EH1300HSETTS-24.333M - Ecliptek Corporation

RoHS

EH1300HSETTS-24.333M

EH13 00 HS ET TS -24.333M

Series

RoHS Compliant (Pb-free) 3.3V 8 Pin DIP Metal

Thru-Hole LVCMOS High Frequency Oscillator

Frequency Tolerance/Stability

±100ppm Maximum

Package

Operating Temperature Range

-40°C to +85°C

Nominal Frequency

24.333MHz

Pin 1 Connection

Tri-State (Disabled Output: High Impedance)

Duty Cycle

50 ±10(%)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 24.333MHz

Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Ouput Load Change, 1st Year Aging at 25°C,

Shock, and Vibration.)

Aging at 25°C ±5ppm/year Maximum

Operating Temperature Range -40°C to +85°C

Supply Voltage 3.3Vdc ±0.3Vdc

Input Current 35mA Maximum (No Load)

Output Voltage Logic High (Voh) 2.7Vdc Minimum (IOH = -8mA)

Output Voltage Logic Low (Vol) 0.5Vdc Maximum (IOL = +8mA)

Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform)

Duty Cycle 50 ±10(%) (Measured at 50% of waveform)

Load Drive Capability 30pF Maximum

Output Logic Type CMOS

Pin 1 Connection Tri-State (Disabled Output: High Impedance)

Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output (High Impedance), No

Connect to enable output.

Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical

One Sigma Clock Period Jitter ±50pSec Maximum, ±40pSec Typical

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Lead Integrity MIL-STD-883, Method 2004

Mechanical Shock MIL-STD-202, Method 213, Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 1 of 6

EH1300HSETTS-24.333M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

7.620

±0.203

7.620 ±0.203

13.2

MAX

13.2

MAX

85DIA 0.457

±0.1 (X4)

5.08 MIN

5.6 MAX

0.8 ±0.1 (X3)

MARKING

ORIENTATION

PIN CONNECTION

1 Tri-State (High

Impedance)

4 Case/Ground

5 Output

8 Supply Voltage

LINE MARKING

1ECLIPTEK

2EH13TS

EH13=Product Series

324.333M

4XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

80% of Waveform

50% of Waveform

20% of Waveform

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

VIH

VIL

tPLZ tPZL

CLOCK OUTPUT TRI-STATE INPUT

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 2 of 6

EH1300HSETTS-24.333M

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 3 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1300HSETTS-24.333M

High Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 4 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1300HSETTS-24.333M

Low Temperature Infrared/Convection 185°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)185°C Maximum

Target Peak Temperature (TP Target) 185°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 5 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1300HSETTS-24.333M

Low Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 30 - 60 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)245°C Maximum

Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times

Time within 5°C of actual peak (tp)5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 6 of 6