LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Features
* Lead (Pb) free product – RoHS compliant
* High luminous intensity output
* Low power consumption
* 3.2mm dome package with 5.0mm leads pitch
* Available on tape without lead forming
* Low overall height available for a slim unit design
* Reliable and rugged
Package Dimensions
Part No. Lens Source Color
LTL-816GE Green Transparent Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
Part No. : LTL-816GE Page : 1 of 10
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Absolute Maximum Ratings at T
A
=25
°C
Parameter Maximum Rating Unit
Power Dissipation 100 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA
DC Forward Current 30 mA
Derating Linear From 50℃ 0.4 mA/
°C
Operating Temperature Range -55
°C
to + 100
°C
Storage Temperature Range -55
°C
to + 100
°C
Lead Soldering Temperature
[1.6mm(.063") From Body] 260
°C
for 5 Seconds
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Electrical / Optical Characteristics at T
A
=25
°C
Parameter Symbol Min. Typ. Max. Unit
Test Condition
Luminous Intensity I
V
12.6 29 110 mCd
I
F
= 10mA
Note 1,3 and Pg.7
Viewing Angle 2θ
1/2
35 deg Note 2 (Fig.5)
Peak Emission Wavelength λ
P
563 568 573 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λ
d
563 569 573 nm Note 4
Spectral Line Half-Width ∆λ
30 nm
Forward Voltage V
F
2.1 2.6 V I
F
= 20mA
Reverse Current I
R
10 µA V
R
= 5V
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ
1/2
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
5. The Iv guarantee should be added ±15%.
6. Reverse voltage (V
R
) condition is applied for IR test only. The device is not designed for
reverse operation.
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BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Typical Electrical / Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)℃
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BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Packing Spec
500 or 200,100 pcs per packing bag
10packing bags per inner carton
total 5,000 pcs per inner carton
8 Inner cartons per outer carton
total 40,000 pcs per outer carton
Would pack non-full packing for remain outer.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Bin Table Specification
Luminous Intensity Unit : mcd @10mA
Bin Code Min. Max.
O1
60.0 110
N1 40.0 60.0
N2 29.0 40.0
N3 19.0 29.0
N4 12.6 19.0
Note: Tolerance of Measurement precision is ±15%
Dominant Wavelength Unit : nm @10mA
Bin Code Min. Max.
YG 571.0 573.0
PG 569.0 571.0
GG 567.0 569.0
GG1 565.0 567.0
GG2 563.0 565.0
Note: Tolerance of Measurement precision is ±1nm
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BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure or
malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic
control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored
in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron Wave soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
Part No. :
LTL
-
816GE
Page :
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f Lite- O n O n l y
8. Reliability Test
Classification
Test Item Test Condition Reference Standard
Operation Life Ta= Under Room Temperature As
Per Data Sheet Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
Ta= 65±5°C
RH= 90 ～ 95%
Test Time= 240HRS±2HRS
MIL-STD-202F: 103B(1980)
JIS C 7021 : B-11(1982)
High Temperature
High Humidity
Reverse BIAS
Ta= 65±5°C
RH= 90 ～ 95%
VR=5V
Test Time = 500HRS (-24HRS, +48HRS)
JIS C 7021 : B-11(1982)
High Temperature
Storage Ta= 105±5°C
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Endurance
Test
Low Temperature
Storage Ta= -55±5°C
*Test Time=1000HRS (-24HRS,+72HRS) JIS C 7021:B-12 (1982)
Temperature
Cycling
105°C ～ 25°C ～ -55°C ～ 25°C
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021: A-4(1982)
Thermal
Shock
105 ± 5°C ～ -55°C ± 5°C
10mins 10mins
10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance T.sol = 260 ± 5°C
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021: A-1(1982)
Environmental
Test
Solderability T. sol = 230 ± 5°C
Dwell Time= 5 ± 1secs
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
JIS C 7021: A-2(1982)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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