memory as a lower and upper

word, with the upper byte of the upper word being

unimplemented. The lower word always has an even

address, while the upper word has an odd address

(See Figure 4-2).

Program memory addresses are always word-aligned

on the lower word, and addresses are incremented or

decremented by two during code execution. This

arrangement provides compatibility with data memory

space addressing and makes data in the program

memory space accessible.

4.1.2 INTERRUPT AND TRAP VECTORS

All PIC24HJ32GP202/204 and PIC24HJ16GP304

devices reserve the addresses between 0x00000 and

0x000200 for hard-coded program execution vectors.

A hardware Reset vector is provided to redirect code

execution from the default value of the PC on device

Reset to the actual start of code. A GOTO instruction is

programmed by the user application at 0x000000, with

the actual address for the start of code at 0x000002.

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices also have two interrupt vector tables, located

from 0x000004 to 0x0000FF and 0x000100 to

0x0001F F. These v ec tor tables a llo w ea ch of the m an y

device interrupt sources to be handled by separate

Interrupt Service Routines (ISRs). Section 7.1

“Interrupt Vector Table” provides a more detailed

discussion of the interrupt vector tables.

FIGURE 4-2: PROGRAM MEMORY ORGANIZATION

0816

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ By te

(read as ‘0’)

least significant word

most significant word

Ins truction Width

0x000001

0x000003

0x000005

0x000007

msw

Address (lsw Address)

 2009 Microchip Technology Inc. Preliminary DS70289F-page 27

PIC24HJ32GP202/204 and PIC24HJ16GP304

4.2 Data Address Sp ace

The PIC24HJ32GP202/204 and PIC24HJ16GP304

CPU has a separate 16-bit-wide data memory space.

The data space is accessed using separate Address

Generat ion Units (AG Us) for read and wr ite operations.

The data memory maps is shown in Figure 4-3.

All Effective Addresses (EAs) in the data memory sp ace

are 16 bits wide and point to the bytes within the data

space. This arrangement gives a data space address

range of 64 Kbytes or 32K words. The lower half of the

data memory space (that is, when EA<15> = 0) is used

for implemented memory addresses, while the upper

half (EA<15> = 1) is reserved for the Program Space

Visibility area (see Section 4.4.3 “Reading Data from

Program Memory Using Program Space Visibility”).

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices implement up to 30 Kbytes of data memory.

Should a n EA point to a lo cation out side of this area, an

all-zero word or byte will be returned.

4.2.1 DATA SPACE WIDTH

The data memory space is organized in byte

address able, 16-bit wide blocks . Dat a is aligned in dat a

memory and registers as 16-bit words, but all data

space EAs resolve to bytes. The Least Significant

Bytes (LSB s) of each w ord have even ad dresses, whil e

the Most Significant Bytes (MSBs) have odd

addresses.

4.2.2 DATA MEMORY ORGANIZATION

AND ALIGNMENT

To maintain backward compatibility with PIC® devices

and improve data space memory usage efficiency, the

PIC24HJ 32GP202/204 an d PIC24HJ16GP30 4 instruc-

tion set supports both word and byte operations. As a

conseq uen ce of byte acces sibility, all effective add ress

calculations are internally scaled to step through

word-aligned memory. For example, the core recog-

nizes that Post-Modified Register Indirect Addressing

mode [WS++] will result in a value of Ws + 1 for byte

operations and Ws + 2 for word operations.

Data byte reads will read the complete word that

contains the byte, using the LSB of any EA to

determine which byte to select. The selected byte is

placed onto the LSB of the data path. That is, data

memory and registers are organized as two parallel

byte-wide entities with shared (word) address decode,

but sepa rate wri te lines . Data byte w rites o nly write to

the corresponding side of the array or register that

matches the byte address.

All word accesses must be al igned to an even a ddress.

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word

operations, o r whe n tran sl ating from 8- bit M CU cod e. If

a misaligned read or write is attempted, an address

error trap is generated. If the error occurred on a read,

the instruc tion underway is c ompleted. If the ins truction

occurred on a write, the instruction is executed but the

write does not occur. In either case, a trap is then

executed, allowing the system and/or user application

to examine the machine state prior to execution of the

address Fault.

All byte loads into any W register are loaded into the

Least Signifi can t Byte. T he Most Signific ant By te is not

modified.

A sign-extend instruction (SE) is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, user

applications can clear the MSB of any W register by

executing a zero-extend (ZE) instruction on the

appropr iate address .

4.2.3 SFR SPACE

The firs t 2 Kbytes o f the Near Data S pa ce, from 0x 0000

to 0x07FF, is primarily occupied by Special Function

Registers (SFRs). These are used by the

PIC24HJ32GP202/204 and PIC24HJ16GP304 core

and peripheral modules to control the operation of the

device.

SFRs are distributed among the modules that they

control, and are genera lly grouped toge ther by mod ule.

Much of the SFR space contains unused addresses;

these are read as ‘0’. A complete listing of implemented

SFRs, including their addresses, is shown in Table 4-1

through Table 4-22.

4.2.4 NEAR DATA SPACE

The 8 Kbyte area between 0x0000 and 0x1FFF is

referred to as the Near Data Space. Locations in this

space are directly addressable via 13-bit absolute

address field within all memory direct instructions.

Addition ally , th e whole dat a spa ce is addressa ble using

MOV instructions, which support Memory Direct

Addressing mode with a 16-bit address field, or by

using Indirect Addressing mode using a working

Note: The actual set of peripheral features and

interrupts varies by the device. Refer to

the corresponding device tables and

pinout diagrams for device-specific

information.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 28 Preliminary  2009 Microchip Technology Inc.

FIGURE 4-3: DATA MEMORY MAP FOR PIC24HJ32GP202/204 AND PIC24HJ16GP304

DEVICES WITH 2 KB RAM

0x0000

0x07FE

0x0FFE

0xFFFE

LSB

Address

16 bits

LSbMSb

MSB

Address

0x0001

0x07FF

0xFFFF

Optionally

Mapped

into Program

Memory

0x0801 0x0800

0x1000

2 Kbyte

SFR Sp ace

2 Kbyte

SRAM Space

0x8001 0x8000

SFR Space

X Data RAM (X)

X Data

Unimplemented (X)

0x0FFF

0x1001

0x1FFF 0x1FFE

0x2001 0x2000

8 Kbyte

Near data space

 2009 Microchip Technology Inc. Preliminary DS70289F-page 29

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-1: CPU CORE REGISTERS MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

WREG0 0000 Wo rk ing Re gis ter 0

0000

WREG1 0002 Wo rk ing Re gis ter 1

0000

WREG2 0004 Wo rk ing Re gis ter 2

0000

WREG3 0006 Wo rk ing Re gis ter 3

0000

WREG4 0008 Wo rk ing Re gis ter 4

0000

WREG5 000A W o rkin g Re gis ter 5

0000

WREG6 000C Wo rk ing Re gis ter 6

0000

WREG7 000E W o rkin g Re gis ter 7

0000

WREG8 0010 Wo rk ing Re gis ter 8

0000

WREG9 0012 Wo rk ing Re gis ter 9

0000

WREG10 0014 Working Register 10

0000

WREG11 0016 Working Register 1 1

0000

WREG12 0018 Working Register 12

0000

WREG13 001A Working Register 13

0000

WREG14 001C Working Register 14

0000

WREG15 001E Working Register 15

0800

SPLIM 0020 S tack Pointer Limit Register

xxxx

PCL 002E Program Counter Low Word Register

0000

PCH 0030 — — — — — — — — Prog ram C ou nter H igh By te R e gister

0000

TBLPAG 0032 — — — — — — — — Table Page Address Pointer Register

0000

PSVPAG 0034 — — — — — — — — Program Memory Visibility Page Address Pointer Register

0000

RCOUNT 0036 Repeat Loop Counter Register

xxxx

SR 0042 — — — — — — — DC IPL2 IPL1 IPL0 RA N OV Z C

0000

CORCON 0044 — — — — — — — — — — — —

IPL3 PSV

— —

0000

DISICNT 0052 —

— Disable Interrupts Counter

xxxx

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ 16GP304

DS70289F-page 30 Preliminary  2009 Microchip Technology Inc.

TABLE 4-2: CHANGE NOTIFICATION REGISTER MAP FOR PIC24HJ32GP202

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE

—- — —

CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE

0000

CNEN2 0062

—

CN30IE CN29IE

—

CN27IE

— —

CN24IE CN23IE CN22IE CN21IE

— — — —

CN16IE

0000

CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE

— — —

CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE

0000

CNPU2 006A

—

CN30PUE CN29PUE

—

CN27PUE

— —

CN24PUE CN23PUE CN22PUE CN21PUE

— — — —

CN16PUE

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-3: CHANGE NOTIFICATION REGISTER MAP FOR PIC24HJ32GP204 AND PIC24HJ16GP304

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000

CNEN2 0062 — CN30IE CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000

CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000

CNPU2 006A — CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 31

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-4: INTERRUPT CONTROLLER REGISTER MAP

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

INTCON1 0080 NSTDIS — — — — — — — — DIV0ERR — MATHERR ADDRERR STKERR OSCFAIL —0000

INTCON2 0082 ALTIVT DISI — — — — — — — — — — — INT2EP INT1EP INT0EP 0000

IFS0 0084 —— AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF 0000

IFS1 0086 ——INT2IF — — — — — IC8IF IC7IF — INT1IF CNIF — MI2C1IF SI2C1IF 0000

IFS4 008C — — — — — — — — — — — — — —U1EIF—0000

IEC0 0094 —— AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE 0000

IEC1 0096 ——INT2IE — — — — — IC8IE IC7IE — INT1IE CNIE — MI2C1IE SI2C1IE 0000

IEC4 009C — — — — — — — — — — — — — —U1EIE—0000

IPC0 00A4 — T1IP<2:0> —OC1IP<2:0>—IC1IP<2:0>— INT0IP<2:0> 4444

IPC1 00A6 — T2IP<2:0> —OC2IP<2:0>—IC2IP<2:0>— — — — 4440

IPC2 00A8 — U1RXIP<2:0> — SPI1IP<2:0> — SPI1EIP<2:0> — T3IP<2:0> 4444

IPC3 00AA — — — — — — — — — AD1IP<2:0> — U1TXIP<2:0> 0044

IPC4 00AC — CNIP<2:0> — — — — — MI2C1IP<2:0> — SI2C1IP<2:0> 4044

IPC5 00AE — IC8IP<2:0> —IC7IP<2:0>— — — — — INT1IP<2:0> 4404

IPC7 00B2 — — — — — — — — — INT2IP<2:0> — — — — 0040

IPC16 00C4 — — — — — — — — — U1EIP<2:0> — — — — 0040

INTTREG 00E0 — — — —ILR<3:0> — VECNUM<6:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ 16GP304

DS70289F-page 32 Preliminary  2009 Microchip Technology Inc.

TA BLE 4-5: TIMER REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TMR1 0100 Timer1 Register

xxxx

PR1 0102 Period Register 1

FFFF

T1CON 0104 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0>

—

TSYNC TCS

—

0000

TMR2 0106 Timer2 Register

xxxx

TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only)

xxxx

TMR3 010A Timer3 Register

xxxx

PR2 010C Period Register 2

FFFF

PR3 010E Period Register 3

FFFF

T2CON 0110 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0> T32

—

TCS

—

0000

T3CON 0112 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0>

— —

TCS

—

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-6: INPUT CAPTURE REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

IC1BUF 0140 Input 1 Cap ture Regi ster

xxxx

IC1CON 0142

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC2BUF 0144 Input 2 Cap ture Regi ster

xxxx

IC2CON 0146

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC7BUF 0158 Input 7 Cap ture Regi ster

xxxx

IC7CON 015A

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC8BUF 015C In pu t 8 C ap tu re R eg is te r

xxxx

IC8CON 015E

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-7: OUTPUT COMPARE REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

OC1R S 0180 Outpu t Co m p are 1 Se cond ar y R eg ister

xxxx

OC1R 0182 Output Compare 1 Register

xxxx

OC1CON 0184

— —

OCSIDL

— — — — — — — —

OCFLT OCTSEL OCM<2:0>

0000

OC2R S 0186 Outpu t Co m p are 2 Se cond ar y R eg ister

xxxx

OC2R 0188 Output Compare 2 Register

xxxx

OC2CON 018A

— —

OCSIDL

— — — — — — — —

OCFLT OCTSEL OCM<2:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 33

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-8: I2C1 REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

I2C1RCV 0200 — — — — — — — — Receive Register

0000

I2C1TRN 0202 — — — — — — — —Transmit Register

00FF

I2C1BRG 0204 — — — — — — — Baud R ate Gene rator Re gister

0000

I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN

1000

I2C1STAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF

0000

I2C1ADD 020A — — — — — — Addres s R egi ster

0000

I2C1MSK 020C — — — — — — Add re ss M a sk R e gist er

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-9: UART1 REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL

0000

U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA

0110

U1TXREG 0224 — — — — — — — UART T r an sm it R e gist er

xxxx

U1RXREG 0226 — — — — — — — UART Receive Register

0000

U1BRG 0228 Ba ud R a te G en era to r P r es ca le r

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-10: SPI1 REGISTER MAP

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

SPI1STAT 0240 SPIEN — SPISIDL —————— SPIROV — — — — SPITBF SPIRBF

0000

SPI1CON1 0242 ——— DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0>

0000

SPI1CON2 0244 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY —

0000

SPI1BUF 0248 SPI1 T ransmit and Receive Buffer Register

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ 16GP304

DS70289F-page 34 Preliminary  2009 Microchip Technology Inc.

TABLE 4-11: PERIPHERAL PIN SELECT INPUT REGISTER MAP

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RPINR0 0680 — — — INT1R<4:0> — — — — — — — — 1F00

RPINR1 0682 ———————————INT2R<4:0>

001F

RPINR3 0686 — — —T3CKR<4:0>———T2CKR<4:0>

1F1F

RPINR7 068E — — — IC2R<4:0> ——— IC1R<4:0> 1F1F

RPINR10 0694 — — — IC8R<4:0> ——— IC7R<4:0> 1F1F

RPINR11 0696 ———————————OCFAR<4:0>

001F

RPINR18 06A4 — — — U1CTSR<4:0> ———U1RXR<4:0>

1F1F

RPINR20 06A8 — — —SCK1R<4:0>———SDI1R<4:0>

1F1F

RPINR21 06AA ———————————SS1R<4:0>

001F

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-12: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR PIC24HJ32GP202

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RPOR0 06C0 — — — RP1R<4:0> — — — RP0R<4:0> 0000

RPOR1 06C2 — — —RP3R<4:0>— — — RP2R<4:0> 0000

RPOR2 06C4 — — —RP5R<4:0>— — — RP4R<4:0> 0000

RPOR3 06C6 — — —RP7R<4:0>— — — RP6R<4:0> 0000

RPOR4 06C8 — — —RP9R<4:0>— — — RP8R<4:0> 0000

RPOR5 06CA — — —RP11R<4:0>— — —RP10R<4:0>

0000

RPOR6 06CC — — —RP13R<4:0>— — —RP12R<4:0>

0000

RPOR7 06CE — — —RP15R<4:0>— — —RP14R<4:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 35

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-13: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR PIC24HJ32GP204 AND PIC24HJ16GP304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RPOR0 06C0 — — — RP1R<4:0> — — — RP0R<4:0> 0000

RPOR1 06C2 — — —RP3R<4:0>— — — RP2R<4:0> 0000

RPOR2 06C4 — — —RP5R<4:0>— — — RP4R<4:0> 0000

RPOR3 06C6 — — —RP7R<4:0>— — — RP6R<4:0> 0000

RPOR4 06C8 — — —RP9R<4:0>— — — RP8R<4:0> 0000

RPOR5 06CA — — —RP11R<4:0>— — —RP10R<4:0>

0000

RPOR6 06CC — — —RP13R<4:0>— — —RP12R<4:0>

0000

RPOR7 06CE — — —RP15R<4:0>— — —RP14R<4:0>

0000

RPOR8 06D0 — — — RP17R<4:0> — — —RP16R<4:0>

0000

RPOR9 06D2 — — — RP19R<4:0> — — —RP18R<4:0>

0000

RPOR10 06D4 — — —RP21R<4:0>— — —RP20R<4:0>

0000

RPOR11 06D6 — — —RP23R<4:0>— — —RP22R<4:0>

0000

RPOR12 06D8 — — —RP25R<4:0>— — —RP24R<4:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ 16GP304

DS70289F-page 36 Preliminary  2009 Microchip Technology Inc.

TABLE 4-14: ADC1 REGISTER MAP FOR PIC24HJ32GP204 AND PIC24HJ16GP304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

ADC1BUF0 0300 ADC Data Buffer 0 xxxx

ADC1BUF1 0302 ADC Data Buffer 1 xxxx

ADC1BUF2 0304 ADC Data Buffer 2 xxxx

ADC1BUF3 0306 ADC Data Buffer 3 xxxx

ADC1BUF4 0308 ADC Data Buffer 4 xxxx

ADC1BUF5 030A ADC Data Buffer 5 xxxx

ADC1BUF6 030C ADC Data Buff er 6 xxxx

ADC1BUF7 030E ADC Data Buffer 7 xxxx

ADC1BUF8 0310 ADC Data Buffer 8 xxxx

ADC1BUF9 0312 ADC Data Buffer 9 xxxx

ADC1BUFA 0314 ADC Data Buffer 10 xxxx

ADC1BUFB 0316 ADC Data Buffer 11 xxxx

ADC1BUFC 0318 ADC Data Buffer 12 xxxx

ADC1BUFD 031A ADC Data Buffer 13 xxxx

ADC1BUFE 031C ADC Data Buffer 14 xxxx

ADC1BUFE 031E ADC Data Buffer 15 xxxx

AD1CON1 0320 ADON —ADSIDL —— AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000

AD1CON2 0322 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000

AD1CON3 0324 ADRC — — SAMC<4:0> ADCS<7:0> 0000

AD1CHS123 0326 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000

AD1CHS0 0328 CH0NB —— CH0SB<4:0> CH0NA —— CH0SA<4:0> 0000

AD1PCFGL 032C — — — PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000

AD1CSSL 0330 — — — CSS12 CSS11 CSS10 CSS9 CSS8 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 37

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-15: ADC1 REGISTER MAP FOR PIC24HJ32GP202

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

ADC1BUF0 0300 ADC Data Buffer 0 xxxx

ADC1BUF1 0302 ADC Data Buffer 1 xxxx

ADC1BUF2 0304 ADC Data Buffer 2 xxxx

ADC1BUF3 0306 ADC Data Buffer 3 xxxx

ADC1BUF4 0308 ADC Data Buffer 4 xxxx

ADC1BUF5 030A ADC Data Buffer 5 xxxx

ADC1BUF6 030C ADC Data Buffer 6 xxxx

ADC1BUF7 030E ADC Data Buffer 7 xxxx

ADC1BUF8 0310 ADC Data Buffer 8 xxxx

ADC1BUF9 0312 ADC Data Buffer 9 xxxx

ADC1BUFA 0314 ADC Data Buffer 10 xxxx

ADC1BUFB 0316 ADC Data Buffer 11 xxxx

ADC1BUFC 0318 ADC Data Buffer 12 xxxx

ADC1BUFD 031A ADC Data Buffer 13 xxxx

ADC1BUFE 031C ADC Data Buffer 14 xxxx

ADC1BUFF 031E ADC Data Buffer 15 xxxx

AD1CON1 0320 ADON —ADSIDL—— AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000

AD1CON2 0322 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000

AD1CON3 0324 ADRC — — SAMC<4:0> ADCS<7:0> 0000

AD1CHS123 0326 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000

AD1CHS0 0328 CH0NB —— CH0SB<4:0> CH0NA —— CH0SA<4:0> 0000

AD1PCFGL 032C — — — PCFG12 PCFG11 PCFG10 PCFG9 — — — PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000

AD1CSSL 0330 — — — CSS12 CSS11 CSS10 CSS9 — — — CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ 16GP304

DS70289F-page 38 Preliminary  2009 Microchip Technology Inc.

TABLE 4-16: PORTA REGISTER MAP FOR PIC24HJ32GP202

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TRISA 02C0

— — — — — — — — — — — TRISA4 TRISA3 TRISA2 TRISA1 TRISA0

001F

PORTA 02C2

— — — — — — — — — — — RA4 RA3 RA2 RA1 RA0

xxxx

LATA 02C4

— — — — — — — — — — — LATA4 LATA3 LATA2 LATA1 LATA0

xxxx

ODCA 02C6

— — — — — — — — — — — ODCA4 ODCA3 ODCA2 ODCA1 ODCA0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-17: PORTA REGISTER MAP FOR PIC24HJ32GP204 AND PIC24HJ16GP304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TRISA 02C0

— — — — —

TRISA10 TRISA9 TRISA8 TRISA7

— — TRISA4 TRISA3 TRISA2 TRISA1 TRISA0

079F

PORTA 02C2

— — — — —

RA10 RA9 RA8 RA7

—— RA4 RA3 RA2 RA1 RA0

xxxx

LATA 02C4

— — — — —

LATA10 LATA9 LATA8 LATA7

—— LATA4 LATA3 LATA2 LATA1 LATA0

xxxx

ODCA 02C6

— — — — — ODCA10 ODCA9 ODCA8 ODCA7 —— ODCA4 ODCA3 ODCA2 ODCA1 ODCA0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-18: PORTB REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0

FFFF

PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0

xxxx

LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0

xxxx

ODCB 02CE

ODCB15 ODCB14 ODCB13 ODCB12 ODCB11 ODCB10 ODCB9 ODCB8 ODCB7 ODCB6 ODCB5 ODCB4 ODCB3 ODCB2 ODCB1 ODCB0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.

TABLE 4-19: PORTC REGISTER MAP FOR PIC24HJ32GP204 AND PIC24HJ16GP304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TRISC 02D0 —————— TRISC9 TRISC8 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0

03FF

PORTC 02D2 —————— RC9 RC8 RC7 RC6 RC5 RC4 RC4 RC2 RC1 RC0

xxxx

LATC 02D4 —————— LATC9 LATC8 LATC7 LATC6 LATC5 LATC4 LATC4 LATC2 LATC1 LATC0

xxxx

ODCC 02D6 —————— ODCC9 ODCC8 ODCC7 ODCC6 ODCC5 ODCC4 ODCC4 ODCC2 ODCC1 ODCC0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 39

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-20: SYSTEM CONTROL REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RCON 0740 TRAPR IOPUWR ———— CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR

xxxx

(1)

OSCCON 0742 —COSC<2:0>— NOSC<2:0> CLKLOCK IOLOCK LOCK —CF— LPOSCEN OSWEN 0300

(2)

CLKDIV 0744 ROI DOZE<2:0> DOZEN FRCDIV<2:0> PLLPOST<1:0> — PLLPRE<4:0> 3040

PLLFBD 0746 — — — — — — — PLLDIV<8:0> 0030

OSCTUN 0748 — — — — — — — — — — TUN<5:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

Note 1: RCON register Reset values dependent on type of Reset.

2: OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset.

TABLE 4-21: NVM REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

NVMCON 0760 WR WREN WRERR — — — — — — ERASE ——NVMOP<3:0>

0000

(1)

NVMKEY 0766

———————— NVMKEY<7:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.

TABLE 4-22: PMD REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

PMD1 0770 — — T3MD T2MD T1MD — — — I2C1MD —U1MD —SPI1MD — — AD1MD 0000

PMD2 0772 IC8MD IC7MD — — — —IC2MDIC1MD— — — — — —OC2MDOC1MD0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 40 Preliminary  2009 Microchip Technology Inc.

4.2.5 SOFTWARE STACK

In addition to its use as a working register, the W15

PIC24HJ16GP304 devices is also used as a software

Stack Pointer. The Stack Pointer always points to the

first av ailab le free word and gr ows from low er to h igher

addresses. It pre-decrements for stack pops and

post-increments for stack pushes, as shown in

Figure 4-4. For a PC push during any CALL instruction,

the MSB of the PC is zero-extended before the push,

ensuring that the MSB is always clear.

The Stack Pointer Limit register (SPLIM) associated

with the S t ack Pointe r set s an upp er address bounda ry

for the stack. SPLIM is uninitialized at Reset. Similarly,

the S tack Po inter , SPLIM<0> is forced to ‘0’ beca use all

stack operations must be word aligned.

When an EA is generated using W15 as a source or

destination pointer, the resulting address is compared

with the value in SPLIM. If the contents of the Stack

Pointer (W15) and the SPLIM register are equal and a

push operation is performed, a stack error trap will not

occur. The stack err or tra p will occ ur on a su bsequ ent

push operation. For example, to cause a stack error

trap when the stack grows beyond address 0x1000 in

RAM, initialize the SPLIM with the value 0x0FFE.

Similarly, a S t ac k Pointer un derflow (stack error) tra p is

generated when the Stack Pointer address is found to

be lesser than 0x0800. This prevents the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM re gister should not be immediatel y

followed by an indirect read operation using W15.

FIGURE 4-4: CALL STACK FRAME

4.2.6 DATA RAM PROTECTION FEATURE

The PIC24H product family supports Data RAM

protecti on fe atures that ena ble se gment s of R AM to b e

protected when used in conjunction with Boot and

Secur e Code Se gment S ecurity. BSRAM (Secure RAM

segment for BS) is accessible only from the Boot

Segment Flash code when enabled. SSRAM (Secure

RAM segment for RAM) is accessible only from the

Secure Segment Flash code when enabled. See

Table 4-1 for an overview of the BSRAM and SSRAM

SFRs.

4.3 Instruction Addressing Modes

The addressing modes shown in Table 4-23 form the

basis of the addressing modes optimized to support the

specific features of individual instructions. The

addressing modes provided in the MAC class of

instructions differ from those in the other instruction

types.

4.3.1 FILE REGISTER INSTRUCTIONS

Most fil e re gis ter i ns truc tio ns us e a 1 3-bi t address f iel d

(f) to directly address data present in the first 8192

bytes of data memory (Near Data Space). Most file

whic h is den oted as WREG in these i nstruc tions. The

destination is typically either the same file register or

WREG (with the exception of the MUL instruction),

which w rites the re sult t o a re gister or regi ster pair . Th e

MOV instruction allows additional flexibility and can

access the entire data space.

4.3.2 MCU INSTRUCTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where, Operand 1 is always a working register (that is,

the addressing mode can only be reg ister direct), which

is referred to as Wb. Operand 2 can be a W register,

fetched from data memory, or a 5-bit literal. The result

location can be either a W register or a data memory

location. The following addressing modes are

supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

Note: A PC push during exception processing

concat enates the SRL regis ter to the M SB

of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Toward

Higher Address

0x0000

PC<22:16>

POP : [--W15]

PUSH : [W15++]

Note: Not all instructions support all the

addressing modes given above. Individual

instructions can support different subsets

of these addressing modes.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 41

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 4-23: FUNDAMENTAL ADDRESSING MODES SUPPORTED

4.3.3 MOVE (MOV) INSTRUCTION

Move instructions provide a greater degree of

addressing flexibility than the other instructions. In

addition to the Addressing modes supported by most

MCU instructions, MOV instructions also support

mode. This is also referred to as Register Indexed

mode.

In summary, move instructions support the following

addressing modes:

• Register Direct

• Register Indirect

• Register Indirect Post-modified

• Register Indirect Pre-modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

4.3.4 OTHER INSTRUCTIONS

Besides the addressing modes outlined previously,

some i nstructio ns use li teral con sta nts of various sizes.

For example, BRA (branch) instructions use 16-bit

signed l iterals to spe cify the branch de stination dire ctly ,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, such as ADD Acc, the

source of an operand or result is implied by the opc ode

itse lf. Cert ain opera tions, such as NOP, do not have any

operands.

Addressing Mode Description

File Register Direct The address of the file register is specified explicitly.

decremented) by a constant value.

to form the EA.

(Register Indexed) The sum of Wn and Wb forms the EA.

Note: For the MOV instructions, the addressing

mode specified in the instruction can differ

for the source and the destination EA.

However, the 4-bit Wb (Register Offset)

field is shared by both source and

destination (but typically only used by

one).

Note: Not all instructions support all the

address ing m odes give n above . Indi vidua l

instructions may support different subsets

of these addressing modes.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 42 Preliminary  2009 Microchip Technology Inc.

4.4 Interfac ing Program and Data

Memory Spaces

The PIC24HJ32GP202/204 and PIC24HJ16GP304

architecture uses a 24-bit-wide program space and a

16-bit wide data space. The architecture is also a

modified Harvard scheme, which means that the data

can also be present in the program space. To use this

data successfully, it must be accessed in a way that

preserv es the ali gnm en t of information in both sp ac es .

Aside from normal execution, the

PIC24HJ32GP202/204 and PIC24HJ16GP304

architecture provides two methods by which program

space can be accessed during operation:

• Using ta ble in stru ctions to acce ss in divid ual by tes

or words anywhere in the p rogram space

• Remapping a portion of the program space into

the data space (Program Space Vi sibility)

Table instructions allow an application to read or write

to small areas of the program memory. This capability

makes the method ideal for accessing data tables that

need to be updated periodically. It also allows ac cess

to all bytes of the program word. The remapping

method allows an appli cation to access a large b lock of

data on a read-only basis, which is ideal for look ups

from a large table of static data. The application can

only access the least significant word of the program

word.

4.4. 1 ADDRESSING PROGRAM SPACE

Since the address ranges for the data and program

spaces are 16 and 24 bits, respectively, a method is

needed to create a 23-bit or 24-bit program address

from 16-bit da ta regist ers. The soluti on depends on the

interface method to be used.

For table operations, the 8-bit Table Page register

(TBLPAG) is used to define a 32K word region within

the program space. This is concatenated with a 16-bit

EA to arrive at a full 24-bit program space address. In

this format, the Most Significant bit of TBLPAG is used

to determ ine if the ope ration occurs in the user mem ory

(TBLPAG<7> = 0) or the configuration memory

(TBLPAG<7> = 1).

For remapping operations, the 8-bit Program Space

Visibility register (PSVPAG) is used to define a

16K word page in the program space. When the Most

Signific ant bit of th e EA is ‘1’, PSVPAG is concatenated

with t he lower 15 b its of the EA to form a 23-bit program

space address. Unlike table operations, this limits

remappi ng ope rations stric tly to the u ser m emory are a.

Table 4-24 and Figure 4-5 sho w how the program EA is

created for table operations and remapping accesses

from the data EA. Here, P<23:0> refers to a program

space word, and D<15:0> refers to a data space word.

TABLE 4-24: PROGRAM SPACE ADDRESS CONSTRUCTION

Access Type Access

Space Program S pace Address

<23> <22:16> <15> <14:1> <0>

Instruction Access

(Code Execution) User 0PC<22:1> 0

0xx xxxx xxxx xxxx xxxx xxx0

TBLRD/TBLWT

(Byte/Word Read/Write) User TBLPAG<7:0> Data EA<15:0>

0xxx xxxx xxxx xxxx xxxx xxxx

Configuration TBLPAG<7:0> Data EA<15:0>

1xxx xxxx xxxx xxxx xxxx xxxx

Program Space Visibilit y

(Block Remap/Read) User 0PSVPAG<7:0> Data EA<14:0>(1)

0 xxxx xxxx xxx xxxx xxxx xxxx

Note 1: Data EA<15> is always ‘1’ in this case , but is n ot used in calcul ating th e progra m sp ace a ddress . Bit 15 of

the address is PSVPAG<0>.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 43

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 4-5: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

0Program Counter

23 bits

PSVPAG

8 bits

15 bit s

Program Counter(1)

Select

TBLPAG

8 bits

16 bits

Byte Select

1/0

User/Configuration

Table Operat ion s(2)

Program Space Visibility(1)

Space Select

24 bi ts

23 bits

(Remapping)

1/0

Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as ‘0’ to

maintain word alignment of data in the program and data spaces.

2: Table op erations are not required t o b e w o rd-al ign ed . Table re ad ope rati on s a r e p erm itt ed

in the configuration mem ory sp ac e.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 44 Preliminary  2009 Microchip Technology Inc.

4.4.2 DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

The TBLRDL and TBLWTL instructions offer a direct

method to read or write the lower word of any address

within the program space without going through data

space. The TBLRDH and TBLWTH instructions are the

only methods to read or write the upper 8 bits of a

program space word as data.

The PC is incremented by 2 for each successive 24-bit

program word. This al lows program memory addres ses

to directly map to data space addresses. Program

memory can thus be regarded as two 16-bit wide word

address spaces, residing side by side, each with the

same add ress range. TBLRDL and TBLWTL access the

space that contains the least significant data word.

TBLRDH and TBLWTH access the space that contains

the upper data byte.

Two table instructions are provided to move byte or

word sized (16-bit) data to and from program space.

Both function as either byte or word operations.

•TBLRDL (Table Read Low): In Word mode, this

instruction maps the lower word of the program

spa ce loc ati on (P<15:0> ) to a data address

(D<15:0>).

In Byte mode, eit her the upp er or low er byte of the

lower program word is mapped to th e lower byte of

a data address. The upper byte is selected when

Byte Select is ‘1’; the lower byte is selected when

it is ‘0’.

•TBLRDH (Table Read High): In W o r d m o d e , th i s

instruction maps the entire upper word of a program

address (P<23:16>) to a data address. Note that

D<15:8>, the ‘phantom byte’, will always be ‘0’.

In Byte mode, this instruction maps the upper or

lower byte of the program word to D<7:0> of the

data address, as in the TBLRDL instruction. Note

that the data will always be ‘0’ when the upper

‘Phantom’ byte is selected (Byte Select = 1).

In a similar fashion, two table instructions, TBLWTH

and TBLWTL, are used to write individual bytes or

words to a program space address. The details of

their operation are explained in Section 5.0 “Flash

Program Memory”.

For all table operations, the area of program memory

spac e to be ac cess ed is de termin ed by the Table Page

memory space of the device, including user and

configu ration space s. When T BLPAG<7> = 0, the t able

page is located in the user memory space. When

TBLPAG<7> = 1, the page is located in configuration

space.

FIGURE 4-6: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS

081623

00000000

‘Phantom’ Byte

TBLRDH.B (Wn<0> = 0)

TBLRDL.W

TBLRDL.B (Wn<0> = 1)

TBLRDL.B (Wn<0> = 0)

23 15 0

TBLPAG

0x000000

0x800000

0x020000

0x030000

Program Space

The address for the table operation is determ ined by the data EA

within the page defined by the TBLPAG register.

Only read operations are s hown; write operations are also va lid in

the user memory area.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 45

PIC24HJ32GP202/204 and PIC24HJ16GP304

4.4.3 READING DATA FROM PROGRAM

MEMORY USING PROGRAM SPACE

VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word page of the p rogram spac e.

This option provides transparent access to the stored

constant data from the data space without the need to

use special instructions (such as TBLRDL/H).

Program space access through the data space occurs

if the Mo st Significan t bit of the dat a space EA is ‘ 1’ and

prog ram spac e visib ility is enabl ed by se tting t he PSV

bit in the Core Control register (CORCON<2>). The

location of the program memory space to be mapped

into the data space is determined by the Program

Space Visibility Page register (PSVPAG). This 8-bit

16K words in program space. In effect, PSVPAG

functions as the upper 8 bits of the program memory

address, with the 15 bits of the EA functioning as the

lower bits. By incrementing the PC by 2 for each

progra m mem ory word , the low e r 15 bits of data space

addresses directly map to the lower 15 bits in the cor-

responding program space addresses.

Data reads to this area add a cycle to the instruction

being executed, since two program memory fetches

are required.

Although each data space address 8000h and higher

maps directly into a corresponding program memory

address (see Figure 4-7), only the lower 16 bits of the

24-bit program word are used to contain the data. The

upper 8 bits of any program space location used as

data should be programmed with ‘1111 1111’ or

‘0000 0000’ to force a NOP. This prevents possible

issues should the area of code ever be accidentally

executed.

For operations that use PSV and are executed outside

a REPEAT loop, the MOV and MOV.D instructions

require one instructio n cycle in add ition to the sp ecified

execution time. All other instructions require two

ins truction cycles in addition to the specified execution

time.

For operations that use PSV, and are executed inside

a REPEA T loop, these instan ces require two instruction

cycle s in add iti on to the spe ci fied exec uti on ti me of the

instruction:

• Execution in the first iteration

• Execution in the last iteration

• Execution prior to exiting the loop due to an

interrupt

• Execution upon re-entering the loop after an

interr upt is serviced

Any other iteration of the REPEAT loop will allow the

instruction using PSV to access data to execute in a

single cycle.

FIGURE 4-7: PROGRAM SPAC E VISIBILITY OPERATION

Note: PSV acc ess is tempo raril y disabl ed durin g

table reads/writes.

23 15 0

PSVPAG Data Space

Program Space

0x0000

0x8000

0xFFFF

02 0x000000

0x800000

0x010000

0x018000

When CORCON<2> = 1 and EA<15> = 1:

The data in the page

designated by

PSVPAG is mapped

into the upper half of

the data memory

space...

Data EA<14:0>

...while the lower 15 bits

of the EA specify an

exact address within

the PSV area. This

corresponds exactly to

the same lower 15 bits

of the actual program

space address.

PSV Area

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 46 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 47

PIC24HJ32GP202/204 and PIC24HJ16GP304

5.0 FLASH PROGRAM MEMORY

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices contain internal Flash program memory to

store and execute application code. The memory is

readable, writable and erasable during normal

operation over the entire VDD range.

Flash memory can be programmed in two ways:

• In-Circuit Serial Programming™ (ICSP™)

programming capability

• Run-Time Self-Programming (RTSP)

ICSP allows a PIC24HJ32GP202/204 and

PIC24HJ16GP304 device to be serially programmed

while in the end application circuit. This is done with

two lin es for programm ing clock and pr ogramming da ta

(one of the alternate programming pin pairs:

PGECx/PGEDx), and three other lines for power (VDD),

ground (VSS) and Master Clear (MCLR). This allows

customers to manufacture boards with unprogrammed

devices and then program the microcontroller just

before shipping the product. This also allows the most

recent firmware or a custom firmware to be pro-

grammed.

RTSP is accomplished using TBLRD (table read) and

TBLWT (table write) instructions. With RTSP, the user

application can write program memory data either in

‘blocks ’ or ‘rows ’ of 64 instructi ons (192 bytes) at a tim e

or a single program memory word, and erase program

memory in blocks or ‘pages’ of 512 instructions (1536

bytes) at a time.

5.1 Table Instructions and Flash

Programming

Regardless of the method used, all programming of

Flash memory is done with the table read and table

write instructions. These allow direct read and write

access to the program memory space from the data

memory while the device is in normal operating mode.

The 24-bit target address in the program memory is

formed using bit s <7:0> of the TBLPAG register and the

Effective Address (EA) from a W register specified in

the table instruction, as shown in Figure 5-1.

The TBLRDL and the TBLWTL instructions are used to

read or write to the bits<15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

both Word and Byte modes.

The TBLRDH and TBLWTH instruc tions are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTH can also access program memo ry in Word

or Byte mode.

FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 4. Program Memory”

(DS70202) of the ”dsPIC33F/PIC24H

Family Reference Manual”, which is avai l-

able from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Program Counter

24 bi ts

Prog ram C ounte r

TBLPAG Reg

8 bits

Wor king Re g EA

16 bits

Byte

24-bit EA

1/0

Select

Using

Table Instruction

Using

User/Configuration

Space Select

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 48 Preliminary  2009 Microchip Technology Inc.

5.2 RTSP Operation

The PIC24HJ32GP202/204 and PIC24HJ16GP304

Flash program memory array is organized into rows of

64 instructions or 192 bytes. RTSP allows the user

application to erase a page of memory, which consists

of eight rows (512 instructions) at a time, and to

program one row or one word at a time. The 8-row

erase pages and single row write rows are

edge-aligned from the beginning of program memory,

on boundaries of 1536 bytes and 192 bytes,

respectively.

The program memory implements holding buffers that

can contain 64 instructions of programming data. Prior

to the actual programming operation, the write data

must be loaded into the buffers sequentially. The

instruction words loaded must always be from a group

of 64 boundary.

The basi c sequence for R TSP programming is to set up

a Table Pointer, then do a series of TBLWT instructions

to load the buffers. Programming is performed by

setting the co ntro l bits in the NVMCON regi st er. A total

of 64 TBLWTL and TBLWTH instructions are required

to load the instru cti ons .

All table write operations are single-word writes (two

instruc tion cycles) becaus e only the buffe rs are written.

A progr amming cycle is required for prog ramming each

row.

5.3 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. The processor stalls (waits) until the

programming operation is finished.

The programming time depends on the FRC accuracy

(see Table 22-18, “AC Characteristics: Internal RC

Accuracy”) and the value of the FRC O scillator T uning

calculate the minimum and maximum values for the

Row Write Time, Page Erase Time, and Word Write

Cycle Time parameters (see Table 22-12, “DC

Characteristics : Program Memor y”).

EQUATION 5-1: PROGRAMMING TIME

For example, if the device is operating at +125C, the

FRC accuracy will be ±5%. If the TUN<5:0> bits (see

Write Time is:

and, the Ma xi mum Row W r i te Time is:

Setting the WR bit (NVMCON<15>) starts the

operaion , and the WR bit is automa tically clea red when

the operation is finished.

5.4 Control Registers

Two SFRs are used to read and write the program

Flash memory:

• NVMCON: Flash Memory Control Register

• NVMKEY: Nonvolatile Memory Key Register

The NVMCON register (Register 5-1) controls which

blocks need to be erased, which memory type is to be

programmed and the start of the programming cycle.

NVMKEY (Register 5-2) is a write-only register that is

used for write protection. To start a programming or

erase sequence, the user application must

consecutively write 0x55 and 0xAA to the NVMKEY

Operations” for further details.

7.37 MHz FRC Accuracy%FRC Tuning%

--------------------------------------------------------------------------------------------------------------------------

TRW 11064 C yc le s

7.37 MHz 10.05+1 0.00375–

---------------------------------------------------------------------------------------------- 1.4 35 ms==

TRW 11064 C ycles

7.37 MHz 10.05–1 0.00375–

---------------------------------------------------------------------------------------------- 1.586ms==

 2009 Microchip Technology Inc. Preliminary DS70289F-page 49

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0

WR WREN WRERR — — — — —

bit 15 bit 8

U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1)

— ERASE ——NVMOP<3:0>

(2)

bit 7 bit 0

Legend: SO = Settable Only bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 WR: Write Control bit

1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is

cleared by hardware once operation is complete

0 = Program or erase operation is complete and inactive

bit 14 WREN: Write Enable bit

1 = Enable Flash program/erase operations

0 = Inhibit Flash program/erase operations

bit 13 WRERR: Write Sequence Error Flag bit

1 = An improper program or erase sequence attempt or termination has occurred (bit is set

automatically on any set attempt of the WR bit)

0 = The program or erase operation completed normally

bit 12-7 Unimplemented: Read as ‘0’

bit 6 ERASE: Erase/Program Enable bit

1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command

0 = Perform the program operation specified by NVMOP<3:0> on the next WR command

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2)

If ERASE = 1:

1111 = Memory bulk erase operation

1101 = Erase General Segment

1100 = Erase Secure Segment

0011 = No operation

0010 = Memory page erase operation

0001 = No operation

0000 = Erase a single Configuration register byte

If ERASE = 0:

1111 = No operation

1101 = No operation

1100 = No operation

0011 = Memory word program operation

0010 = No operation

0001 = Memory row program operation

0000 = Program a single Configuration register byte

Note 1: These bits can only be reset on POR.

2: All other combinations of NVMOP<3:0> are unimplemented.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 50 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0

NVMKEY<7:0>

bit 7 bit 0

Legend: SO = Settabl e Onl y bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-8 Unimplemented: Read as ‘0’

bit 7-0 NVMKEY<7:0>: Key Register (write-only) bits

 2009 Microchip Technology Inc. Preliminary DS70289F-page 51

PIC24HJ32GP202/204 and PIC24HJ16GP304

5.4.1 PROGRAMMING ALGORITHM FOR

FLASH PROGRAM MEMORY

Programmers can program one row of program Flash

memory at a time. To do this, it is necessary to erase

the 8-row erase page that contains the desired row.

The general process is:

1. Read eight rows of program memory

(512 instructions) and store in data RAM.

2. Update the program data in RAM with the

desired new data.

3. Erase the block (see Example 5-1):

a) Set the NVMOP bits (NVMCON<3:0>) to

‘0010’ to configure for block erase. Set

ERASE (NVMCON<6>) and WREN (NVM-

CON<14>) bits.

b) Write th e s t arti ng addres s o f th e page to be

erased into the TBLPAG and W registers.

c) Write 0x55 to NVMKEY.

d) Write 0xAA to NVMKEY.

e) Set the WR bit (NVMCON<15>). The erase

cycle begins and the CPU stalls for the

duration of the erase cycle. When the erase is

done, the WR bit is cleared automatically.

4. Write the first 64 instruc tions from dat a RAM in to

the prog ram memory buf fers (see Example 5-2).

5. Write the program block to Flash memory:

a) Set the NVMOP bits to ‘0001’ to configure

for row programming. Clear the ERASE bit

and set the WREN bit.

b) Write 0x55 to NVMKEY.

c) Write 0xAA to NVMKEY.

d) Set the WR bit. The programming cycle

begi ns and the CP U stalls for the duration of

the write cycle. When the write to Flash

memory is done, the WR bit is cleared

automatically.

6. Repeat steps 4 and 5, using the next available

64 instructions from the block in data RAM by

incrementing the value in TBLPAG, until all

512 instructions are written back to Flash memory.

To protect against accidental operations, the write

initiate sequence for NVMKEY must be used to allow

any erase or program operation to proceed. After the

programming command has been executed, the user

application must wait for the programming time until

programming is complete. The two instructions

following the start of the programming sequence

should be NOPs, as shown in Example 5-3.

EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE

; Set up NVMCON for block erase operation

MOV #0x4042, W0 ;

MOV W0, NVMCON ; Initialize NVMCON

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR), W0 ;

MOV W0, TBLPAG ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer

TBLWTL W0, [W0] ; Set base address of erase block

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55, W0

MOV W0, NVMKEY ; Write the 55 key

MOV #0xAA, W1 ;

MOV W1, NVMKEY ; Write the AA key

BSET NVMCON, #WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 52 Preliminary  2009 Microchip Technology Inc.

EXAMPLE 5-2: LOADING THE WR ITE BUFFERS

EXAMPLE 5-3: INITIATING A PROGRAMMING SE QUENCE

; Set up NVMCON for row programming operations

MOV #0x4001, W0 ;

MOV W0, NVMCON ; Initialize NVMCON

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000, W0 ;

MOV W0, TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000, W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0, W2 ;

MOV #HIGH_BYTE_0, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1, W2 ;

MOV #HIGH_BYTE_1, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2, W2 ;

MOV #HIGH_BYTE_2, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

•

; 63rd_program_word

MOV #LOW_WORD_31, W2 ;

MOV #HIGH_BYTE_31, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55, W0

MOV W0, NVMKEY ; Write the 55 key

MOV #0xAA, W1 ;

MOV W1, NVMKEY ; Write the AA key

BSET NVMCON, #WR ; Start the erase sequence

NOP ; Insert two NOPs after the

NOP ; erase command is asserted

 2009 Microchip Technology Inc. Preliminary DS70289F-page 53

PIC24HJ32GP202/204 and PIC24HJ16GP304

6.0 RESETS

The Reset module combines all reset sources and

controls the devi ce Master Reset Signal, SYSRST. The

following is a list of device Reset sources:

• POR: Power-on Reset

• BOR: Brown-out Reset

•MCLR

: Master Clear Pin Reset

•SWR: RESET Instruction

• WDTO: Watchdog Timer Reset

• CM: Configuration Mismatch Reset

• TRAPR: Trap Conflict Reset

• IOPUWR: Illegal Condition Device Res et

- Illegal Opcode Reset

- Uninitialized W Register Reset

- Security Reset

A simplified block diagram of the Reset module is

shown in Figure 6-1.

Any active source of reset will make the SYSRST

signa l active. On sy stem Reset, some of the r egisters

associated with the CPU and peripherals are forced to

a known Reset state and some are unaffected.

All types of device Reset sets a corresponding status

bit in the RCON register to indicate the type of Reset

(see Register 6-1) .

A POR clears all the bits, except for the POR bit

(RCON<0>), that are set. The user application can set

or clear any bit at any time during code execution. The

RCON bit s only serve as status bits. Setti ng a particular

Reset status bit in software does not cause a device

Reset to occur.

The RCON register also has other bits associated with

the Watchdog Timer and device power-saving states.

The functi on of these bits is discusse d in other section s

of this manual.

FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 families of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

“Section 8. Reset” (DS70192) of the

”dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: Refer to the specific peripheral section or

Section 3.0 “CPU” of this manual for

Note: The status bits in the RCON register

should be cleared after they are read so

that the next RCON register value after a

device Reset is meaningful.

MCLR

VDD

Internal

Regulator BOR

Sleep or Idle

RESET Instruction

WDT

Module

Glitch Filter

Trap Conflict

Il le ga l Opc ode

Uninitialized W Register

SYSRST

VDD Rise

Detect POR

Configuration Mismatch

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 54 Preliminary  2009 Microchip Technology Inc.

R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

TRAPR IOPUWR — — — —CMVREGS

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1

EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TRAPR: Trap Reset Flag bit

1 = A Trap Conflict Reset has occurre d

0 = A Trap Conflict Reset has not occurred

bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit

1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an

Address Pointer caused a Reset

0 = An illegal opcode or uninitialized W Reset has not occurred

bit 13-10 Unimplemented: Read as ‘0’

bit 9 CM: Confi guration Mismatch Flag bi t

1 = A configuration mismatch Reset has occurred

0 = A configuration mismatch Reset has NOT occurred

bit 8 VREGS: Voltage Regulator Standby During Sleep bit

1 = Voltage regulator is active during Sleep

0 = Voltage regulator goes into Standby mode during Sleep

bit 7 EXTR: External Reset (MCLR) Pin bit

1 = A Master Clear (pin) Reset has occurred

0 = A Master Clear (pin) Reset has not occurred

bit 6 SWR: Software Reset (Instruction) Flag bit

1 = A RESET instruction has been executed

0 = A RESET instruction has not been executed

bit 5 SWDTEN: Software Enable/Disable of WDT bit(2)

1 = WDT is enabled

0 = WDT is disabled

bit 4 WDTO: Wat chdog Timer Time-out F lag bit

1 = WDT time-out has occurred

0 = WDT time-out has not occurred

bit 3 SLEEP: Wake-up from Sleep Flag bit

1 = Device has been in Sleep mode

0 = Device has not been in Sleep mode

bit 2 IDLE: Wake-up from Idle Flag bit

1 = Device was in Id le mode

0 = Device was not in Idle mode

Note 1: All of t he Rese t sta tus bit s can be s et or cleare d in so ftw are. Set ting on e of t hese b its in sof tware d oes no t

cause a device Reset.

2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the

SWDTEN bit setting.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 55

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 1 BOR: Brown-out Rese t Flag bit

1 = A Brown-out Reset has occurred

0 = A Brown-out Reset has not occurred

bit 0 POR: Power-on Reset Flag bit

1 = A Power-on Reset has occurred

0 = A Power-on Reset has not occurred

Note 1: All of t he Rese t sta tus bit s can be s et or cleare d in so ftw are. Set ting on e of t hese b its in sof tware d oes no t

cause a device Reset.

2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the

SWDTEN bit setting.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 56 Preliminary  2009 Microchip Technology Inc.

6.1 System Reset

The PIC24HJ32GP202/204 and PIC24HJ16GP304

family of devices have two types of Reset:

•Cold Reset

•Warm Reset

A cold Reset is the result of a Power-on Reset (POR)

or a Brown-out Reset (BOR). On a cold Reset, the

FNOSC configuration bits in the FOSC device

configuration register selects the device clock source.

A warm Reset is the result of all other reset sources,

including the RESET instruction. On warm Reset, the

device will continue to operate from the current clock

source as indi ca ted by the Current O sc ill ato r Selec tio n

(COSC<2:0>) bits in the Oscillator Control

(OSCCON<14:12>) register.

The device is kept in a Reset state until the system

power supplies have stabilized at appropriate levels

and the oscillator clock is ready. The sequence in

which this occurs is detailed below and is shown in

Figure 6-2.

1. POR Reset: A POR circuit holds the device in

Reset when the power supply is turned on. The

POR circ uit is active un til VDD crosses the VPOR

threshol d and the del ay TPOR has elapsed.

2. BOR Reset: The on-chip voltage regulator has

a BOR circuit that keeps the device in Reset

until VDD crosses the VBOR threshold and the

delay TBOR has elapsed. The delay TBOR

ensures that the voltage regulator output

becomes stable.

3. PWRT Timer: The programmable power-up

timer continues to hold the processor in Reset

for a specific period of time (TPWRT) after a

BOR. The delay TPWRT ensures that the system

power supplies have stabilized at the appropri-

ate lev el for fu ll-spe ed ope ration . Afte r the de lay

TPWRT has elapsed, the SYSRST becomes

inactive, which in turn enables the selected

oscillat or to s tart generating clock cycles.

4. Oscillat or Delay: The total delay for the clock to

be ready for various clock source selections is

given in Table 6-1. Refer to Section 8.0

“Oscillator Configuration” for more

information.

5. When the o scillator cl ock is ready, the process or

begins execution from location 0x000000. The

user application programs a GOTO instru ct i on at

the reset address, which redirects program

execution to the appropriate start-up routine.

6. The Fail-Sa fe Cloc k Monitor (FSCM) , if enabled,

begins to monitor the system clock when the

system clock is ready and the delay TFSCM

elapsed.

TABLE 6-1: OSCILLATOR DELAY

Oscillator Mode Oscillator

Start-up Delay Oscillator Start-up

Timer PLL Lock Time Total Delay

FRC, FRCDIV16,

FRCDIVN TOSCD ——TOSCD

FRCPLL TOSCD —TLOCK TOSCD + TLOCK

XT TOSCD TOST —TOSCD + TOST

HS TOSCD TOST —TOSCD + TOST

EC ————

XTPLL TOSCD TOST TLOCK TOSCD + TOST + TLOCK

HSPLL TOSCD TOST TLOCK TOSCD + TOST + TLOCK

ECPLL — — TLOCK TLOCK

SOSC TOSCD TOST —TOSCD + TOST

LPRC TOSCD ——TOSCD

Note 1: TOSCD = Oscillator Start-up Delay (1.1 s max for FRC, 70 s max for LPRC). Crystal Oscillator start-up

times var y with crystal char acter istics, load capacitance, et c.

2: TOST = Oscillator Start-up Timer Delay (1024 oscillator clock period). For example, TOST = 102.4 s for a

10 MHz crystal and TOST = 32 ms for a 32 kHz crystal.

3: TLOCK = PLL lock time (1.5 ms nominal), if PLL is enabled.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 57

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 6-2: SYSTEM RESET TIMING

Reset Run

Device Status

VDD

VPOR Vbor

VBOR

POR Reset

BOR Reset

SYSRST

TPWRT

TPOR

TBOR

Oscillator Clock

TOSCD TOST TLOCK

Time

FSCM TFSCM

Note 1: POR Reset: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is

active until VDD crosses the VPOR threshold and the delay TPOR has elapsed.

2: BOR Reset: The on-chip voltage regulator has a BOR circuit t hat keeps the device in Reset until V DD crosses

the VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output

becomes stable.

3: PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific

period of time (TPWRT) after a BOR. The delay TPWRT ensures that the system power supplies have stabilized

at the appropriate level for full-speed operation. After the delay TPWRT has elapsed, the SYSRST becom es

inactive, which in turn enables the selected oscillator to start generating clock cycles.

4: O scillator Delay: The total delay for the clock to be ready for various clock source selections are given in

Table 6-1. Refer to Section 8.0 “Oscillato r Configur ation” for more information.

5: When the oscillator clock is ready, the processor begins execution from location 0x000000. The user

application programs a GOTO instruction at the reset address, which redirects program execution to the

appropriate start-up routine.

6: The Fail-Safe Clo ck Monitor (FS CM) , if enabled, begins to m onitor the syst em c lock when the system c lock

is ready and the delay TFSCM elapsed.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 58 Preliminary  2009 Microchip Technology Inc.

6.2 Power-on Reset (POR)

A Power-on Reset (POR) circuit ensures the device is

reset from power-on. The POR circuit is active until

VDD crosses the VPOR threshold and the delay TPOR

has elapsed. The delay TPOR ensures the internal

device bias circuits become stable.

The device supply voltage characteristics must meet

the specified starting voltage and rise rate

requirements to generate the POR. Refer to

Section 22.0 “Electrical Characteristics” for details.

The POR status (POR) bit in the Reset Control

(RCON<0>) register is set to indicate the Power-on

Reset.

6.2.1 Brown-out Reset (BOR) and

Power-up timer (PWRT)

The on-chip regulator has a Brown-out Reset (BOR)

circuit that resets the device when the VDD is too low

(VDD < VBOR) for proper device operation. The BOR

circuit keeps the device in Reset until VDD crosses

VBOR threshold and the delay TBOR has elapsed. The

delay TBOR ensures the voltage regulator output

becomes stable.

The BOR status (BOR) bit in the Reset Control

(RCON<1>) register is set to indicate the Brown-out

Reset.

The devi ce will not run a t full spee d after a BOR as the

VDD should rise to acceptable levels for full-speed

operation. The PWRT provides power-up time delay

(TPWRT) to ensure that the system power supplies have

stabilized at the appropriate levels for full-speed

operation before the SYSRST is released.

The power-up timer delay (TPWRT) is programmed by

the Power-on Reset Timer Value Select

(FPWRT<2:0>) bits in the POR Configuration

(FPOR<2:0>) register, which provides eight settings

(from 0 ms to 128 ms). Refer to Section 19.0 “Speci al

Features” for further details.

Figure 6-3 shows the typical brown-out scenarios. The

reset delay (TBOR + TPWRT) is initiated each time VDD

rises above the VBOR trip point

TABLE 6-2: OSCILLATOR DELAY

Symbol Parameter Value

VPOR POR threshold 1.8V nominal

TPOR POR extension time 30 s maximum

VBOR BOR threshold 2.5V nominal

TBOR BOR extension time 100 s maximum

TPWRT Programmable power-up time delay 0-128 ms nominal

TFSCM Fail-Safe Clock Monitor Delay 900 s maximum

Note: When the device exits the Reset condi-

tion (begins normal operation), the

device operating parameters (voltage,

frequency, temperature, etc.) must be

within their operating ranges, otherwise

the device may not function correctly.

The user application must ensure that

the delay between the time power is

first applied, and the time SYSRST

becomes inactive, is long enough to get

all operating parameters within

specification.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 59

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 6-3: BROWN-OUT SITUATIONS

6.3 External Reset (EXTR)

The external Reset is generated by driving the MCLR

pin low. The MCLR pin is a Schmitt tri gger inpu t with an

additio nal g lit ch fi lter. Rese t p ulses t hat are l onger than

the minimum pulse-width will generate a Reset. Refer

to Section 22.0 “Electrical Characteristics” for

minimum pulse-width specifications. The External

Reset (MCLR) Pin (EXTR) bit in the Reset Control

(RCON) register is set to indicate the MCLR Reset.

6.3.1 EXTERNAL SUPERVISORY CIRCUIT

Many systems have external supervisory circuits that

generate reset signals to Reset multiple devices in the

system . This extern al Res et signa l can be dire ctly co n-

nected to the MCLR pin to Reset the device when the

rest of system is Reset.

6.3.2 INTERNAL SUPERVISORY CIRCUIT

When using the internal power supervisory circuit to

Reset the devic e, the externa l reset pin (MCLR) sh ould

be tied directly or resistively to VDD. In this case, the

MCLR pin will not be used to generate a Reset. The

external reset pin (MCLR) does not have an internal

pull-up and must not be left unconnected.

6.4 Software RESET Instruction (SWR)

Whenever the RESET instruction is executed, the

device will assert SYSRST, placing the device in a

special Reset state. This Reset state will not

re-initia lize t he clo ck. Th e clo ck sourc e in ef fec t pr ior to

the RESET instru ction will remai n. SYSRST is release d

at th e nex t in str u cti on cy cle , a nd t h e re se t ve ct or fet ch

will commence.

The Software Reset (Instruction) Flag (SWR) bit in the

Reset Control (RCON<6>) register is set to indicate

the software Reset.

6.5 Watchdog Time-out Reset (WDTO)

Whenever a Watchdog time-out occurs, the device will

asynchronously assert SYSRST. The cloc k sourc e will

remain unchanged. A WDT time-out during Sleep or

Idle mode w ill wake-u p the proces sor, but will not reset

the processor.

The Watchdog Timer Time-out Flag (WDTO) bit in the

Reset Control (RCON<4>) register is set to indicate

the Watchdog Reset. Refer to Section 19.4

“Watchdog Timer (WDT)” for more information on

Watchdog Reset.

6.6 Trap Conflict Reset

If a lower-priority hard trap occurs while a

higher-priority trap is being processed, a hard trap

conflict Reset occurs. The hard traps include

exceptions of priority level 13 through level 15,

inclusive. The address error (level 13) and oscillator

error (level 14) traps fall into this category.

The Tr ap Reset Flag (TRAPR) bit in the Reset Control

(RCON<15 >) register is set to in dicate the T rap Conflict

Reset. Refer to Section 7.0 “Inte rrupt Controller” for

more information on trap conflict Resets.

VDD

SYSRST

VBOR

VDD

SYSRST

VBOR

VDD

SYSRST

VBOR

TBOR + TPWRT

VDD dips before PWRT expires

TBOR + TPWRT

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 60 Preliminary  2009 Microchip Technology Inc.

6.7 Configuration Mismatch Reset

To maintain the integrity of the peripheral pin select

control registers, they are constantly monitored with

shadow registers in hardware. If an unexpected

change in any of the registers occur (such as cell dis-

turbances caused by ESD or other external events), a

configuration mismatch Reset occurs.

The Configuration Mismatch Flag (CM) bit in the

Reset Control (RCON<9>) register is set to indicate

the configuration mismatch Reset. Refer to

Section 10.0 “I/O Ports” for more information on the

configurati on mi sm atc h Reset.

6.8 Illegal Condition Device Reset

An illegal condition device Reset occurs due to the

following sources:

• Illegal Opcode Reset

• Uninitialized W Register Reset

• Security Reset

The Illegal Opcode or Uninitialized W Access Reset

Flag (IOPUWR) bit in the Reset Control (RCON<14>)

Reset.

6.8.1 ILLEGAL OPCODE RESET

A device Reset is generated if the device attempts to

execute an illegal opcode value that is fetched from

program memory .

The illegal opcode Reset function can prevent the

device from executing program memory sections that

are used to store constant data. To take advantage of

the illegal opcode Reset, use only the lower 16 bits of

each pro gram memory s ection to sto re the data v alues.

The upper 8 bits should be programmed with 3Fh,

which is an illegal opcode value.

6.8.2 UNINITIALIZED W REGISTER

RESET

Any attempts to use the uninitialized W register as an

address pointer will Reset the device. The W register

array (with the exception of W15) is cleared during all

resets and is considered uninitialized until written to.

6.8.3 SECURITY RESET

If a Program Flow Change (PFC) or Vector Flow

Change (VFC) targets a restricted location in a

protected segment (Boot and Secure Segment), that

operation will cause a security Reset.

The PFC occurs when the Program Counter is

reloaded as a result of a Call, Jump, Computed Jump,

Return, Return from Subroutine, or other form of

branch instruction.

The VFC occurs when the Program Counter is

reloaded with an Interrupt or Trap vector.

Refer to Section 19.6 “Code Protection and

CodeGuard™ Security” for more information on

Security Reset.

6.9 Using the RCON Status Bits

The user application can read the Reset Control

(RCON) register after any device Reset to determine

the cause of the reset.

Table 6-3 provides a summary of the reset flag bit

operation.

TA BLE 6-3: RESET FLAG BIT OPERATION

Note: The configuration mismatch feature and

assoc iated reset flag i s not availa ble on all

devices.

Note: The status bits in the RCON register

should be cleared after they are read so

that the next RCON register value after a

device Reset will be meaningful.

Flag Bit Set by: Cleared by:

TRAPR (RCON<15>) Trap confli c t event POR,BOR

IOPWR (RCON<14>) Illegal opcode or uninitialized

W registe r access or Secu rity Reset POR,BOR

CM (RCON<9>) Configuration Mismatch POR,BOR

EXTR (RCON<7>) MCLR Reset POR

SWR (RCON<6>) RESET instruction POR,BOR

WDTO (RCON<4>) WDT time-out PWRSAV instruction,

CLRWDT instruction, POR,BOR

SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR ,BOR

IDLE (RCON<2>) PWRSAV #IDLE instruction POR ,BOR

BOR (RCON<1>) POR, BOR —

POR (RCON<0>) POR —

Note: All Rese t flag bit s can be set or cleared by us er software.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 61

PIC24HJ32GP202/204 and PIC24HJ16GP304

7.0 INTERRUPT CONTROLLER

The PIC24HJ32GP202/204 and PIC24HJ16GP304

interrupt controllers reduce the numerous peripheral

interrupt request signals to a single interrupt request

signal to the PIC24HJ32GP202/204 and

PIC24HJ16GP304 CPU.

It has the following features:

• Up to eight processor exceptions and software traps

• Seven user-selectable priority levels

• Interrupt Vector Table (IVT) with up to 118 vectors

• A unique vector for each interrupt or exception

source

• Fixed priority within a specified user priority level

• Alternate Interrupt Vector Table (AIVT) for debug

support

• Fixed interrupt entry and return latencies

7.1 Interrupt Vector Table

Figure 7-1 shows the Interrupt Vector Table. The IVT

resides in program memory, starting at location

000004h. The IVT contains 126 vectors consisting of

eight nonmaskable trap vectors and up to 118 sources

of interrupt. In general, each interrupt source has its

own v ector . Each interrupt ve ctor cont ains a 24 -bit wide

address. The value programmed into each interrupt

vector l ocation is th e starti ng address of the assoc iated

Interrupt Service Routine (ISR).

Interrupt vectors are prioritized in terms of their natural

priority; this priority is linked to their position in the

vector table. Lower addresses generally have a higher

natural priority. For example, the interrupt associated

with vector 0 will take priority over interrupts at any

other vector address.

PIC24HJ32GP202/204 and PIC24HJ16GP304 devices

implement up to 21 unique interrupts and 4

nonmaskable traps. These are summarized in

Table 7-1 and Ta ble 7-2.

7.1.1 ALTERNATE INTERR UPT VECTOR

TABLE

The Alternate Interrupt Vector Table (AIVT) is located

after the IVT, as shown in Figure 7-1. Access to the

AIVT is provided by the ALTIVT control bit

(INTCON2<15>). If the ALTIVT bit is set, all interrupt

and exception processes use the alternate vectors

inst ead of the defa ult vector s. The altern ate vectors a re

organized in the same manner as the default vectors.

The A IVT s up ports debugging b y providing a m ean s to

switch between an application and a support

environment without requiring the interrupt vectors to

be reprogram m ed. Th is featu re als o ena bl es s w itc hin g

between applications for evaluation of different

software algorithms at run time. If the AIVT is not

needed, the AIVT should be programmed with the

same addre sses used in the IVT.

7.2 Reset Sequence

A device Reset is not a true exception because the

interr upt control ler is not involved in the Rese t process .

The PIC24HJ32GP202/204 and PIC24HJ16GP304

device clear its registers in response to a Reset, which

forc es th e P C to ze ro. T he m ic r oc ont r o ll er the n be gi ns

the program execution at location 0x000000. The user

application can use a GOTO instruction at the Reset

address which redirects program execution to the

appropr iate start-up routine.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 6. Interrupts”

(DS70184) of the ”dsPIC33F/PIC24H

Family Reference Manual”, which is avai l-

able from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: Any unimplemented or unused vector

locations in the IVT and AIVT should be

programmed with the address of a default

interrupt handler routine that contains a

RESET instruction.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 62 Preliminary  2009 Microchip Technology Inc.

FIGURE 7-1: PIC24HJ32GP202/204 AND PIC24HJ16GP304 INTERRUPT VECTOR TABLE

Reset – GOTO Instruction 0x000000

Reset – GOTO Address 0x000002

Reserved 0x000004

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

Reserved

Interrupt Ve ctor 0 0x 000014

Interrupt Vector 1

Interrupt Vector 52 0x00007C

Interrupt Vector 53 0x00007E

Interrupt Vector 54 0x000080

Interrupt Vector 116 0x0000FC

Interrupt Vector 117 0x0000FE

Reserved 0x000100

Reserved 0x000102

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

Reserved

Interrupt Ve ctor 0 0x 000114

Interrupt Vector 1

Interrupt Vector 52 0x00017C

Interrupt Vector 53 0x00017E

Interrupt Vector 54 0x000180

Interrupt V ector 116

Interrupt Vector 117 0x0001FE

Start of Code 0x000200

Decreasing Natural Order Priority

Interrupt Vector Table (IVT)(1)

Alternate Interrupt Vector Table (AIVT)(1)

Note 1: See Table 7-1 for the list of implemented interrupt vectors.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 63

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 7-1: INTERRUPT VECTORS

Vector

Number

Interrupt

Request (IRQ)

Number IVT Address AIVT Address Interrupt Source

8 0 0x000014 0x000114 INT0 – External Interrupt 0

9 1 0x00001 6 0x000116 IC1 – Input Comp are 1

10 2 0x000018 0x000118 OC1 – Output Compare 1

11 3 0x00 001 A 0x 00 011A T1 – T i mer1

12 4 0x00001C 0x00011C Reserved

13 5 0x00001E 0x00011E IC2 – Input Capture 2

14 6 0x000020 0x000120 OC2 – Output Compare 2

15 7 0x000022 0x000 122 T2 – T i me r2

16 8 0x000024 0x000 124 T3 – T i me r3

17 9 0x000026 0x000126 SPI1E – SPI1 Error

18 10 0x000028 0x000128 SPI1 – SPI1 Transfer Done

19 11 0x00002A 0x00012A U1RX – UART1 Receiver

20 12 0x00002C 0x00012C U1TX – UART1 Transmitter

21 13 0x00002E 0x00012E ADC1 – ADC1

22 14 0x000030 0x000130 Reserved

23 15 0x000032 0x000132 Reserved

24 16 0x000034 0x000134 SI2C1 – I2C1 Slave Events

25 17 0x000036 0x000136 MI2C1 – I2C1 Master Events

26 18 0x000038 0x000138 Reserved

27 19 0x00003A 0x00013A Change Notification Interrupt

28 20 0x00003C 0x00013C INT1 – External Interrupt 1

29 21 0x00003E 0x00013E Reserved

30 22 0x000040 0x000140 IC7 – Input Capture 7

31 23 0x000042 0x000142 IC8 – Input Capture 8

32 24 0x000044 0x000144 Reserved

33 25 0x000046 0x000146 Reserved

34 26 0x000048 0x000148 Reserved

35 27 0x00004A 0x00014A Reserved

36 28 0x00004C 0x00014C Reserved

37 29 0x00004E 0x00014E INT2 – External Interrupt 2

38 30 0x000050 0x000150 Reserved

39 31 0x000052 0x000152 Reserved

40 32 0x000054 0x000154 Reserved

41 33 0x000056 0x000156 Reserved

42 34 0x000058 0x000158 Reserved

43 35 0x00005A 0x00015A Reserved

44 36 0x00005C 0x00015C Reserved

45 37 0x00005E 0x00015E Reserved

46 38 0x000060 0x000160 Reserved

47 39 0x000062 0x000162 Reserved

48 40 0x000064 0x000164 Reserved

49 41 0x000066 0x000166 Reserved

50 42 0x000068 0x000168 Reserved

51 43 0x00006A 0x00016A Reserved

52 44 0x00006C 0x00016C Reserved

53 45 0x00006E 0x00016E Reserved

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 64 Preliminary  2009 Microchip Technology Inc.

TABLE 7-2: TRAP VECTORS

54 46 0x000070 0x000170 Reserved

55 47 0x000072 0x000172 Reserved

56 48 0x000074 0x000174 Reserved

57 49 0x000076 0x000176 Reserved

58 50 0x000078 0x000178 Reserved

59 51 0x00007A 0x00017A Reserved

60 52 0x00007C 0x00017C Reserved

61 53 0x00007E 0x00017E Reserved

62 54 0x000080 0x000180 Reserved

63 55 0x000082 0x000182 Reserved

64 56 0x000084 0x000184 Reserved

65 57 0x000086 0x000186 Reserved

66 58 0x000088 0x000188 Reserved

67 59 0x00008A 0x00018A Reserved

68 60 0x00008C 0x00018C Reserved

69 61 0x00008E 0x00018E Reserved

70 62 0x000090 0x000190 Reserved

71 63 0x000092 0x000192 Reserved

72 64 0x000094 0x000194 Reserved

73 65 0x000096 0x000196 U1E – UART1 Error

74 66 0x000098 0x000198 Reserved

75 67 0x00009A 0x00019A Reserved

76 68 0x00009C 0x00019C Reserved

77 69 0x00009E 0x00019E Reserved

78 70 0x0000A0 0x0001A0 Reserved

79 71 0x0000A2 0x0001A2 Reserved

80-125 72-117 0x0000A4-0x0000FE 0x0001A4-0x0001FE Reserved

Vector Number IVT Address AIVT Address Trap Source

0 0x000004 0x000104 Reserved

1 0x000006 0x000106 Oscillator Failure

2 0x000008 0x00010 8 Address Error

3 0x00000A 0x0001 0A S tack Error

4 0x00000C 0x00010C Math Error

5 0x00000E 0x00010E Reserved

6 0x000010 0x000110 Reserved

7 0x000012 0x000112 Reserved

TABLE 7-1: INTERRUPT VECTORS (CONTINUED)

Vector

Number

Interrupt

Request (IRQ)

Number IVT Address AIVT Address Interrupt Source

 2009 Microchip Technology Inc. Preliminary DS70289F-page 65

PIC24HJ32GP202/204 and PIC24HJ16GP304

7.3 Interrupt Control and Status

Registers

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices implement a total of 17 registers for the

interrupt contro lle r:

• Interrupt Control Register 1 (INTCON1)

• Interrupt Control Register 2 (INTCON2)

• Interrupt Flag Status Registers (IFSx)

• Interrupt Enable Control Registers (IECx)

• Interrupt Priority Control Registers (IPCx)

• Interrupt Control and Status Register (INTTREG)

7.3.1 INTCON1 AND INTCON2

Global interrupt control functions are controlled from

INTCON1 and INTCON2. INTCON1 contains the

Interrupt Nesting Disable (NSTDIS) bit as well as the

control a nd s tatus flags fo r the proces sor trap sources.

The INTCON2 register controls the external interrupt

request signal behavior and the use of the Alternate

Interrupt Vector Table.

7.3.2 IFSx

The IFS registers maintain all the interrupt request

flags. Eac h source of inte rrupt has a st atus bi t, which is

set by th e resp ectiv e periph erals or exter nal si gnal an d

this is cleared via software.

7.3.3 IECx

The IEC reg ist ers maintain al l the interrup t ena ble bits .

These control bits are used individually to enable

interrupts from the peripherals or external signals.

7.3.4 IPCx

The IPC registers are used to set the interrupt priority

level for each source of interrupt. Each user interrupt

source can be assigned to one of the eight priority

levels.

7.3.5 INTTREG

The INTTREG register contains the associated

interrupt vector number and the new CPU interrupt

priority level, which are latched into vector number

(VECNUM<6:0>) and Interrupt level (ILR<3:0>) bit

fields in the INTTREG register. The new interrupt

priority level is the priority of the pending interrupt.

The interrupt sources are assigned to the IFSx, IECx

and IPCx reg ist ers in th e s ame sequenc e tha t they are

listed in Table 7-1. For example, the INT0 (External

Interrupt 0) is shown as having vector number 8 and a

natural order priority of 0. Thus, the INT0IF bit is found

in IFS0<0>, the IN T0IE b it in IEC0< 0>, a nd th e INT0 IP

bits in the first position of IPC0 (IPC0<2:0>).

7.3.6 STATUS REGISTERS

Although these are not specifically part of the interrupt

control hardware, two of the CPU Control registers

contain bits that control interrupt functionality:

• The CPU STATUS register, SR, contains the

IPL<2:0> bits (SR<7:5>). These bits indicate the

current CPU interrupt priority level. The user can

change th e curren t CPU prio rity lev el by wri ting to

the IPL bits.

• The CORCON register contains the IPL3 bit

which, together with IPL<2:0>, also indicates the

current CPU priority level. IPL3 is a read-only bit,

so that t r ap ev ent s c ann ot be m as ke d b y t he user

software.

All Interrupt registers are described in Register 7-1

through Register 7-19 in the following pages.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 66 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —DC

bit 15 bit 8

R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0

IPL2(2) IPL1(2) IPL0(2) RA N OV Z C

bit 7 bit 0

Legend:

C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’

S = Set only bit W = Writable bit -n = Value at POR

‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)

111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110 = CPU Interrupt Priority Level is 6 (14)

101 = CPU Interrupt Priority Level is 5 (13)

100 = CPU Interrupt Priority Level is 4 (12)

011 = CPU Interrupt Priority Level is 3 (11)

010 = CPU Interrupt Priority Level is 2 (10)

001 = CPU Interrupt Priori ty Level is 1 (9)

000 = CPU Interrupt Priori ty Level is 0 (8)

Note 1: For complete register details, see Register 3-1: “SR: CPU STATUS Register”.

2: The IPL<2: 0> b it s are con ca ten ated with the IPL<3 > bi t (CORCON<3 >) to form the CPU Interrup t Prio rity

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

3: The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 67

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 R/C-0 R/W-0 U-0 U-0

— — — — IPL3(2) PSV — —

bit 7 bit 0

Legend: C = Clea r only bit

R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set

0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’

bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2)

1 = CPU interrupt priority level is greater than 7

0 = CPU interrupt priority level is 7 or less

Note 1: For complete register details, see Register 3-2: “CORCON: CORE Control Register”.

2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 68 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

NSTDIS — — — — — — —

bit 15 bit 8

U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0

—DIV0ERR— MATHERR ADDRERR STKERR OSCFAIL —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 NSTDIS: Interrupt Nesting Disable bit

1 = Interrupt nesting is disabled

0 = Interrupt nesting is enabled

bit 14-7 Unimplemented: Read as ‘0’

bit 6 DIV0ERR: Arithmetic Error Status bit

1 = Math error trap was caused by a divide by zero

0 = Math error trap was not caused by a divide by zero

bit 5 Unimplemented: Read as ‘0’

bit 4 MATHERR: Arithmetic Error Status bit

1 = Math error trap has occurred

0 = Math error trap has not occurred

bit 3 ADDRERR: Address Error Trap Status bit

1 = Address error trap has occurred

0 = Address error trap has not occurred

bit 2 STKERR: Stack Error Trap Status bit

1 = Stack error trap has occurred

0 = Stack error trap has not occurred

bit 1 OSCFAIL: Oscillator Failure Trap Status bit

1 = Oscillator failure trap has occurred

0 = Oscillator failure trap has not occurred

bit 0 Unimplemented: Read as ‘0’

 2009 Microchip Technology Inc. Preliminary DS70289F-page 69

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0

ALTIVT DISI — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — INT2EP INT1EP INT0EP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit

1 = Use alternate vector table

0 = Use standard (default) vector table

bit 14 DISI: DISI Ins truc tio n Stat us bit

1 = DISI instru cti on is ac tiv e

0 = DISI instru cti on is not ac tiv e

bit 13-3 Unimplemented: Read as ‘0’

bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 70 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-4 Unimplemented: Read as ‘0’

bit 13 AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 8 T3IF: Timer3 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 7 T2IF: Timer2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 4 Unimplemented: Read as ‘0’

bit 3 T1IF: Timer1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

 2009 Microchip Technology Inc. Preliminary DS70289F-page 71

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 INT0IF: External Interrupt 0 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 72 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——INT2IF— — — — —

bit 15 bit 8

R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

IC8IF IC7IF — INT1IF CNIF — MI2C1IF SI2C1IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-4 Unimplemented: Read as ‘0’

bit 13 INT2IF: External Interrupt 2 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 12-8 Unimplemented: Read as ‘0’

bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 5 Unimplemented: Read as ‘0’

bit 4 INT1IF: External Interrupt 1 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 3 CNIF: Input Change Notification Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 2 Unimplemented: Read as ‘0’

bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

 2009 Microchip Technology Inc. Preliminary DS70289F-page 73

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — —U1EIF—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-2 Unimplemented: Read as ‘0’

bit 1 U1EIF: UAR T1 Error Interru pt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 74 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-4 Unimplemented: Read as ‘0’

bit 13 AD1IE: ADC1 Conversion Complete Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 10 SPI1IE: SPI1 Event Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 9 SPI1EIE: SPI1 Error Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 8 T3IE: Timer3 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 7 T2IE: Timer2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 4 Unimplemented: Read as ‘0’

bit 3 T1IE: Timer1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 75

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 INT0IE: External Interrupt 0 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 76 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——INT2IE— — — — —

bit 15 bit 8

R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

IC8IE IC7IE — INT1IE CNIE — MI2C1IE SI2C1IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 INT2IE: External Interrupt 2 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 12-8 Unimplemented: Read as ‘0’

bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 5 Unimplemented: Read as ‘0’

bit 4 INT1IE: External Interrupt 1 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 3 CNIE: Input Change Notification Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 2 Unimplemented: Read as ‘0’

bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 77

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — —U1EIE—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-2 Unimplemented: Read as ‘0’

bit 1 U1EIE: UART1 Error Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 78 Preliminary  2009 Microchip Technology Inc.

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— T1IP<2:0> — OC1IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— IC1IP<2:0> — INT0IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 IC1IP<2:0>: Input Captur e Channel 1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 79

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— T2IP<2:0> — OC2IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— IC2IP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 IC2IP<2:0>: Input Capture Channel 2 I nterrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 80 Preliminary  2009 Microchip Technology Inc.

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— U1RXIP<2:0> — SPI1IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— SPI1EIP<2:0> — T3IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 U1RXIP<2:0>: UAR T1 Re ce iver Interru pt Priority bit s

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 81

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— AD1IP<2:0> — U1TXIP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 82 Preliminary  2009 Microchip Technology Inc.

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

—CNIP<2:0>— — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— MI2C1IP<2:0> — SI2C1IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11-7 Unimplemented: Read as ‘0’

bit 6-4 MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 83

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— IC8IP<2:0> —IC7IP<2:0>

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0

— — — — — INT1IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Inter rupt Priori ty bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 IC7IP<2:0>: Input Captur e Chann el 7 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7-3 Unimplemented: Read as ‘0’

bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 84 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— INT2IP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

 2009 Microchip Technology Inc. Preliminary DS70289F-page 85

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— U1EIP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 86 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0

— — — —ILR<3:0>

bit 15 bit 8

U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

— VECNUM<6:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-12 Unimplemented: Read as ‘0’

bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits

1111 = CPU Interrupt Priority Level is 15

•

0001 = CPU Interrupt Priority Level is 1

0000 = CPU Interrupt Priority Level is 0

bit 7 Unimplemented: Read as ‘0’

bit 6-0 VECNUM<6:0>: Vector Number of Pending Interrupt bits

0111111 = Interrupt Vector pending is number 135

•

0000001 = Interrupt Vector pending is number 9

0000000 = Interrupt Vector pending is number 8

 2009 Microchip Technology Inc. Preliminary DS70289F-page 87

PIC24HJ32GP202/204 and PIC24HJ16GP304

7.4 Interrupt Setup Procedures

7.4.1 INITIALIZATION

To configure an interrupt source at initialization:

1. Set the NSTDIS bit (INTCON1<15>) if nested

interrupts are not desi red.

2. Select the user-assigned priority level for the

interrupt source by writing the control bits in the

appropriate IPCx register. The priority level will

depend on the specific application and type of

inter rupt source . If multipl e priority le vels are n ot

desired, the IPCx register control bits for all

enabled interrupt sources can be programmed

to the same non-zero value.

3. Clear the int errupt flag st atus bi t associa ted with

the peripheral in the associated IFSx register.

4. Set the interrupt enable control bit associated

with the source in the appropriate IECx register

to enable the interrupt source.

7.4.2 INTERRUPT SERVIC E ROUTINE

The method used to declare an Interrupt Service Rou-

tine (ISR) and initialize the IVT with the correct vector

address depends on the programming language (C or

Assembler) and the language development toolsuite

used to develop the application.

In gene ral , the us er a pp lic ati on m us t c le ar t he in terrupt

flag in the appropriate IFSx register for the source of

interrupt that the ISR handles. Otherwise, the program

will re-enter the ISR immediately after exiting the

routine. If the ISR is coded in assembly language, it

must be terminated using a RETFIE instruction to

unstack the saved PC value, SRL value and old CPU

priority level.

7.4.3 TRAP SERVICE ROUTINE

A Trap Service Routine (TSR) is coded like an ISR,

except that the appropriate trap status flag in the

INTCON1 register must be cleared to avoid re-entry

into the TSR.

7.4.4 INTERRUPT DISABLE

All user interrupts can be disabled using this proce-

dure:

1. Push the current SR value onto the software

stac k using the PUSH instructi on.

2. Force the CPU to priority level 7 by inclusive

ORing the value OEh with SRL.

To enable user interrupts, the POP instruction can be

used to restore the previous SR value.

The DISI instruction provides a convenient way to

disabl e interru pt s of priorit y levels 1-6 for a fixe d p eriod

of time. Level 7 interrupt sources are not disabled by

the DISI instruction.

Note: At a device Reset, t he IPCx reg ister s are

initialized such that all user interrupt

sources are assigned to priority level 4. Note: Only user interrupts with a priority level of

7 or lower can be disabled. Trap sources

(level 8-level 15) cannot be disabled.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 88 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 89

PIC24HJ32GP202/204 and PIC24HJ16GP304

8.0 OSCILLATOR CONFIGURATION The PIC24HJ32GP202/204 and PIC24HJ16GP304

oscillator system provides:

• External and internal oscillator options as clock

sources.

• An on-chip PLL to scale the internal operating

frequency to the required system clock frequency.

• An internal FRC oscillator that can also be used

with the PLL, thereby allowing full speed

operation without any external clock generation

hardware.

• Clock switching between various clock sources.

• Programm abl e c loc k pos t s ca ler for syst em power

savings.

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures.

• A Clock Control register (OSCCON).

• Nonvolatile Configuration bits for main oscillator

selection.

A simplified diagram of the oscillator system is shown

in Figure 8-1.

FIGURE 8-1: PIC24HJ32GP202/204 AND PIC24HJ16GP304 OSCILLATOR SYSTEM DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 7. Oscillator”

(DS70186) of the ”dsPIC33F/PIC24H

Family Reference Manual”, which is avai l-

able from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note 1: See Figure 8-2 for PLL details.

2: If the Oscillator is used with XT or HS modes, an external parallel resistor with the value of 1 MW must be connected.

Secondary Oscillator

LPOSCEN

SOSCO

Ti mer 1

XTPLL, HSPLL,

XT, HS, EC

FRCDIV<2:0>

WDT, PWRT,

FSCM

FRCDIVN

SOSC

FRCDIV16

ECPLL, FRCPLL

NOSC<2:0> FNOSC<2:0>

Reset

FRC

Oscillator

LPRC

Oscillator

DOZE<2:0>

S1/S3

FRC

LPRC

÷16

Clock Switch

Clock Fail

÷2

TUN<5:0>

PLL(1) FCY

FOSC

FRCDIV

DOZE

OSC2

OSC1 Primary Oscillator

R(2)

POSCMD<1:0>

SOSCI

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 90 Preliminary  2009 Microchip Technology Inc.

8.1 CPU Clocking System

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices provide the following seven system clock

options.

• Fast RC (FRC) Oscillator

• FRC Oscillator with PLL

• Primary (XT, HS or EC) Oscillator

• Primary Oscillator with PLL

• Secondary (LP) Oscillator

• Low-Power RC (LPRC) Oscillator

• FRC Osci lla tor wi th pos t s ca ler

8.1.1 SYSTEM CLOCK SOURCES

8.1.1.1 Fast RC

The Fas t RC (FRC) i nternal os cillator runs at a n ominal

frequency of 7.37 MHz. User software can tune the

FRC frequency. User software can optionally specify a

factor (ranging from 1:2 to 1:256) by which the FRC

clock frequency is divided. This fac tor is selec ted using

the FRCDIV<2:0> (CLKDIV<10:8>) bits.

8.1.1.2 Primary

The primary oscillator can use one of the following as

its clock source:

• Crystal (XT): Crystals and ceramic resonators in

the range of 3 MHz to 10 MHz. The crystal is

connected to the OSC1 and OSC2 pins.

• HS (High-Speed Crystal): Crystals in the range of

10 MHz to 40 MHz. The crystal is connected to

the OSC1 and OSC2 pins.

• EC (External Clock): The external clock signal is

directly applied to the OSC1 pin.

8.1.1.3 Secondary

The secondary (LP) oscillator is designed for low power

and uses a 32.768 kHz crystal or ceramic resonator.

The LP oscillator uses SOSCI and SOSCO pins.

8.1.1.4 Low-Power RC

The Low-Power RC (LPRC) internal oscIllator runs at a

nominal frequency of 32.768 kHz. It is also used as a

reference clock by the Watchdog Timer (WDT) and

Fail-Safe Clock Monitor (FSCM).

8.1.1.5 FRC

The clock signals generated by the FRC and primary

oscillators can be optionally applied to an on-chip

Phase Locked Loop (PLL) to provide a wide range of

output frequencies for device operation. PLL

configuration is described in Section 8.1.3 “PLL

Configuration”.

The FRC frequency depends on the FRC accuracy

(see Table 22-18) and the value of the FRC Oscillator

Tuning register (see Register 8-4).

8.1.2 SYSTEM CLOCK SELECTION

The oscillator source used at a device Power-on Reset

event is selected using Configuration bit settings. The

oscillator Configuration bit settings are located in the

Configuration registers in the program memory . (Refer to

Section 19.1 “Configuration Bits” for further details.)

The Initial Oscillator Selection Configuration bits,

FNOSC<2:0> (FOSCSEL<2:0>), and the Primary

Oscillator Mode Select Configuration bits,

POSCMD<1:0> (FOSC<1:0>), select the oscillator

source that is used at a Power-on Reset. The FRC

primary oscillator is the default (unprogrammed)

selection.

The Confi guration bit s allow users to ch oose among 12

diffe rent clock modes, shown in Table 8-1.

The output of the oscillator (or the output of the PLL if

a PLL mod e has bee n select ed) FOSC is d ivided by 2 to

generate the device instruction clock (FCY) and the

peripheral clock time base (FP). FCY defines the

operating speed of the device, and speeds up to 40

MHz are supported by the PIC24HJ32GP202/204 and

PIC24HJ16GP304 architecture.

Instruction execution speed or device operating

frequency, FCY, is given by:

EQUATION 8-1: DEVICE OPERATING

FREQUENCY

8.1.3 PLL CONFIGURATION

The primary oscillator and internal FRC oscillator can

optionally use on-chip PLL to obtain higher speeds of

operation. The PLL provides significant flexibility in

selecting the device operating speed. A block diagram

of the PLL is shown in Figure 8-2.

The outp ut of the p rimary os cillator or FRC, den oted as

‘FIN’ is divided down by a prescale factor (N1) of 2, 3,

... or 33 before it is be ing p rovi ded to th e PL L’ s Volt ag e

Controlled Oscilla tor (VCO). The input to the VCO must

be selected in the range of 0.8 MHz to 8 MHz. The

prescale factor ‘N1’ is selected using the

PLLPRE<4:0> bits (CLKDIV<4:0>).

The PLL Feedback Divisor, selected using the

PLLDI V<8:0> bit s (P LLFBD< 8:0>) , pro vid es a fact or ‘M’ ,

by which the input to the VCO is multiplied. This factor

must be selected such that the resulting VCO output

freq ue nc y is i n t he range o f 100 M H z to 2 00 M Hz.

The VCO o utput is furthe r divi ded by a pos ts cale f act or

‘N2.’ This factor is selected using the PLLPOST<1:0>

bits (C LKDI V<7:6 >). ‘N2’ can be 2, 4 or 8, and mus t b e

selected such that the PLL output frequency (FOSC) is

in the range of 12.5 MHz to 80 MHz, which generates

device operating speeds of 6.25-40 MIPS.

FCY FOSC

-------------

 2009 Microchip Technology Inc. Preliminary DS70289F-page 91

PIC24HJ32GP202/204 and PIC24HJ16GP304

For a primary oscillator or FRC oscillator, output ‘FIN’,

the PLL output ‘FOSC’ is given by:

EQUATION 8-2: FOSC CALCULATION

For example, when a 10 MHz crystal is bein g used, with

“XT with PLL” being the selected oscillator mode.

• If PLLPRE<4:0> = 0, then N1 = 2. This yields a

VCO input of 10/2 = 5 MHz, which is within the

acceptable range of 0.8-8 MHz.

• If PLLDIV<8:0> = 0x1E, then M = 32. This yields a

VCO output of 5 x 32 = 160 MHz, which is within

the 100 MHz to 200 MHz range, which is needed.

• If PLLPOST<1:0 > = 0, then N2 = 2 . Th is pro vi des

a Fosc of 160/2 = 80 MHz. The resultant device

operating speed is 80/2 = 40 MIPS.

EQUATION 8-3: XT WITH PLL MODE

EXAMPLE

FIGURE 8-2: PIC24HJ32GP 202 /204 AND PIC24HJ16GP304 PLL BLOCK DIAGRAM

TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

FOSC FIN M

N1N2

-------------------





=

FCY FOSC

------------- 1

---10000000 32

22

----------------------------------





40 MIPS===

Oscillato r Mode Oscilla tor Source POSCMD<1:0> FNOSC<2:0> Note

Fast RC Oscillator with Divide-by-N

(FRCDIVN) Internal xx 111 1, 2

Fast RC Oscillator with Divide-by-16

(FRCDIV16) Internal xx 110 1

Low-Power RC Oscillator (LPRC) Internal xx 101 1

Secondary (Timer1) Oscillator (SOSC) Secondary xx 100 1

Primary Oscillator (HS) with PLL

(HSPLL) Primary 10 011 —

Primary Oscillator (XT) with PLL

(XTPLL) Primary 01 011 —

Primary Oscillator (EC) with PLL

(ECPLL) Primary 00 011 1

Primary Oscillator (HS) Primary 10 010 —

Primary Oscillator (XT) Primary 01 010 —

Primary Oscillator (EC) Primary 00 010 1

Fast RC Oscillator with PLL (FRCPLL) Internal xx 001 1

Fast RC Oscillator (FRC) Internal xx 000 1

Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit.

2: This is the default oscillator mode for an unprogrammed (erased) device.

0.8-8.0 MHz

Here(1) 100-200 MHz

Here(1)

Divide by

2, 4, 8

Divide by

2-513

Divide by

2-33

Source (Crystal, External Clock PLLPRE XVCO

PLLDIV

PLLPOST

or Internal RC)

12.5-80 MHz

Here(1)

FOSC

Note 1: This frequency range must be satisfied at all times.

FVCO

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 92 Preliminary  2009 Microchip Technology Inc.

U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y

—COSC<2:0>—NOSC<2:0>

(2)

bit 15 bit 8

R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 R/W-0 R/W-0

CLKLOCK IOLOCK LOCK —CF — LPOSCEN OSWEN

bit 7 bit 0

Legend: y = Value set from Configuration bits on POR C = Clear only bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only)

000 = Fast RC oscillator (FRC)

001 = Fast RC oscillator (FRC) with PLL

010 = Primary oscillator (XT, HS, EC)

011 = Primary oscillator (XT, HS, EC) with PLL

100 = Secondary oscillator (SOSC)

101 = Low-Power RC oscillator (LPRC)

110 = Fast RC oscillator (FRC) with Divide-by-16

111 = Fast RC oscillator (FRC) with Divide-by-n

bit 11 Unimplemented: Read as ‘0’

bit 10-8 NOSC<2:0>: New Oscillato r Selecti on bits(2)

000 = Fast RC oscillator (FRC)

001 = Fast RC oscillator (FRC) with PLL

010 = Primary oscillator (XT, HS, EC)

011 = Primary oscillator (XT, HS, EC) with PLL

100 = Secondary oscillator (SOSC)

101 = Low-Power RC oscillator (LPRC)

110 = Fast RC oscillator (FRC) with Divide-by-16

111 = Fast RC oscillator (FRC) with Divide-by-n

bit 7 CLKLOCK: Clock Lock Enable bit

If clock switching is enabled and FSCM is disabled (FOSC<FCKSM> = 0b01)

1 = Clock switching is disabled, system clock source is locked

0 = Clock switching is enabled, system clock source can be modified by clock switching

bit 6 IOLOCK: Peripheral Pin S elect Lock bit

1 = Peripherial Pin Select is locked, write to peripheral pin select register is not allowed

0 = Peripherial Pin Select is unlocked, write to peripheral pin select register is allowed

bit 5 LOCK: PLL Lock Status bit (read-o nly)

1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied

0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled

bit 4 Unimplemented: Read as ‘0’

Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70227) in the

“PIC24H Family Reference Manual” (available from the Microchip website) for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in either direction. In these instances, the application must switch to FRC mode

as a transition clock s ource betw een the two PL L modes .

 2009 Microchip Technology Inc. Preliminary DS70289F-page 93

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 3 CF: Clock Fail Detect bit (read/clear by application)

1 = FSCM has detected clock failure

0 = FSCM has not detected clock failure

bit 2 Unimplemented: Read as ‘0’

bit 1 LPOSCEN: Secondary (LP) Oscill ator Enable bit

1 = Enable secondary oscillator

0 = Disable secondary oscillator

bit 0 OSWEN: Oscillator Switch Enable bit

1 = Request oscillator switch to selection specified by NOSC<2:0> bits

0 = Oscillator switch is complete

Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70227) in the

“PIC24H Family Reference Manual” (available from the Microchip website) for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in either direction. In these instances, the application must switch to FRC mode

as a transition clock source between the two PL L modes .

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 94 Preliminary  2009 Microchip Technology Inc.

R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0

ROI DOZE<2:0> DOZEN(1) FRCDIV<2:0>

bit 15 bit 8

R/W-0 R/W-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PLLPOST<1:0> — PLLPRE<4:0>

bit 7 bit 0

Legend: y = Value set from Configuration bits on POR

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ROI: Recover on Interrupt bit

1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1

0 = Interrupts have no effect on the DOZEN bit

bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits

000 = FCY/1

001 = FCY/2

010 = FCY/4

011 = FCY/8 (d efault)

100 = FCY/16

101 = FCY/32

110 = FCY/64

111 = FCY/128

bit 11 DOZEN: DOZE Mode Enab le bit(1)

1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks

0 = Processor clock/peripheral clock ratio forced to 1:1

bit 10-8 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits

000 = FRC divide by 1 (default)

001 = FRC divide by 2

010 = FRC divide by 4

011 = FRC divide by 8

100 = FRC divide by 16

101 = FRC divide by 32

110 = FRC divide by 64

111 = FRC divide by 256

bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)

00 = Output/2

01 = Output/4 (default)

10 = Reserved

11 = Output/8

bit 5 Unimplemented: Read as ‘0’

bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)

00000 = Input/2 (default)

00001 = Input/3

•

11111 = Input/33

Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 95

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —PLLDIV<8>

bit 15 bit 8

R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0

PLLDIV<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-9 Unimplemented: Read as ‘0’

bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)

000000000 = 2

000000001 = 3

000000010 = 4

•

000110000 = 50 (default)

•

111111111 = 513

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 96 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— TUN<5:0>(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-6 Unimplemented: Read as ‘0’

bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1)

011111 = Center frequency + 11.625% (8.23 MHz)

011110 = Center frequency + 11.25% (8.20 MHz)

•

000001 = Center frequency + 0.375% (7.40 MHz)

000000 = Center frequency (7.37 MHz nominal)

111111 = Center frequency - 0.375% (7.345 MHz)

•

100001 = Center frequency - 11.625% (6.52 MHz)

100000 = Center frequency - 12% (6.49 MHz)

Note 1: OSCTUN functionality has been provided to help customers compensate for temperature effects on the

FRC freq uency o ver a w ide range of temp eratures. T he tuning step s ize is an approxim ation an d is ne ither

characterized nor tested.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 97

PIC24HJ32GP202/204 and PIC24HJ16GP304

8.2 Clock Switching Operation

Applications are free to switch among any of the four

clock sources (Primary, LP, FRC and LPRC) under

software control at any time. To limit the possible side

effects of this flexibility, PIC24HJ32GP202/204 and

PIC24HJ 16G P30 4 dev ic es hav e a saf egu ard lo ck bui lt

into the switch process.

8.2.1 ENABLING CLOCK SWITCHING

To enable clock switching, the FCKSM1 Configuration

bit in the Configuration register must be programmed to

‘0’. (Refer to Section 19.1 “Configuration Bits” for

further details.) If the FCKSM1 Configuration bit is

unprogrammed (‘1’), the clock switching function and

Fail-Safe Clock Monitor function are disabled. This is

the default setting.

The NOSC control bits (OSCCON<10:8>) do not

control the clock selection when clock switching is

disabled. However , the COSC bit s (OSCCON<14:12>)

reflect the clock source selected by the FNOSC

Configuration bits.

The OSWEN control bit (OSCCON<0>) has no effect

when clock switching is disabled. It is held at ‘0’ at all

times.

8.2.2 OSCILLATOR SW ITCHING

SEQUENCE

Performing a clock switch requires the following basic

sequence:

1. Read the COSC bits (OSCCON<14:12>) to

determine the current oscillator source, if

desired.

2. Perform the unlock sequence to allow a write to

the OSCCON register high byte.

3. Write the ap propria te val ue to th e NOSC co ntrol

bits (OSCCON<10:8>) for the new oscillator

source.

4. Perform the unlock sequence to allow a write to

the OSCCON register low byte.

5. Set the OSWEN bit to initiate the oscillator

switch.

Once the basic sequence is completed, the system

clock hardware responds automatically as follows:

1. The clock switching hardware compares the

COSC status bits with the new value of the

NOSC con trol bits. If bo th of them are the s ame,

the cloc k switch is a redundant op eration. In thi s

case, the OSWEN bit is cleared automatically

and the clock switch is aborted.

2. If a valid clock switch has been initiated, the

LOCK (OSCCON<5>) and the CF

(OSCCON< 3>) st a tus bit s are cl eare d.

3. The new oscillator is turned on by the hardware

if it is not currently running. If a crystal oscillator

has to be turn ed on, the hardwa re waits un til the

Oscillator Start-up Timer (OST) expires. If the

new so urce is using th e PLL, the hardw are waits

until a PLL lock is detected (LOCK = 1).

4. The hardware w aits for 10 clock cycle s fro m the

new clock source and then performs the clock

switch.

5. The hardw are c lears the OSWEN bit to i ndicat e a

successful clock transition. In addition, the NOSC

bit valu es are transf erred to the COSC st atus bits .

6. The old clock source is turned off at this time,

with the exception of LPRC (if WDT or FSCM

are enabled) or LP (if LPOSCEN remains set).

8.3 Fail-Safe Clock Monitor (FSCM)

The Fail-Saf e Cl oc k Mo nito r (FSCM) all ow s the devic e

to conti nue to o pe rate eve n in th e even t of an oscil lator

failure. The FSCM function is enabled by programming.

If the FSCM function is enabled, the LPRC internal

oscillator runs at all times (except during Sleep mode)

and is not subject to control by the Watchdog Timer.

In the event of an oscillator failure, the FSCM

generates a clock failure trap event and switches the

system clock over to the FRC oscillator. Then the

application program can either attempt to restart the

oscillator or execute a controlled shutdown. The trap

can be treated as a warm Reset by simply loading the

Reset address into the oscillator fail trap vector.

If the PLL multiplier is used to scale the system clock,

the internal FRC is also multiplied by the same factor

on clock failure. Essentially, the device switches to

FRC with PLL on a clock failure.

Note: Primary Oscillator mode has three different

submodes (XT, HS and EC), which are

determined by the POSCMD<1:0>

Configuration bits. While an application

can switch to and from Primary Oscillator

mode i n s oft wa re , it c an no t swi t ch am ong

the different primary submodes without

reprogram mi ng the devic e.

Note 1: The proc esso r con tinues to e xecut e cod e

throughou t the c lock swit ching se quence.

Timing-sensitive code should not be

executed during this time.

2: Direct clock switches between any primary

oscillator mode with PLL and FRCPLL

mode are not permitted. This applies to

clock switches in either direction. In these

instances, the application must switch to

FRC mode as a transition clock source

between the two PLL modes.

3: Refer to Section 7. “Oscillator”

(DS70227) in the “PIC24H Family Refer-

ence Manual” for detail s.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 98 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 99

PIC24HJ32GP202/204 and PIC24HJ16GP304

9.0 POWER-SAVING FEATURES

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices provide the ability to manage power

consumption by selectively managing clocking to the

CPU and the peripherals. In general, a lower clock

frequency and a reduction in the number of circuits

being clocked constitutes lower consumed power.

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices can manage power consumption in four

different ways:

• Clock frequency

• Instruction-based Sleep and Idle modes

• Software-controlled Doze mode

• Selective peripheral control in software

Combinations of the above methods can be used to

selectively customize an application’s power

consumption while still maintaining critical application

features, such as timing-sensitive communications.

9.1 Clock Frequency and Clock

Switching

PIC24HJ32GP202/204 and PIC24HJ16GP304 devices

allow a wide range of clock frequencies to be selected

under application control. If the system clock

configuration is not locked, users can choose

low-power or high-precision oscillators by simply

changing the NOSC bits (OSCCON<10:8>). The

process of changing a system clock during operation,

as well as limitations to the process, are discussed in

more detail in Section 8.0 “Oscillator

Configuration”.

9.2 Instruction-Based Power-Saving

Modes

PIC24HJ32GP202/204 and PIC24HJ16GP304 dev ices

have tw o sp ecial power-s aving mode s that are en tered

through the execution of a special PWRSAV instru ct i on.

Sleep mode stops clock operation and halts all code

execution. Idle mode halts the CPU and code

execution, but allows peripheral modules to continue

operatio n. Example 9-1 shows th e Assembler s yntax of

the PWRSAV instruction.

Sleep and Idle modes can be exited as a result of an

enabled interrupt, WDT time-out or a device Reset. When

the device exits these modes, it is said to wake-up.

9.2.1 SLEEP MODE

In the Sleep mode,

• The system cloc k source is shut down . If an

on-chip oscillator is us ed, it is turned off.

• The device current consumption is reduced to a

minimum, provided that no I/O pin is sourcing

current.

• The Fail-Safe Clock Monitor does not operate,

since the sy ste m clo ck sourc e is dis ab led .

• The LPRC clock continues to run if the WDT is

enabled.

• The WDT, if enabled, is automatically cleared

prior to entering Sleep mode.

• Some device featu res or p eripherals may continu e

to operate. This includes items such as the input

change notification on the I/O port s , o r peripherals

that use an external clock in put.

• Any peripheral that requires the system clock

source for it s ope rati on is dis ab led .

The device will wake-up from Sleep mode on any of

these events:

• Any interrupt source that is individually enabled

• Any form of device Reset

• A WDT time-out

On wake-up from Sleep mode, the processor restarts

with the same clock source that was active when Sleep

mode was entered.

EXAMPL E 9-1: PWRSAV INSTRUCTION SYNTAX

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 9. Watchdog Timer

and Pow er Sa ving s M od es” (D S7 019 6)

of the ”dsPIC33F/PIC24H Family Refer-

ence Manual”, which i s av ailabl e from th e

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: SLEEP_MODE and IDLE_MODE are

constants defined in the assembler

include file for the selected device.

PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode

PWRSAV #IDLE_MODE ; Put the device into IDLE mode

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 100 Preliminary  2009 Microchip Technology Inc.

9.2.2 IDLE MODE

The following occur in Idle mode:

• The CPU stops executing instructions.

• The WDT is automatically cleared.

• The system clock source remains active. By

default, all peripheral modules con tinue to operate

normally from the system clock source, but can

also be selectively disabled (see Section 9.4

“Peripheral Mod ule Disab le” ).

• If the WDT or FSCM is enabled, the LPRC also

remains active.

The device will wake from Idle mode on any of these

events:

• Any interrupt that is individually enabled.

• Any device Reset

• A WDT time-out

On wake-up from Idle mode, the clock is reapplied to

the CPU and instruction execution will begin

(2-4 cycles la t e r), s tart i ng wi th t h e ins t r uc tio n f o l low i ng

the PWRSAV instruction, or the first instruction in the

ISR.

9.2.3 INTERRUPTS COINCIDENT WITH

POWER SAVE INSTRUCTIONS

Any interrupt that coincides with the execution of a

PWRSAV instruction is held off until entry into Sleep or

Idle mode is completed. The device then wakes up

from Sleep or Idle mode.

9.3 Doze Mode

The preferred strategies for reducing power

consumption are changing clock speed and invoking

one of the power-saving modes. In some

circumstances, however, these are not practical. For

example, it may be necessary for an application to

maintain uninterrupted synchronous communication,

even while it is doing nothing else. Reducing system

clock speed can introd uce commu nication errors, whil e

usin g a pow er-sav ing mod e can s top comm unica tions

completely.

Doze mode is a simple an d effective alternat ive method

to reduce power consumption while the device is still

executing code. In this mode, the system clock

continues to operate from the same source and at the

same speed. Peripheral modules continue to be

clock ed at the sam e speed, w hile the CPU c lock spee d

is reduced. Synchronization between the two clock

domains is maintained, allowing the peripherals to

access the SFRs while the CPU executes code at a

slower rate.

Doze mode is enabled by setting the DOZEN bit

(CLKDIV<11>). The ratio between peripheral and core

clock speed is determined by the DOZE<2:0> bits

(CLKDIV<14:12>). There are eight possible

configurations, from 1:1 to 1:128, with 1:1 being the

default set ti ng.

Programs can use Doze mode to selectively reduce

power consumption in event-driven applications. This

allows clock-sensitive functions, such as synchronous

communications, to continue without interruption while

the CPU idles, waiting for something to invoke an

interrupt routine. An auto matic return to ful l-speed CPU

operation on interrupts can be enabled by setting the

ROI bit (CLKDIV<15>). By default, interrupt events

have no effect on Doze mode operation.

For example, suppose the device is operating at

20 MIPS and the CAN modu le has bee n co nfigure d for

500 kbps based on this device operating speed. If the

device is placed in Doze mode with a clock frequency

ratio of 1:4, the CAN modu le continues to communicate

at the required bit rate of 500 kbps, but the CPU now

starts executing instructions at a frequency of 5 MIPS.

9.4 Peripheral Module Disable

The Peripheral Module Disable (PMD) registers

provide a method to disable a peripheral module by

stopping all clock sources supplied to that module.

When a peripheral is disabled using the appropriate

PMD control bit, the peripheral is in a minimum power

consumption state. The control and status registers

associated with the peripheral are also disabled. So

writes to those registers will have no effect and read

values will be invalid.

A peripheral module is enabled only if both the

associated bit in the PMD register are cleared and the

peripheral is supported by the specific PIC24H variant.

If the per ipheral is prese nt in the devi ce, it is e nabled in

the PMD register by default.

Note: If a PMD bit is set, the corresponding

module is disabled after a delay of one

instruction cycle. Similarly, if a PMD bit is

cleared, the corresponding module is

enabled after a delay of one instruction

cycle (assuming the module control

registers are already configured to enable

module operation).

 2009 Microchip Technology Inc. Preliminary DS70289F-page 101

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0

—— T3MD T2MD T1MD — — —

bit 15 bit 8

R/W-0 U-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0

I2C1MD —U1MD— SPI1MD ——AD1MD

(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 T3MD: Timer3 Module Disable bit

1 = Timer3 module is disabled

0 = Timer3 module is enabled

bit 12 T2MD: Timer2 Module Disable bit

1 = Timer2 module is disabled

0 = Timer2 module is enabled

bit 11 T1MD: Timer1 Module Disable bit

1 = Timer1 module is disabled

0 = Timer1 module is enabled

bit 10-8 Unimplemented: Read as ‘0’

bit 7 I2C1MD: I2C1 Module Disable bit

1 = I2C1 module is disabled

0 = I2C1 module is enabled

bit 6 Unimplemented: Read as ‘0’

bit 5 U1MD: UART1 Module Disable bit

1 = UART1 module is disabled

0 = UART1 module is enabled

bit 4 Unimplemented: Read as ‘0’

bit 3 SPI1MD: SPI1 Module Disable bit

1 = SPI1 module is disabled

0 = SPI1 module is enabled

bit 2-1 Unimplemented: Read as ‘0’

bit 0 AD1MD: ADC1 Module Disable bit(1)

1 = ADC1 module is disabled

0 = ADC1 module is enabled

Note 1: PCFGx bits have no effect if the ADC module is disabled by setting this bit. In this case, all port pins

multipl ex ed with ANx wi ll be in Digital mode.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 102 Preliminary  2009 Microchip Technology Inc.

R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

IC8MD IC7MD — — — —IC2MDIC1MD

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

— — — — — —OC2MDOC1MD

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 IC8MD: Input Capture 8 Module Disable bit

1 = Input Capture 8 module is disabled

0 = Input Capture 8 module is enabled

bit 14 IC7MD: Input Capture 2 Module Disable bit

1 = Input Capture 7 module is disabled

0 = Input Capture 7 module is enabled

bit 13-10 Unimplemented: Read as ‘0’

bit 9 IC2MD: Input Capture 2 Module Disable bit

1 = Input Capture 2 module is disabled

0 = Input Capture 2 module is enabled

bit 8 IC1MD: Input Capture 1 Module Disable bit

1 = Input Capture 1 module is disabled

0 = Input Capture 1 module is enabled

bit 7-2 Unimplemented: Read as ‘0’

bit 1 OC2MD: Output Compare 2 Module Disable bit

1 = Output Compare 2 module is disabled

0 = Output Compare 2 module is enabled

bit 0 OC1MD: Output Compare 1 Module Disable bit

1 = Output Compare 1 module is disabled

0 = Output Compare 1 module is enabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 103

PIC24HJ32GP202/204 and PIC24HJ16GP304

10.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared among the peripher als and the

parallel I/O ports. All I/O input ports feature Schmitt

Trigger inputs for improved noise immunity.

10.1 Parallel I/O (PIO) Ports

A parallel I/O port that shares a pin with a peripheral is

generally subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has own ership of the outp ut dat a and co ntrol si gn als of

the I/O pin. The logic also prevents “loop through”, in

which a port’s digital output can drive the input of a

periphera l that shares the same pin. Figure 10-1 shows

how ports are shared with other peripherals and the

associated I/O pin to which they are connected.

When a peripheral is enabled and the peripheral is

active ly driv ing an a ss oc iat ed pin, the use of the pi n as

a general purpose output pin is disabled. The I/O pin

can be read, but the output driver for the parallel port bit

is disabled. If a periphe ral is enabled, but the peripheral

is not actively driving a pin, that pin can be driven by a

port.

All port pins have three registers directly associated

with their operation as digital I/O. The data direction

or an output. If the data direction bit is ‘1’, then the pin

is an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx) read the latch.

Wr ite s to the la tch , wri te th e lat ch . Reads from the po rt

(PORTx) read the port pins, while writes to the port pins

write the latch.

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabl ed. Th is mean s that the co rrespon ding LATx and

TRISx registers and the port pin will read as zeros.

When a pin is shared with another peripheral or

function that is defined as an input only, it is

nevertheless regarded as a dedicated port because

there is no other competing source of outputs.

FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a

comprehensive reference source. To

complement the information in this data

sheet, refer to “Section 10. I/O Ports”

(DS70193) of the ”dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

WR LAT +

TRIS Latch

I/O Pin

WR Port

Data Bus

Data Latch

Read Port

Read TRIS

WR TRIS

Peripheral Output Data Output Enable

Peripheral Input Data

I/O

Peripheral Module

Peripheral Output Enable

PIO Modul e

Output Multipl exers

Output Data

Input Data

Peripheral Module Enable

Read LAT

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 104 Preliminary  2009 Microchip Technology Inc.

10.2 Open-Drain Configuration

In addition to the PORT, LAT and TRIS registers for

data control, some port pins can also be individually

configu red for eithe r digital or open-drai n output . This is

controlled by the Open-Drain Control register, ODCx,

associated with each port. Setting any of the bits con-

figures the corresponding pin to act as an open-drain

output.

The open-drain feature allows the generation of

outputs higher than VDD (e.g., 5V) on any desired 5V

tolerant pins by using external pull-up resistors. The

maximum open-drain voltage allowed is the same as

the maximum VIH specificati on .

See “Pin Diagrams” for the available pins and their

functionality.

10.3 Configuring Analog Port Pins

The AD1PCFG and TRIS registers control the

operation of the analog-to-digital (A/D) port pins. The

port pins that are desired as analog inputs must have

their corresponding TRIS bit set (input). If the TRIS bit

is clear ed (output), the digi tal outp ut le vel (VOH or VOL)

will be converted.

The AD1PCFGL register ha s a default value of 0x0000;

therefore, all pins that share ANx functions are analog

(not digital) by default.

When the POR T registe r is rea d, all pi ns co nfi gure d a s

analog in put channels will rea d as cleared (a low le vel).

Pins configured as digital inputs will not convert an

analog i nput. Analog leve ls on any pin that is defined as

a digital input (including the ANx pins) can cause the

input buffer to consume current that exceeds the

device specifications.

10.4 I/O Port Write/Read Timing

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically this instruction

would be a NOP. An exampl e is sho wn in Exam ple 10-1.

10.5 Input Change Noti fication

The input change notification function of the I/O ports

allows the PIC24HJ32GP202/204 and

PIC24HJ16GP304 devices to generate interrupt

requests to the processor in response to a

change-of-state on selected input pins. This feature

can detec t input ch ange-o f-st ates eve n in Sleep mode,

when th e clocks are d isabled. D epending on t he device

pin count, up to 31 external signals (CNx pin) can be

selected (enabled) for generating an interrupt request

on a c hange-o f-state.

Four control registers are associated with the CN

module . The C NEN1 and CN EN 2 reg isters contai n th e

interrupt enable control bits for each of the CN input

pins. Setting any of these bits enables a CN interrupt

for the corresponding pins.

Each CN pin also has a weak pull-up connected to it.

The pull-ups act as a current source connected to the

pin, and eliminate the need for external resistors when

push button or keypad devices are connected. The

pull-ups are enabled separately using the CNPU1 and

CNPU2 registers, which contain the control bits for

each of the CN pins. Setting any of the control bits

enables the weak pull-ups for the corresponding pins.

EXAMPLE 10-1: PORT WRITE/READ EXAMPLE

Note: Pull-ups on change notification pins

should always be disabled when the port

pin is configured as a digital output.

MOV 0xFF00, W0 ; Configure PORTB<15:8> as inputs

MOV W0, TRISBB ; and PORTB<7:0> as output s

NOP ; Delay 1 cycle

btss PORTB, #13 ; Next Instruction

 2009 Microchip Technology Inc. Preliminary DS70289F-page 105

PIC24HJ32GP202/204 and PIC24HJ16GP304

10.6 Peripheral Pin Select

A major challenge in general purpose devices is

providi ng the large st possib le set of pe ripheral fea tures

while minimizing the conflict of features on I/O pins.

The challenge is even greater on low-pin count

devices. In an application where more than one

peripheral must be assigned to a single pin, inconve-

nient workarounds in application code or a complete

redesign may be the only option.

Peripheral pin select configuration enables peripheral

set selection and placement on a wide range of I/O

pins. By increasing the pinout options available on a

particular device, programmers can better tailor the

microcontroller to their entire application, rather than

trimming the application to fit the device.

The peripheral pin select configuration feature

operates over a fixed subset of digital I/O pins.

Programmers can independently map the input and/or

output of most digital peripherals to any one of these

I/O pins. Peripheral pin sel ect is performed in softwa re,

and generally does not require the device to be

reprogrammed. Hardware safegua rds are included that

prevent accidental or spurious changes to the

peripheral mapping, once it has been established.

10.6.1 AVAILABLE PINS

The peripheral pin select feature is used with a range

of up to 26 pi ns. Th e num ber o f ava ilable pins dep ends

on the particular device and its pin count. Pins that

support the peripheral pin select feature include the

designation “RPn” in their full pin designation, where

“RP” designat es a remappab le peripheral and “n” is the

remappable pin number.

10.6.2 C ONT RO LLIN G PERIP HERA L PIN

SELECT

Peripheral pin select features are controlled through

two sets of special function registers to map

peripherals and to map outputs.

Since they are separately controlled, a particular

periphera l’s input and output (if the peripheral has both)

can be placed on any selectable function pin without

constraint.

The association of a peripheral to a peripheral

selectable pin is handled in two different ways,

depending on whether an input or output is being

mapped.

10.6.2.1 Input Mapping

The inputs of the peripheral pin select options are

mapped on the basis of the peripheral. A control

will be mapped to. The RPINRx registers are used to

configure peripheral input mapping (see Register 10-1

through Register 10-9). Each register contains sets of

5-bit fields, with each set associated with one of the

remappable peripherals. Programming a given

peripheral’s bit field with an appropriate 5-bit value

map s the RPn pin with t hat value to that pe riphera l. For

any given device, the valid range of values for any bit

field corresponds to the maximum number of peripheral

pin select ions supported by t he device .

Figure 10-2 Illustrates remappable pin selection for

U1RX input.

FIGURE 10-2: REMAPPABLE MUX

INPUT FOR U1RX

Note: For i npu t m ap pi ng onl y, the Per iph eral Pi n

Select (PPS) functionality does not have

priority over the TRISx settings. Therefore,

when configuring the RPn pin for input, the

corresponding bit in the TRISx register

must also be configured for input (i.e., set

to ‘1’).

RP0

RP1

RP2

U1RX input

U1RXR<4:0>

to peripheral

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 106 Preliminary  2009 Microchip Technology Inc.

TABLE 10-1: REMAPPABLE PERIPHERAL INPUTS(1)

10.6.2.2 Output Mapping

In contrast to inputs, the outputs of the peripheral pin

select options are mapped on the basis of the pin. In

this case, a control register associated with a particular

pin dictates the peripheral output to be mapped. The

RPORx registers are used to control output mapping.

Like t h e RP IN Rx r egi st ers , ea ch re gi ste r conta in s se ts

of 5-bit fields, with each set associated with one RPn

pin (see Register 10-10 through Register 10-22). The

value of the bit field corresponds to one of the periph-

erals, and that peri pheral’ s out put i s m app ed to the pin

(see Table 1 0-2 and Figure 10-3).

The lis t of perip he rals for output m appin g also in clude s

a null value of 00000 because of the mapping

technique. This permits any given pin to remain

unconnected from the output of any of the pin

selectable peripherals.

FIGURE 10-3: MULTIPLEXING OF

REMAPPABLE OUTPUT

FOR RPn

Input Name Function Name Register Configuration

Bits

External Interrupt 1 INT1 RPINR0 INT1R<4:0>

External Interrupt 2 INT2 RPINR1 INT2R<4:0>

Timer 2 External Clock T2CK RPINR3 T2CKR<4:0>

Timer 3 External Clock T3CK RPINR3 T3CKR<4:0>

Input Capture 1 IC1 RPINR7 IC1R<4:0>

Input Capture 2 IC2 RPINR7 IC2R<4:0>

Input Capture 7 IC7 RPINR10 IC7R<4:0>

Input Capture 8 IC8 RPINR10 IC8R<4:0>

Output Compare Fault A OCFA RPINR11 OCFAR<4:0>

UART 1 Receive U1RX RPINR18 U1RXR<4:0>

UART 1 Clear To Send U1CTS RPINR18 U1CTSR<4:0>

SPI 1 Data Input SDI1 RPINR20 SDI1R<4:0>

SPI 1 Clock Input SCK1IN RPIN R20 SCK1R<4:0>

SPI 1 Slave Select Input SS1IN RPINR21 SS1R<4:0>

Note 1: Unless otherwise noted, all inputs use the Schmitt input buffers.

RPnR<4:0>

Default

U1TX Output Enable

U1RTS Output Enable 4

OC1 Output Enable

Default

U1TX Output

U1RTS Output 4

OC2 Output

OC1 Output

Output Enable

Output Data RPn

OC2 Output Enable

 2009 Microchip Technology Inc. Preliminary DS70289F-page 107

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 10-2: OUTPUT SELECTION FOR REMAPPABLE PIN (RPn)

10.6.3 CONTRO LLIN G CON FIGURATIO N

CHANGES

Because periphe ral rem ap pin g ca n be c hanged durin g

run time, some restrictions on peripheral remapping

are needed to prevent accidental configuration

changes. PIC24H devices include three features to

prevent alterations to the peripheral map:

• Control register lock sequence

• Contin uou s stat e monitoring

• Configuration bit pin select lock

10.6.3.1 Control Register Lock

Under normal operation, writes to the RPINRx and

RPORx registers are not allowed. Attempted writes

appear to execute normally, but the contents of the

registers remain unchanged. To change these

registers, they must be unlocked in hardware. The

(OSCCON<6>). Setting IOLOCK prevents writes to the

control registers; clearing IOLOCK allows writes.

To set or clear IOLOC K, a specif ic comm and sequ ence

must be executed:

1. Write 0x46 to OSCCON<7:0>.

2. Write 0x57 to OSCCON<7:0>.

3. Clear (or set) IOLOCK as a single operation.

Unlike the similar sequence with the oscillator’s LOCK

bit, IOLOCK remains in one state until changed. This

allows all the peripheral pin selects to be configured

with a single unlock s equence followe d by an u pdate to

all control registers, then locked with a second lock

sequence.

10.6.3.2 Continuous State Monitoring

In addition to being protected from direct writes, the

contents of the RPINRx and RPORx registers are

const antly monit ored in ha rdwar e by sha dow regis ters.

If an unexpected change in any of the registers occurs

(such as cell disturbances caused by ESD or other

external events), a configuration mismatch Reset will

be triggered.

10.6.3.3 Configuration Bit Pin Select Lock

As an additional level of safety, the device can be

configured to prevent more than one write session to

the RPINRx and RPORx registers. The IOL1WAY

(FOSC<IOL1WAY>) configuration bit blocks the

IOLOCK bit from being cleared after it has been set

once.

In the default (unprogrammed) state, IOL1WAY is set

restricti ng the users t o one write s ession. Programm ing

IOL1WAY allows user applications unlimited access

(with the proper use of the unlock sequence) to the

peripheral pin select registers.

10.7 Peripheral Pin Select Registers

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices implement 17 registers for remappable

periphe ral configuration:

• Input Remappable Peripheral Registers (9)

• Output Remappable Peripheral Registers (8)

Function RPnR<4:0> Output Name

NULL 00000 RPn tied to default port pin

U1TX 00011 RPn tied to UART1 Transmit

U1RTS 00100 RPn tied to UART1 Ready To Send

SDO1 00111 RPn tied to SPI1 Data Output

SCK1OUT 01000 RPn tied to SPI1 Clock Ou tput

SS1OUT 01001 RPn tied to SPI1 Slave S elect Output

OC1 10010 RPn tied to Output Compare 1

OC2 10011 RPn tied to Output Compare 2

Note: MPLAB® C30 prov ides built-in C language

functions for unlocking the OSCCON

__builtin_write_OSCCONL(value)

__builtin_write_OSCCONH(value)

See MPLAB Help for more information.

Note: Input and Outp ut Regis ter valu es can onl y

be changed if OSCCON<IOLOCK> = 0.

See Section 10.6.3.1 “Control Register

Lock” for a specific command sequence.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 108 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —INT1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-0 Unimplemented: Read as ‘0’

 2009 Microchip Technology Inc. Preliminary DS70289F-page 109

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —INT2R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 110 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —T3CKR<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —T2CKR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 T3CKR<4:0>: Assign Timer3 Exter nal C lock (T3CK) to the Corres ponding RP n pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 T2CKR<4:0>: Assign Timer2 Exter nal C lock (T2CK) to the Corres ponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

 2009 Microchip Technology Inc. Preliminary DS70289F-page 111

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC2R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 112 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC8R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC7R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding pin RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding pin RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

 2009 Microchip Technology Inc. Preliminary DS70289F-page 113

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —OCFAR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 114 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — U1CTSR<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —U1RXR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 U1CTSR<4:0>: Assign UART 1 Clear to Se nd (U 1CTS) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 U1RXR<4:0>: Assign UART 1 Receive (U1RX) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

 2009 Microchip Technology Inc. Preliminary DS70289F-page 115

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —SCK1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —SDI1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 SCK1R<4:0>: Assign SPI 1 Clock Input (SCK1IN) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 SDI1R<4:0>: Assign SPI 1 Data Input (SDI1) to the corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 116 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — SS1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the Corresponding RPn pin

11111 = Input tied to Vss

11001 = Input tied to RP25

•

00001 = Input tied to RP1

00000 = Input tied to RP0

 2009 Microchip Technology Inc. Preliminary DS70289F-page 117

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP0R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP1R<4:0>: Peripheral O utput Function i s Assigned to R P1 Output Pin (see Table 10-2 for periph eral

function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP0R<4:0>: Periph eral Output Func tion is Assign ed to RP0 Outpu t Pin (see Table 10-2 for peripheral

function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP3R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP2R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP3R<4:0>: Peripheral O utput Function i s Assigned to R P3 Output Pin (see Table 10-2 for periph eral

function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP2R<4:0>: Periph eral Output Func tion is Assign ed to RP2 Outpu t Pin (see Table 10-2 for peripheral

function numbers)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 118 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP5R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP4R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP5R<4:0>: Peripheral O utput Function i s Assigned to RP5 Output Pin (see Table 10-2 for peripheral

function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP4R<4:0>: Periph eral Output Func tion is Assign ed to RP4 Ou tput Pin (see Table 10-2 for periph eral

function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP7R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP6R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP7R<4:0>: Peripheral O utput Function i s Assigned to RP7 Output Pin (see Table 10-2 for peripheral

function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP6R<4:0>: Periph eral Output Func tion is Assign ed to RP6 Ou tput Pin (see Table 10-2 for periph eral

function numbers)

 2009 Microchip Technology Inc. Preliminary DS70289F-page 119

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP9R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP8R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP9R<4:0>: Peripheral O utput Function i s Assigned to R P9 Output Pin (see Table 10-2 for periph eral

function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP8R<4:0>: Periph eral Output Func tion is Assign ed to RP8 Outpu t Pin (see Table 10-2 for peripheral

function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP11R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP10R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP11R<4:0>: Periphera l O utp ut Fu nct ion is As si gned to RP11 Output Pin (see Table 10-2 for pe riph -

eral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP10R<4:0>: Peripher al Output Fu nction is Assigne d to RP10 Output Pin (see Tabl e 10-2 for

peripheral function numbers)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 120 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP13R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP12R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP13R<4:0>: Peripheral Output Func tion is Assigned to RP13 Output Pin ( see Table 10- 2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP15R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP14R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP15R<4:0>: Peripheral Output Func tion is Assigned to RP15 Output Pin ( see Table 10- 2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin (see Table 10-2 for

peripheral function numbers)

 2009 Microchip Technology Inc. Preliminary DS70289F-page 121

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP17R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP16R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP17R<4:0>: Periph eral Output Function is Assign ed to R P15 Outp ut Pin (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP16R<4:0>: Peri pheral Output Function is A ssigned to RP14 Output Pin (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP19R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP18R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP19R<4:0>: Periph eral Output Function is Assign ed to R P19 Output Pin (s ee Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP18R<4:0>: Peripher al Output Fu nction is Assigne d to RP18 Output Pin (see Tabl e 10-2 for

peripheral function numbers)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 122 Preliminary  2009 Microchip Technology Inc.

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP21R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP20R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP21R<4:0>: Peripheral Output Func tion is Assigned to RP21 Output Pin ( see Table 10- 2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP20R<4:0>: Peripheral Output Function is Assigned to RP20 Output Pin (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP23R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP22R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP23R<4:0>: Peripheral Output Func tion is Assigned to RP23 Output Pin ( see Table 10- 2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP22R<4:0>: Peripheral Output Function is Assigned to RP22 Output Pin (see Table 10-2 for

peripheral function numbers)

 2009 Microchip Technology Inc. Preliminary DS70289F-page 123

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP25R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP24R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP25R<4:0>: Periph eral Output Function is Assign ed to R P25 Output Pin (s ee Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP24R<4:0>: Peripher al Output Fu nction is Assigne d to RP24 Output Pin (see Tabl e 10-2 for

peripheral function numbers)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 124 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 125

PIC24HJ32GP202/204 and PIC24HJ16GP304

11.0 TIMER1

The Timer1 module is a 16-bit timer, which can serve

as the time counter for the real-time clock, or operate

as a free-running interval timer/counter. Timer1 can

operate in three modes:

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Timer1 also supports these features:

• Timer gate operation

• Selectable pres c ale r settin gs

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

Figu re 11-1 sh ows a b lock di agram of the 16- bit time r

module.

To configure Timer1 for operation:

1. Set the TON bit (= 1) in the T1CON register.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits in the T1CON register.

3. Set the Clock and Gating modes using the TCS

and TGATE bits in the T1CON register.

4. Set or clear the TSYNC bit in T1CON to select

synchronous or asynchronous operation.

5. Load the timer period value into the PR1

6. If interrupts are required, set the interrupt enabl e

bit, T1IE. Use the priority bits, T1IP<2:0>, to set

the interrupt priority.

FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices. It is

not inte nded to be a co mprehensive refer-

ence sou rce. To complement th e informa-

tion in this data sheet, refer to “Section

11. Timers” (DS702064) of the

”dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

TON

SOSCI

SOSCO/

PR1

Set T1IF

Equal Comparator

TMR1

Reset

SOSCEN

TSYNC

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

T1CK

TCS

TGATE

Sync

Gate

Sync

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 126 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON —TSIDL— — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0

— TGATE TCKPS<1:0> — TSYNC TCS —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer1 On bit

1 = Starts 16-bit Timer1

0 = Stops 16-bit Time r1

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit

When T1CS = 1:

This bit is ignored.

When T1CS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disabled

bit 5-4 TCKPS<1:0> Timer1 Input Clock Prescale Select bits

11 = 1:256

10 = 1:64

01 = 1:8

00 = 1:1

bit 3 Unimplemented: Read as ‘0’

bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit

When TCS = 1:

1 = Synchronize external clock input

0 = Do not synchronize external clock input

When TCS = 0:

This bit is ignored.

bit 1 TCS: Timer 1 Cloc k Source Select bit

1 = External clock from pin T1CK (on the ris ing edge)

0 = Internal clock (FCY)

bit 0 Unimplemented: Read as ‘0’

 2009 Microchip Technology Inc. Preliminary DS70289F-page 127

PIC24HJ32GP202/204 and PIC24HJ16GP304

12.0 TIMER2/3 FEAT URE

The Timer2/3 f eature has 3 2-bit timers that can a lso be

configured as two independent 16-bit timers with

selectable operating modes.

As a 32-bit timer, the Timer2/3 feature permits

operation in three modes:

• Two Independent 16-bit timers (Timer2 and

Timer3) wit h all 16-bit operat ing modes (except

Asynchronous Counter mode)

• Single 32-bit timer (Timer2/3)

• Single 32-bit synchronous counter (Timer2/3)

The Timer2/3 feature also supports:

• Timer gate operation

• Selectable Prescaler Settings

• Timer operation during Idle and Sleep modes

• Interrupt on a 32-bit Period Register Match

• T ime Ba se fo r Input Capture and Ou tput Comp are

Modules (Timer2 and Timer3 only)

• ADC1 Event Trigger (Timer2/3 only)

Individ ually , al l eight of the 16-bit tim ers can function as

synchronous timers or counters. They also offer the

features that are listed above, except for the event

trigger. The operating mod es and en abled fe atures are

determined by setting the appropriate bit(s) in the

T2CON and T3CON registers. T2CON registers are

shown in generic form in Register 12-1. T3CON

registers are shown in Register 12-2.

For 32-bit timer/counter operation, Timer2 is the least

significant word (lsw), and Timer3 is the most

significant word (msw) of the 32-bit timers.

12.1 32-bit Operation

To configure the Timer2/3 feature for 32-bit operation:

1. Set the corresponding T32 control bit.

2. Select the prescaler ratio for Timer2 using the

TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the

corresponding TCS and TGATE bits.

4. Load the timer period value. PR3 contains the

most significant word of the value, while PR2

contains the least significant word.

5. Set the inte rrupt enabl e bit T3IE, if i nterrupt s are

required. Use the priority bits T3IP<2:0> to set

the interrupt priority. While Timer2 controls the

timer, the interrupt appears as a Timer3

interrupt.

6. Set the corresponding TON bit.

The timer value at any point is stored in the register pair

TMR3:TMR2. TMR3 always contains the most

signi f ic an t w o rd of t he co un t , w h ile TM R 2 conta i ns t he

least significant word.

To configure any of the timers for individual 16-bit

operation:

1. Clear the T32 bit corresponding to that timer.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the TCS

and TGATE bits.

4. Load the timer period value into the PRx

5. If interrupts are required, set the interrupt enabl e

bit, TxIE. Use the priority bits, TxIP<2:0>, to set

the interrupt priority.

6. Set the TON bit.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices. It is

not inte nded to be a co mprehensive refer-

ence sou rce. To complement th e informa-

tion in this data sheet, refer to “Section

11. Timers” (DS70206) of the

”dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: For 32-bit operation, T3CON control bits

are ignored. Only T2CON control bit is

used for setup and control. Timer2 clock

and gate inputs are used for the 32-bit

timer modules, but an interrupt is

generated with the Timer3 interrupt flags.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 128 Preliminary  2009 Microchip Technology Inc.

FIGURE 12-1: TIMER2/3 (32-BIT) BLOCK DIAGRAM(1)

Set T3IF

Equal Comparator

PR3 PR2

Reset

LSbMSb

Note 1: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective

to the T2CON register.

2: The ADC event trigger is available only on Timer2/3.

Data Bus<15:0>

TMR3HLD

Read TMR2

Wr i te TMR2 16

TGATE

TON TCKPS<1:0>

TCY

TCS

TGATE

T2CK

ADC Event Trigger(2)

Gate

Sync Prescaler

1, 8, 64, 256

Sync

TMR3 TMR2

 2009 Microchip Technology Inc. Preliminary DS70289F-page 129

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 12-2: TIMER2 (16-BIT) BLOCK DIAGRAM

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY TCS

TGATE

T2CK

PR2

Set T2IF

Equal Comparator

TMR2

Reset

TGATE

Gate

Sync

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 130 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON —TSIDL— — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0

— TGATE TCKPS<1:0> T32 —TCS—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer2 On bit

When T32 = 1:

1 = Starts 32-bit Timer2/3

0 = Stops 32-bit Time r2/3

When T32 = 0:

1 = Starts 16-bit Timer2

0 = Stops 16-bit Time r2

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer2 Gated Time Accumulation Enable bit

When TCS = 1:

This bit is ignored.

When TCS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disabled

bit 5-4 TCKPS<1:0>: Timer2 Input Clock Prescale Select bits

11 = 1:256

10 = 1:64

01 = 1:8

00 = 1:1

bit 3 T32: 32-bit Ti mer Mode Select bit

1 = Timer2 and Timer3 form a single 32-bit timer

0 = Timer2 and Timer3 act as two 16-bit timers

bit 2 Unimplemented: Read as ‘0’

bit 1 TCS: Timer 2 Cloc k Source Select bit

1 = External clock from pin T2CK (on the ris ing edge)

0 = Internal clock (FCY)

bit 0 Unimplemented: Read as ‘0’

 2009 Microchip Technology Inc. Preliminary DS70289F-page 131

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON(2) —TSIDL

(1) — — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0

— TGATE

(2) TCKPS<1:0>(2) ——TCS

(2) —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer3 On bit(2)

1 = Starts 16-bit Timer3

0 = Stops 16-bit Time r3

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit(1)

1 = Discontinue timer operation when device enters Idle mode

0 = Continue timer operation in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer3 Gated Time Accumulation Enable bit(2)

When TCS = 1:

This bit is ignored.

When TCS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disabled

bit 5-4 TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(2)

11 = 1:256 prescale value

10 = 1:64 prescale value

01 = 1:8 presc ale value

00 = 1:1 presc ale value

bit 3-2 Unimplemented: Read as ‘0’

bit 1 TCS: Timer 3 Cloc k Source Select bit(2)

1 = External clock from T3CK pin

0 = Internal clock (FOSC/2)

bit 0 Unimplemented: Read as ‘0’

Note 1: When 32-b it tim er opera tion is enabl ed (T32 = 1) in th e T im er Contro l regis ter (T2CO N<3>), th e TSIDL bit

must be cleared to operate the 32-bit timer in Idle mode.

2: When the 32-b it timer operat ion is enabl ed (T32 = 1) in the Tim er Con trol (T2C ON<3>) register, th ese bit s

have no effect.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 132 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 133

PIC24HJ32GP202/204 and PIC24HJ16GP304

13.0 INPUT CAPTURE

The input capture module is useful in applications

requiring frequency (period) and pulse measurement.

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices support up to eight input capture channels.

The input capture module captures the 16-bit value of

the selected Time Base register when an event occurs

at th e ICx pi n. The events th at cause a captu re even t

are listed below in three categories:

• Simple Capture Event modes:

- Capture timer value on every falling edge of

input at ICx pin

- Capture timer value on every rising edge of

input at ICx pin

• Capture timer value on every edge (rising and

falling).

• Pr escaler Capture Event modes:

- Capture timer value on every 4th rising edge

of input at ICx pin

-Capture timer value on every 16th rising

edge of input at ICx pin

Each input capture channel can select one of the

two 16-bit timers (Timer2 or Timer3) for the time

base. The selected timer can use either an internal

or external clock.

Other operational features include:

• Device wake-up from capture pin during CPU

Sleep and Idle modes

• Interrupt on input capture event

• Four-word FIFO buffer for capture values

- Interrupt optionally generated after 1, 2, 3 or

4 buf fer locations are fill ed

• Use of input capture to provide additional sources

FIGURE 13-1: INP UT CAPTURE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices. It is

not inte nded to be a co mprehensive refer-

ence sou rce. To complement th e informa-

tion in this data sheet, refer to “Section

12. Input Capture” (DS70198) of the

”dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

ICxBUF

ICx Pin ICM<2:0> (ICxCON<2:0>)

Mode Select

Set Flag ICxIF

(in IFSn Register)

TMR2 TMR3

Edge Detection Logic

16 16

FIFO

R/W

Logic

ICxI<1:0>

ICOV, ICBNE (ICxCON<4: 3>)

ICxCON Interrupt

Logic

System Bus

From 16-bit Timers

ICTMR

(ICxCON<7>)

FIFO

Prescaler

Counter

(1, 4, 16) and

Clock Synchronizer

Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 134 Preliminary  2009 Microchip Technology Inc.

13.1 Input Capt ure Registers

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——ICSIDL— — — — —

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

bit 7 bit 0

Legend: HC = Cleared in Hardware

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit

1 = Input capture module will halt in CPU Idle mode

0 = Input capture module will continue to operate in CPU Idle mode

bit 12-8 Unimplemented: Read as ‘0’

bit 7 ICTMR: Input Capture Timer Select bit s

1 = TMR2 contents are captured on capture event

0 = TMR3 contents are captured on capture event

bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits

11 = Interrupt on every fourth capture event

10 = Interrupt on ever y third capture event

01 = Interrupt on every second capture event

00 = Interrupt on every capture event

bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only)

1 = Input capture overflow occurred

0 = No input capture overflow occurred

bit 3 ICBNE: Input Capture Buffer Empt y Status bit (read- only)

1 = Input capture buffer is not empty, at least one more capture value can be read

0 = Input capture buffer is empty

bit 2-0 ICM<2:0>: Input Capture Mode Select bits

111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode

(Rising edge detect only, all other control bits are not applicable.)

110 = Unused (module disabled)

101 = Capture mode, every 16th rising edge

100 = Capture mode, every 4th rising edge

011 = Capture mode, every rising edge

010 = Capture mode, every falling edge

001 = Capture mode, every edge (rising and falling)

(ICI<1:0> bits do not control interrupt generation for this mode.)

000 = Input capture module turned off

 2009 Microchip Technology Inc. Preliminary DS70289F-page 135

PIC24HJ32GP202/204 and PIC24HJ16GP304

14.0 OUTPUT COMPARE The Output Compare module can select either Timer2

or Timer3 fo r its time ba se. Th e module co mpares t he

value of th e time r with th e value of one or two comp are

registers depending on the operating mode selected.

The state of the output pin changes when the timer

value m atc he s the compare register va lue. The O utp ut

Compare module generates either a single output

pulse or a sequence of output pulses, by changing the

state of the output pin on the compare match events.

The Output Compare module can also generate

interrupts on compare match events.

The Output Compare module has multiple operating

modes:

• Active-Low One-Shot mode

• Active-High One-Shot mode

• Toggle mode

• Delay ed On e-Sho t mod e

• Continuous Pulse mode

• PWM mode without fault protection

• PWM mode with fault protection

FIGURE 14-1: OUTPUT C OMPARE MODULE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 13. Output Compare”

(DS70209) of the ”dsPIC33F/PIC24H

Family Reference Manual”, w hich is avail-

able from the Microchip website

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

OCxR

Comparator

Output

Logic

OCM<2:0>

Output Enable

OCx

Set Flag bit

OCxIF

OCxRS

Mode Select

OCTSEL 01

OCFA

TMR2 TMR2

TMR3 TMR3

Rollover Rollover

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 136 Preliminary  2009 Microchip Technology Inc.

14.1 Output Compare Modes

Configure the Output Compare modes by setting the

appropri ate Output Compare Mod e (OCM<2:0>) bit s in

the Out put C ompare C on trol (O CxCO N<2:0>) regi ste r.

Table 14-1 lists the different bit settings for the Output

Compare modes. Figure 14-2 illustrates the output

compare operation for various modes. The user

application must disable the associated timer when

wri ting to the ou tput compare control regist ers to avoid

malfunctions.

TABLE 14-1: OUTPUT COMPARE MODES

FIGURE 14-2: OUTPUT COMPARE OPERATION

Note: See Section 13. “Output Compare” in

the “PIC24H Family Reference Manual”

(DS70247) for OCxR and OCxRS register

restrictions.

OCM<2:0> Mode OCx Pin Initial State OCx Interrupt Generation

000 Module Dis ab led Controlled by GPIO register —

001 Active-Low One-Shot 0OCx Rising edge

010 Active-High One-Shot 1OCx Falling edge

011 Toggle Mode Cur rent output is maintained OCx Risi ng and Falling edge

100 Delayed One-Shot 0OCx Falling edge

101 Continuous Pulse mode 0OCx Falling edge

110 PWM mode without fault

protection 0, if OCxR is zero

1, if OCxR is non-zero No interrupt

111 PWM mode with fault pr otection 0, if OCxR is zero

1, if OCxR is non-zero OCFA Falling edge for OC1 to OC4

OCxRS

TMRy OCxR

Timer is reset on

period match

Continuous Pulse Mode

(OCM = 101)

PWM Mode

(OCM = 110 or 111)

Active-Low One-Shot

(OCM = 001)

Active-High One-Shot

(OCM = 010)

Toggle Mode

(OCM = 011)

Delayed One-Sho t

(OCM = 100)

Output Compare

Mode enabled

 2009 Microchip Technology Inc. Preliminary DS70289F-page 137

PIC24HJ32GP202/204 and PIC24HJ16GP304

14.2 Output Compare Register

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——OCSIDL — — — — —

bit 15 bit 8

U-0 U-0 U-0 R-0 HC R/W-0 R/W-0 R/W-0 R/W-0

— — — OCFLT OCTSEL OCM<2:0>

bit 7 bit 0

Legend: HC = Cleared in Hardware HS = Set in Hardware

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 OCSIDL: Stop Output Compare in Idle Mode Control bit

1 = Output Compare x will halt in CPU Idle mode

0 = Output Compare x will continue to operate in CPU Idle mode

bit 12-5 Unimplemented: Read as ‘0’

bit 4 OCFLT: PWM Fault Condition Status bit

1 = PWM Fault condition has occurred (cleared in hardware only)

0 = No PWM Fault condition has occurred

(This bit is only use d wh en OC M< 2: 0> = 111.)

bit 3 OCTSEL: Output Compare Timer Select bit

1 = Timer3 is the clock source for Compare x

0 = Timer2 is the clock source for Compare x

bit 2-0 OCM<2:0>: Output Compare Mode Select bits

111 = PWM mode on OCx, Fault pin enabled

110 = PWM mode on OCx, Fault pin disabled

101 = Initialize OCx pin low, generate continuous output pulses on OCx pin

100 = Initialize OCx pin low, generate single output pulse on OCx pin

011 = Compare event toggles OCx pin

010 = Initialize OCx pin high, compare event forces OCx pin low

001 = Initialize OCx pin low, compare event forces OCx pin high

000 = Output compare channel is disabled

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 138 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 139

PIC24HJ32GP202/204 and PIC24HJ16GP304

15.0 SERIAL P ERIPHERAL

INTERFACE (SPI) The Serial Peripheral Interface (SPI) module is a

synchronous serial interface useful for communicating

with othe r peri phe ral or mi cro co ntro lle r dev ices. These

peripheral devices can be serial EEPROMs, shift

registers, display drivers, Analog-to-Digital Converters

(ADCs) and so on. The SPI module is compatible with

SPI and SIOP from Motorola®.

Each SPI module consists of a 16-bit shift register,

SPIxSR (where x = 1 or 2), used for shifting data in and

out, and a buffer register, SPIxBUF. A control register,

SPIxCON, configures the module. Additionally, a status

The serial interface consists of these four pins:

• SDIx (serial data input)

• SD Ox (serial data out p ut)

• SCKx (shift clock input or output)

• SSx ( active-low slave select)

In Master mode operation, SCK is a clock output. In

Slave mo de, it is a clock inp ut.

FIGURE 15-1: SPI MOD U LE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 18. Serial Peripheral

Interface (SPI™)” (DS70206) of the

”dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Inte rn al Da ta Bu s

SDIx

SDOx

SSx

SCKx

SPIxSR

bit 0

Shift Control

Edge

Select

FCY

Primary

1:1/4/16/64

Enable

Prescaler

Sync

SPIxBUF

Control

Transfer

Write SPIxBUF

Read SPIxBUF

SPIxCON1<1:0>

SPIxCON1<4:2>

Master Clock

Clock

Control

Secondary

Prescaler

1:1 to 1:8

SPIxRXB SPIxTXB

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 140 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

SPIEN — SPISIDL — — — — —

bit 15 bit 8

U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0

— SPIROV — — — — SPITBF SPIRBF

bit 7 bit 0

Legend: C = Clearable bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 SPIEN: SPIx Enable bit

1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins

0 = Disabl es module

bit 14 Unimplemented: Read as ‘0’

bit 13 SPISIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 SPIROV: Receive Overflow Flag bit

1 = A new byte/word is completely received and discarded. The user software has not read the

previous data in the SPIxBUF register

0 = No overflow has occurred.

bit 5-2 Unimplemented: Read as ‘0’

bit 1 SPITBF: SPIx Transmit Buffer Full Status bit

1 = Transmit not yet started, SPIxTXB is full

0 = Transmit started, SPIxTXB is empty

Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.

Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR.

bit 0 SPIRBF: SPIx Receive Buffer Fu ll Status bit

1 = Receive complete, SPIxRXB is full

0 = Receive is not complete, SPIxRXB is empty

Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.

Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 141

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — DISSCK DISSDO MODE16 SMP CKE(1)

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SSEN(2) CKP MSTEN SPRE<2:0>(3) PPRE<1:0>(3)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)

1 = Internal SPI clock is disabled, pin functions as I/O

0 = Internal SPI clock is enabled

bit 11 DISSDO: Disable SDOx pin bit

1 = SDOx pin is not used by module; pin functions as I/O

0 = SDOx pin is controlled by the module

bit 10 MODE16: Word/Byte Commu nic ati on Sele ct bit

1 = Communication is word-wide (16 bits)

0 = Communication is byte-wide (8 bits)

bit 9 SMP: SPIx Data Input Sample Phase bit

Master mode:

1 = Input data sampled at end of data output time

0 = Input data sampled at middle of data output time

Slave mode:

SMP must be cleared when SPIx is used in Slave mode.

bit 8 CKE: SPIx Clock Edge Selec t bit(1)

1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)

0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)

bit 7 SSEN: Slave Select Enable bit (Slave mode)(2)

1 = SSx pin used for Slave mode

0 = SSx pin not used by module. Pin controlled by port function

bit 6 CKP: Clock Pola rity Selec t bit

1 = Idle state for clock is a high level; active state is a low level

0 = Idle state for clock is a low level; active state is a high level

bit 5 MSTEN: Master Mode Enable bit

1 = Master mo de

0 = Slave mode

Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes

(FRMEN = 1).

2: This bit must be cleared when FRMEN = 1.

3: Do not set both Primary and Secondary prescalers to a value of 1:1.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 142 Preliminary  2009 Microchip Technology Inc.

bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)(3)

111 = Secondary prescale 1:1

110 = Secondary prescale 2:1

•

000 = Secondary prescale 8:1

bit 1-0 PPRE<1:0>: Primary Prescale bits (M aster mo de)(3)

11 = Primary prescale 1:1

10 = Primary prescale 4:1

01 = Primary prescale 16:1

00 = Primary prescale 64:1

Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes

(FRMEN = 1).

2: This bit must be cleared when FRMEN = 1.

3: Do not set both Primary and Secondary prescalers to a value of 1:1.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 143

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0

FRMEN SPIFSD FRMPOL — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — — FRMDLY —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 FRMEN: Framed SPIx Support bit

1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)

0 = Framed SPIx support disabled

bit 14 SPIFSD: Frame Sync Pulse Direction Control bit

1 = Frame sync pulse input (slave)

0 = Frame sync pulse output (master)

bit 13 FRMPOL: Frame Sync Pulse Polarity bit

1 = Frame sync pulse is active-high

0 = Frame sync pulse is active-low

bit 12-2 Unimplemented: Read as ‘0’

bit 1 FRMDLY: Frame Sync Pulse Edge Select bit

1 = Frame sync pulse coincides with first bit clock

0 = Frame sync pulse precedes first bit clock

bit 0 Unimplemented: This bit must not be set to ‘1’ by the user applic atio n

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 144 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 145

PIC24HJ32GP202/204 and PIC24HJ16GP304

16.0 INTER-INTEGRATED

CIRCUIT™ (I2C™)

The Inter-Integrated Circuit (I2C) module provides

complete hardware support for both Slave and

Multi-Master modes of the I2C serial communication

standard, with a 16-bit interface.

The I2C module has a 2-pin interface:

• The SCLx pin is clock

• The SDAx pin is data.

The I2C module offers the following key features:

•I

2C interface supporting both Master and Slave

modes of opera tion.

•I

2C Slave mode supports 7-bit and 10-bit address

•I

2C Master mode supports 7-bit and 10-bit address

•I

2C port allows bidirectional transfers between

master and slav es.

• Serial clock synchronization for I2C port can be

used as a ha ndshake mechanis m to suspen d and

resume serial transfer (SCLREL control).

•I

2C supports multi-master operation, detects bus

collision and arbitrates accordingly.

16.1 Operating Modes

The hardw are fully im plements all the maste r and slave

functions of the I2C Standard and Fast mode

specifications, as well as 7 and 10-bit addressing.

The I2C module can operate either as a slave or a

master on an I2C bus.

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit address

•I

2C slave operation with 10-bit address

•I

2C master operation with 7-bit or 10-bit address

For det ai ls about the communi catio n sequ ence in eac h

of these modes, refer t o the “PIC24H Family Reference

Manual”.

16.2 I2C Registers

I2CxCON and I2CxSTAT are control and status

registers, respectively. The I2CxCON register is

readable and writable. The lower six bits of I2CxSTAT

are read-only. The remaining bits of the I2CSTAT are

read/write.

• I2CxRSR is the shift register used for shifting

data.

• I2CxRCV is the receive buffer and the register to

which data bytes are written, or from which data

bytes are read.

• I2CxTRN is the transmit register to which bytes

are written during a transmit operation.

• The I2CxADD register holds the slave address.

• A status bit, ADD10, indicates 10-bit Address

mode.

• I2CxBRG acts as the Baud Rate Generator

(BRG) reload value.

In receiv e operations , I2CxRSR and I2Cx RCV together

form a double-buffered receiver. When I2CxRSR

receives a complete byte, it is transferred to I2CxRCV,

and an interrupt pulse is generated.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 19. Inter-Integrated

Circuit™ (I2C™)” (DS70195) of the

”dsPIC33Fj/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 146 Preliminary  2009 Microchip Technology Inc.

FIGURE 16-1: I2C™ BLOCK DIAGRAM (X = 1)

Internal

Data Bus

SCLx

SDAx

Shift

Match Detect

I2CxADD

S tart and Stop

Bit Detect

Clock

Address Match

Clock

Stretching

I2CxTRN LSb

Shift Clock

BRG Down Counter

Reload

Control

TCY/2

S tart and Stop

Bit Generation

Acknowledge

Generation

Collision

Detect

I2CxCON

I2CxSTAT

Control Logic

Read

LSb

Write

Read

I2CxBRG

I2CxRSR

Write

Read

Write

Read

Write

Read

Write

Read

Write

Read

I2CxMSK

I2CxRCV

 2009 Microchip Technology Inc. Preliminary DS70289F-page 147

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 U-0 R/W -0 R/W-1 HC R/W-0 R/W-0 R/W-0 R/W-0

I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC

GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN

bit 7 bit 0

Legend: U = Unimplemented bit, read as ‘0’

R = Readable bit W = Writable bit H S = Set in hardware HC = Cleared in hardware

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 I2CEN: I2Cx Enable bit

1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins

0 = Disables the I2Cx module. All I2C pins are controlled by port functions

bit 14 Unimplemented: Read as ‘0’

bit 13 I2CSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters an Idle mode

0 = Continue module operation in Idle mode

bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave)

1 = Release SCLx clock

0 = Hold SCLx clock low (clock str etch)

If STREN = 1:

Bit is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear

at beginning of slave transmission. Hardware clear at end of slave reception.

If STREN = 0:

Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave

transmission.

bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit

1 = IPMI mode is enabled; all addresses Acknowledged

0 = IPMI mode disabled

bit 10 A10M: 10-bit Slave Address bit

1 = I2CxADD is a 10-bit slave address

0 = I2CxADD is a 7-bit slav e addr ess

bit 9 DISSLW: Disable Slew Rate Control bit

1 = Slew rate control disabled

0 = Slew rate control enabled

bit 8 SMEN: SMBus Input Levels bit

1 = Enable I/O pin thresholds compliant with SMBus specification

0 = Disable SMBus input thresholds

bit 7 GCEN: General Call Enable bit (when operating as I2C slave)

1 = Enable interrupt when a general call address is received in the I2CxRSR

(module is enabled for reception)

0 = General call address disabled

bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)

Used in conjunction with SCLREL bit.

1 = Enable software or receive clock stretching

0 = Disable software or receive clock stretching

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 148 Preliminary  2009 Microchip Technology Inc.

bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicabl e dur ing master rece ive)

Value that will be transmitted when the software initiates an Acknowledge sequence.

1 = Send NACK during Acknowled ge

0 = Send ACK during Acknowledge

bit 4 ACKEN: Acknowledge Sequence Enable bit

(when operating as I2C master, applicable during master receive)

1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.

Hardware clear at end of master Acknowledge sequence

0 = Acknowledge sequence not in progress

bit 3 RCEN: Receive Enable bit (when operating as I2C master)

1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte

0 = Receive sequence not in progress

bit 2 PEN: Stop Condition Enable bit (when operating as I2C ma ster)

1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence

0 = Stop condition not in progress

bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master)

1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of

master Repeated Start sequence

0 = Repeated Start condition not in progress

bit 0 SEN: Start Condition Enable bit (when operating as I2C master)

1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence

0 = Start conditi on not in prog res s

 2009 Microchip Technology Inc. Preliminary DS70289F-page 149

PIC24HJ32GP202/204 and PIC24HJ16GP304

R-0 HSC R-0 HSC U-0 U-0 U-0 R/C-0 HS R-0 HSC R-0 HSC

ACKSTAT TRSTAT — — — BCL GCSTAT ADD10

bit 15 bit 8

R/C-0 HS R/C-0 HS R-0 HSC R/C-0 HSC R/C-0 HSC R-0 HSC R-0 HSC R-0 HSC

IWCOL I2COV D_A P S R_W RBF TBF

bit 7 bit 0

Legend: U = Unimplemented bit, read as ‘0’

R = Readable bit W = Writable bit HS = Set in hardware HSC = Hardware set/cleared

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ACKSTAT: Acknowledge Status bit

(when operating as I2C master, applicable to master transmit operation)

1 = NACK received from slave

0 = ACK received from slave

Hardware set or clear at end of slave Acknowledge.

bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)

1 = Master transmit is in progress (8 bits + ACK)

0 = Master transmit is not in progress

Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.

bit 13-11 Unimplemented: Read as ‘0’

bit 10 BCL: Master Bus Collision Detect bit

1 = A bus collision has been detected during a master operation

0 = No collision

Hardware set at detection of bus collision.

bit 9 GCSTAT: General Call Status bit

1 = General call address was received

0 = General call address was not received

Hardware set when address matches general call address. Hardware clear at Stop detection.

bit 8 ADD10: 10-bit Address Status bit

1 = 10-bit address was matched

0 = 10-bit address was not matched

Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.

bit 7 IWCOL: Write Collision Detect bit

1 = An attempt to write the I2CxTRN register failed because the I2C module is busy

0 = No collision

Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).

bit 6 I2COV: Receive Overflow Flag bit

1 = A byte was received while the I2CxRCV regi ster is still holding the previous byte

0 = No overflow

Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).

bit 5 D_A: Data/Address bit (when operating as I2C slave)

1 = Indicates that the last byte received was data

0 = Indicates that the last byte received was device address

Hardware clear at device address match. Hardware set by reception of slave byte.

bit 4 P: Stop bit

1 = Indicates that a Stop bit has been detected last

0 = Stop bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 150 Preliminary  2009 Microchip Technology Inc.

bit 3 S: Start bit

1 = Indicates that a Start (or Repeated Start) bit has been detected last

0 = Start bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

bit 2 R_W: Read/Write Information bit (when operating as I2C slave)

1 = Read – indicates data transfer is output from slave

0 = Write – indicates data transfer is input to slave

Hardware set or clear after reception of I2C device address byte.

bit 1 RBF: Receive Buffer Full Status bit

1 = Receive complete, I2CxRCV is full

0 = Receive not complete, I2CxRCV is empty

Hardware set when I2CxRCV is written with received byte. Hardware clear when software

reads I2CxRCV.

bit 0 TBF: Transmit Buffer Full Status bit

1 = Transmit in progress, I2CxTRN is full

0 = Transmit complete, I2CxTRN is empty

Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 151

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

— — — — — — AMSK9 AMSK8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-10 Unimplemented: Read as ‘0’

bit 9-0 AMSKx: Mask for Address bit x Select bit

1 = Enable masking for bit x of incoming message address; bit match not required in this position

0 = Disable masking for bit x; bit match required in this position

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 152 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 153

PIC24HJ32GP202/204 and PIC24HJ16GP304

17.0 UNIVERSAL ASY NCHRONOUS

RECEIVER TRANSMITTER

(UART)

The Universal Asynchronous Receiver Transmitter

(UART) module is one of the serial I/O modules

available in the PIC24HJ32GP202/204 and

PIC24HJ16GP304 device family. The UART is a

full-duplex asynchronous system that can

communicate with peripheral devices, such as

personal computers, LIN, RS-232 and RS-485

interfaces. The module also supports a hardware flow

control option with the UxCTS and UxRTS pins and

also includes an IrDA ® encoder and decoder.

The primary features of the UART module are:

• Full- Dupl ex 8- or 9-bit D a t a Transmiss ion thro ug h

the UxTX and UxRX pins

• Even, odd or no parity options (for 8-bit data)

• One or two stop bits

• Hardware Flow Contr ol O ption with UxCTS and

UxRTS pins

• Fully Integrated Baud Rate Generator with 16-bit

prescaler

• Baud rates ranging from 10 Mbps to 38 bps at 40

MIPS

• 4-deep first-in-first-out (FIFO) Transmit Data Buf-

fer

• 4-deep FIFO Receive Data Buffer

• Parity, framing and buffer overrun error d etection

• Support for 9-bit mode with Address Detect

(9th bit = 1)

• Transmit and Receive interrupts

• A separate interrupt for all UAR T error conditions

• Loopback mode for diagnostic support

• Support for Sync and B reak characters

• Support for automatic baud rate detection

•IrDA

® encoder and decoder logic

• 16x baud clock output for IrDA® support

A simplified block diagram of the UART module is

shown in Figure 17-1. The UART module consists of

the following key hardware elements:

• Baud Rate Generator

• Asynchronous Transmitter

• Asynchronous Receiver

FIGURE 17-1: UART SIMPLIFIED BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 17. UART” (DS70188)

of the ”dsPIC33F/PIC24H Family Refer-

ence Manual”, which i s av ailabl e from th e

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

UxRX

Hardware Flow Control

UART Receiver

UART Transmitte r UxTX

BCLK

Baud Rate Generator

UxRTS

IrDA®

UxCTS

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 154 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

UARTEN(1) — USIDL IREN(2) RTSMD —UEN<1:0>

bit 15 bit 8

R/W-0 HC R/W-0 R/W-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL

bit 7 bit 0

Legend: HC = Hardware Clearable

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 UARTEN: UARTx Enable bit(1)

1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>

0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal

bit 14 Unimplemented: Read as ‘0’

bit 13 USIDL: Stop in Idle Mode bit

1 = Disconti nue module operation when dev ice enters Idle mode

0 = Continue module operation in Idle mode

bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2)

1 =IrDA

® encoder and decoder enabled

0 =IrDA

® encoder and decoder disabled

bit 11 RTSMD: Mode Selection for UxRTS Pin bi t

1 =UxRTS

pin in Simplex mode

0 =UxRTS

pin in Flow Control mode

bit 10 Unimplemented: Read as ‘0’

bit 9-8 UEN<1:0>: UARTx Enable bits

11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches

10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used

01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches

00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by

port latches

bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit

1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared

in hardware on following rising edge

0 = No wake-up enabled

bit 6 LPBACK: UARTx Loopback Mode Select bit

1 = Enable Loopback mode

0 = Loopback mode is disabled

bit 5 ABAUD: Auto-Baud Enable bit

1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h)

before other data; cleared in hardware upon completion

0 = Baud rate measurement disabled or completed

Note 1: Refer to Section 17. “UART” (DS70232) in the “PIC24H Family Reference Manual” for information on

enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

 2009 Microchip Technology Inc. Preliminary DS70289F-page 155

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 4 URXINV: Receive Polarity Inversion bit

1 = UxRX Idle state is ‘0’

0 = UxRX Idle state is ‘1’

bit 3 BRGH: High Baud Rate Enable bit

1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)

0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)

bit 2-1 PDSEL<1:0>: Parity and Data Selection bits

11 = 9-bit data, no parity

10 = 8-bit data, odd parity

01 = 8-bit data, even parity

00 = 8-bit data, no parity

bit 0 STSEL: Stop Bit Selection bit

1 = Two Stop bits

0 = One Stop bit

Note 1: Refer to Section 17. “UART” (DS70232) in the “PIC24H Family Reference Manual” for information on

enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 156 Preliminary  2009 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1

UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN(1) UTXBF TRMT

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0

URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA

bit 7 bit 0

Legend: HC = Hardware cleared C = Clear only bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits

11 = Reserved; do not use

10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the

transmit buffer becomes empty

01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit

operations are completed

00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is

at least one character open in the transmit buffer)

bit 14 UTXINV: Transmit P olarity Inv ersion bit

If IREN = 0:

1 = UxTX Idle state is ‘0’

0 = UxTX Idle state is ‘1’

If IREN = 1:

1 =IrDA

® encoded UxTX Idle state is ‘1’

0 =IrDA

® encoded UxTX Idle state is ‘0’

bit 12 Unimplemented: Read as ‘0’

bit 11 UTXBRK: Transmit Break bit

1 = Send Sync Break on next transm ission – S t art bit, followe d by twelve ‘ 0’ bits, followed by Stop bit;

cleared by hardware upon completion

0 = Sync Break transmission disabled or completed

bit 10 UTXEN: Transmit Enable bit(1)

1 = Transmit enabled, UxTX pin controlled by UARTx

0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled

by port

bit 9 UTXBF: Transmit Buffer Full Status bit (read-only)

1 = Transmit buffer is full

0 = Transmit buffer is not full, at least one more character can be written

bit 8 TRMT: Transmit Shift Register Empty bit (read-only)

1 = Transmit Shif t Register is empty and transmit buf fer is empty (the last transmission has completed)

0 = Transmit Shift Register is not empty, a transmission is in progress or queued

bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits

11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)

10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)

0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive

buffer. Receive buffer has one or more characters

Note 1: Refer to Section 17. “UART” (DS70232) in the “PIC24H Family Reference Manual” for information on

enabling the UART module for transmit operation.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 157

PIC24HJ32GP202/204 and PIC24HJ16GP304

bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)

1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect

0 = Address Detect mode disabled

bit 4 RIDLE: Receiver Idle bit (read-only)

1 = Receiver is Id le

0 = Receiver is active

bit 3 PERR: Parity Error Status bit (read-only)

1 = Parity error has been de tected for the cu rrent cha racter (c harac ter at the to p of the rec eive FIFO )

0 = Parity error has not been detected

bit 2 FERR: Framing Error Status bit (read-only)

1 = Framing error has been detected for the current character (character at the top of the receive

FIFO)

0 = Framing error has not been detected

bit 1 OERR: Receive Buffer Overrun Error Status bit (read/clear only)

1 = Receive buffer has ov erf lowed

0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (10 transit ion) will reset

the receiver buffer and the UxRSR to the empty state

bit 0 URXDA: Receive Buffer Data Available bit (read-only)

1 = Receive buffer has data, at least one more character can be read

0 = Receive buffer is empty

Note 1: Refer to Section 17. “UART” (DS70232) in the “PIC24H Family Reference Manual” for information on

enabling the UART module for transmit operation.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 158 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 159

PIC24HJ32GP202/204 and PIC24HJ16GP304

18.0 10-BIT/12-BIT

ANALOG-TO-DIGITAL

CONVERTER (ADC)

The PIC24HJ32GP202/204 and PIC24HJ16GP304

devices have up to 13 Analog-to-Digital Conversion

(ADC) module input channels.

The AD12B bit (AD1CON1<10>) allows each of the

ADC modules to be configured as either a 10-bit,

4-sample-and-hold ADC (default configuration), or a

12-bit, 1-sample-and-ho ld ADC.

18.1 Key Features

The 10-bit ADC configuration has the following key

features:

• Successive Approximation (SAR) conversion

• Conversion speeds of up to 1.1 Msps

• Up to 13 analog input pins

• External voltage reference input pins

• Simultaneous sampling of up to four analog input

pins

• Automatic Channel Scan mode

• Selectable conversion trigger source

• Selectable Buffer Fill modes

• Operati on duri ng CP U Sleep and Idle mode s

• 16-word conversion result buffer

The 12-bit ADC configuration supports all the above

features, except:

• In the 12-bit configuration, conversion speeds of

up to 500 ksps are supported.

• There is only 1 sam ple -an d-ho ld am pli fie r in the

12-bit confi gu ration, so simu ltaneous samp lin g of

multiple channels is not supported.

Depending on the particular device pinout, the ADC

can have up to 13 analog input pins, designated AN0

through AN12. In addition, there are two analog input

pins for external voltage reference connections. These

volt age reference in puts can be sh are d w i th o the r an a-

log input pins.

The actual number of analog input pins and external

volt age reference input configuration will depend o n the

specific device. Refer to the device data sheet for

further details.

A block diagram of ADC for PIC24HJ16GP304 and

PIC24 HJ32GP2 04 device s is shown in Figure 18 -1. A

block diagram of the ADC for the PIC24HJ32GP202

device is shown in Figure 18-2.

18.2 ADC Initialization

To configure the ADC module:

1. Select port pins as analog inputs

(AD1PCFGH<15:0> or AD1PCFGL<15:0>).

2. Select voltage reference source to match

expected range on analog inputs

(AD1CON2<15:13>).

3. Select the analog conversion clock to match

desired data rate with processor clock

(AD1CON3<7:0>).

4. Determine how many sample-and-hold

channels will be used (AD1CON2<9:8> and

AD1PCFGH<15:0> or AD1PCFGL<15:0>).

5. Select the appropriate sample/conversion

sequence (AD1CON1<7:5> and

AD1CON3<12:8>).

6. Select th e way con versi on result s ar e presente d

in the buffer (AD1CON1<9:8>).

7. Turn on the ADC module (AD1CON1<15>).

8. Configure ADC interrupt (if required):

a) Clear the AD1IF bit.

b) Select ADC interrupt priority.

Note 1: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family of devices.

However, it is not intended to be a com-

prehensive reference source. To comple-

ment the information in this data sheet,

refer to “Section 16. Analog-to-Digital

Converter (ADC) with DMA” (DS70210)

of the ”dsPIC33F/PIC24H Family Refer-

ence Manual”, which i s av ailabl e from th e

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be avail-

able on all devices. Refer to Section 4.0

“Memory Organization” in this data

sheet for device-specific register and bit

information.

Note: The AD C modul e must b e disab led befo re

the AD12B bit can be modified.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 160 Preliminary  2009 Microchip Technology Inc.

FIGURE 18-1: ADC1 MODULE BLOCK DIAGRAM FOR PIC24HFJ16GP304 AND

PIC24HJ32GP204 DEVICES

SAR ADC

S/H0

S/H1

ADC1BUF0

ADC1BUF1

ADC1BUF2

ADC1BUFF

ADC1BUFE

AN0

AN12

AN1

VREFL-

CH0SB<4:0>

CH0NA CH0NB

AN0

AN3

CH123SA

AN9

VREFL-

CH123SB

CH123NA CH123NB

AN6

S/H2

AN1

AN4

CH123SA

AN10

VREFL-

CH123SB

CH123NA CH123NB

AN7

S/H3

AN2

AN5

CH123SA

AN11

VREFL-

CH123SB

CH123NA CH123NB

AN8

CH1(2)

CH0

CH2(2)

CH3(2)

CH0SA<4:0>

CHANNEL

SCAN

CSCNA

Alternate

Note 1: VREF+, VREF- inputs can be multiplexed with other analog inputs.

2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.

Input Selection

VREFH VREFL

AVDD AVSS

VREFL-(1)

VREFL+(1)

VCFG<2:0>

 2009 Microchip Technology Inc. Preliminary DS70289F-page 161

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 18-2: ADC1 MODULE BLOCK DIAGRAM FOR PIC24HJ32GP202 DEVICES

SAR ADC

S/H0

S/H1

ADC1BUF0

ADC1BUF1

ADC1BUF2

ADC1BUFF

ADC1BUFE

AN0

AN12

AN1

VREFL-

CH0SB<4:0>

CH0NA CH0NB

AN0

AN3

CH123SA

AN9

VREFL-

CH123SB

CH123NA CH123NB

S/H2

AN1

AN4

CH123SA

AN10

VREFL-

CH123SB

CH123NA CH123NB

S/H3

AN2

AN5

CH123SA

AN11

VREFL-

CH123SB

CH123NA CH123NB

CH1(2)

CH0

CH2(2)

CH3(2)

CH0SA<4:0>

CHANNEL

SCAN

CSCNA

Alternate

Note 1: VREF+, VREF- inputs can be multiplexed with other analog inputs.

2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.

Input Selection

VREFH VREFL

AVDD AVSS

VREFL-(1)

VREFL+(1)

VCFG<2:0>

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 162 Preliminary  2009 Microchip Technology Inc.

FIGURE 18-3: ADC CONVE RSION CLOCK PERIOD BLOCK DIAGRAM

ADC Internal

RC Clock(2)

TOSC(1) X2

ADC Conversion

Clock Multiplier

1, 2, 3, 4, 5,..., 64

AD1CON3<15>

TCY

TAD

AD1CON3<5:0>

Note 1: Refer to Figure 8-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal

to the clock frequency. TOSC = 1/FOSC.

2: See the ADC Electrical Characteristics for the exact RC Clock value.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 163

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0

ADON —ADSIDL——AD12B FORM<1:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0

HC,HS R/C-0

HC, HS

SSRC<2:0> — SIMSAM ASAM SAMP DONE

bit 7 bit 0

Legend: HC = Cleared by hardware HS = Set by ha rdware C = Clear o nly bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ADON: ADC Operating Mode bit

1 = ADC module is operating

0 =ADC is off

bit 14 Unimplemented: Read as ‘0’

bit 13 ADSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12-11 Unimplemented: Read as ‘0’

bit 10 AD12B: 10-bit or 12-bit Operation Mode bit

1 = 12-bit, 1-channel ADC operation

0 = 10-bit, 4-channel ADC operation

bit 9-8 FORM<1:0>: Data Output Format bits

For 10-bit operation:

11 = Reserved

10 = Reserved

01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>)

00 = Integer (DOUT = 0000 00dd dddd dddd)

For 12-bit operation:

11 = Reserved

10 = Reserved

01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>)

00 = Integer (DOUT = 0000 dddd dddd dddd)

bit 7-5 SSRC<2:0>: Sample Clock Source Select bits

111 = Internal counter ends sampling and starts conversion (auto-convert)

110 = Reserved

101 = Reserved

100 = Reserved

011 = Reserved

010 = GP timer 3 compare ends sampling and starts conversion

001 = Active transition on INT0 pin ends sampling and starts conversion

000 = Clearing sample bit ends sampling and starts conversion

bit 4 Unimplemented: Read as ‘0’

bit 3 SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x)

When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’

1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or

Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01)

0 = Samples multiple channels individually in sequence

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 164 Preliminary  2009 Microchip Technology Inc.

bit 2 ASAM: ADC Sample Auto-Start bit

1 = Sampling begins immediately after last conversion. SAMP bit is auto-set

0 = Sampling begins when SAMP bit is set

bit 1 SAMP: ADC Sample Enable bit

1 = ADC sample-and-hold amplifiers are sampling

0 = ADC sample-and-hold amplifiers are holding

If ASAM = 0, software can write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1.

If SSRC = 000, software ca n write ‘0’ to end sampling and start conversion. If SSRC 000,

automatically cleared by hardware to end sampling and start conversion.

bit 0 DONE: ADC Conversion Status bit

1 = ADC conversion cycle is completed

0 = ADC conversion not started or in progress

Automatically set by hardware when ADC conversion is complete. Software can write ‘0’ to clear

DONE st atus (sof tware not al lowed t o wri te ‘1’). Clea ring thi s bit will NOT af fec t any operati on in prog-

ress. Automatically clea red b y hardware at start of a new conver sion.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 165

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0

VCFG<2:0> —— CSCNA CHPS<1:0>

bit 15 bit 8

R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

BUFS — SMPI<3:0> BUFM ALTS

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 VCFG<2:0>: Converter Voltage Reference Configuration bits

bit 12-11 Unimplemented: Read as ‘0’

bit 10 CSCNA: Scan Input Selections for CH0+ during Sample A bit

1 = Scan inputs

0 = Do not scan inputs

bit 9-8 CHPS<1:0>: Select Channels Utilized bits

When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’

1x = Converts CH0, CH1, CH2 and CH3

01 = Converts CH0 and CH1

00 = Converts CH0

bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1)

1 = ADC is currently filling second half of buffer, user application should access data in the first half

0 = ADC is currently filling first half of buffer, user application should access data in the second half

bit 6 Unimplemented: Read as ‘0’

bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits

1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence

1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence

•

0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence

0000 = Interrupts at the completion of conversion for each sample/convert sequence

bit 1 BUFM: Buffer Fill Mode Select bit

1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt

0 = Always starts filling buffer from the beginning

bit 0 ALTS: Alternate Input Sample Mode Select bit

1 = Uses channel input selects for Sample A on first sample and Sample B on next sample

0 = Always uses channel input selects for Sample A

ADREF+ ADREF-

000 AVDD AVSS

001 External VREF+AVSS

010 AVDD External VREF-

011 External VREF+ External VREF-

1xx AVDD Avss

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 166 Preliminary  2009 Microchip Technology Inc.

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADRC —— SAMC<4:0>(1)

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADCS<7:0>(2)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ADRC: ADC Conversion Clock Source bit

1 = ADC internal RC clock

0 = Clock derived from system clock

bit 14-13 Unimplemented: Read as ‘0’

bit 12-8 SAMC<4:0>: Auto Sam ple Time bits(1)

11111 = 31 TAD

•

00001 = 1 TAD

00000 = 0 TAD

bit 7-0 ADCS<7:0>: ADC Conversion Clock Select bits(2)

11111111 = Reserved

•

01000000 = Reserved

00111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD

•

00000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD

00000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD

00000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD

Note 1: This bit only used if AD1CON1<7:5> (SSRC<2:0>) = 111.

2: This bit is not used if AD1CON3<15> (ADRC) = 1.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 167

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — CH123NB<1:0> CH123SB

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — CH123NA<1:0> CH123SA

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10-9 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits

PIC24HJ32GP202 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10 = Reserved

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

PIC24HJ32GP204 and PIC24HJ16GP304 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

bit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit

If AD12B = 1:

1 = Reserved

0 = Reserved

If AD12B = 0:

1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

bit 7-3 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 168 Preliminary  2009 Microchip Technology Inc.

bit 2-1 CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits

PIC24HJ32GP202 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10 = Reserved

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

PIC24HJ32GP204 and PIC24HJ16GP304 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11

10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit

If AD12B = 1:

1 = Reserved

0 = Reserved

If AD12B = 0:

1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

 2009 Microchip Technology Inc. Preliminary DS70289F-page 169

PIC24HJ32GP202/204 and PIC24HJ16GP304

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CH0NB —— CH0SB<4:0>

bit 15 bit 8

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CH0NA —— CH0SA<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 CH0NB: Channel 0 Negative Input Select for Sample B bit

1 = Channel 0 negative input is AN1

0 = Channel 0 negative input is VREF-

bit 14-13 Unimplemented: Read as ‘0’

bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits

PIC24HJ32GP204 and PIC24HJ16GP304 devices only:

01100 = Channel 0 positive input is AN12

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

PIC24HJ32GP202 devices only:

01100 = Channel 0 positive input is AN12

•

01000 = Reserved

00111 = Reserved

00110 = Reserved

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit

1 = Channel 0 negative input is AN1

0 = Channel 0 negative input is VREF-

bit 6-5 Unimplemented: Read as ‘0’

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 170 Preliminary  2009 Microchip Technology Inc.

bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits

PIC24HJ32GP204 and PIC24HJ16GP304 devices only:

01100 = Channel 0 positive input is AN12

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

PIC24HJ32GP202 devices only:

01100 = Channel 0 positive input is AN12

•

01000 = Reserved

00111 = Reserved

00110 = Reserved

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

 2009 Microchip Technology Inc. Preliminary DS70289F-page 171

PIC24HJ32GP202/204 and PIC24HJ16GP304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — CSS12 CSS11 CSS10 CSS9 CSS8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-0 CSS<12:0>: ADC Input Scan Selection bits

1 = Select ANx for input scan

0 = Skip ANx for input scan

Note 1: On devi ces w ithout 1 3 analog input s, all AD1CSSL bits can be select ed by the u ser appl icatio n. Howe ver,

inputs selected for scan without a corresponding input on device converts VREFL.

2: CSSx = ANx, where x = 0 through 12.

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — PCFG12 PCFG11 PCFG10 PCFG9 PCFG8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-0 PCFG<12:0>: ADC Port Configuration Control bits

1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS

0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage

Note 1: On dev ices wi thout 13 analog i nputs , all PCFG bits are R/W b y user s oftw are. Howeve r , t he PCFG bi ts are

ignored on ports without a corresponding input on device.

2: PCFGx = ANx, where x = 0 through 12.

3: The PCFGx bits have no effect if the ADC module is disabled by setting ADxMD bit in the PMDx register.

In this case, all port pins multiplexed with ANx will be in Digital mode.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 172 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 173

PIC24HJ32GP202/204 and PIC24HJ16GP304

19.0 SPECIAL FEATURES

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices include several features that are intended to

maximize application flexibility and reliability, and

minimize cost through elimination of external

compon en t s. The se are:

• Flexible configuration

• Watchdog Timer (WDT)

• Code Protection and CodeGuard™ Security

• JTAG Boundary Scan Interface

• In-Circuit Serial Programming™ (ICSP™)

• In-Circuit emulation

19.1 Configuration Bits

The Configuration bits can be programmed (read as

‘0’), or left unprogrammed (read as ‘1’), to select

various device configurations . These bits are mapped

starting at program memory location 0xF80000.

The Device Configuration register map is shown in

Table 19-1.

The individual Configuration bit descriptions for the

Configuration registe rs are shown in Table 19-2.

Note that address 0xF80000 is beyond the user

progra m memory spac e. It b elo ngs to the confi gurat ion

memory sp ac e (0x 800 000 -0x FFFF FF), whic h ca n onl y

be accessed using table reads and table writes.

To prevent the inadvertent configuration changes

during c ode executio n, all progra mmable Confi guration

bits are write-once. After a bit is initially programmed

during a power cycle, it cannot be written to again.

Changi ng a devic e conf igurat ion req uires that p ower to

the device be cycled.

TABLE 19-1: DEVICE CONFIGURATION REGIS TER MAP

Note: This data sheet summarizes the features

of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 devices. It is not

intende d to be a comprehe nsive refer ence

source. To complement the information in

this data sheet, refer to the

“dsPIC33F/PIC24F Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0xF80000 FBS — — — — BSS<2:0> BWRP

0xF80002 Reserved — — — — — — — —

0xF80004 FGS — — — — — GSS<1:0> GWRP

0xF80006 FOSCSEL IESO — — —FNOSC<2:0>

0xF80008 FOSC FCKSM<1:0> IOL1WAY ——OSCIOFNCPOSCMD<1:0>

0xF8000A FWDT FWDTEN WINDIS — WDTPRE WDTPOST<3:0>

0xF8000C FPOR Reserved(1) ALTI2C —FPWRT<2:0>

0xF8000E FICD Reserved(2) JTAGEN — — —ICS<1:0>

0xF80010 FUID0 User Unit ID Byte 0

0xF80012 FUID1 User Unit ID Byte 1

0xF80014 FUID2 User Unit ID Byte 2

0xF80016 FUID3 User Unit ID Byte 3

Legend: — = unimplemented bit, read as ‘0’.

Note 1: These bits are reserved and always read as ‘1’.

2: These bits are reserved for use by development tools and must be programmed as ‘1’.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 174 Preliminary  2009 Microchip Technology Inc.

TABLE 19-2: PIC24HJ32GP202/204 AND PIC24HJ16GP304 CONFIGURATION BITS

DESCRIPTION

Bit Field Register Description

BWRP FBS Boot Segment Program Flash Write Protection

1 = Boot segment may be written

0 = Boot segment is write-protected

BSS<2:0> FBS PIC24HJ32GP202 and PIC24HJ32GP204 Devices Only

Boot Segment Program Flash Code Protection Size

X11 = No Boot program Flash segment

Boot space is 768 Instruction Words (except interrupt vectors)

110 = Standard security; boot program Flash segment ends at 0x0007FE

010 = High security; boot program Flash segment ends at 0x0007FE

Boot space is 3840 Instruction Words (except interrupt vectors)

101 = Standard security; boot program Flash segment, ends at

0x001FFE

001 = High security; boot program Flash segment ends at 0x001FFE

Boot space is 7936 Instruction Words (except interrupt vectors)

100 = S t an dard security ; b oot program Fla sh se gm ent ends a t 0x 003FFE

000 = High security; boot program Flash segment ends at 0x003FFE

BSS<2:0> FBS PIC24HJ16GP304 Devices Only

Boot Segment Program Flash Code Protection Size

X11 = No Boot program Flash segment

Boot space is 768 Instruction Words (except interrupt vectors)

110 = Standard security; boot program Flash segment ends at 0x0007FE

010 = High security; boot program Flash segment ends at 0x0007FE

Boot space is 3840 Instruction Words (except interrupt vectors)

101 = Standard security; boot program Flash segment, ends at

0x001FFE

001 = High security; boot program Flash segment ends at 0x001FFE

Boot space is 5376 Instruction Words (except interrupt vectors)

100 = S t andard securit y; boot prog ram Flash se gment en ds at 0x00 2BFE

000 = High security; boot program Flash segment ends at 0x002BFE

GSS<1:0> FGS General Segment Code -Prote ct bit

11 = Use r program memor y is not code-protected

10 = Standard security

0x = High security

GWRP FGS General Segment Write-Protect bit

1 = User program memory is not write-protected

0 = User program memory is write-protected

IESO FOSCSEL Two-speed Oscillator Start-up Enable bit

1 = Start-up device with FRC, then automatically switch to the

user-selected oscillator source when ready

0 = Start-up device with user-selected oscillator source

FNOSC<2:0> FOSCSEL Initial Oscillator Source Selection bits

111 = Internal Fast RC (FRC) oscillator with postscaler

110 = Internal Fast RC (FRC) oscillator with divide-by-16

101 = LPRC oscillator

100 = Secondary (LP) oscillator

011 = Primary (XT, HS, EC) oscillator with PLL

010 = Primary (XT, HS, EC) oscillator

001 = Internal Fast RC (FRC) oscillator with PLL

000 = FRC oscillator

 2009 Microchip Technology Inc. Preliminary DS70289F-page 175

PIC24HJ32GP202/204 and PIC24HJ16GP304

FCKSM<1:0> FOSC Clock Switching Mode bits

1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled

01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled

00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled

IOL1WAY FOSC Peripheral Pin Select Configuration

1 = Allow only one re-configuration

0 = Allow multiple re-configurations

OSCIOFNC FOSC OSC2 Pin Function bit (except in XT and HS modes)

1 = OSC2 is clock output

0 = OSC2 is gener al purpose digital I /O pin

POSCMD<1:0> FOSC Primary Oscillator Mode Select bits

11 = Primary oscillator disabled

10 = HS Crystal Oscillator mode

01 = XT Crystal Oscillator mode

00 = EC (External Clock) mode

FWDTEN FWDT Watchdog Timer Enable bit

1 = Wa tchdog Timer alw ays enab led (LPRC oscillat or canno t be disabl ed.

Cleari ng th e SWDTEN bi t in th e RCON reg is te r wi ll h av e no effect.)

0 = Watchdog Timer enabled/disabled by user software (LPRC can be

disabled by clearing the SWDTEN bit in the RCON register)

WINDIS FWDT Watchdog Timer Window Enable bit

1 = Watchdog Timer in Non-Window mode

0 = Watchdog Timer in Window mode

WDTPRE FWDT Watchdog Timer Prescaler bit

1 = 1:128

0 = 1:32

WDTPOST<3:0> FWDT Watchdog Timer Postscaler bits

1111 = 1:32,768

1110 = 1:16,384

0001 = 1:2

0000 = 1:1

ALTI2C FPOR Alternate I2C pins

1 = I2C mapped to SDA1/SCL1 pins

0 = I2C mapped to ASDA1/ASCL1 pins

FPWRT<2:0> FPOR Power-on Reset Timer Value Select bits

111 = PWRT = 128 ms

110 = PWRT = 64 ms

101 = PWRT = 32 ms

100 = PWRT = 16 ms

011 = PWRT = 8 ms

010 = PWRT = 4 ms

001 = PWRT = 2 ms

000 = PWRT = Disabled

JTAGEN FICD JTAG Enable bit

1 = JTAG enabled

0 = JTAG disabled

ICS<1:0> FICD I CD Communic ation Channel Sele ct bits

11 = Communicate on PGEC1 and PGED1

10 = Communicate on PGEC2 and PGED2

01 = Communicate on PGEC3 and PGED3

00 = Reserved, do not use

T ABLE 19-2: PIC24HJ32GP202/204 AND PIC24HJ16GP304 CONFIGURATION BITS DESCRIPTION

(CONTINUED)

Bit Field Register Description

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 176 Preliminary  2009 Microchip Technology Inc.

19.2 On-Chip Voltage Regulator

All of the PIC24HJ32GP202/204 and

PIC24HJ16GP304 devices power their core digital

logic at a nominal 2.5V. This can create a conflict for

designs that are required to operate at a higher typical

voltage, such as 3.3V. To simplify system design, all

devices in the PIC24HJ32GP202/204 and

PIC24HJ16GP304 family incorporate an on-chip regu-

lator that allows the device to run its core logic from

VDD.

The regul ator provides power to the c ore from the other

VDD pins. When the regulator is enabled, a low-ESR

(less than 5 ohms) capacitor (such as tantalum or

ceramic) must be connected to the VCAP/VDDCORE pin

(Figure 19-1). This helps to maintain the stability of the

regulator. The recommended value for th e filt er capac-

itor is provided in Table 22-13 located in Section 22.1

“DC Characteristics”.

On a POR, i t take s approxim ately 20 s for the on- chip

voltage regulator to generate an output voltage. During

this time, designated as TSTARTUP, code execution is

disabled. TSTARTUP is applied every time the device

resumes operation after any power-down.

FIGURE 19-1: CONNE CTIONS FOR THE

ON-CHIP VO LTAGE

REGULATOR(1)

19.3 BOR: Brown-Out Reset

The Brown-out Reset (BOR) module is based on an

internal voltage reference circuit that monitors the

regulate d voltage VCAP/VDDCORE. The main purpos e of

the BOR mod ule is to generate a device Reset whe n a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (for

example, missing portions of the AC cycle waveform

due to bad power transmission lines, or voltage sags

due to excessive current draw when a large inductive

load is turned on).

A BOR generates a Reset pulse, which resets the

device. The BOR selects the clock source, based on

the device Configuration bit values (FNOSC<2:0> and

POSCMD<1:0>).

If an osci llator m ode is sel ected , the BOR ac tivates th e

Oscillator Start-up Timer (OST). The system clock is

held until OST expires. If the PLL is used, the clock is

held until the LOCK bit (OSCCON<5>) is ‘1’.

Concurrently, the PWRT time-out (TPWRT) will be

applied before the internal Re set is releas ed. If TPWR T

= 0 and a crystal oscillator is being used, a nominal

delay of TFSCM = 100 is applied. The total delay in this

case is TFSCM.

The BOR Stat us bit (RCON <1>) is set to in dicate tha t a

BOR has occurred. The BOR circuit continues to

operate while in Sleep or Idle mode and resets the

device in case VDD falls below the BOR threshold

voltage.

Note: It is import ant for the low-ESR capa citor to

be placed as close as possible to the

VCAP/VDDCORE pin.

Note 1: These are typical operating voltages. Refer

to Table 2 2-13 loca ted i n Sect ion 22.1 “DC

Characteristics” for the full operating

ranges of VDD and VCAP/VDDCORE.

2: It is important for the low-ESR capacitor to

be placed as close as possible to the

VCAP/VDDCORE pin.

VDD

VCAP/VDDCORE

VSS

PIC24H

CEFC

3.3V

 2009 Microchip Technology Inc. Preliminary DS70289F-page 177

PIC24HJ32GP202/204 and PIC24HJ16GP304

19.4 Watchdog Timer (WDT)

For PIC24HJ32GP202/204 and PIC24HJ16GP304

devices, the WDT is driven by the LPRC oscillator.

When the WDT is enabled, the clock source is also

enabled.

19.4.1 PRESCALER/POSTSCALER

The nominal WDT clock source from LPRC is 32 kHz.

This fee ds a presca ler than can b e configured for either

5-bit (divide-by-32) or 7-bit (divide-by-128) operation.

The presc aler is set by the WDTPRE Con figurati on bit.

With a 32 kHz input, the prescaler yields a nominal

WDT time-out period (TWDT) of 1 ms in 5- bit mode , or

4 ms in 7-bi t mode.

A variable postscaler divides down the WDT prescaler

output and allows for a wide range of time-out periods.

The postscaler is controlled by the WDTPOST<3:0>

Configuration bits (FWDT<3:0>), which allows the

select ion of 16 settings , from 1:1 to 1:32,768. U sing the

prescal er and postscaler , ti me-out periods ranging from

1 ms to 131 seconds can be achieved.

The WDT, prescaler and postscaler are reset:

• On any device Reset

• On the completion of a clock switch, whether

invoked by software (i.e., setting the OSWEN bit

after changing the NOSC bits) or by hardware

(i.e., Fail-Safe Clock Monitor)

• When a PWRSAV instruction is executed (Sleep or

Idle mode is entered)

• When the device exits Sleep or Idle mode to

resume normal operation

•By a CLRWDT instr uction during normal executi on

19.4.2 SL EEP AND IDLE MODES

If the WDT is enabled, it will continue to run during

Sleep or Idle modes. When the WDT time-out occurs,

the device will wake the device and code execution will

continue from where the PWRSAV instruction was

executed. The corresponding SLEEP or IDLE bits

(RCON<3,2>) will need to be cleared in software after

the device wakes up.

19.4.3 ENABLING WDT

The WDT is enabled or disabled by the FWDTEN

Configuration bit in the FWDT Configuration register.

When the FWDTEN Configura tion bit is s et, the WDT is

always enabled.

The WDT flag bit, WDTO (RCON<4>), is not automatically

cleared following a WDT time-out. To detect subsequent

WDT event s, the flag m ust be c leared in s oftware.

The WDT can be optiona lly controll ed in softwa re when

the FWDTEN Configuration bit has been programmed

to ‘0’. The WDT is enabled in software by setting the

SWDTEN control bit (RCON<5>). The SWDTEN

control bi t is cleared on any device Reset. The software

WDT option allows the user application to enable the

WDT for critical code segments and disable the WDT

during non-critical segments for maximum power

savings.

FIGURE 19-2: WD T BLOCK DIAGRAM

Note: The CLRWDT and PWRSAV instructions

clear the prescaler and postscaler counts

when execute d.

Note: If the WINDIS bit (FWD T<6>) is cleare d, the

CLRWDT instruc tion sho uld be ex ecuted by

the ap plicat ion s oftware only du ring the l as t

1/4 of the WDT period. This CLRWDT

wind ow can b e determ ined by us ing a t imer .

If a CLRWDT instruction is executed before

this wi nd ow, a WDT Rese t o c cu rs .

All Device Resets

Transition to New Clock Source

Exit Sleep or Idle Mode

PWRSAV Instruction

CLRWDT Instruction

WDTPRE WDTPOST<3:0>

Watchdog Timer

Prescaler

(divide by N1 ) Postscaler

(divide by N2)

Sleep/Idle

WDT

WDT Window Select

WINDIS

WDT

CLRWDT Instruction

SWDTEN

FWDTEN

LPRC Clock

RS RS

Wake-up

Reset

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 178 Preliminary  2009 Microchip Technology Inc.

19.5 JTAG Interface

PIC24HJ32GP202/204 and PIC24HJ16GP304

devices implement a JTAG interface, which supports

boundary scan device testing, as well as in-circuit

progra mming. Detail ed information on this interfac e will

be provided in future revisions of the document.

19.6 Code Protecti on and

CodeGuard™ Security

The PIC24HJ32GP202/204 and PIC24HJ16GP304

product families offer the intermediate implementation

of CodeGuard Security. CodeGuard Security allows

multi ple partie s to sec urely sha re resou rces (mem ory,

interrupts and peripherals) on a single chip. This

feature helps to protect individual Intellectual Property

in collaborative system designs.

When coupled with software encryption libraries,

CodeGuard Security can be used to securely update

Flash even when multiple IPs reside on the si ngle chip.

The code protection features are controlled by the

Configuration registers: FBS and FGS. The Secure

segment and RAM is not implemented.

TABLE 19-3: CODE FLASH SECURITY

SEGMENT SIZES FOR

32 KBYTE DEVICES

TABLE 19-4: CODE FLASH SECURITY

SEGMENT SIZES FOR

16 KBYTE DEVICES

Note: Refer to “CodeGuard™ Security

Reference Manual” (DS70180) for further

information on usage, configuration and

operation of CodeGuard Security.

CONFIG BITS

BSS<2:0>=x11

BSS<2:0>=x10

256

BSS<2:0>=x01

768

BSS<2:0>=x00

1792

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 11008 IW 003FFEh

004000h

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

003FFEh

004000h

GS = 10240 IW

BS = 768 IW

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

003FFEh

004000h

GS = 7168 IW

BS = 3840 IW

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 3072 IW

003FFEh

004000h

BS = 7936 IW

CONFIG BITS

BSS<2:0>=x11

BSS<2:0>=x10

256

BSS<2:0>=x01

768

BSS<2:0>=x00

1792

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 5376 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 4608 IW

BS = 768 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 1536 IW

BS = 3840 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

BS = 5376 IW

 2009 Microchip Technology Inc. Preliminary DS70289F-page 179

PIC24HJ32GP202/204 and PIC24HJ16GP304

19.7 In-Circuit Seria l Programming

PIC24HJ32GP202/204 and PIC24HJ16GP304 family

microcontrollers can be serially programmed while in

the end application circuit. This is done with two lines

for clock and data, and three other lines for power,

ground and the programming sequence. Serial pro-

gramming allows customers to manufacture boards

with unprogrammed devices and then program the

microcontroller just before shipping the product. Serial

programming also allows the most recent firmware or a

custom firmware to be programmed. Refer to the

“dsPIC30F/33F Flash Programming Specification”

(DS70152) document for details about In-Circuit Serial

Programming (ICSP).

Any of the following three pairs of programming

clock/data pins can be used:

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

19.8 In-Ci rcuit Debugger

When MPLAB® ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This

function all ow s s imple debuggi ng fu nctions w hen use d

with MPLAB IDE. Debugging functionality is controlled

through the Emulation/Debug Clock (PGECx) and

Emulation/Debug Data (PGEDx) pin functions.

Any of the following three pairs of debugging clock/dat a

pins can be used:

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

To make use of the in-circuit debugger function of the

device, the design must implement ICSP connections

to MCLR, VDD, VSS and PGECx/PGEDx pin pair. In

addition, when the feature is enabled, some of the

resources are not available for general use. These

resources include the first 80 bytes of data RAM and

two I/O pins.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 180 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 181

PIC24HJ32GP202/204 and PIC24HJ16GP304

20.0 INSTRUCTION SET SUMMARY

The PIC24H instruction set is identical to that of the

PIC24F, and is a subset of the dsPIC30F/33F

instr uction set.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single-word instruction is a 24-bit word, divided

into an 8-bit opcode, which specifies the instruction

type and one or more operands, which further specify

the operation of the instruction.

The instruction set is highly orthogonal and is grouped

into five bas ic ca tegories:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• Control operations

Table 20-1 shows the general symbols used in

des c ribing the instructions.

The P IC24H ins truction set sum mary in Table 20-2 list s

all the instructions, along with the status flags affected

by each instructio n.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand which is typically a

• The second source operand which is typically a

• The destination of the result which is typically a

However , word or byte-oriented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could either be the file

‘WREG’

Most bit-oriented instructions (including simple

rotate/shift instructions) have tw o operan ds:

• The W register (with or without an address

modifier) or file register (specified by the value of

‘Ws’ or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The litera l instruct ions that invo lve data m ovement ma y

use some of the following operands:

• A lite ral value to b e load ed into a W regi ster or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand which is a register ‘Wb’

without any addre s s modifier

• The second source operand which is a literal

value

• The destination of th e result (only i f not the same

as the first source operand) which is typically a

The control instructions may use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

All instructions are single word. Certain double-word

instructions are designed to provide all of the required

information in these 48 bits. In the second word, the

8MSbs are ‘0’s. If thi s se co nd wo r d is ex ec ut e d as an

instruction (by itself), it will execute as a NOP.

Most single-word instructions are executed in a single

instruction cycle, unless a conditional test is true, or the

program counter is changed as a result of the

instruction. In these cases, the execution takes two

instruction cycles with the additional instruction cycle(s)

executed as a NOP. Notable exceptions are the BRA

(unconditional/computed branch), indirect CALL/GOTO,

all table reads and writes and RETURN/RETFIE

instructions, which are single-word instructions but take

two or three cycles. Certain instructions th at involve skip-

ping over the subsequent instruction require either two

or three cycles if the skip is performed, depending on

whether the instruction being skipped is a single-wo rd or

double word instruction. Moreover, double word moves

require two cycles. The double word instructions

execute in two instruction cycles.

Note: This data sheet summarizes the features

of this group of PIC24HJ32GP202/204

and PIC24HJ16GP304 devices. It is not

intende d to be a comprehe nsive refer ence

source. To complement the information in

this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

Note: For more details on the instruction set,

refer to the “16-bit MCU and DSC Pro-

grammer’s Reference Manual”

(DS70157).

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 182 Preliminary  2009 Microchip Technology Inc.

TABLE 20-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Means literal defined by “text”

(text) Means “content of text”

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double Word mode selection

.S Shadow register select

.w Word mode selection (default)

bit4 4-bit bit selection field (used in word addressed instructions) {0...15}

C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero

Expr Absolute address, label or expression (resolved by the linker)

f File register address {0x0000...0x1FFF}

lit1 1-bit unsigned literal {0,1}

lit4 4-bit unsigned literal {0...15}

lit5 5-bit unsigned literal {0...31}

lit8 8-bit unsigned literal {0...255}

lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal {0...16384}

lit16 16-bit unsigned literal {0...65535}

lit23 23-bit unsigned literal {0...8388608}; LSB must be ‘0’

None Field does not require an entry, may be blank

PC Program Counter

Slit10 10-bit signed literal {-512...511}

Slit16 16-bit signed literal {-32768...32767}

Slit6 6-bit signed literal {-16...16}

Wb Base W register {W0..W15}

Wd Destination W register { Wd, [Wd] , [Wd++], [Wd-- ], [++Wd], [--Wd] }

Wdo Destination W register 

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (direct addressing)

Wm*Wm Multiplicand and Multiplier working register pair for Square instructions 

{W4 * W4,W5 * W5,W6 * W6,W7 * W7}

Wn One of 16 working registers {W0..W15}

Wnd One of 16 destination working registers {W0...W15}

Wns One of 16 source working registers {W0...W15}

WREG W0 (working register used in file register instructions)

Ws Source W register { Ws, [Ws], [Ws++ ], [Ws--] , [+ + Ws], [- -Ws ] }

Wso Source W register 

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

 2009 Microchip Technology Inc. Preliminary DS70289F-page 183

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 20-2: INSTRUCTION SET OVERVIEW

Base

Instr

Assembly

Mnemonic Assemb ly Sy ntax Descr ipt ion # of

Words # of

Cycles Status Flags

Affected

1ADD ADD f f = f + WREG 1 1 C,DC,N,OV,Z

ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z

2 ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z

3AND AND f f = f .AND. WREG 1 1 N,Z

AND f,WREG WREG = f .AND. WREG 1 1 N,Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z

4 ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Rig ht Sh ift Wb by Wns 1 1 N,Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z

5BCLRBCLR f,#bit4 Bit Cle ar f 1 1 Non e

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6BRA BRA C,Expr Bran ch if Carry 1 1 (2) No ne

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsi gne d gre ater than or equal 1 1 (2) No ne

BRA GT,Expr Branch if greater tha n 1 1 (2) N o ne

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigne d le ss than or equ al 1 1 (2) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr Bran ch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) No ne

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr B ran ch if Zero 1 1 (2) No ne

BRA Wn Computed Branch 1 2 None

7 BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 None

8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws <Wb> 1 1 None

9BTG BTG f,#bit4 Bit Toggle f 1 1 None

BTG Ws,#bit4 Bit Toggle Ws 1 1 None

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3) None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3) None

11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1

(2 or 3) None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3) None

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 184 Preliminary  2009 Microchip Technology Inc.

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

16 CLRWDT CLRWDT Clear Wa tchdog Timer 1 1 WDTO,Sleep

17 COM COM f f = f 11 N,Z

COM f,WREG WREG = f 11 N,Z

COM Ws,Wd Wd = Ws 11 N,Z

18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z

CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z

19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z

CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z

20 CPB CPB f Co mpare f with WREG, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,Ws Compare Wb with Ws, with Borrow

(Wb - Ws - C)1 1 C,DC,N,OV,Z

21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3) None

22 CPSGT CPSGT Wb, Wn Comp are Wb with Wn, skip if > 1 1

(2 or 3) None

23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3) None

24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ¼ 1 1

(2 or 3) None

25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

26 DEC DEC f f = f - 1 1 1 C,DC,N,OV,Z

DEC f,WREG WREG = f - 1 1 1 C,DC,N,OV,Z

DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z

27 DEC2 DEC2 f f = f - 2 1 1 C,DC,N,OV,Z

DEC2 f,WREG WREG = f - 2 1 1 C,DC,N,OV,Z

DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z

28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV

30 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

31 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) S ide 1 1 C

32 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

33 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C

34 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to indirect 1 2 None

TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assemb ly Sy ntax Descr ipt ion # of

Words # of

Cycles Status Flags

Affected

 2009 Microchip Technology Inc. Preliminary DS70289F-page 185

PIC24HJ32GP202/204 and PIC24HJ16GP304

35 INC INC f f = f + 1 1 1 C,DC,N,OV,Z

INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

36 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z

INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z

37 IOR IOR f f = f .IOR. WREG 1 1 N,Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z

38 LNK LNK #lit14 Link Frame Pointer 1 1 None

39 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z

40 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 N,Z

MOV f,WREG Move f to WREG 1 1 N,Z

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 N,Z

MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None

41 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd } = sign ed (Wb ) * un si gn ed (Ws ) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd } = uns ign ed (Wb ) * s i gn ed(W s) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(Ws) 11 None

MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = s ign ed (Wb ) * un sig ne d( l it5 ) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(lit5) 11 None

MUL f W3:W2 = f * WREG 1 1 None

42 NEG NEG f f = f + 1 1 1 C,DC,N,OV,Z

NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

43 NOP NOP No Operation 1 1 None

NOPR No Operati o n 1 1 None

44 POP POP f Pop f from Top-of-S tack (TOS) 1 1 None

POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from Top-of-Stack (TOS) to

W(nd):W(nd + 1) 12 None

POP.S Pop Shadow Registe rs 1 1 All

45 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None

PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None

PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack

(TOS) 12 None

PUSH.S Push Shadow Registers 1 1 None

46 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep

TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assemb ly Sy ntax Descr ipt ion # of

Words # of

Cycles Status Flags

Affected

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 186 Preliminary  2009 Microchip Technology Inc.

47 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

48 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None

REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None

49 RESET RESET Software device Reset 1 1 None

50 RETFIE RETFIE Return from interrupt 1 3 (2) None

51 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

52 RETURN RETURN Return from Subroutine 1 3 (2) None

53 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z

RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z

54 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z

RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z

55 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z

RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z

56 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z

57 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z

58 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xF FFF 1 1 None

59 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z

60 SUB SUB f f = f - WREG 1 1 C,DC,N,OV,Z

SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z

SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z

SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z

SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z

61 SUBB SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z

62 SUBR SUBR f f = WREG - f 1 1 C,DC,N,OV,Z

SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z

SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z

SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z

63 SUBBR SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR f,WREG WREG = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z

64 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

65 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assemb ly Sy ntax Descr ipt ion # of

Words # of

Cycles Status Flags

Affected

 2009 Microchip Technology Inc. Preliminary DS70289F-page 187

PIC24HJ32GP202/204 and PIC24HJ16GP304

66 TBLRDL TBLRDL Ws,Wd Read Prog<15: 0> to Wd 1 2 None

67 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None

68 TBLWTL TBLWTL Ws,Wd Write W s to Prog<15: 0> 1 2 None

69 ULNK ULNK Unlink Frame Pointer 1 1 None

70 XOR XOR f f = f .XOR. WREG 1 1 N,Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z

71 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N

TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assemb ly Sy ntax Descr ipt ion # of

Words # of

Cycles Status Flags

Affected

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 188 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 189

PIC24HJ32GP202/204 and PIC24HJ16GP304

21.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers and dsPIC® digital signal

controllers are supported with a full range of software

and hardware development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Various Device

Families

- HI-TECH C for Various Device Families

- MPASMTM Assembler

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

- MPLAB ICD 3

- PICkit™ 3 Debug Express

• Device Progra mm ers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

• Low-C ost D emonstration/Development Boards,

Evaluation Kits, and Starter Kits

21.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- In-Circuit Emulator (sold separately)

- In-Circuit Deb ugger (so ld separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Exten si ve on-l ine help

• Integration of select third par ty to ols, such as

IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files ( either C or assembly)

• One-tou ch compile o r assemble , and downl oad to

emulator and simulator tools (automatically

updates all project information)

• Debug us ing :

- Sour ce files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 190 Preliminary  2009 Microchip Technology Inc.

21.2 MPLAB C Compilers for Various

Device Families

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

For easy source level debugging, the comp ilers provide

symbol info rmation tha t is optimized to the MPLAB IDE

debugger.

21.3 HI-TECH C for Various Device

Families

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontroll ers and the dsPIC family of digita l

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of use.

For easy source level debugging, the comp ilers provide

symbol info rmation tha t is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker, pre-

process or , and one-s tep driver , and can run on multipl e

platforms.

21.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly co de

• Conditional assembly for multi-purpose

sour ce fil es

• Directives that allow complete control over the

assembly process

21.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLA B C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB O bject Li brarian manage s the cre ation an d

modification of library files of precompiled code. When

a rout in e from a l ibra ry is c al led fro m a so urc e file, o nly

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, re placement, delet ion and extraction

21.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the asse mbler to pro duce i ts o bje ct file . The ass embl er

generates relocatable object files that can then be

archived or lin ked with other relocatable ob ject files and

arch ives to c rea te an e xecu tabl e fil e. N otab le fe atu res

of the assembler include:

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich dire cti ve set

• Flexible macro language

• MPLAB IDE compatibility

 2009 Microchip Technology Inc. Preliminary DS70289F-page 191

PIC24HJ32GP202/204 and PIC24HJ16GP304

21.7 MPLAB SIM Sof tware Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most periph erals and i nternal regi sters.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The soft-

ware simulator offers the flexibility to develop and

debug code outside of the hardware laboratory envi-

ronment, making it an excellent, economical software

developm ent tool .

21.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC® Flash MCUs and dsPIC® Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated D evelopment Environment (IDE),

included with each kit.

The emulator is connected to the design engineer’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The emulator is field upgrad able through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers signifi-

cant advantages over competitive emulators including

low-cost, full-speed emulation, run-time variable

watches, trace analysis, complex breakpoints, a rugge-

dized probe interface and long (up to three meters) inter-

connection cables.

21.9 MPLAB ICD 3 In-Circuit Debugger

System

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip's most cost effective high-speed hardware

debugger/programmer for Microchip Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

device s. It debugs and programs PIC® Flash microco n-

trollers and dsPIC® DSCs with the powerful, yet easy-

to-use graphical user interface of MPLAB Integrated

Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nect ed to t he des ign e nginee r's PC using a hig h-spee d

USB 2.0 i nte rfac e a nd is co nnected to the target w ith a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 support s all

MPLAB ICD 2 headers.

21.10 PICkit 3 In-Cir cuit Debugger/

Programmer and

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and program-

ming of PIC® and dsPIC® Flash microcontrollers at a

most af fordable price point using the powerful graphi cal

user interface of the MPLAB Integrated Development

Environment (IDE). The MPLAB PICkit 3 is connected

to the design engineer's PC using a full speed USB

interface and can be connected to the target via an

Microchip debug (RJ-11) connector (compatible with

MPLAB ICD 3 and MPLAB REAL ICE). The connector

uses two device I/O pins and the reset line to imple-

ment in-circuit debugging and In-Circuit Serial Pro-

gramming™.

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller , hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 192 Preliminary  2009 Microchip Technology Inc.

21.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

The P ICkit™ 2 Develo pment Program mer/Debu gger i s

a low-cost development tool with an easy to use inter-

face fo r programmin g and debu gging Micr ochip’s Flash

families of microcontrollers. The full featured

Windows® programming interface supports baseline

(PIC10F, PIC12F5xx, PIC16F5xx), midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC3 2 fam ilies o f 8 - bi t, 1 6-b it, an d 3 2-b it

microcontrollers, and many Microchip Serial EEPROM

produ cts . With Mic rochip ’s power ful MPL AB Integrate d

Development Environment (IDE) the PICkit™ 2

enables in-circuit debugging on most PIC® microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the application. When halted at a break-

point, the file reg ist ers can be ex amin ed and m odifie d.

The PICkit 2 Debug Express inclu de the PICkit 2, demo

board and microcontroller , hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

21.12 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64 ) for me nus an d err or messag es an d a modu-

lar, detachable socket assembly to support various

package type s. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Devic e Programmer can rea d, verify an d program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPL AB PM3 has high-spe ed comm unications and

optimized algorithms for quick programming of large

memory devices and inc orporates an MMC card for file

storage and data applications.

21.13 Demonstration/Development

Boards, Evaluation Kits, and

Starter Kits

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The board s suppo rt a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory .

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Also available are starter kits that contain everything

needed to experience t he specified d evice. This usually

includes a single application and debug capability, all

on one board.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 193

PIC24HJ32GP202/204 and PIC24HJ16GP304

22.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of PIC24HJ32GP202/204 and PIC24HJ16GP304 electrical characteristics.

Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC24HJ32GP202/204 and PIC24HJ16GP304 family are listed below. Exposure to

these m aximum ratin g con dition s for e xtend ed peri ods can a ffe ct dev ice reliabi lity. Functio nal opera tio n of t he dev ice at

these or a ny other co nditions above the p aramete rs indica ted in the op eration lis tings of th is speci fication is not implie d.

Absolute Maximum Ratings(1)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Volta ge on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any pin that is not 5V tolerant with respect to VSS(4) ....................................................-0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(4)................................................... -0.3V to +5.6V

Voltage on any 5V tolerant pin with respect to Vss when VDD  3.0V(4).........................................-0.3V to (VDD + 0.3V)

Volta ge on VCAP/VDDCORE with respect to VSS ...................................................................................... 2.25V to 2.75V

Maximum curr ent out of VSS pin ...........................................................................................................................300 mA

Maximum curr ent into VDD pin(2)...........................................................................................................................250 mA

Maximum output current sunk by any I/O pin(3)........................................................................................................4 mA

Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports(2)...............................................................................................................200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 22-2).

3: Excepti ons a re C LKOUT, which is a ble to sink/s ource 25 m A, a nd the V REF+, VREF-, SCLx, SDAx, PGECx

and PGEDx pins, which are able to sink/source 12 mA.

4: Refer to the “Pin Diagrams” section for 5V tolerant pins.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 194 Preliminary  2009 Microchip Technology Inc.

22.1 DC Characteri stics

TABLE 22-1: OPERATING MIPS VS. VOLTAGE

Characteristic VDD Range

(in Volts) Temp Range

(in °C)

Max MIPS

PIC24HJ32GP202/204 and

PIC24HJ16GP304

3.0-3.6V -40°C to +85°C 40

3.0-3.6V -40°C to +125°C 40

TABLE 22-2: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

Industri al Temperatu r e Devi ces

Operating Junction Temperature Range TJ-40 — +125 °C

Operating Ambient Temperature Range TA-40 — +85 °C

Extended Temperature Devices

Operating Junction Temperature Range TJ-40 — +140 °C

Operating Ambient Temperature Range TA-40 — +125 °C

Power Dissipation:

Internal ch ip pow er dis sipatio n:

PINT = VDD x (IDD -  IOH) PDPINT + PI/OW

I/O Pin Power Dissipation:

I/O =  ({VDD - VOH} x IOH) +  (VOL x IOL)

Maximum Allo wed Power Dissipation PDMAX (TJ - TA)/JA W

TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 44-pin QFN JA 32 — °C/W 1

Package Thermal Resistance, 44-pin TFQP JA 45 — °C/W 1

Package Thermal Resistance, 28-pin SPDIP JA 45 — °C/W 1

Package Thermal Resistance, 28-pin SOIC JA 50 — °C/W 1

Package Thermal Resistance, 28-pin QFN-S JA 35 — °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 195

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage

DC10 Supply Voltage

VDD — 3.0 — 3.6 V Industrial and Extended

DC12 VDR RAM Data Retention Voltage(2) 1.8 — — V —

DC16 VPOR VDD Start Voltage(4)

to ensure internal

Power-on Reset signal

——V

SS V—

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.03 — — V/ms 0-3.0V in 0.1s

DC18 VCORE VDD Core(3)

Internal regulator voltage 2.25 — 2.75 V Voltage is dep end en t on

load, temperature and

VDD

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: This is the limit to wh ich VDD can be lowered without losing RAM data.

3: These parameters are characterized but not tested in manufacturing.

4: VDD voltage must remain at Vss for a minimum of 200 µs to ensure POR.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 196 Preliminary  2009 Microchip Technology Inc.

TABLE 22-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperat ure -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC20d 20 30 mA -40°C

3.3V 10 MIPS(3)

DC20a 19 30 mA +25°C

DC20b 19 30 mA +85°C

DC20c 19 35 mA +125°C

DC21d 28 40 mA -40°C

3.3V 16 MIPS(3)

DC21a 27 40 mA +25°C

DC21b 27 45 mA +85°C

DC21c 27 45 mA +125°C

DC22d 33 50 mA -40°C

3.3V 20 MIPS(3)

DC22a 33 50 mA +25°C

DC22b 33 55 mA +85°C

DC22c 33 55 mA +125°C

DC23d 44 70 mA -40°C

3.3V 30 MIPS(3)

DC23a 43 70 mA +25°C

DC23b 42 70 mA +85°C

DC23c 41 70 mA +125°C

DC24d 55 90 mA -40°C

3.3V 40 MIPS

DC24a 54 90 mA +25°C

DC24b 52 90 mA +85°C

DC24c 51 90 mA +125°C

Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loa din g an d s w itc hi ng ra te, os cil la tor ty pe , internal cod e execut ion p a ttern and temp erature, als o h av e

an imp act on th e current consum ption . The test co nd itions f or all IDD measurement s a r e as f oll ow s: OS C1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS.

MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are

operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits

are all zeroed).

3: These p aram et ers are charac teri ze d, but are not tes ted in manufa ct urin g.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 197

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

DC40d 7 20 mA -40°C

3.3V 10 MIPS(3)

DC40a 6 20 mA +25°C

DC40b 6 20 mA +85°C

DC40c 6 20 mA +125°C

DC41d 10 20 mA -40°C

3.3V 16 MIPS(3)

DC41a 8 mA +25°C20

DC41b 8 20 mA +85°C

DC41c 8 20 mA +125°C

DC42d 11 20 mA -40°C

3.3V 20 MIPS(3)

DC42a 10 20 mA +25°C

DC42b 10 20 mA +85°C

DC42c 10 20 mA +125°C

DC43d 14 25 mA -40°C

3.3V 30 MIPS(3)

DC43a 13 25 mA +25°C

DC43b 13 25 mA +85°C

DC43c 13 25 mA +125°C

DC44d 14 30 mA -40°C

3.3V 40 MIPS

DC44a 17 30 mA +25°C

DC44b 17 30 mA +85°C

DC44c 18 30 mA +125°C

Note 1: Data in “Typic al” co lumn is at 3 .3V, 25°C unless otherwise stated.

2: Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module

Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS.

3: These parameters are characterized, but are not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 198 Preliminary  2009 Microchip Technology Inc.

TABLE 22-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power-Down Current (IPD)(2)

DC60d 55 500 A-40°C

3.3V Base Power-Down Current(3,4)

DC60a 63 500 A +25°C

DC60b 85 750 A +85°C

DC60c 146 1000 A +125°C

DC61d 8 15 A-40°C

3.3V W atc hd og Timer Current: IWDT(3,5)

DC61a 2 3 A +25°C

DC61b 2 3 A +85°C

DC61c 1 2 A +125°C

Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.

2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>)=1.

3: The  current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

4: These currents are measured on the device containing the most memory in this family.

5: These p aram et ers are charac teri ze d, but are not tes ted in manufa ct urin g.

TABLE 22-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Parameter No. Typical(1,2) Max Doze

Ratio Units Conditions

DC73a 41 50 1:2 mA -40°C 3.3V 40 MIPSDC73f 20 25 1:64 mA

DC73g 19 25 1:128 mA

DC70a 40 45 1:2 mA +25°C 3.3V 40 MIPSDC70f 18 25 1:64 mA

DC70g 18 25 1:128 mA

DC71a 40 45 1:2 mA +85°C 3.3V 40 MIPSDC71f 18 25 1:64 mA

DC71g 18 25 1:128 mA

DC72a 39 45 1:2 mA +125°C 3.3V 40 MIPSDC72f 18 25 1:64 mA

DC72g 18 25 1:128 mA

Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.

2: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 199

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C  TA+125°C for Extende d

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage

DI10 I/O pins VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 I/O Pins with OSC1 or SOSCI VSS —0.2VDD V

DI18 I/O Pins with I2CVSS —0.3 VDD V SMbus disabled

DI19 I/O Pins with I2C VSS —0.2 VDD V SMbus enabled

VIH Input High Voltage

DI20 I/O Pins Not 5V Tolerant(4)

I/O Pins 5V Tolerant(4) 0.7 VDD

0.7 VDD —

—VDD

5.5 V

V—

ICNPU CNx Pull-up Current

DI30 50 250 400 AV

DD = 3.3V, VPIN = VSS

IIL Input Leakage Current(2,3)

DI50 I/O Pins 5V Tolerant(4) ——±2AVSS  VPIN  VDD,

Pin at hi gh-i mpedance

DI51 I/O Pins Not 5V Tolerant(4) ——±1AVSS  VPIN  VDD,

Pin at hi gh-i mpedance,

-40°C TA +85°C

DI51a I/O Pins Not 5V Tolerant(4) ——±2A Shared with external refer-

ence pins, -40°C TA

+85°C

DI51b I/O Pins Not 5V Tolerant(4) ——±3.5AVSS  VPIN  VDD, Pin at

high-impedance,

-40°C TA +125°C

DI51c I/O Pins Not 5V Tolerant(4) ——±8A Analog pins shared with

external refe renc e pins ,

-40°C TA +125°C

DI55 MCLR ——±2AVSS VPIN VDD

DI56 OSC1 — — ±2 AVSS VPIN VDD,

XT and HS modes

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of digital-only and analog pins.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 200 Preliminary  2009 Microchip Technology Inc.

TABLE 22-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

VOL Output Low Voltage

DO10 I/O ports — — 0.4 V IOL = 2mA, VDD = 3.3V

DO16 OSC2/CLKO — — 0.4 V IOL = 2mA, VDD = 3.3V

VOH Output High Voltage

DO20 I/O ports 2.40 — — V IOH = -2.3 mA, VDD = 3.3V

DO26 OSC2/CLKO 2.41 — — V IOH = -1.3 mA, VDD = 3.3V

TABLE 22-11: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operati ng tem per ature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

BO10 VBOR BOR Event on VDD transition

high-to-low

BOR event is tied to VDD core voltage

decrease

2.40 — 2.55 V —

Note 1: Parameters are for design guidance only and are not tested in manufacturing.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 201

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS

TABLE 22-12: DC CHARACTERISTICS: PROGRAM MEMORY

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(3) Min Typ(1) Max Units Conditions

Program Flash Memory

D130 EPCell Endurance 10,000 — — E/W -40 C to +125C

D131 VPR VDD for Read VMIN —3.6VVMIN = Minimum operating

voltage

D132B VPEW VDD for Self-Timed Write VMIN —3.6VVMIN = Minimum operating

voltage

D134 TRETD Characteristic Retention 20 — — Year Provided no other specifications

are violated, -40C to +125C

D135 IDDP Supply Current during

Programming —10—mA

D136a TRW Row Write Time 1.32 — 1.74 ms TRW = 11064 FRC cycles,

TA = +85°C, See Note 2

D136b TRW Row Write Time 1.28 — 1.79 ms TRW = 11064 FRC cycles,

TA = +125°C, See Note 2

D137a TPE Page Erase Time 20.1 — 26.5 ms TPE = 168517 FRC cycles,

TA = +85°C, See Note 2

D137b TPE Page Erase Time 19.5 — 27.3 ms TPE = 168517 FRC cycles,

TA = +125°C, See Note 2

D138a TWW Word Write Cycle Time 42.3 — 55.9 sTWW = 355 FRC cycles,

TA = +85°C, See Note 2

D138b TWW Word Write Cycle Time 41.1 — 57.6 sTWW = 355 FRC cycles,

TA = +125°C, See Note 2

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Ot her co nditions : FRC = 7.37 MHz, TUN< 5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).

This parameter depends on the FRC accuracy (see Table 22-18) and the value of the FRC Oscillator Tun-

ing register (see Register 8-4). For complete details on calculating the Minimum and Maximum time see

Section 5.3 “Programming Operations”.

3: These parameters are assured by design, but are not characterized or tested in manufacturing.

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  T

A +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristics Min Typ Max Units Comments

CEFC External Filter Cap ac ito r

Value 4.7 10 — F Capacitor must be low

series res is t anc e

(< 5 ohms)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 202 Preliminary  2009 Microchip Technology Inc.

22.2 AC Characteri stics and Ti ming

Parameters

The information contained in this section defines

PIC24HJ32GP202/204 and PIC24HJ16GP304 AC

characteristics and timing parameters.

TABLE 22-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 22-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

TABLE 22-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pera ture -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Operati ng voltage VDD range as described in Section 22.0 “Electric al

Characteristics”.

Param

No. Symbol Characteristic Min Typ Max Units Conditions

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XT and HS modes when

external clock is used to drive

OSC1

DO56 CIO All I/O pins and OSC2 — — 50 pF EC mode

DO58 CBSCLx, SDAx — — 400 pF In I2C™ mode

VDD/2

VSS

RL= 464

CL= 50 pF for all pins except OSC2

15 pF for OSC2 output

Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2

 2009 Microchip Technology Inc. Preliminary DS70289F-page 203

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-2: EX TER NAL CLOCK TIMING

TABLE 22-16: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symb Characteristic Min Typ(1) Max Units Conditions

OS10 FIN External CLKI Frequency

(External clocks allowed only

in EC and ECPLL modes)(4)

DC — 40 MHz EC

Oscilla tor C rys tal Frequency(5) 3.5

10 —

—

MHz

kHz

SOSC

OS20 TOSC TOSC = 1/ FOSC(4) 12.5 — DC ns —

OS25 TCY Instructi on Cycle Time(2,4) 25 — DC ns —

OS30 TosL,

TosH External Clock in (OSC1)(5)

High or Low Ti me 0.375 x TOSC — 0.625 x TOSC ns EC

OS31 TosR,

TosF External Clock in (OSC1)(5)

Rise or Fall Time — — 20 ns EC

OS40 TckR CLKO Rise Time(3,5) —5.2—ns —

OS41 TckF CLKO Fall Time(3,5) —5.2—ns —

OS42 GMExternal Oscillator

Transconductance(6) 14 16 18 mA/V VDD = 3.3V

TA = +25ºC

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits can result in an unstable oscillator

operation and/or higher than expected current consumption. All devices a re te sted t o oper ate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“max.” cycle time limit is “DC” (no clock) for all devices.

3: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.

4: These parameters are characterized by similarity, but are tested in manufacturing at FIN = 40 MHz only.

5: These parameters are characterized by similarity, but are not tested in manufacturing.

6: Data for this parameter is preliminary. This parameter is characterized, but is not tested in manufacturing.

Q1 Q2 Q3 Q4

OSC1

CLKO

Q1 Q2 Q3 Q4

OS20

OS25

OS30 OS30

OS40

OS41

OS31 OS31

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 204 Preliminary  2009 Microchip Technology Inc.

TABLE 22-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS50 FPLLI PLL Voltage Controlled

Oscillator (VCO) Input

Frequency Range(2)

0.8 — 8 MHz ECPLL, XTPLL modes

OS51 FSYS On-Chip VCO System

Frequency(3) 100 — 200 MHz —

OS52 TLOCK PLL Start-up Time (Lock Time)(3) 0.9 1.5 3.1 ms —

OS53 DCLK CLKO Stabi lit y (Jitt er)(3) -3 0.5 3 % Measured over 100 ms

period

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: These parameters are characterized by similarity, but are tested in manufacturing at 7.7 MHz input only.

3: These parameters are characterized by similarity, but are not tested in manufacturing.

TABLE 22-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise sta ted)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1,2)

F20a FRC -2 — +2 % -40°C  TA +85°C VDD = 3.0-3.6V

F20b FRC -5 — +5 % -40°C  TA +125°C VDD = 3.0-3.6V

Note 1: Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.

2: FRC is set to initial frequency of 7.37 MHz (±2%) at 25°C.

TABLE 22-19: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ 32.768 kHz(1,2)

F21a LPRC -20 ±6 +20 % -40°C  TA +85°C VDD = 3.0-3.6V

F21b LPRC -70 — +70 % -40°C  TA +125°C VDD = 3.0-3.6V

Note 1: Change of LPRC frequency as VDD changes.

2: LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 19.4 “Watchdog

Time r (W DT)” for more information.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 205

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-3: I/O TIMING CHARACTERISTICS

TABLE 22-20: I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pera ture -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(2) Min Typ(1) Max Units Conditions

DO31 TIOR Port Output Rise Time — 1 0 25 ns —

DO32 TIOF Port Output Fall Ti me — 10 25 ns —

DI35 TINP INTx Pin High or Low Time (output) 25 — — ns —

DI40 TRBP CNx High or Low Time (input) 2 — — TCY —

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: These parameters are characterized, but are not tested in manufacturing.

Note: Refer to Figure 22-1 for load conditions.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Val ue New Value

DI40

DO31

DO32

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 206 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-4: RES ET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER T IMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to Figure 22-1 for load conditions.

FSCM

Delay

SY35

SY30

SY12

 2009 Microchip Technology Inc. Preliminary DS70289F-page 207

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min Typ(2) Max Units Conditions

SY10 TMCLMCLR Pulse-Width (low)(1) 2 — — s -40°C to +85°C

SY11 TPWRT Power-up Timer Period(1) —2

128

— ms -40°C to +85°C

User program ma ble

SY12 TPOR Power-on Reset Delay(3) 31030s -40°C to +85°C

SY13 TIOZ I/O High-Impedance from

MCLR Low or Watchdog

Timer R ese t(1)

0.68 0.72 1.2 s—

SY20 TWDT1 Watchd og Timer T i me -out

Period(1) ———msSee Section 1 9.4 “Watchdog

Timer (WDT)” and LPRC

speci fic ati on F21a (Table 22-19).

SY30 TOST Oscillator Start-up Time — 1024

TOSC ——TOSC = OSC 1 period

SY35 TFSCM Fail-Safe Clock Monitor

Delay(1) — 500 900 s -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: These parameters are characterized by similarity, but are not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 208 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS

TABLE 22-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operati ng tem pe rature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(2) Min Typ Max Units Conditions

TA10 TTXH TxCK High Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA11 TTXL TxCK Low Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA15 TTXP TxCK Input Period Synchronous,

no prescaler TCY + 40 — — ns —

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

———N = prescale

value

(1, 8, 64, 256)

Asynchronous 20 — — ns —

OS60 Ft1 SOSC1/T1CK Oscillator Input

frequency Range (oscillator enabled

by setting bit TCS (T1CON<1>))

DC — 50 kHz —

TA20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY 1.5

TCY ——

Note 1: Timer1 is a Type A.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

Note: Refer to Figure 22-1 for load conditions.

Tx11

Tx15

Tx10

Tx20

TMRx OS60

TxCK

 2009 Microchip Technology Inc. Preliminary DS70289F-page 209

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pera ture -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TB10 TtxH TxCK High Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB11 TtxL TxCK Low Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB15 TtxP TxCK Input

Period Synchronous,

no prescaler TCY + 40 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TB20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY — 1.5 TCY ——

Note 1: These parameters are characterized, but are not tested in manufacturing.

TABLE 22-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input Period Synchr ono us ,

no prescaler TCY + 40 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with presca le r Greater of:

20 ns or

(TCY + 40)/N

TC20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY —1.5

TCY ——

Note 1: These parameters are characterized, but are not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 210 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-6: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

FIGURE 22-7: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

TABLE 22-25: INPUT CAPTURE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Time No Prescaler 0 .5 TCY + 20 — ns —

With Prescaler 10 — ns

IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns —

With Prescaler 10 — ns

IC15 TccP ICx Input Period (TCY + 40)/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

TABLE 22-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Ope rati ng temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

OC10 TccF OCx Output Fall Time — — — ns See parameter D032

OC11 TccR OCx Output Rise Time — — — ns See parameter D031

Note 1: These parameters are characterized but not tested in manufacturing.

ICx

IC10 IC11

IC15

Note: Refer to Figure 22-1 for load cond itio ns .

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 22-1 for load conditions.

or PWM Mode)

 2009 Microchip Technology Inc. Preliminary DS70289F-page 211

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-8: OC/PW M MODULE TIMING CHARACTERISTICS

TABLE 22-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

OC15 TFD Fault Input to PWM I/O

Change — — 50 ns —

OC20 TFLT Fault Input Pulse-Width 50 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

OCFA/OCFB

OCx

OC20

OC15

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 212 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-9: SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDIx

SP11 SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

MSb In LSb In

Bit 14 - - - -1

SP30

SP31

Note: Refer to Figure 22-1 for load conditions.

TABLE 22-28: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operati ng tem per ature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKx Output Low Time TCY/2 — — ns See Note 3

SP11 TscH SCKx Output High Time TCY/2 — — ns See Note 3

SP20 TscF SCKx Output Fall Time — — — ns See parameter D032

and Note 4

SP21 TscR SCKx Output Rise Time — — — ns See parameter D031

and Note 4

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter D032

and Note 4

SP31 TdoR SDOx Data Output Rise Ti me — — — ns See parameter D031

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — 6 20 ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 23 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPIx pins.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 213

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-10: SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS

TABLE 22-29: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SDIX

SP36

SP30,SP31

SP35

MSb

MSb In

Bit 14 - - - - - -1

LSb In

Bit 14 - - - -1

LSb

Note: Refer to Figure 22-1 for load conditions.

SP11 SP10 SP20

SP21

SP20

SP40

SP41

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKx Output Low Time TCY/2 — — ns See Note 3

SP11 TscH SCKx Output High Time TCY/2 — — ns See Note 3

SP20 TscF SCKx Output Fall Time — — — ns See parameter D032

and Note 4

SP21 TscR SCKx Output Rise Time — — — ns See parameter D031

and Note 4

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter D032

and Note 4

SP31 T doR SDOx Data Output Rise Time — — — ns See parameter D031

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdoV2sc,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 T diV2scH,

TdiV2scL Setup Time of SDIx Data

Input to SCKx Edge 23 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 214 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-11: SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

SSX

SCKX

(CKP =

)

SCKX

(CKP =

)

SDOX

SP50

SP40 SP41

SP30,SP31 SP51

SP35

MSb LSb

Bit 14 - - - - - -1

MSb In Bit 14 - - - -1 LSb In

SP52

SP73

SP72

SP73

SP71 SP70

Note: Refer to Figure 22-1 fo r load conditions.

SDIX

TABLE 22-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCKx Input Low Time 30 — — ns —

SP71 TscH SCKx Input High Time 30 — — ns —

SP72 TscF SCKx Input Fall Time — 10 25 ns See Note 3

SP73 TscR SCKx Input Rise Time — 10 25 ns See Note 3

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter D032

and Note 3

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter D031

and Note 3

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — — 30 ns —

SP40 TdiV2scH,

TdiV2scL Set up Time of SDIx Data Input

to SCKx Edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold T im e of SDIx Data Input to

SCKx Edge 20 — — ns —

SP50 TssL2scH,

TssL2scL SSx  to SCKx  or SC Kx Input 120 — — ns —

SP51 TssH2doZ SSx  to SDOx Output

High-Impedance 10 — 50 ns See Note 3

SP52 TscH2ssH

TscL2ssH SSx after SCKx Edge 1.5 TCY +40 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: Assumes 50 pF load on all SPIx pins.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 215

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-12: SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SSx

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDI

SP50

SP60

SDIx

SP30,SP31

MSb Bit 14 - - - - - -1 LSb

SP51

MSb In Bit 14 - - - -1 LSb In

SP35

SP52

SP73

SP72

SP73

SP71 SP70

SP40 SP41

Note: Refer to Figure 22-1 for load conditions.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 216 Preliminary  2009 Microchip Technology Inc.

TABLE 22-31: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise sta ted)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP7 0 TscL SCKx Inp ut Low Time 30 — — ns —

SP71 TscH SCKx Inp ut Hi gh Time 30 — — ns —

SP72 TscF SCKx Input Fall Time — 10 25 ns See Note 3

SP73 TscR SCKx Input Rise Time — 10 25 ns See Note 3

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter D032

and Note 3

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter D031

and Note 3

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge ——30ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 20 — — ns —

SP50 TssL2scH,

TssL2scL SSx  to SCKx  or SCKx 

Input 120 — — ns —

SP51 TssH2doZ SSx  to SDOX Output

High-Impedance 10 — 50 ns See Note 4

SP52 TscH2ssH

TscL2ssH SSx  after SCKx Edge 1.5 TCY + 40 — — ns —

SP60 TssL2doV SDOx Data Output Valid after

SSx Edge ——50ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 217

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-13: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 22-14: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM31 IM34

SCLx

SDAx

Start

Condition Stop

Condition

IM30 IM33

Note: Refer to Figure 22-1 for load conditions.

IM11 IM10 IM33

IM11 IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCLx

SDAx

Out

Note: Refer to Figure 22-1 for load conditions.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 218 Preliminary  2009 Microchip Technology Inc.

TABLE 22-32: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(3) Min(1) Max Units Conditions

IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) — s—

400 kHz mode TCY/2 (BRG + 1) — s—

1 MHz mode(2) TCY/2 (BRG + 1) — s—

IM11 THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) — s—

400 kHz mode TCY/2 (BRG + 1) — s—

1 MHz mode(2) TCY/2 (BRG + 1) — s—

IM20 TF:SCL SDAx and SCLx

Fall Time 100 kHz mode — 300 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 100 ns

IM21 TR:SCL SDAx and SCLx

Rise Time 100 kHz mode — 1000 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 300 ns

IM25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(2) 40 — ns

IM26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — s—

400 kHz mode 0 0.9 s

1 MHz mode(2) 0.2 — s

IM30 TSU:STA Start Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — s Only r eleva nt for

Repeated Start

condition

400 kHz mode TCY/2 (BRG + 1) — s

1 MHz mode(2) TCY/2 (BRG + 1) — s

IM31 THD:STA Start Condition

Hold Time 100 kHz mode TCY/2 (BRG + 1) — s After this period the

first clock pulse is

generated

400 kHz mode TCY/2 (BRG + 1) — s

1 MHz mode(2) TCY/2 (BRG + 1) — s

IM33 TSU:STO Stop Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — s—

400 kHz mode TCY/2 (BRG + 1) — s

1 MHz mode(2) TCY/2 (BRG + 1) — s

IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — ns —

Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns

1 MHz mode(2) TCY/2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock 100 kHz mode — 3500 ns —

400 kHz mode — 1000 ns —

1 MHz mode(2) — 400 ns —

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — s Tim e the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — s

1 MHz mode(2) 0.5 — s

IM50 CBBus Capacitive Loading — 400 pF —

Note 1: BRG is the value of the I2C Baud Rate Generato r . Refer to Sectio n 19. “Inter-In tegrated Circu it (I2C™)”

in the “PIC24H Family Reference Manual”.

2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

3: These parameters are characterized by similarity, but are not tested in manufacturing.

4: Typical value for this parameter is 130 ns.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 219

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-15: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 22-16: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IM51 TPGD Pulse Gobbler delay 65 390 ns See Note 4

TABLE 22-32: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic(3) Min(1) Max Units Conditions

Note 1: BRG is the value of the I2C Baud Rate Generato r . Refer to Sectio n 19. “Inter-In tegrated Circu it (I2C™)”

in the “PIC24H Family Reference Manual”.

2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

3: These parameters are characterized by similarity, but are not tested in manufacturing.

4: Typical value for this parameter is 130 ns.

IS31 IS34

SCLx

SDAx

Start

Condition Stop

Condition

IS30 IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCLx

SDAx

Out

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 220 Preliminary  2009 Microchip Technology Inc.

TABLE 22-33: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param Symbol Characteristic(2) Min Max Units Conditions

IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — s Device must operate at a

minimum of 1.5 M Hz

400 kHz mode 1.3 — s Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — s—

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — s Device must operate at a

minimum of 1.5 M Hz

400 kHz mode 0.6 — s Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — s—

IS20 TF:SCL SDAx and SCLx

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mo de 20 + 0.1 CB300 ns

1 MHz mode(1) — 100 ns

IS21 TR:SCL SDAx and SCLx

Rise Time 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mo de 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

IS25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time 100 kHz mode 0 0 s—

400 kHz mode 0 0.9 s

1 MHz mode(1) 00.3s

IS30 TSU:STA Start Conditi on

Setup Time 100 kHz mode 4.7 — s Only relevant for Repeated

Start condition

400 kHz mode 0.6 — s

1 MHz mode(1) 0.25 — s

IS31 THD:STA Start Condition

Hold Time 100 kHz mode 4.0 — s Af ter thi s period, the firs t

clo ck pulse is generated

400 kHz mode 0.6 — s

1 MHz mode(1) 0.25 — s

IS33 TSU:STO Stop Condition

Setup Time 100 kHz mode 4.7 — s—

400 kHz mode 0.6 — s

1 MHz mode(1) 0.6 — s

IS34 THD:ST

OStop Condition

Hold Time 100 kHz mode 4000 — ns —

400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid

From Clock 100 kHz mode 0 3500 ns —

400 kHz mode 0 1000 ns

1 MHz mode(1) 0 350 ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — s

1 MHz mode(1) 0.5 — s

IS50 CBBus Capacitive Loading — 400 pF —

Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

2: These parameters are characterized by similarity, but are not tested in manufacturing.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 221

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-34: ADC MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating tempe rature -40 °C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply(2) Greater of

VDD – 0.3

or 3.0

— Lesser of

VDD + 0.3

or 3.6

V—

AD02 AVSS Module VSS Supply (2) VSS – 0.3 — VSS + 0 .3 V —

Reference Inputs

AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD VSee Note 1

AD05a 3.0 — 3.6 V VREFH = AVDD

VREFL = AVSS = 0, se e Note 2

AD06 VREFL Reference Voltage Low AVSS —AVDD – 2.7 V See Note 1

AD06a 0 — 0 V VREFH = AVDD

VREFL = AVSS = 0, se e Note 2

AD07 VREF Absolute Re ference

Voltage(2) 2.7 — 3.6 V VREF = VREFH - VREFL

AD08 IREF Current Drain —

—250

—550

10 A

AADC operating, See Note 1

ADC off, See Note 1

AD08a IAD Operati ng Curren t —

—7.0

2.7 9.0

3.2 mA

mA 10-bit ADC mode, See Note 2

12-bit ADC mode, See Note 2

Analog Input

AD12 VINH Input Voltage Range

VINH(2) VINL —VREFH V This voltage reflects Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), positive

input

AD13 VINL Input Voltage Range

VINL(2) VREFL —AVSS + 1V V This voltage refle cts Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), negative

input

AD17 RIN Recommended Imped-

ance of Analog Voltage

Source(3)

—

——

—200

200 

10-bit ADC

12-bit ADC

Note 1: These parameters are not characterized or tested in manufacturing.

2: These parameters are characterized, but are not tested in manufacturing.

3: These parameters are assured by design, but are not characterized or tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 222 Preliminary  2009 Microchip Technology Inc.

TABLE 22-35: ADC MODULE SPECIFICATIONS (12-BIT MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pe rature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(3)

AD20a Nr Resolution 12 data bits bits —

AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22a DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23a GERR Gain Error 1.25 3.4 10 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD24a EOFF Offset Error -0.2 0.9 5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD25a — Monotonicity — — — — Guaranteed(1)

ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-(3)

AD20a Nr Resolution 12 data bits bits —

AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD22a DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23a GERR Gain Error 2 10.5 20 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD24a EOFF Offset Error 2 3.8 10 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD25a — Monotonicity — — — — Guaranteed(1)

Dynamic Performance (12-bit Mode)(2)

AD30a T HD Total Harmonic Distortion — — -75 dB —

AD31a SINAD Signal to Noise and

Distortion 68.5 69.5 — dB —

AD32 a SFDR Spurious Free Dynam ic

Range 80 — — dB —

AD33a FNYQ Input Signal Bandwidth — — 250 k Hz —

AD34a ENOB Effectiv e Number of Bits 11.0 9 11.3 — bits —

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: These parameters are characterized, but are tested at 20 ksps only.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 223

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 22-36: ADC MODULE SPECIFICATIONS (10-BIT MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pe rature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREF-(3)

AD20b Nr Resol ution 10 data bits bits —

AD21b INL Integral Nonlinearity -1.5 — +1.5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23b GERR Gain Error 0.4 3 6 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD24b EOFF Offset Error 0.2 2 5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD25b — Monotonicity — — — — Guaranteed(1)

ADC Accuracy (10-bit Mode) – Measurements with internal VREF+/VREF-(3)

AD20b Nr Resol ution 10 data bits bits —

AD21b INL Integral Nonlinearity -1 — +1 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23b GERR Gain Error 3 7 15 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD24b EOFF Offset Error 1.5 3 7 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD25b — Monotonicity — — — — Guaranteed(1)

Dynamic Performance (10-bit Mode)(2)

AD30b T HD Total Harmonic Distortion — — -64 dB —

AD31b SINAD Signal to Noise and

Distortion 57 58.5 — dB —

AD32 b SFDR Spurious Free Dynam ic

Range 72 — — dB —

AD33b FNYQ Input Signal Bandwidth — — 550 kHz —

AD34b ENOB Effec tive Number of Bits 9.16 9.4 — bits —

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: These parameters are characterized, but are tested at 20 ksps only.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 224 Preliminary  2009 Microchip Technology Inc.

FIGURE 22-17: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS

(ASAM = 0, SSRC<2:0> = 000)

TABLE 22-37: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

AD55

TSAMP

Clear SAMPSet SAMP

AD61

ADCLK

Instruction

SAMP

AD60

DONE

AD1IF

1 2 3 4 5 6 87

1– Software sets AD1CON. SAMP to start sampling.

2– Sampling starts after discharge period. TSAMP is described in

3– Software clears AD1CON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 11.

9– One TAD fo r end of conversion.

AD50

6– Convert bit 10.

7– Convert bit 1.

8– Convert bit 0.

Execution

Section 28. “10/12-bit ADC without DMA” in the “PIC24H Family

Reference Manual”.

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operati ng tem pe rature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD ADC Clock Period(2) 117.6 — — ns —

AD51 tRC ADC Internal RC Oscillator

Period(2) — 250 — ns —

Conversion Rate

AD55 tCONV Conversion Time(2) —14 TAD —ns —

AD56 FCNV Throughput Rate(2) ——500Ksps —

AD57 TSAMP Sample Time(2) 3.0 TAD —— — —

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger(2) 2.0 TAD —3.0 TAD — Auto Convert Trigger

not selected

AD61 tPSS Sample Start from Setting

Sample (SAMP) bit(2) 2.0 TAD —3.0 TAD ——

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)(2) — 0.5 TAD —— —

AD63 tDPU Time to Stabilize Analog Stage

from ADC Off to ADC On(2) ——20s—

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: These parameters are characterized but not tested in manufacturing.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 225

PIC24HJ32GP202/204 and PIC24HJ16GP304

FIGURE 22-18: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

FIGURE 22-19: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01,

SIMSAM = 0, AS AM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)

AD55

TSAMP

Clear SAMPSet SAMP

AD61

ADCLK

Instruction

SAMP

AD60

DONE

AD1IF

Buffer(0)

Buffer(1)

1 2 3 4 5 6 8 5 6 7

1– Software sets AD1CON. SAMP to start sampling.

2– Sampling starts after discharge period. TSAMP is described in

3– Software clears AD1CON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 9.

8– One TAD for end of conversion.

AD50

AD55

6– Convert bit 8.

7– Convert bit 0.

Execution

“PIC24H Family Reference Manual”.

Section 28. “10/12-bit ADC without DMA” in the

1 2 3 4 5 6 4 5 6 8

1– Software sets AD1CON. ADON to start AD operation.

2– Sampling starts after discharge period. TSAMP is described in

3– Convert bit 9.

4– Convert bit 8.

5– Convert bit 0.

7 3

6– One TAD for end of conversion.

7– Begin conversion of next channel.

8– Sample for time specified by SAMC<4:0>.

Section 28. “10/12-bit ADC without DMA” in the

ADCLK

Instruction Set ADON

Execution

SAMP TSAMP

AD1IF

DONE

AD55 AD55 TSAMP AD55

AD50

“PIC24H Family Reference Manual”.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 226 Preliminary  2009 Microchip Technology Inc.

TABLE 22-38: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA +85°C for Industrial

-40°C TA+125°C for Extended

Param

No. Symbol Characteristic Min. Typ(1) Max. Units Conditions

Clock Parameters

AD50 TAD ADC Clock Period(1) 76 — — ns —

AD51 tRC ADC Internal RC Oscillator

Period(1) —250— ns —

Conversion Rate

AD55 tCONV Conversion Time(1) —12 TAD —— —

AD56 FCNV Throughput Rate(1) ——1.1Msps —

AD57 TSAMP Sample Time(1) 2.0 TAD ——— —

Timing Parameters

AD60 tPCS Conv ersion Start from S ample

Trigger(1) 2.0 TAD — 3.0 TAD — Auto-Convert Trigger

not selected

AD61 tPSS Sample Start from Setting

Sample (SAMP) bit(1) 2.0 TAD — 3.0 TAD ——

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)(1) — 0.5 TAD —— —

AD63 tDPU Time to Stabilize Analog Stage

from ADC Off to ADC On(1) ——20s—

Note 1: These parameters are characterized but not tested in manufacturing.

2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 227

PIC24HJ32GP202/204 and PIC24HJ16GP304

23.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS

This section provides an overview of PIC24HJ32GP202/204 and PIC24HJ16GP304 electrical characteristics for

devices operating in an ambient temperature range of -40°C to +140°C.

The spec ifications be tween -40°C to +14 0°C are identical to those s hown in Section 22.0 “Electr ical Char acteristics”

for operation between -40°C to +125°C, with the exception of the parameters listed in this section.

Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in

Section 22.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.

Absolute maximum ratings for the PIC24HJ32GP202/204 and PIC24HJ16GP304 high temperature devices are listed

below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional

operation of the device at these or any other conditions above the parameters indicated in the operation listings of this

specification is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias(4) .........................................................................................................-40°C to +140°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Volta ge on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any pin that is not 5V tolerant with respect to VSS(5) ....................................................-0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS w hen VDD < 3.0V(5) ....................................... -0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS w hen VDD  3.0V(5) .................................................... -0.3V to 5.6V

Volta ge on VCAP/VDDCORE with respect to VSS ...................................................................................... 2.25V to 2.75V

Maximum curr ent out of VSS pin .............................................................................................................................60 mA

Maximum curr ent into VDD pin(2).............................................................................................................................60 mA

Maximum junction temperature.............................................................................................................................+145°C

Maximum output current sunk by any I/O pin(3)........................................................................................................1 mA

Maximum output current sourced by any I/O pin(3)...................................................................................................1 mA

Maximum current sunk by all ports combined ........................................................................................................10 mA

Maximum current sourced by all ports combined(2) ................................................................................................10 mA

Note: Programming of the Flash memory is not allowed above 125°C.

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 23-2).

3: Unlike devices at 125°C and below, the specifications in this section also apply to the CLKOUT, VREF+,

VREF-, SCLx, SDAx, PGCx and PGDx pins.

4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which

the tot al opera ting time from 125°C to 150° C will be greater than 1 ,000 hours is not warranted w ithout pri or

written approval from Microchip Technology Inc.

5: Refer to the “Pin Diagrams” section for 5V tolerant pins.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 228 Preliminary  2009 Microchip Technology Inc.

23.1 High Temperature DC Characteristics

TABLE 23-1: OPERATING MIPS VS. VOLTAGE

TABLE 23-2: THERMAL OPERATING CONDITIONS

TABLE 23-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

TABLE 23-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Characteristic VDD Range

(in Volts) Temper ature Range

(in °C)

Max MIPS

PIC24HJ32GP202/204 and

PIC24HJ16GP304

3.0V to 3.6V -40°C to +140°C 20

Rating Symbol Min Typ Max Unit

High Temperature Devices

Operating Junction Temperature Range TJ-40 — +145 °C

Operating Ambient Temperature Range TA-40 — +140 °C

Power Dissipation:

Internal ch ip pow er dis sipatio n:

PINT = VDD x (IDD -  IOH) PDPINT + PI/OW

I/O Pin Power Dissipation:

I/O =  ({VDD - VOH} x IOH) +  (VOL x IOL)

Maximum Allo wed Power Dissipation PDMAX (TJ - TA)/JA W

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA  +140°C for High Temperature

Parameter

No. Symbol Characteristic Min Typ Max Units Conditions

Operating Voltage

HDC10 Supply Voltage

VDD — 3.0 3.3 3.6 V -40°C to +140°C

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operati ng tem per ature -40°C  TA  +140°C for High Temperature

Parameter

No. Typical Max Units Conditions

Power-Down Current (IPD)

HDC60e 250 2000 A +140°C 3.3V Base Power-Down Current(1,3)

HDC61c 3 5 A +140°C 3.3V Watchdog Timer Current: IWDT(2,4)

Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

2: The  current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

3: These currents are measured on the device containing the most memory in this family.

4: These p aram et ers are charac teri ze d, but are not tes ted in manufa ct urin g.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 229

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 23-5: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

TABLE 23-6: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

TABLE 23-7: DC CHARACTERISTICS: PROGRAM MEMORY

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA  +1 40°C for Hi gh Temper atu re

Parameter

No. Typical(1) Max Doze

Ratio Units Conditions

HDC72a 39 45 1:2 mA +140°C 3.3V 20 MIPSHDC72f 18 25 1:64 mA

HDC72g 18 25 1:128 mA

Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

VOL Output Low Voltage

HDO10 I/O ports — — 0.4 V IOL = 1 mA, V DD = 3.3V

HDO16 OSC2/CLKO — — 0.4 V IOL = 1 mA, VDD = 3.3V

VOH Output High Voltage

HDO20 I/O ports 2.40 — — V IOH = -1 mA, VDD = 3.3V

HDO26 OSC2/CLKO 2.41 — — V IOH = -1 mA, VDD = 3.3V

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

Program Flash Memory

HD130 EPCell En durance 10,000 — — E/W -40C to +140C(2)

HD134 TRETD Characteristic Retention 20 — — Year 1000 E/W cycles or less and no

other specifications are violated

Note 1: These parameters are assured by design, but are not characterized or tested in manufacturing.

2: Programming of the Flash memory is not allowed above 125°C.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 230 Preliminary  2009 Microchip Technology Inc.

23.2 AC Characteri stics and Ti ming

Parameters

The information contained in this section defines

PIC24HJ32GP202/204 and PIC24HJ16GP304 AC

characteristics and timing parameters for high

temperature devices. However, all AC timing

specifications in this section are the same as those in

Section 22.2 “AC Characteristics and Timing

Parameters”, with the exception of the parameters

listed in this section.

Parameters in this section begin with an H, which

denotes High temperature. For example, parameter

OS53 in Section 22.2 “AC Characteristics and

Timing Parameters” is the Industrial and Extended

temperature equivalent of HOS53.

TABLE 23-8: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 23-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

TABLE 23-9: PLL CLOCK TIMING SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise st ated)

Operati ng tem pera ture -40°C  TA  +140°C for High Temperature

Operati ng voltage VDD range as described in Table 23-1.

VDD/2

VSS

RL= 464

CL= 50 pF for all pins except OSC2

15 pF for OSC2 output

Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

HOS53 DCLK CLKO Stability (Jitter)(1) -5 0.5 5 % Measured over 100 ms

period

Note 1: These paramet ers are characterized, but are not tes ted in manufa ct urin g.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 231

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 23-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS

TABLE 23-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Ope rati ng temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —1025ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 28 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 35 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —1025ns —

HSP36 TdoV2sc,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 35 — — ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 28 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 35 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 232 Preliminary  2009 Microchip Technology Inc.

TABLE 23-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

TABLE 23-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — — 35 ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 25 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Dat a Inp ut to

SCKx Edge 25 — — ns —

HSP51 TssH2doZ SSx  to SDOx Output

High-Impedance 15 — 55 ns See Note 2

Note 1: These parameters are characterized but not tested in manufacturing.

2: Assumes 50 pF load on all SPIx pins.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge ——35ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 25 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 25 — — ns —

HSP51 TssH2doZ SSx  to SDOX Output

High-Impedance 15 — 55 ns See Note 2

HSP60 TssL2doV SDOx Data Output Valid after

SSx Edge ——55ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Assumes 50 pF load on all SPIx pins.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 233

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 23-14: ADC MODULE SPECIFICATIONS

TABLE 23-15: ADC MODULE SPECIFICATIONS (12-BIT MODE)

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Reference Inputs

HAD08 IREF Current Drain —

—250

—600

50 A

AADC operating, See Note 1

ADC off, See Note 1

Note 1: These parameters are not characterized or tested in manufacturing.

2: These parameters are characterized, but are not tested in manufacturing.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating tempe rature -40 °C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

ADC Accuracy (12-bit Mode) – Measurements with External VREF+/VREF-(1)

HAD20a Nr Resolution 12 data bits bits —

HAD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD22a DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD23a GERR Gain Error -2 — 10 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD24a EOFF Offset Error -3 — 5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (12-bit Mode) – Measurements with Internal VREF+/VREF-(1)

HAD20a Nr Resolution 12 data bits bits —

HAD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD22a DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD23a GERR Gain Error 2 — 20 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD24a EOFF Offset Error 2 — 10 LSb VINL = AVSS = 0V, AVDD = 3.6V

Dynamic Performance (12-bit Mode)(2)

HAD33a FNYQ Input Signal Bandwidth — — 200 kHz —

Note 1: These parameters are characterized, but are tested at 20 ksps only.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 234 Preliminary  2009 Microchip Technology Inc.

TABLE 23-16: ADC MODULE SPECIFICATIONS (10-BIT MODE)

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

ADC Accuracy (10-bit Mode) – Measurements with External VREF+/VREF-(1)

HAD20b Nr Resolution 10 data bits bits —

HAD21b INL Integral Nonlinearity -3 — 3 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD22b DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD23b GERR Gain Error -5 — 6 LSb V INL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD24b EOFF Offset Error -1 — 5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (10-bit Mode) – Measurements with Internal VREF+/VREF-(1)

HAD20b Nr Resolution 10 data bits bits —

HAD21b INL Integral Nonlinearity -2 — 2 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD22b DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = 0V, AVDD = 3 .6V

HAD23b GERR Gain Error -5 — 15 LSb V INL = AVSS = 0V, AVDD = 3.6V

HAD24b EOFF Offset Error -1.5 — 7 LSb VINL = AVSS = 0V, AVDD = 3.6V

Dynamic Performance (10-bit Mode)(2)

HAD33b FNYQ Input Signal Bandwidth — — 400 kHz —

Note 1: These parameters are characterized, but are tested at 20 ksps only.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 235

PIC24HJ32GP202/204 and PIC24HJ16GP304

TABLE 23-17: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

TABLE 23-18: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Clock Parameters

HAD50 TAD ADC Clock Period(1) 147 — — ns —

Conversion Rate

HAD56 FCNV Throughput Rate(1) ——400Ksps —

Note 1: These parameters are characterized but not tested in manufacturing.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C  TA  +140°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Clock Parameters

HAD50 TAD ADC Clock Period(1) 104 — — ns —

Conversion Rate

HAD56 FCNV Throughput Rate(1) — — 800 Ksps —

Note 1: These parameters are characterized but not tested in manufacturing.

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 236 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 237

PIC24HJ32GP202/204 and PIC24HJ16GP304

24.0 PACKAGING INFORMATION

24.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: If the full M icroc hip p art nu mber ca nn ot be ma rked on one li ne, it is carrie d over to the nex t

line, thus limiting the number of available characters for customer-specific information.

28-Lead SPDIP

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC24HJ32GP202-I/SP

0730235

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC24HJ32GP202/SO

0730235

28-Lead QFN-S

XXXXXXXX

YYWWNNN

Example

24HJ32GP

202E/MM

0730235

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

PIC24HJ32

Example

GP204-E/ML

0730235

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

PIC24HJ

32GP204

0730235

-E/PT

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 238 Preliminary  2009 Microchip Technology Inc.

24.2 Package Details

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e .100 BSC

Top to Seating Plane A – – .200

Molded Package Thickness A2 .120 .135 .150

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .335

Molded Package Width E1 .240 .285 .295

Overall Length D 1.345 1.365 1.400

Tip to Seating Plane L .110 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .040 .050 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

NOTE 1

Microchip Technology Drawing C04-070B

 2009 Microchip Technology Inc. Preliminary DS70289F-page 239

PIC24HJ32GP202/204 and PIC24HJ16GP304

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e 1.27 BSC

Overall Height A – – 2.65

Molded Package Thickness A2 2.05 – –

Standoff § A1 0.10 – 0.30

Overall Width E 10.30 BSC

Molded Package Width E1 7.50 BSC

Overall Length D 17.90 BSC

Chamfer (optional) h 0.25 – 0.75

Foot Length L 0.40 – 1.27

Footprint L1 1.40 REF

Foot Angle Top φ0° – 8°

Lead Thickness c 0.18 – 0.33

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

Microchip Technology Drawing C04-052B

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 240 Preliminary  2009 Microchip Technology Inc.

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EXPOSED

PAD

NOTE 1

TOP VIEW BOTTOM VIEW

  ) 0/

 2009 Microchip Technology Inc. Preliminary DS70289F-page 241

PIC24HJ32GP202/204 and PIC24HJ16GP304

'()!!*++(

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PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 242 Preliminary  2009 Microchip Technology Inc.

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 44

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 8.00 BSC

Exposed Pad Width E2 6.30 6.45 6.80

Overall Length D 8.00 BSC

Exposed Pad Length D2 6.30 6.45 6.80

Contact Width b 0.25 0.30 0.38

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3 A1

Microchip Technology Drawing C04-103B

 2009 Microchip Technology Inc. Preliminary DS70289F-page 243

PIC24HJ32GP202/204 and PIC24HJ16GP304

))!!"#$&

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PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 244 Preliminary  2009 Microchip Technology Inc.

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Leads N 44

Lead Pitch e 0.80 BSC

Overall Height A – – 1.20

Molded Package Thickness A2 0.95 1.00 1.05

Standoff A1 0.05 – 0.15

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ0° 3.5° 7°

Overall Width E 12.00 BSC

Overall Length D 12.00 BSC

Molded Package Width E1 10.00 BSC

Molded Package Length D1 10.00 BSC

Lead Thickness c 0.09 – 0.20

Lead Width b 0.30 0.37 0.45

Mold Draft Angle Top α11° 12° 13°

Mold Draft Angle Bottom β11° 12° 13°

NOTE 1NOTE 2

123

Microchip Technology Drawing C04-076B

 2009 Microchip Technology Inc. Preliminary DS70289F-page 245

PIC24HJ32GP202/204 and PIC24HJ16GP304

))-(+.-///!!"#!!$-&

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PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 246 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 247

PIC24HJ32GP202/204 and PIC24HJ16GP304

APPENDIX A: REVISION HISTORY

Revision A (July 2007)

Initial release of this document.

Revision B (June 2008)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

The major changes are referenced by their respective

section in the following table.

TABLE 24-1: MAJOR SECTION UPDATES

Section Name Update Descripti on

“High-Performance, 16-bit

Microcontrollers” Added E xtended I nterrupts column to Remappable Peripherals in the

Controller Families table and Note 2 (see Table 1).

Added Note 1 to all pin diagrams, which references RPn pin usage by

remappable peripherals (see “Pin Diagrams”).

Section 1.0 “Device Overview” Changed PORTA pin name from RA15 to RA10 (see Table 1-1).

Section 3.0 “Memory Organization” U pdated Reset values for the following SFRs: IPC1, IPC3-IPC5, IPC7,

IPC16, and INTTREG (see Table 3-4).

Added the System Control Register Map (see Table 3-20).

Section 5.0 “Resets” Entire se ction was repl aced t o main tai n cons isten cy with other PIC 24H dat a

sheets.

Section 7.0 “Oscillator

Configuration” Re moved the fi rst sentenc e of the third cloc k source item (External Cl ock) in

Section 7.1.1.2 “Primary”.

Updated the default bit values for DOZE and FRCDIV in the Clock Divisor

Added the ce nter frequ ency in the O SCTUN regi ster for the FRC T uning bit s

(TUN<5:0>) value 011111 and updated the center frequency for bits value

011110 (see Register 7-4).

Section 8.0 “Power-Saving

Features” Added the following two registers:

• PMD1: Peripheral Module Disable Control Register 1

• PMD2: Peripheral Module Disable Control Register 2

Section 9.0 “I/O Ports” Added paragraph and Table 9-1 to Section 9.1.1 “Open-Drain

Configuration”, which provides details on I/O pins and their functionality.

Removed the following sections, which are now available in the related

section of the PIC24H Family Reference Manual:

• 9.4.2 “Available Peripherals”

• 9.4.3.3 “Ma ppi ng”

• 9.4.5 “Considerations for Peripheral Pin Selection”

Section 13.0 “Output Compare” R eplaced sections 13.1, 13.2 and 13.3 and related figures and tables with

entirely new content.

Section 14.0 “Serial Peripheral

Interface (SPI)” Removed the following sections, which are now available in the related

section of the PIC24H Family Reference Manual:

• 14.1 “Interrupts”

• 14.2 “Receive Operations”

• 14.3 “Transmit Operations”

• 14.4 “SPI Setup” (retained Figu re 14-1: SPI Module Block Diagram)

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 248 Preliminary  2009 Microchip Technology Inc.

Section 15.0 “Inter-Integrated

Circuit (I2C™)” Removed the following sections, which are now available in the related

section of the PIC24H Family Reference Manual:

• 15.3 “I2C Interrupts”

• 15.4 “Baud Rate Generator” (retained Figure 15-1: I2C Block Diagram)

• 15.5 “I2C Module Addresses”

• 15.6 “Slave Address Masking”

• 15.7 “IPMI Support”

• 15.8 “General Call Address Support”

• 15.9 “Automatic Clock Stretch”

• 15.10 “Software Controlled Clock Stretching (STREN = 1)”

• 15.11 “Slope Control”

• 15.12 “Clock Arbitr ation”

• 15.13 “Mul ti-M as ter Co mm uni ca tion, Bus C ol lisio n, a nd Bus Arbitra tio n ”

• 15.14 “Peripheral Pin Select Limitations”

Section 16.0 “Universal

Asynchronous Receiver T ransmitter

(UART)”

Removed the following sections, which are now available in the related

section of the PIC24H Family Reference Manual:

• 16.1 “UART Baud Rate Generator”

• 16.2 “Transmit ting in 8-bit Data Mode”

• 16.3 “Transmit ting in 9-bit Data Mode”

• 16.4 “Break and Sync Transmit Sequence”

• 16.5 “Receiving in 8-bit or 9-bit Data Mode”

• 16.6 “Flow Control Using UxCTS and UxRTS Pins”

• 16.7 “ Infr ared Support ”

Removed IrDA references and Note 1, and updated the bit and bit value

descriptions for UTXINV (UxSTA<14>) in the UARTx Status and Control

Section 17.0 “10-bit/12-bit Analog-

to-Digital Converter (ADC)” Removed Equation 17-1: ADC Conversion Clock Period and Figure 17-2:

ADC T rans fer Function (10-B it Exampl e).

Added ADC1 Module Block Diagram for PIC24HFJ16GP304 and

PIC24HJ32 GP204 Dev ices (Figure 17-1) and ADC1 Mo dule Block D iagram

FOR PIC24HJ 32 GP2 02 Devi ce s ( Fig ure 17-2).

Added Not e 2 to F igu re 17-3: ADC Conv ers io n Cl ock Pe riod Blo ck Dia gram .

Added device-specific information to Note 1 in the ADC1 Input Scan Select

Regist er Low (see Registe r 17-6), and updated the defau lt bit value for bits

12-10 (CSS12-CSS1 0) fr om U- 0 to R/ W-0.

Added device-specific information to Note 1 in the ADC1 Port Configuration

Regist er Low (see Registe r 17-7), and updated the defau lt bit value for bits

12-10 (PCFG12-PCFG10) from U-0 to R/W-0.

TABLE 24-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Descripti on

 2009 Microchip Technology Inc. Preliminary DS70289F-page 249

PIC24HJ32GP202/204 and PIC24HJ16GP304

Section 18.0 “Special Features” Added FICD register information for address 0xF8000E in the Device

Configuration Register Map (see Table 18-1).

Added FICD regis ter con ten t (BKBUG, COE, JTAGEN, and ICS<1:0> to th e

PIC24HJ32GP202/204 and PIC24HJ16GP304 Configuration Bits

Description (see Table 18-2).

Added a note regarding the placement of low-ESR capacitors, after the

second paragraph of Section 18.2 “On-Chip Voltage Regulator” and to

Figure 18-1.

Removed the words “if enabled” from the second sentence in the fifth

paragraph of Section 18.3 “BOR: Brown-Out Reset”.

Section 21.0 “Electrical

Characteristics” Removed Typ value for parameter DC12 (see Table 21-4).

Updated MIPS conditions for parameters DC24c, DC44c, DC72a, DC72f

and DC72g (see Table 21-5, Table 21-6 and Table 21-8).

Added Note 4 (reference to new tab le containing digit a l-only and anal og p in

information to I/O Pin Input Specifications (see Table 21-9).

Updated Min, Ty p, and Max values and updated Min values for Program

Memory parameters D136, D137 and D138 (see Table 21-12).

Updated Max value for Internal RC Accuracy parameter F21 for -40°C  TA

+125°C condition and added Note 2 (see Table 21-19).

Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer,

and Power-up Timer parameter SY20 and updated conditions, which now

refers to Section 18.4 “Watchdog Timer (WDT)” and LPRC parameter

F21 (see Table 21-21 ).

Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63

and removed Note 3 (see Table 21-37).

Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63

and removed Note 3 (see Table 21-38).

TABLE 24-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Descripti on

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 250 Preliminary  2009 Microchip Technology Inc.

Revision C (December 2008)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

The major changes are referenced by their respective

section in the following table.

TABLE 24-2: MAJOR SECTION UPDATES

Section Name Update Descripti on

“High-Performance, 16-bit

Microcontrollers” Updated all pin diagrams to denote the pin voltage tolerance (see “Pin

Diagrams”).

Section 2.0 “Guidelines for Getting

S tarted with 16-bit Microcontrollers” Added new section to the data sheet that provides guidelines on getting

started with 16-b it microcontrollers.

Section 10.0 “I/O Ports” Updated 5V tolerant status for I/O pin RB4 from Yes to No (see Table 10-1).

Section 22.0 “Electrical

Characteristics” Removed the maximum value for parameter DC12 (RAM Data Retention

Voltage) in Table 22-4.

Updated typical values for Operating Current (IDD) and added Note 3 in

Table 22-5.

Updated typical and maximum values for Idle Current (IIDLE): Core OFF

Clock ON Base Current and added Note 3 in Table 22-6.

Updated typical and maximum values for Power Down Current (IPD) and

added Note 5 in Table 22-7.

Updated typical and maximum values for Doze Current (IDOZE) and added

Note 2 in Table 22-8.

Added Note 3 to Table 22-12.

Updated minimum value for Internal Voltage Regulator Specifications in

Table 22-13.

Added parameter OS42 (GM) and Notes 4, 5, and 6 to Table 22-16.

Added Notes 2 and 3 to Table 22-17.

Added Note 2 to Table 22-20.

Added Note 2 to Table 22-21.

Added Note 2 to Table 22-22.

Added Note 1 to Table 22-23.

Added Note 1 to Table 22-24.

Added Note 3 to Table 22-32.

Added Note 2 to Table 22-33.

Updated typical value for parameter AD08 (ADC in operation) and added

Notes 2 and 3 in Table 22-34.

Updated minimum, typical, and maximum values for parameters AD23a,

AD24a, AD30a, AD32a, AD32a, and AD34a, and added Notes 2 and 3 in

Table 22-35.

Updated minimum, typical, and maximum values for parameters AD23b,

AD24b, AD30b, AD32b, AD32b, and AD34b, and added Notes 2 and 3 in

Table 22-36.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 251

PIC24HJ32GP202/204 and PIC24HJ16GP304

Revision D (June 2009)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

Global changes include:

• Changed all instances of OSCI to OSC1 and

OSCO to OSC2

• Changed all instances of PGCx/EMUCx and

PGDx/EMUDx (where x = 1, 2, or 3) to PGECx

and PGEDx

Chang ed all insta nces of VDDCORE and VDDCORE/VCAP

to VCAP/VDDCORE

All other major changes are referenced by their

respective section in the following table.

TABLE 24-3: MAJOR SECTION UPDATES

Section Name Update Description

“High-Performance, 16-bit

Microcontrollers” Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin diagrams,

which re ferences pin connections to VSS.

Section 8.0 “Oscillator Configuration” Updated the Oscillator System Diagram (see Figure 8-1).

Added Note 1 to the Oscillator Tuning (OSCTUN) register (see

Section 10.0 “I/O Ports” Removed Table 10-1 and added reference to pin diagrams for I/O pin

availability and functionality.

Section 15.0 “Serial Peripheral Interface

(SPI)” Added Note 2 to the SPIx Control Register 1 (see Register 15-2).

Section 17.0 “Universal Asynchronous

Receiver Transmitter (UART)” Update d the UTXINV bit settings in the UxST A regi ster and added N ote

1 (see Register 17-2).

Section 22.0 “Electrical Characteristics” Updated the Min value for parameter DC12 (RAM Retention Voltage)

and added Note 4 to the DC Temperature and Voltage Specifications

(see Table 22-4).

Updated the Min value for parameter DI35 (see Table 22-20).

Updated AD08 and added reference to Note 2 for parameters AD05a,

AD06a, and AD08a (see Table 22-34).

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 252 Preliminary  2009 Microchip Technology Inc.

Revision E (November 2009)

The revision includes the following global update:

• Added Note 2 to the shad ed table tha t appears at

the beginning of each chapter. This new note

provides information regarding the availability of

registers and their associated bits

This revision also includes minor typographical and

formatting changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

Revision F (November 2009)

Updated MIPS rating from 16 to 20 for high tempera-

ture devices in “Operating Range:” and Table 23-1:

Operati ng MIPS vs . Volta ge.

TABLE 24-4: MAJOR SECTION UPDATES

Section Name Update Description

“High-Performance, 16-bit Microcontrollers” Added information on high temperature operation (see

“Operating Rang e:”).

Section 10.0 “I/O Ports” Changed the reference to digital-only pins to 5V tolerant pins in

the second paragraph of S ectio n 10.2 “Open-Dr ain

Configuration”.

Section 17.0 “Universal Asynchronous

Receiver Transmitter (UART)” Updated the two baud rate range features to: 10 Mbps to 38 bps

at 40 MIPS.

Section 18.0 “10-bit/12-bit Analog-to-Digital

Converter (ADC)” Updated the ADC1 block diagrams (see Figure 18-1 and

Figure 18-2).

Section 19.0 “Special Features” Updated the second paragraph and removed the fourth

paragraph in Section 19.1 “Configurati on Bits”.

Update d the De vi ce Conf igur ation Registe r M ap (se e Table 19-1 ).

Section 22.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings for high temperature

and added Note 4.

Updated the SPIx Mo dule Slav e Mode (CKE = 1) T iming

Characteristics (see Figure 22-12).

Section 23.0 “High Temperature Elec tr ical

Characteristics” Added new chapter with high temperature specifications.

“Product Identification System” Added the “H” definition for high temperature.

 2009 Microchip Technology Inc. Preliminary DS70289F-page 253

PIC24HJ32GP202/204 and PIC24HJ16GP304

INDEX

A/D Converte r..................... ................... .............. .............159

Initialization...............................................................159

Key Feat ures....................... ................... ...................159

AC Characteristics ....................................................202, 230

ADC Module..............................................................233

ADC Module (10-bit Mode).......................................234

ADC Module (12-bit Mode).......................................233

Internal RC Accuracy................................................204

Load Conditions............................. .. .. .. .... .. .. .....202, 230

ADC Module

ADC11 Register Map......................................34, 36, 37

Alte rn a te Interrupt Ve ctor Table (AIVT) ...... ...... .. ..... .. ...... .. .61

Arithm e tic Logic Unit ( ALU)........... ............... ............... ........24

Assembler

MPASM Assembler...................................................190

Block Diagrams

16-bit Timer1 Module................................................125

A/D Module................. .... .... .. ......... .... .. .... .... .....160, 161

Connections for On-Chip Voltage Regulator. . ...........176

Device Clock.........................................................89, 91

Input Capture............ .. .... .. .... .. ....... .... .. .... .. ....... .... .. ..133

Output Co mpa re ........... ................... ............... ..........135

PIC24H .......................................................................12

PIC24H CPU Core......................................................20

PLL..............................................................................91

Reset System.......... ................... .................. ...............53

Shared Po rt Stru cture..... ........................... ...............103

SPI............................................................................139

Timer2 (16-bit) ..........................................................129

Timer2 /3 (32-bit) ................................ ................... ....128

UART........................................................................153

Watchdog Timer (WDT)............................................177

C Compilers

Hi-Tech C ..................................................................190

MPLAB C..... ....................... ................... ...................190

Clock Switching...................................................................97

Enabling......................................................................97

Sequence....................................................................97

Code Examples

Erasing a Program Memory Page...............................51

Initiating a Programming Sequence............................52

Loading Write Buffers ........... ....... .. .... .. .. .... .. ....... .. .. ....52

Port Write/Read ........................................................104

PWRSAV Instruction Synt a x.................... ...................99

Code Protection ........................................................173, 178

Configuration Bits..............................................................173

Description (Table)....................................................174

Configuration Register Map..............................................173

Configuring Analog Port Pins............................................104

CPUControl Register............ ............... ................... ............22

CPU Clocking System.........................................................90

Options........................................................................90

Selection.....................................................................90

Customer Change Notification Service.............................257

Custome r Notificatio n Se rvice... ........... .............. ...............257

Customer Support......................................................... ....257

Data Addre ss Space.................. .................. ................... .... 27

Alignment.................................................................... 27

Memory Map for PIC24H Devices with 8 KBs RAM... 28

Near D a ta Spac e... ...... ..... ...... ...... .. ...... ..... ...... ...... ..... 27

Soft war e Stack ............... ................................ ............ 40

Width .......................................................................... 27

DC Ch a r a cteri stics....... ...... ......... ...... ...... ...... ..... ...... ...... ... 1 9 4

Doze Current (IDOZE)................................................ 229

High Tempera tu re................ .............. ................... .... 228

I/O Pin Input Specifications ....... .... .. .... ......... .. .... .... .. 199

I/O Pin Output........................................................... 229

I/O Pin Output Specifications.................................... 200

Idle Current (IDOZE) .................................................. 198

Idle Current (IIDLE).................................................... 197

Operating Current (IDD) ............................................ 196

Operating MIPS vs. Voltage.... ................................. 228

Power-Down Current (IPD)........................................ 198

Power-down Current (IPD)........................................ 228

Program Memory.............................................. 201, 229

Temperature and Voltage......................................... 228

Temperature and Voltage Specifications .................. 195

Thermal Operating Conditions .................................. 228

Demonstration/Development Boards, Evaluation Kits, and

Starter Kits............ ................... ................... .............. 19 2

Development Support....................................................... 189

Elect r i ca l C h a ra c t e r i stics .......... ...... ...... .. ...... ..... ...... ...... ... 1 9 3

AC..................................................................... 202, 230

Equations

Device Operating Frequency...................................... 90

Errata.................................................................................... 9

Flash Progra m Mem o ry...... ................................ ................ 47

Control Registers........................................................ 48

Operations.................................................................. 48

Progra mming Al gorithm................................ .............. 51

RTSP Operatio n.................. .......... ............... .............. 48

Table Instructions ....................................................... 47

Flexible Configuration....................................................... 173

High Temperature Electrical Characteristics .................... 227

I/O Ports ........ . .............. ........................... ......................... 103

Para ll e l I/O (P IO ) . .. ...... ..... ...... ...... ......... ...... ...... ...... . 103

Write/Read Timing.................................................... 104

I2CAddresses................................................................. 146

Operating Modes...................................................... 145

Registers .................................................................. 145

I2C Module

I2C1 Register Map...................................................... 33

In-Circuit Debugger........................................................... 179

In-C i r cu i t Emul a ti on ..... ...... ...... ..... ...... .. ...... ..... ...... ...... ..... 173

In-Circuit Serial Programming (ICSP)....................... 173, 179

Input Capture

Registers .................................................................. 134

Input Change Notification................................................. 104

Instruction Addressing Modes ............................................ 40

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 254 Preliminary  2009 Microchip Technology Inc.

File Register Instructions ............................................40

Fundamental Modes Supported..................................41

MCU Inst ructio n s . ....................... ................... .............40

Move and Accumulator Instructions.. ..........................41

Other Instructions........................................................41

Instruction Set

Overview...................................................................183

Summary...................................................................181

Instruction-Based Power-Saving Modes.............................99

Idle............................................................................100

Sleep...........................................................................99

Internal RC Oscillator

Use with WDT...........................................................177

Inter net Addre ss... ................... ....................... ...................257

Interrupt Control and Status Registers......................... .......65

IECx............................................................................65

IFSx.............................................................................65

INTCON1 ....................................................................65

INTCON2 ....................................................................65

IPCx............................................................................65

Interrupt Setup Procedures.......................................... .......87

Initialization.................................................................87

Inter rupt Disab l e..... ................... ................... ...............87

Inter rupt Service Routine........ ........... .............. ...........87

Trap Ser vice Routine.... .......... ................... .................87

Interrupt Vector Table (IVT) ................................................61

Interrupts Coincident with Power Save Instructions..........100

JTAG Boundary Scan Interf ace ........................................173

Memory Organization..........................................................25

Microc h i p In ternet Web Site............ ................... ...............257

MPLAB ASM30 Assembler, Linker, Librarian ...................190

MPLAB ICD 3 In-Circuit Debugger System.......................191

MPLAB Integrated Development Environment Software ..189

MPLAB PM3 Device Programmer.....................................192

MPLAB REA L IC E In -Circuit Emula to r System.................191

MPLINK Object Linker/MPLIB Object Libraria n ................190

Multi-Bit Data Shifter...........................................................24

NVM Module

Open-Drain Configuration.................................................104

Output Co mpa re.................... .................. ................... .......135

Registers...................................................................137

Packaging .........................................................................237

Details.......................................................................238

Marking.....................................................................237

Peripheral Module Disable (PMD).....................................100

PICkit 2 Development Programmer/Debugger and PICkit 2

Debug Express .........................................................192

PICkit 3 In-Circuit Debugger/Programmer and PICkit 3 Debug

Express.....................................................................191

Pinout I/O Descriptions (table). ...........................................13

PMD Module

PORTA

PORTB

Power-on Reset (POR)....................................................... 58

Power-S a ving Feat u res....................... .............. ............... .. 99

Clock Frequency and Switching ................................. 99

Program Address Space..................................................... 25

Construction ............................................................... 42

Data Access from Program Memory Using Program

Space Visi b ility ......... ............... .......... ............... ..45

Data Access from Program Memory Using Table Instruc-

tions.................................................................... 44

Data Access from, Address Generation ..................... 43

Memory Map ............................................................... 25

Table Read Instructions

TBLRDH............................................................. 44

TBLRDL.............................................................. 44

Visibility Operation...................................................... 45

Program Mem ory

Interrupt Vector........................................................... 26

Organization ............................................................... 26

Reset Vec tor......................... ................... ................... 26

Reader Response............................................................. 258

Registers

AD1CHS0 (ADC1 Input Channel 0 Select................ 169

AD1CHS123 (AD C1 Input Channel 1, 2, 3 Select)... 167

AD1CON 1 (A D C 1 C o n tr o l 1 ).... ...... ...... ...... ..... .. ...... . 163

AD1CON 2 (A D C 1 C o n tr o l 2 ).... ...... ...... ...... ..... .. ...... . 165

AD1CON 3 (A D C 1 C o n tr o l 3 ).... ...... ...... ...... ..... .. ...... . 166

AD1CSSL (ADC1 Input Scan Select Low)................ 171

AD1PCFGL (ADC1 Port Configuration Low)............ 171

CLKDIV (Clock Divisor) .............................................. 94

COR C ON (C o re C o n t rol). ...... ......... ...... ...... ......... . 23 , 6 7

I2CxCON (I2Cx Control)........................................... 147

I2CxMSK (I2 Cx Slave Mode Addr ess Mask)............ 151

I2C xSTAT (I2 Cx Sta t u s) .......... . ...... ...... ...... .. ..... .. ..... 149

ICxCON (Input Capture x Control)............................ 134

IEC0 (Interrupt Enable Control 0)......................... 74, 77

IEC1 (Interrupt Enable Control 1)............................... 76

IFS0 ( In terrupt Flag Status 0)...... ............................... 70

IFS1 ( In terrupt Flag Status 1)...... ............................... 72

IFS4 ( In terrupt Flag Status 4)...... ............................... 73

INTC ON1 ( I n te r rup t C o n trol 1).......... ...... ...... ......... ..... 68

INTC ON2 ( I n te r rup t C o n trol 2).......... ...... ...... ......... ..... 69

INTTREG Interrupt Control and Status Register ........ 86

IPC0 (Interrupt Prio rity Contr o l 0)................ ....... ........ 78

IPC1 (Interrupt Prio rity Contr o l 1)................ ....... ........ 79

IPC16 (Interrupt Priority Control 16)........................... 85

IPC2 (Interrupt Prio rity Contr o l 2)................ ....... ........ 80

IPC3 (Interrupt Prio rity Contr o l 3)................ ....... ........ 81

IPC4 (Interrupt Prio rity Contr o l 4)................ ....... ........ 82

IPC5 (Interrupt Prio rity Contr o l 5)................ ....... ........ 83

IPC7 (Interrupt Prio rity Contr o l 7)................ ....... ........ 84

NVMCOM (Flash Memory Control)....................... 49, 50

OCxCON (Output Compare x Control)..................... 137

OSCCON (Oscillator Control)..................................... 92

OSC T U N ( F RC Os c i ll a t o r Tu n i n g )...... .. ......... ...... . . ..... 96

PLLFBD (PLL Feedback Divisor)................................ 95

PMD1 (Peripheral Module Disable Control Register 1). .

101

PMD2 (Peripheral Module Disable Control Register 2). .

102

RCON (Reset Control)................................................ 54

SPIx C ON1 (S PIx Co ntrol 1 )... ..... ...... ...... ...... ..... .. ..... 141

SPIx C ON2 (S PIx Co ntrol 2 )... ..... ...... ...... ...... ..... .. ..... 143

SPIxSTAT (SPIx Status and Control)....................... 140

 2009 Microchip Technology Inc. Preliminary DS70289F-page 255

PIC24HJ32GP202/204 and PIC24HJ16GP304

SR (CPU Status)...................................................22, 66

T1CON (Timer1 Con trol)................ .............. ........... ..126

TxCON (T2CON, T4CON, T6CON or T8CON Control)..

130

TyCON (T3CON, T5CON, T7CON or T9CON Control)..

131

UxMODE (UARTx Mode)..........................................154

UxSTA (UARTx Status and Control).........................156

Reset

Illegal Opcode................................ .. .. .... .. .. .. ....... ..53, 60

Trap Conflict..... ............... ............... .............. .........59, 60

Uninitialized W Register........................................53, 60

Reset Sequence .................................................. ......... .... ..61

Resets.................................................................................53

Serial Peripheral Interface (SPI) .......................................139

Software Reset Instruction (SWR)......................................59

Softwa re Simulato r ( MP L AB SIM).......... ....................... ....191

Software Stack Pointer, Frame Pointer

CALL Stack Frame......................................................40

Speci a l Features of th e CPU ........................... ............... ..173

SPI Module

SPI1 Register Map......................................................33

Symbols Used in Opcode Descriptions .............................182

System Control

Temperature and Voltage Specifications

AC.....................................................................202, 230

Timer1...............................................................................125

Timer2/3, Timer4/5, Timer6/7 and Timer8/9 .....................127

Timing Characteristics

CLKO and I/O ...........................................................205

Timing Diagrams

10-bit A/D Conversion...............................................225

10-bit A/D Conversion (CHP S<1:0> = 01, SIMSAM = 0,

ASAM = 0, SSRC<2:0> = 000).........................225

12-bit A/D Conversion (ASAM = 0, SSRC<2:0> = 000)..

224

Brown-out Situations...................................................59

External Clock...........................................................203

I2Cx Bus Data (Master Mode) ..................................217

I2Cx Bus Data (Slave Mode) ....................................219

I2Cx Bus Start/Stop Bits (Master Mode)...................217

I2Cx Bus Start/Stop Bits (Slave Mode).....................219

Input Capture (CAPx)............................................ .. ..210

OC/PWM...................................................................211

Output Co mpa re (OCx)....... ............... ............... ........210

Reset, Watchdog Timer, Oscillator Start-up Timer and

Power-up Timer.... .......... ............... ............... ....206

SPIx Master Mode (CKE = 0) ...................................212

SPIx Master Mode (CKE = 1) ...................................213

SPIx Slave Mode (CKE = 0) .....................................214

SPIx Slave Mode (CKE = 1) .....................................215

Timer1 , 2 , 3 , 4 , 5 , 6, 7, 8, 9 Exte rnal Clock...............208

Timing Requirements

ADC Conversion (10-bit mode).................................235

ADC Conversion (12-bit Mode).................................235

CLKO and I/O ...........................................................205

External Clock...........................................................203

Input Capture............ .. .... .. .... .. ....... .... .. .... .. ....... .... .. ..210

SPIx Master Mode (CKE = 0) ...................................231

SPIx Module Master Mode (CKE = 1).......................231

SPIx Module Slave Mode (CKE = 0)....................... ..232

SPIx Module Slave Mode (CKE = 1) ........................ 232

Timing Specifications

10-bit A/D Conversion Requirements....................... 226

12-bit A/D Conversion Requirements....................... 224

I2Cx Bus Data Requirements (Master Mode)........... 2 18

I2Cx Bus Data Requirements (Slave Mode)............. 220

Output Compare Requirements.............................. .. 210

PLL Clock......................................................... 204, 230

Reset, Watchdog Timer, Oscillator Start-up Time r, P ow-

er-up Timer and Brown-out Reset Requirements...

207

Simple OC/PWM Mode Requirements..................... 211

SPIx Master Mode (CKE = 0) Requirements............ 212

SPIx Master Mode (CKE = 1) Requirements............ 213

SPIx Slave Mode (CKE = 0) Requirements.............. 214

SPIx Slave Mode (CKE = 1) Requirements.............. 216

Timer1 External Clock Requirements....................... 208

Timer2, Timer4, Tim er6 and Timer8 External Clock Re-

quirements........................................................ 209

Timer3, Timer5, Tim er7 and Timer9 External Clock Re-

quirements........................................................ 209

UART Module

UAR T1 R e g i s t e r Ma p .. ......... ...... ...... ..... ...... ...... ...... ... 3 3

Usin g the R C ON St atu s Bi t s.. .. . ...... ...... .. ...... . ...... ...... ...... .. . 60

Voltage Re gulator (On-Chip)................... ........... .............. 176

Watchdog Tim e -ou t Reset (WDTR)..... ........... .......... .......... 59

Watchdog Timer (WDT)............................................ 173, 177

Programming Considerations................................... 177

WWW Address .................................. ........................... .... 2 5 7

WWW, On-Line Support....................................................... 9

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 256 Preliminary  2009 Microchip Technology Inc.

NOTES:

 2009 Microchip Technology Inc. Preliminary DS70289F-page 257

PIC24HJ32GP202/204 and PIC24HJ16GP304

THE MICROCHIP WEB SITE

Microc hip pro vides onl ine s upport v ia our W WW site at

www.microc hi p.c om . Thi s web si te i s us ed as a m ean s

to make files and information easily available to

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ordering guides, latest Microchip press releases,

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Microchip sales offices, distributors and factory

representatives

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changes, updates, revisions or errata related to a

specif ied produ ct family or develo pment tool of interes t.

To register, access the Microchip web site at

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Notification and follow the registration instructions.

CUSTOMER SUPP ORT

Users of Microchip products can receive assistance

through several channels:

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Customers should contact their distributor,

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Technic al suppo rt is avail able throug h the we b site

at: http://support.microchip.com

PIC24HJ32GP202/204 and PIC24HJ16GP304

DS70289F-page 258 Preliminary  2009 Microchip Technology Inc.

READER RESP ONSE

It is ou r intention to pro vi de you wit h th e b es t docume ntat ion po ss ib le to e ns ure succ es sfu l u se of y ou r M ic roc hip prod-

uct. If you wi sh to prov ide you r comment s on org aniza tion, clar ity, su bject m atter , a nd ways in whic h our doc umenta tion

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DS70289FPIC24HJ32GP202/204 and

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

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7. How would you improve this document?

 2009 Microchip Technology Inc. Preliminary DS70289F-page 259

PIC24HJ32GP202/204 and PIC24HJ16GP304

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Architecture: 24 = 16-bit Microcontroller

Flash Memory Family: HJ = Flash program memory, 3.3V

Product Group: GP2 = General purpose family

GP3 = General purpose family

Pin Count: 02 = 28-pin

03 = 44-pin

Temperature Range: I = -40C to +85C (Industrial)

E=-40C to +125C (Extended)

H=-40C to +140C (High)

Package: SP = Skinny Plastic Dual In-Line - 300 mil body (SPDIP)

SO = Plastic Small Outline - Wide - 7.5 mm body (SOIC)

MM = Plastic Quad, No Lead Package - 6x6 mm body (QFN-S)

PT = Plastic Thin Quad Flatpack - 10x10x1 mm body (TQFP

ML = Plastic Quad, No Lead Package - 8x8 mm body (QFN)

Examples:

a) PIC24HJ32GP202-E/SP:

General-purpose PIC24H,

32 KB program memory,

28-pin, Extended temp.,

SPDIP package.

Microchip T rademark

Architecture

Flash Memory Family

Program Memory Size (KB)

Product Group

Pin Coun t

Temperature Range

Package

Pattern

PIC 24 HJ 32 GP2 02 T E / SP - XXX

Tape and Reel Flag (if applicable)

DS70289F-page 260 Preliminary  2009 Microchip Technology Inc.

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Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Cop e nha gen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53 -63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-14 4-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08 -91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921- 5820

Worldwide Sales and Service

03/26/09