STPS1L30 Datasheet 30 V power Schottky rectifier Features * * * Very low forward voltage drop for less power dissipation Surface mount miniature packages Avalanche rated * ECOPACK(R)2 compliant Applications * * * * * Cordless appliance SSD Battery charger Telecom power DC / DC converter Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA or SMB, the STPS1L30 is ideal for use in parallel with MOSFETs in synchronous rectification. Product status STPS1L30 Product summary Symbol Value IF(AV) 1A VRRM 30 V T j(max.) 150 C VF(typ.) 0.26 V DS1243 - Rev 7 - September 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS1L30 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) Forward rms current 10 A 1 A SMA TL = 135 C SMB TL = 140 C IF(AV) Average forward current, = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 C 110 W -65 to +150 C +150 C Tstg Storage temperature range Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Max. value Junction to lead SMA 30 SMB 25 Unit C/W For more information, please refer to the following application note : * AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 100 C Tj = 25 C VF(1) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 1 A IF = 2 A Min. Typ. - 6 - Unit 200 A 15 mA 0.395 0.260 - Max. 0.300 0.445 0.325 V 0.375 1. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses, use the following equation: P = 0.225x IF(AV) + 0.075 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : * AN604: Calculation of conduction losses in a power rectifier * AN4021: Calculation of reverse losses on a power diode DS1243 - Rev 7 page 2/12 STPS1L30 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Average forward current versus ambient temperature ( = 0.5) Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) = 0.05 0.45 IF(AV)(A) 6 0.50 = 0.1 = 0.2 = 0.5 Rth(j-a)= Rth(j-l) 5 0.40 SMB 4 0.35 0.30 SMA =1 3 0.25 0.20 2 0.15 T T 0.10 0.05 I F(A V) (A) 0.00 0.0 0.2 0.4 0.6 =tp/T 0.8 1 1.2 1.0 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 C) 1 0 Tam b (C) tp =tp/T 0 tp 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/ Rth(j-a) PARM (t p ) PARM (10 s) 1.00 SMB 0.1 0.10 Single pulse 0.01 0.001 t p (s) t p(s) 1 DS1243 - Rev 7 10 0.01 100 1000 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 3/12 STPS1L30 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 6. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-a)/ Rth(j-a) 1.E+2 1.00 T j =150C SMA T j =125C 1.E+1 T j =100C 1.E+0 0.10 1.E-1 T j =25C Single pulse 1.E-2 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 VR (V) 1.E-3 0.01 1.E+01 1.E+02 0 1.E+03 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 5 10 15 20 25 30 Figure 8. Forward voltage drop versus forward current (typical values, high level) IF(A) C(pF) 500 10.00 F=1MHz VOSC=30mVRMS Tj=25C Tj=150C 100 Tj=25C Tj=100C 1.00 V R (V) 10 V F (V) 0.10 1 2 10 5 20 50 Figure 9. Forward voltage drop versus forward current (maximum values, low level) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB) IF(A) Rth(j-a) (C/W) 3.0 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 m Tj =150C SMB 2.5 Tj=100C 2.0 150 Tj=125C 1.5 100 Tj=25C 1.0 50 0.5 S(Cu)(cm) V F (V) 0.0 0.10 0.15 DS1243 - Rev 7 0.20 0.25 0.30 0.35 0.40 0.45 0 0.50 0.55 0.60 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/12 STPS1L30 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a) (C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 m SMA 150 100 50 S(Cu)(cm) 0 0.0 DS1243 - Rev 7 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/12 STPS1L30 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 SMB package information * * Epoxy meets UL94, V0 Lead-free package Figure 12. SMB package outline E1 D E A1 C A2 L DS1243 - Rev 7 b page 6/12 STPS1L30 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 Figure 13. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1243 - Rev 7 page 7/12 STPS1L30 SMA package information 2.2 SMA package information * * Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 14. SMA package outline E1 D E A1 C A2 L b Table 5. SMA package mechanical data Dimensions Millimeters Ref. DS1243 - Rev 7 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 page 8/12 STPS1L30 SMA package information Figure 15. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1243 - Rev 7 page 9/12 STPS1L30 Ordering Information 3 Ordering Information Table 6. Ordering information DS1243 - Rev 7 Order code Marking Package Weight Base qty. Delivery mode STPS1L30A GB3 SMA 0.068 g 5000 Tape and reel STPS1L30U G23 SMB 0.107 g 2500 Tape and reel page 10/12 STPS1L30 Revision history Table 7. Document revision history DS1243 - Rev 7 Date Version Changes Jul-2003 5A Aug-2004 6 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). 17-Sep-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 C, unless otherwise specified) and Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 C). Last update. page 11/12 STPS1L30 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DS1243 - Rev 7 page 12/12