To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. 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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET PHOTOCOUPLER PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 HIGH ISOLATION VOLTAGE AC INPUT, DARLINGTON TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES -NEPOC Series- DESCRIPTION The PS2566-1 is optically coupled isolators containing GaAs light emitting diodes and an NPN silicon darlington connected phototransistor. The PS2566-1 is in a plastic DIP (Dual In-line Package) and the PS2566L-1 is lead bending type (Gull-wing) for surface mount. The PS2566L1-1 is lead bending type for long creepage distance. The PS2566L2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES * AC input response * High Isolation voltage (BV = 5 000 Vr.m.s.) * High current transfer ratio (CTR = 2 000% TYP.) * High-speed switching (tr, tf = 100 s TYP.) * Ordering number of taping product: PS2566L-1-E3, E4, F3, F4, PS2566L2-1-E3, E4 * Safety standards * UL approved: File No. E72422 * CSA approved: No. CA 101391 * BSI approved: No. 7112/7420 * SEMKO approved: No. 303059 * NEMKO approved: No. P03200272 * DEMKO approved: No. 312341 * FIMKO approved: No. FI 10620 * DIN EN60747-5-2 (VDE0884 Part2) approved (Option) APPLICATIONS * Telephone/FAX. * FA/OA equipment * Programmable logic controller The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10237EJ03V0DS (3rd edition) Date Published March 2006 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices, Ltd. 1991, 2006 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 PACKAGE DIMENSIONS (UNIT : mm) DIP Type (New package) PS2566-1 TOP VIEW 4 3 1 2 7.62 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 3.50.3 3.20.4 4.150.4 6.50.5 4.60.35 0 to 15 +0.1 0.25 -0.05 1.250.15 0.500.10 0.25 M 2.54 DIP Type PS2566-1 TOP VIEW 4 3 1 2 7.62 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 3.50.3 3.30.5 4.150.4 6.50.5 4.60.5 0 to 15 +0.1 0.25 -0.05 1.250.15 0.500.10 0.25 M 2.54 2 Data Sheet PN10237EJ03V0DS PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 Lead Bending Type (New package) PS2566L-1 TOP VIEW 4 3 1 2 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 0.1 +0.1 -0.05 3.50.3 0.25 +0.1 -0.05 6.50.5 4.60.35 0.90.25 9.600.4 1.250.15 0.25 M 2.54 0.15 Lead Bending Type PS2566L-1 TOP VIEW 4 3 1 2 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 0.1 +0.1 -0.05 3.50.3 0.25 +0.1 -0.05 6.50.5 4.60.5 0.90.25 9.600.4 1.250.15 0.25 M 2.54 0.15 Data Sheet PN10237EJ03V0DS 3 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 Lead Bending Type For Long Creepage Distance (New Package) PS2566L1-1 TOP VIEW 4.60.35 3 1 2 3 1 2 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 10.16 3.5 0.3 3.15 3.85 0.35 0.4 6.50.5 4 4 0.500.1 0.25 M 1.250.15 +0.1 0.25-0.05 2.54 0 to 15 Lead Bending Type For Long Creepage Distance PS2566L1-1 4.60.5 TOP VIEW 4 3 6.50.5 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 1 2 3.50.3 3.150.35 3.850.4 10.16 0 to 15 0.25 +0.1 -0.05 1.250.15 0.500.10 0.25 M 2.54 4 Data Sheet PN10237EJ03V0DS PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 Lead Bending Type For Long Creepage Distance (Gull-Wing) (New Package) PS2566L2-1 TOP VIEW 4.60.35 3 1 2 3 1 2 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector +0.1 0.25-0.05 3.50.3 0.250.2 6.50.5 4 4 0.90.25 0.25 1.250.15 0.25 M 10.16 +0.2 11.8-0.5 2.54 Lead Bending Type For Long Creepage Distance (Gull-Wing) PS2566L2-1 TOP VIEW 4.60.5 4 3 3.50.3 0.25 +0.1 -0.05 1 2 10.16 0.250.2 6.50.5 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector 0.90.25 1.250.15 11.8 +0.2 -0.5 0.25 M 2.54 0.25 Data Sheet PN10237EJ03V0DS 5 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 MARKING EXAMPLE No. 1 pin Mark 2566 NL601 N L Assembly Lot 6 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package 6 Made in Japan Made in Taiwan Standard PKG L New PKG J Data Sheet PN10237EJ03V0DS PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Specification Pb-Free Approval PS2566-1 PS2566-1-A Magazine case 100 pcs PS2566L-1 PS2566L-1-A (UL, CSA, BSI, PS2566L1-1 PS2566L1-1-A NEMKO, SEMKO, PS2566L2-1 PS2566L2-1-A DEMKO, FIMKO PS2566L-1-E3 PS2566L-1-E3-A PS2566L-1-E4 PS2566L-1-E4-A PS2566L-1-F3 PS2566L-1-F3-A PS2566L-1-F4 PS2566L-1-F4-A PS2566L2-1-E3 PS2566L2-1-E3-A PS2566L2-1-E4 PS2566L2-1-E4-A PS2566-1-V PS2566-1-V-A PS2566L-1-V PS2566L-1-V-A (VDE0884 Part2) PS2566L1-1-V PS2566L1-1-V-A approved products PS2566L2-1-V PS2566L2-1-V-A (option) PS2566L-1-V-E3 PS2566L-1-V-E3-A PS2566L-1-V-E4 PS2566L-1-V-E4-A PS2566L-1-V-F3 PS2566L-1-V-F3-A PS2566L-1-V-F4 PS2566L-1-V-F4-A PS2566L2-1-V-E3 PS2566L2-1-V-E3-A PS2566L2-1-V-E4 PS2566L2-1-V-E4-A Embossed Tape 1 000 pcs/reel Standard products Application Part Number *1 PS2566-1 approved) Embossed Tape 2 000 pcs/reel Embossed Tape 1 000 pcs/reel Magazine case 100 pcs DIN EN60747-5-2 Embossed Tape 1 000 pcs/reel Embossed Tape 2 000 pcs/reel Embossed Tape 1 000 pcs/reel *1 For the application of the Safety Standard, following part number should be used. Data Sheet PN10237EJ03V0DS 7 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit IF 80 mA PD/C 1.5 mW/C PD 150 mW IFP 1 A Collector to Emitter Voltage VCEO 40 V Emitter to Collector Voltage VECO 6 V IC 200 mA PC/C 2.0 mW/C PC 200 mW BV 5 000 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +150 C Diode Forward Current (DC) Power Dissipation Derating Power Dissipation *1 Peak Forward Current Transistor Collector Current Power Dissipation Derating Power Dissipation Isolation Voltage *2 *1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. 8 Data Sheet PN10237EJ03V0DS PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Transistor Symbol Conditions MIN. TYP. MAX. Unit 1.4 V Forward Voltage VF IF = 10 mA 1.17 Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 100 ICEO VCE = 40 V, IF = 0 mA CTR IF = 1 mA, VCE = 2 V 200 2 000 CTR1/ IF = 1 mA, VCE = 2 V 0.3 1.0 Collector to Emitter Dark pF 400 nA Current Coupled Current Transfer Ratio % (IC/IF) CTR Ratio *1 3.0 CTR2 Collector Saturation VCE (sat) IF = 1 mA, IC = 2 mA 1.0 V Voltage RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF *2 Rise Time tr VCC = 10 V, IC = 10 mA, RL = 100 100 s *2 tf Fall Time 10 11 Isolation Resistance 100 *1 CTR1 = IC1/IF1, CTR2 = IC2/IF2 IC1 IF1 VCE IC2 IF2 *2 Test circuit for switching time Pulse Input IF VCC PW = 1 ms Duty Cycle = 1/10 50 VOUT RL = 100 Data Sheet PN10237EJ03V0DS 9 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 150 100 1.5 mW/C 50 0 25 50 75 100 125 2 mW/C 100 50 50 75 100 125 Ambient Temperature TA (C) Ambient Temperature TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE FORWARD CURRENT vs. FORWARD VOLTAGE 150 60 Forward Current IF (mA) TA = +100C +60C +25C 10 5 0C -25C -55C 1 0.5 0.7 40 20 0 -20 -40 -60 0.1 0.8 0.9 1.0 1.1 1.2 1.4 1.3 -80 1.5 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 Forward Voltage VF (V) Forward Voltage VF (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 200 100 Collector Current IC (mA) VCE = 2 V 5V 10 V 24 V 40 V 1000 10 1 -50 Remark 10 mA 100 10 000 -25 0 25 50 75 100 5 mA 50 1 mA 10 0.5 mA 5 0.2 mA 1 0.5 0.2 0.4 Ambient Temperature TA (C) 10 25 80 50 Forward Current IF (mA) 150 0 150 100 Collector to Emitter Dark Current ICEO (nA) 200 IF = 0.1 mA 0.6 0.8 1.0 1.2 1.4 Collector Saturation Voltage VCE(sat) (V) The graphs indicate nominal characteristics. Data Sheet PN10237EJ03V0DS 1.6 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE Normalized Current Transfer Ratio CTR 160 5 mA Collector Current IC (mA) 140 120 100 80 2 mA 60 40 1 mA 20 IF = 0.5 mA 0 2 4 NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 6 8 1.4 Normalized to 1.0 at TA = 25C, IF = 1 mA, VCE = 2 V 1.2 1.0 0.8 0.6 0.4 0.2 -50 10 -25 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 50 75 100 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 8 000 7 000 Sample A B C D 6 000 5 000 4 000 3 000 2 000 1 000 Current Transfer Ratio CTR (%) 3 000 VCE = 2 V 0 0.1 0.5 1 5 10 VCE = 2 V 2 500 2 000 1 500 1 000 500 0 30 Sample A B C D 10 50 SWITCHING TIME vs. LOAD RESISTANCE 10 000 VCC = 5 V, 500 IC = 2 mA, CTR = 2 280% tf Switching Time t ( s) 5 000 100 tr td 10 5 ts 2 30 50 tf VCC = 5 V, IF = 1 mA, CTR = 2 280% 1 000 500 ts 100 50 tr 10 td 100 500 1k 5k 300 500 1k 5k 10 k 50 k 100 k Load Resistance RL () Load Resistance RL () Remark 500 SWITCHING TIME vs. LOAD RESISTANCE 1 000 50 100 Forward Current IF ( A) Forward Current IF (mA) Switching Time t ( s) 25 Ambient Temperature TA (C) Collector to Emitter Voltage VCE (V) Current Transfer Ratio CTR (%) 0 The graphs indicate nominal characteristics. Data Sheet PN10237EJ03V0DS 11 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 LONG TERM CTR DEGRADATION FREQUENCY RESPONSE 1.2 IF = 1 mA, VCE = 2 V 1.0 -5 -10 -15 RL = 100 0.5 1 2 5 10 20 TA = 60oC 0.6 0.4 50 100 200 0 10 Frequency f (kHz) Remark 12 TA = 25oC 0.8 0.2 -20 0.2 IF = 1 mA (TYP.) CTR (Relative Value) Normalized Gain GV 0 102 103 104 Time (Hr) The graphs indicate nominal characteristics. Data Sheet PN10237EJ03V0DS 105 106 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 TAPING SPECIFICATIONS (UNIT : mm) 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2566L-1-E3 PS2566L-1-E4 Outline and Dimensions (Reel) 2.00.5 21.00.8 80.01.0 R 1.0 2542.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 1 000 pcs/reel Data Sheet PN10237EJ03V0DS 15.9 to 19.4 Outer edge of flange 13 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2566L-1-F3 PS2566L-1-F4 Outline and Dimensions (Reel) 2.00.5 21.00.8 1001.0 R 1.0 3302.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 2 000 pcs/reel 14 Data Sheet PN10237EJ03V0DS 15.9 to 19.4 Outer edge of flange PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 2.050.1 4.40.2 12.350.15 11.50.1 1.550.1 24.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 0.38 6.60.2 12.00.1 Tape Direction PS2565L2-1-E3 PS2565L2-1-E4 Outline and Dimensions (Reel) R 1.0 21.00.8 1001.0 2.00.5 13.00.2 3302.0 2.00.5 25.51.0 29.51.0 Packing: 1 000 pcs/reel Data Sheet PN10237EJ03V0DS 23.9 to 27.4 Outer edge of flange 15 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C. 16 Data Sheet PN10237EJ03V0DS PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10237EJ03V0DS 17 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Speck Unit Application classification (DIN VDE 0109) for rated line voltages 300 Vr.m.s. IV for rated line voltages 600 Vr.m.s. III Climatic test class (DIN IEC 68 Teil 1/09.80) 55/100/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) UIORM 890 Vpeak Upr 1 068 Vpeak Upr 1 424 Vpeak UTR 8 000 Vpeak Upr = 1.2 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices test) Upr = 1.6 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN VDE 0109) 2 Clearance distance > 7.0 mm Creepage distance > 7.0 mm Comparative tracking index (DIN IEC 112/VDE 0303 part 1) CTI Material group (DIN VDE 0109) 175 III a Storage temperature range Tstg -55 to +150 C Operating temperature range TA -55 to +100 C VIO = 500 V dc at TA = 25C Ris MIN. 10 12 VIO = 500 V dc at TA MAX. at least 100C Ris MIN. 10 11 Package temperature Tsi 175 C Current (input current IF, Psi = 0) Isi 400 mA Power (output or total power dissipation) Psi 700 mW Ris MIN. 10 Isolation resistance, minimum value Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Isolation resistance VIO = 500 V dc at TA = 175C (Tsi) 18 Data Sheet PN10237EJ03V0DS 9 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. * The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PN10237EJ03V0DS 19 PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504