LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode MINI-MELF (LL34) HERMETICALLY SEALED GLASS C Features Surface device type mounting. Hermetically Sealed Glass. B Matte Tin (Sn) Terminal Finish Pb free version and RoHS compliant A All external surfaces are corrosion resistant and terminals are readily solderable. Dimensions Mechanical Data Unit (mm) Unit (inch) Min Max Min Max Case :MINI-MELF Package A 3.30 3.70 0.130 0.146 Terminal: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed B 1.40 1.60 0.055 0.063 C 0.20 0.50 0.008 0.020 High temperature soldering guaranteed: 260C/10s Weight : 29 2.5 mg Suggested PAD Layout Ordering Information 1.25 Package Part No. 0.049 Packing MINI-MELF LLDB3 L1 2.5K / 7" Reel MINI-MELF LLDB3TG L1 2.5K / 7" Reel 2.00 2.50 0.079 0.098 Maximum Ratings and Electrical Characteristics 5.00 0.197 Rating at 25C ambient temperature unless otherwise specified. Maximum Ratings Type Number Power Dissipation Repetitive Peak Forward Current Pulse Width= 20sec Thermal Resistance (Junction to Ambient) (Note 1) Junction and Storage Temperature Range Symbol Value Units PD 150 mW IFRM 2 A RJA 400 C/W TJ, TSTG -40 to + 125 C Notes:1. Valid provided that electrodes are kept at ambient temperature Version : C10 LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Electrical Characteristics Type Number LLDB3 LLDB3TG Min. 28 30 VBO Typ. 32 32 Max. 36 34 + / -VBO IBO Max. +/-3 +/-2 V Max. 100 15 A V Min. 5 IB Max. 10 A VO Min. 5 V Symbol Break-over Voltage C= Break-over Voltage Symmetry C= Break-over Current 22nF 22nF C= 22nF IBO to IF=10mA VB= 0.5VBO (MAX) Dynamic Breakover Voltage Leakage Current *see diagram 1 Output Voltage 9 Units V V Tape & Reel specification TSC label Item Top Cover Tape Carieer Any Additional Label (If Required) P0 d P1 T E A C F W B Symbol Dimension Carrier width A 1.83 0.10 Carrier length B 3.73 0.10 Carrier depth C 1.80 0.10 Sprocket hole d 1.50 0.10 Reel outside diameter D 178 1 Reel inner diameter D1 55 Min Feed hole width D2 13.0 0.20 Sprocke hole position E 1.75 0.10 Punch hole position F 3.50 0.05 Sprocke hole pitch P0 4.00 0.10 Embossment center P1 2.00 0.05 Overall tape thickness T 0.230.005 Tape width W 8.00 0.30 Reel width W1 14.4max W1 D D2 D1 Direction of Feed Version : C10 LLDB3-LLDB3TG 150mW Bi-directional Trigger Diode Small Signal Diode Rating and Characteristic Curves I IF=10m IBO V IB VB=0.5*VBO VF V VBO VBO :Break-Over Voltage IBO : Break-Over Current V : Dynamic Breakover Voltage IB : Leakage Current at V B=0.5*VBO VF : Voltage at Current I F=10mA Diagram 1: Test Circuit FIG 1 Admissible Power Dissipation Curve Power Dissipation (mW) 160 120 80 40 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient Tempeatature ( oC) FIG 3 Repetitive peak pulse current versus pulse duration (maximum values) FIG 2 Relative variation of VBO versus junction temperature (typical values) Repetitive peak pulse current (A) VBO [Tj] / VBO [Tj=25C] 1.08 1.07 1.06 1.05 1.04 1.03 1.02 1.01 1.00 25 50 75 Tj(C) 100 125 100 10 1 0.1 1 10 100 tp (s) Version : C10