2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm IL3W Series Applications: Product Features: 2 Pad SMD Package RoHS Compliant Compatible with Leadfree Processing Ultra Low Profile Real Time Clocks Metering Industrial Control Time Reference Frequency 32.768kHz ESR (Equivalent Series Resistance) 90,000 Ohms Maximum Shunt Capacitance (C0) 2.0pF Maximum Motional Capacitance (C1) 6.5fF Typical Frequency Tolerance @ 25 C 5C 20ppm Maximum Frequency Stability over Temperature Parabolic -0.045ppm/C2 Typical Turnover point +25C 5C (See Graph Below) Crystal Cut X-Cut Load Capacitance 12.5pF (See Table Below) Drive Level 0.1Watt Typical, 0.5Watt Maximum Aging 3ppm/year Maximum Operating Temperature Range -40C to +85C Storage Temperature Range -55C to +125C 1 .6 0 .1 0 M a r k in g 1 .0 0 .1 0 0 .5 0 m ax 0 .8 6 0 .4 0 0 .4 0 0 .5 0 0 .5 0 1 .0 0 0 .6 0 S u g g e s te d L a n d P a tte rn s D im e n s io n s : m m Part Number Guide Package IL3W Sample Part Number: IL3W-HX5F12.5- 32.768 KHz Stability (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range H = 20 ppm X = X Cut 5 = -40C to +85C ode (overtone) F = Fundamental Load Capacitance (pF) 12.5 = 12.5pF 9.0 = 9.0pF 7.0 = 7.0pF ILSI America Phone 775-851-8880 Fax 775-851-8882 email: e-mail@ilsiamerica.com www.ilsiamerica.com Specifications subject to change without notice Frequency 32.768 KHz Rev: 12/08/17_D Page 1 of 2 2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm Pb Free Solder Reflow Profile: IL3W Series Typical Circuit: Ts max to TL (Ramp-up Rate) Preheat Temperature min (Ts min) Temperature typ (Ts typ) Temperature max (Ts max) Time (Ts) Ramp-up Tate (TL to Tp Time Maintained Above Temperature (TL) Time (TL) Peak Temperature (Tp) Time within 5C to Peak Temperature (Tp) Ramp-down Rate Tune 25C to Peak Temperature 3C / second max 150C 175C 200C 60 to180 seconds 3C / second max 217C 60 to 150 seconds 260C max for 10 seconds 20 to 40 seconds 6C / second max 8 minutes max Units are backward compatible with +240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal) Tape and Reel Information: Quantity per Reel A B C D E F 5000 8.0 0.3 4.0 0.2 3.5 0.02 9.0 1.0 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS JESD22-B102 Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A1 MIL-STD-202, Method 215 Marking Line 1: I, Date Code (YWW) ILSI America Phone 775-851-8880 Fax 775-851-8882 email: e-mail@ilsiamerica.com www.ilsiamerica.com Specifications subject to change without notice Rev: 12/08/17_D Page 2 of 2