225510615649 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1st November 1999

File under Discrete Ceramics, ACM2

2000 Jul 18

DISCRETE CERAMICS

C-Array: Class 2, X7R 16 V, 25 V

and 50 V

Noble Metal Electrode

Surface mount ceramic

multilayer capacitors

2000 Jul 18 2

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

FEATURES

•0612 (4 ×0603) capacitors (of the

same capacitance value) per array

•Less than 50% board space of an

equivalent discrete component

•High volumetric efficiency

•Dense dielectric layers

•Supplied in tape on reel or loose in

bag

•Increased throughput, by time

saved in mounting

•Cost savings on manufacturing

time.

APPLICATIONS

•Professional electronics

•High density consumer electronics

•Automotive.

DESCRIPTION

Each capacitor element consists of a

rectangularblockofceramicdielectric

in which a number of interleaved

precious metal electrodes are

contained. This structure gives rise to

a high capacitance per unit volume.

Theinnerelectrodesareconnectedto

the two terminations, silver dipped

with a barrier layer of plated nickel

and finally covered with a layer of

plated tin (NiSn). An outline of the

structure is shown in Fig.1.

QUICK REFERENCE DATA

DESCRIPTION VALUE

Rated voltage UR (DC) 16 V; 25 V; 50 V (IEC)

Capacitance (E12 series):

16 V 10 nF to 100 nF

25V 10nFto68nF

50 V 220 pF to 10 nF

Tolerance on capacitance ±10%; ±20%

Sectional speciﬁcations IEC 60384-10, second edition 1989-04;

also based on CECC 32 100

Detailed speciﬁcation based on CECC 32 101-801

Climatic category (IEC 6068) 55/125/56

handbook, halfpage

CCA833

Fig.1 Simplified outline.

2000 Jul 18 3

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

MECHANICAL DATA

Physical dimensions

Table 1 Capacitor dimensions for product size 0612 (4 ×0603); see Fig.2

CASE

SIZE LW TABP

MIN. MAX.

Dimensions in millimetres

0612

(4 ×0603) 3.20 ±0.15 1.60 ±0.15 0.80 ±0.10 1.20 ±0.10 0.40 ±0.1 0.30 ±0.2 0.80 ±0.1

Dimensions in inches

0612

(4 ×0603) 0.125 ±0.006 0.063 ±0.006 0.032 ±0.004 0.048 ±0.004 0.016 ±0.004 0.012 ±0.008 0.031 ±0.004

Fig.2 Dimensional outline.

For dimensions see Table 1.

handbook, 4 columns

CCB404

2000 Jul 18 4

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

DIMENSIONS OF SOLDER LANDS

Table 2 Solder land dimensions; see Fig.3

CASE

SIZE

FOOTPRINT DIMENSIONS

(mm)

ABCDE

0612

(4 ×0603) 2.54 ±0.15 0.89 ±0.10 0.76 ±0.10 0.80 ±0.10 0.45 ±0.10

handbook, 4 columns

E D

CCC314

solder land

Fig.3 Recommended dimensions of solder lands.

For dimensions see Table 2.

2000 Jul 18 5

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

SELECTION CHART

Thickness classiﬁcation and packaging quantities

(pF) LAST TWO DIGITS

OF 12NC 16 V 25 V 50 V

0612 (4 ×0603)

220 14

270 15

330 16

390 17

470 18

560 19

680 21

820 22

1000 23

1200 24

1500 25 0.8 ±0.1

1800 26

2200 27

2700 28

3300 29

3900 31

4700 32

5600 33

6800 34

8200 35

10000 36

12000 37

15000 38

18000 39

22000 41 0.8 ±0.1

27000 42

33000 43 0.8 ±0.1

39000 44

47000 45

56000 46 1.2 ±0.1

68000 47

82000 48 Values in shaded cells indicate thickness classiﬁcation.

100000 49

THICKNESS

CLASSIFICATION

(mm)

8 mm TAPE WIDTH

AMOUNT PER REEL

∅180 mm; 7" ∅330 mm; 13"

PAPER BLISTER PAPER BLISTER

0.8 ±0.1 4000 4000 10000 10000

1.2 ±0.1 4000 4000 10000 10000

2000 Jul 18 6

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

ORDERING INFORMATION

Components may be ordered by using either a simple 15-digit clear text code or Philips unique 12NC.

Clear text code

EXAMPLE: 06122R104K7B200

SIZE

CODE TEMP.

CHAR. CAPACITANCE TOL. VOLTAGE TERMINATION PACKAGING MARKING SERIES

0612

(4 ×0603) 2R = X7R 104 = 100000 pF;

the third digit

signiﬁes the

multiplying factor:

1=×10

2=×100

3=×1000

4=×10000

K=±10%

M=±20% 7 = 16 V

8 = 25 V

9 = 50 V

B = NiSn 2 = 180 mm; 7" paper

3 = 330 mm; 13" paper

B = 180 mm; 7" blister

F = 330 mm; 13" blister

0 = no marking 0 = conv.

ceramic

Ordering code 12NC

(1) Refer to chapter “Selection chart”.

(2) Amount on reel depends on thickness classification, see section “Thickness classification and packaging quantities”.

handbook, full pagewidth

2 2 X X X X X X 6 X X X

Carrier type

55 blister

paper

Rated voltage - Termination

16 V ; NiSn

25 V ; NiSn

50/63 V ; NiSn

Size

6 0612 (4 × 0603)

Capacitance value(1)

Tolerance

7±10%

±20%

Packaging(2)

5reel: ∅180 mm; 7"

reel: ∅330 mm; 13"

CCB549

2000 Jul 18 7

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

ELECTRICAL CHARACTERISTICS FOR CLASS 2, CAPACITORS

Class 2 capacitors; X7R dielectric; NiSn terminations

Unless otherwise stated all electrical values apply at an ambient temperature of 23 ±3°C, an atmospheric pressure of

86 to 106 kPa, and a relative humidity of 63 to 67%.

Note

1. Measured at 1 V, 1 kHz, using a four-gauge method.

DESCRIPTION VALUE

Capacitance (E12 series):

16 V 10 nF to 100 nF

25V 10nFto68nF

50 V 220 pF to 10 nF

Tolerance on capacitance after 1000 hours ±10%; ±20%

Test voltage (DC) for 1 minute 2.5 ×UR

Tan δ; note 1:

16 V ≤3.5%

25 V and 50 V ≤2.5%

Insulation resistance after 1 minute at UR (DC):

C≤10 nF Rins ×C≥105MΩ

C > 10 nF Rins ×C > 1000 s

Ageing typical 1% per time decade

2000 Jul 18 8

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

Fig.4 Typicalcapacitancechangewithrespect

to the capacitance at 1 V as a function

of DC voltage at 25 °C.

handbook, halfpage

−20

−40

−60 20 40 60

CCB558

∆C

(%)

VDC (V)

12 3

Curve 1 = 16 V product.

Curve 2 = 25 V product.

Curve 3 = 50 V product.

Fig.5 Typical tan δ as a function of temperature.

handbook, halfpage

−60

600

400

200

0−20 140

CCB559

20 60 100

tan δ

(× 10−4)

T (°C)

Curve 1 = 16 V product.

Curve 2 = 25 V product.

Curve 3 = 50 V product.

Fig.6 Typicalcapacitancechangeas

a function of temperature.

handbook, halfpage

−60

−5

−10

−15 −20 140

CCB560

20 60 100

∆C

(%)

T (°C)

2000 Jul 18 9

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

TESTS AND REQUIREMENTS

Table 3 Test procedures and requirements

IEC

60384-10/

CECC 32 100

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE REQUIREMENTS

4.4 mounting the capacitors may be mounted

on printed-circuit boards or

ceramic substrates by applying

wave soldering, reﬂow soldering

(including vapour phase

soldering) or conductive adhesive

no visible damage

4.5 visualinspectionand

dimension check any applicable method using

×10 magniﬁcation in accordance with speciﬁcation

4.6.1 capacitance

(measured

1000 hours after

date of manufacture)

f = 1 kHz; measuring voltage

rms at 20 °Cwithin speciﬁed tolerance

4.6.2 tan δf = 1 kHz; measuring voltage

rms at 20 °Cin accordance with speciﬁcation

4.6.3 insulation resistance at UR (DC) for 1 minute in accordance with speciﬁcation

4.6.4 voltage proof 2.5 ×URfor 1 minute no breakdown or ﬂashover

4.7.1 temperature

characteristic between minimum and maximum

temperature in accordance with speciﬁcation

4.8 adhesion a force of 5 N applied for 10 s to

the line joining the terminations

and in a plane parallel to the

substrate

no visible damage

4.9 bond strength of

plating on end face mounted in accordance with

IEC 60384 10, paragraph 4.4

conditions: bending

1 mm at a rate of 1 mm/s,

radius jig 340 mm

no visible damage

∆C/C: ±10%

4.10 Tb resistance to

soldering heat; jig

clamps to the

second component

in the longitudinal

line

260 ±5°C for 10 ±0.5 s in a static

solder bath the terminations shall be well

tinned after recovery

∆C/C: ±10%

resistance to

leaching; jig clamps

to the second

component in the

longitudinal line

260 ±5°C for 30 ±1 s in a static

solder bath using visual enlargement of

×10, dissolution of the

terminations shall not

exceed 10%

2000 Jul 18 10

Philips Components Product speciﬁcation

Surface mount ceramic

multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V

Noble Metal Electrode

4.11 Ta solderability; jig

clamps to the

second component

in the longitudinal

line

zero hour test, and test after

storage (20 to 24 months) in

original packing in normal

atmosphere;

unmounted chips completely

immersed for 2 ±0.5 s in a solder

bath at 235 ±5°C

the terminations shall be well

tinned

4.12 Na rapid change of

temperature preconditioning:

between minimum and maximum

temperature, 5 cycles

no visible damage

after 24 hours recovery:

∆C/C: ≤15%

4.14 Ca damp heat preconditioning:

56 days at 40 °C; 90 to 95% RH;

UR applied

after 48 hours recovery:

∆C/C: ±15%

tan δ:7%

Rins: 1000 MΩ or RiCR≥25 s,

whichever is less

4.15 endurance preconditioning:

2×URat 125 °C for 1000 hours,

recovery 48 ±4 hours at room

temperature

after 48 hours recovery:

∆C/C: ±20%

tan δ: 7%

Rins: 2000 MΩ or RiCR≥50 s,

whichever is less

IEC

60384-10/

CECC 32 100

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE REQUIREMENTS