2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
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Specifications subject to change without notice
Pb Free Solder Reflow Profile: Typical Circuit:
Ts max to TL (Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
150ºC
175ºC
200ºC
60 to180 seconds
Time Maintained Above
Temperature (TL)
Time (TL)
Time within 5ºC to Peak
Temperature (Tp)
Tune 25ºC to Peak
Temperature
Units are backward compatible with +240ºC reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal)
Tape and Reel Information:
Environmental Specifications
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
Resistance to Soldering Heat
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
JESD22-B102 Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A1
Marking
Line 1: I, Date Code (YWW)