2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm
IL3W Series
Rev: 12/08/17_D
Page 1 of 2
Product Features:
Applications:
1 .6 0 ± .1 0
1 .0 0 ± .1 0
0 .5 0
m a x
0 .8 6
0 .4 00 .4 0
0 .5 00 .5 0
0 .6 0
1 .0 0
S u g g e s t e d
L a n d P a t t e rn s
D i m e n s io n s : m m
M a r k i n g
2 Pad SMD Package
Real Time Clocks
RoHS Compliant
Metering
Compatible with Leadfree Processing
Industrial Control
Ultra Low Profile
Time Reference
Frequency
32.768kHz
ESR (Equivalent Series Resistance)
90,000 Ohms Maximum
Shunt Capacitance (C0)
2.0pF Maximum
Motional Capacitance (C1)
6.5fF Typical
Frequency Tolerance @ 25 C ±5ºC
20ppm Maximum
Frequency Stability over
Temperature
Parabolic -0.045ppm/C2 Typical Turnover point
+25ºC ±5ºC (See Graph Below)
Crystal Cut
X-Cut
Load Capacitance
12.5pF (See Table Below)
Drive Level
0.1µWatt Typical, 0.5µWatt Maximum
Aging
3ppm/year Maximum
Operating Temperature Range
-40C to +85C
Storage Temperature Range
-55C to +125C
Part Number Guide Sample Part Number: IL3W-HX5F12.5- 32.768 KHz
Package
Stability
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
ode
(overtone)
Load Capacitance
(pF)
Frequency
IL3W
H = ±20 ppm
X = X Cut
5 = -40°C to +85°C
F = Fundamental
12.5 = 12.5pF
9.0 = 9.0pF
7.0 = 7.0pF
32.768 KHz
2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm
IL3W Series
Rev: 12/08/17_D
Page 2 of 2
Pb Free Solder Reflow Profile: Typical Circuit:
Ts max to TL (Ramp-up Rate)
3ºC / second max
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
150ºC
175ºC
200ºC
60 to180 seconds
Ramp-up Tate (TL to Tp
3ºC / second max
Time Maintained Above
Temperature (TL)
Time (TL)
217ºC
60 to 150 seconds
Peak Temperature (Tp)
260ºC max for 10 seconds
Time within 5ºC to Peak
Temperature (Tp)
20 to 40 seconds
Ramp-down Rate
6ºC / second max
Tune 25ºC to Peak
Temperature
8 minutes max
Units are backward compatible with +240ºC reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal)
Tape and Reel Information:
Quantity per
Reel
5000
A
8.0 ±0.3
B
4.0 ±0.2
C
3.5 ±0.02
D
9.0 ±1.0
E
60 / 80
F
180
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
Moisture Resistance
MIL-STD-883, Method 1004
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Mechanical Vibration
MIL-STD-883, Method 2007, Condition A
Resistance to Soldering Heat
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Hazardous Substance
Pb-Free / RoHS
Solderability
JESD22-B102 Method 2 (Preconditioning E)
Terminal Strength
MIL-STD-883, Method 2004, Test Condition D
Gross Leak
MIL-STD-883, Method 1014, Condition C
Fine Leak
MIL-STD-883, Method 1014, Condition A1
Solvent Resistance
MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (YWW)