VND5004B-E VND5004BSP30-E Double 4m high side driver with analog current sense for automotive applications Features Parameters Symbol Value Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Max on-state resistance RON 4 m Current limitation (typ) ILIMH 100 A Off-state supply current 2 IS PQFN 12x12 Power lead-less MultiPowerSO-30 - Reverse battery protection with self switch on of the Power MOSFET (see Figure 22) - Electrostatic discharge protection application A(1) 1. Typical value with all loads connected. General - Inrush current active management by power limitation - Very low standby current - 3.0 V CMOS compatible input - Optimized electromagnetic emission - Very low electromagnetic susceptibility - In compliance with the 2002/95/EC European directive Diagnostic functions - Proportional load current sense - Current sense disable - Thermal shutdown indication Protection - Undervoltage shutdown - Overvoltage clamp - Load current limitation - Thermal shutdown - Self limiting of fast thermal transients - Protection against loss of ground and loss of VCC Table 1. All types of resistive, inductive and capacitive loads Suitable for power management applications Description The VND5004BTR-E and VND5004BSP30-E are devices made using STMicroelectronics VIPower technology. They are intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp and load dump protection circuit protect the devices against transients on the Vcc pin (see ISO7637 transient compatibility table). These devices integrate an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is high impedance. Output current limitation protects the devices in overload condition. In case of long duration overload, the devices limit the dissipated power to a safe level up to thermal shutdown intervention. Thermal shutdown with automatic restart allows the device to recover normal operation as soon as a fault condition disappears. Devices summary Package Order codes Tube Tape and reel Tray PQFN-12x12 power lead-less - VND5004BTR-E VND5004B-E MultiPowerSO-30 VND5004BSP30-E VND5004BSP30TR-E - May 2009 Doc ID 15702 Rev 1 1/33 www.st.com 1 Contents VND5004B-E, VND5004BSP30-E Contents 1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 4 5 6 2/33 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.2 PQFN - 12x12 power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 22 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.3 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 27 5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.5 PQFN - 12x12 power lead-less packing information . . . . . . . . . . . . . . . . 30 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Thermal parameters for PQFN - 12x12 power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 24 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 15702 Rev 1 3/33 List of figures VND5004B-E, VND5004BSP30-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. 4/33 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Rthj-amb vs PCB copper area in open box free air condition (one channel on) . . . . . . . . . 20 MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on) . . . 21 Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Rthj-amb vs PCB copper area in open box free air condition (one channel on) . . . . . . . . . 23 PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse (one channel on) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less . . . . . 24 MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 MultiPowerSO-30 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PQFN - 12x12 power lead-less tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . 31 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E 1 Block diagram and pin configurations Block diagram and pin configurations Figure 1. Block diagram VCC Under voltage VCC clamp PwCLAMP DRIVER OUTPUT1 GND ILIM Reverse battery protection Overtemp. IOUT1 PwrLIM K CS_DIS INPUT1 LOGIC CURRENT SENSE1 PwCLAMP DRIVER OUTPUT2 ILIM INPUT2 Overtemp. PwrLIM CS_DIS Table 2. IOUT2 CS_DIS K CURRENT SENSE2 Pin functions Name VCC OUTPUT1,2 GND INPUT1,2 Function Battery connection Power output Ground connection Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current CS_DIS Active high CMOS compatible pin, to disable the current sense pins Doc ID 15702 Rev 1 5/33 Block diagram and pin configurations Figure 2. VND5004B-E, VND5004BSP30-E Configuration diagram (not in scale) PQFN -12x12 Power lead - less (bottom view) 12 11 10 9 8 7 6 5 4 3 2 1 VCC NC FOR TEST ONLY NC NC GND CS_DIS CURRENT SENSE 2 CURRENT SENSE 1 INPUT 2 INPUT 1 NC FOR TEST ONLY NC VCC Table 3. 13 14 16 1 30 VCC Heat Slug1 15 16 VCC OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 MultiPowerSO-30 NC (top view) OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 VCC Suggested connections for unused and not connected pins Connection/pin Current sense 6/33 15 1 NC 2 NC 3 NC 4 GND 5 CS_DIS 6 CURRENT SENSE 2 7 CURRENT SENSE 1 8 INPUT 2 9 INPUT 1 10 NC 11 NC 12 NC 13 FOR TEST ONLY 14 VCC 15 OUTPUT 1 16 OUTPUT 2 N.C. Output Input CS_DIS For test only X X X Floating Not allowed X X To ground Through 1 k resistor X Not allowed Doc ID 15702 Rev 1 Through Through 10 k resistor 10 k resistor Not allowed VND5004B-E, VND5004BSP30-E 2 Electrical specifications Electrical specifications Figure 3. Current and voltage conventions IS VCC ICSD VCSD IIN1,2 VCC IOUT1,2 CS_DIS OUTPUT1,2 VOUT1,2 INPUT1,2 CURRENT SENSE1,2 VSENSE1,2 GND VIN1,2 ISENSE1,2 IGND 2.1 Absolute maximum ratings Stress values that exceed those listed in the "Absolute maximum ratings" table can cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions greater than those, indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality documents. Table 4. Absolute maximum ratings Symbol Value Unit DC supply voltage 28 V Transient supply voltage (T<400 ms, Rload>0.5 ) 41 V -VCC Reverse DC supply voltage 16 V IOUT DC output current Internally limited A 70 A DC input current -1 to 10 mA DC current sense disable input current -1 to 10 mA Current sense maximum voltage (Vcc>0 V) Vcc-41 +VCC V V VCC VCCPK - IOUT IIN ICSD VCSENSE Parameter Reverse DC output current EMAX Maximum switching energy (single pulse) (L=0.3 mH; RL=0 ; Vbat=13.5 V; Tjstart=150 C; IOUT = IlimL(typ.)) 342 mJ VESD Electrostatic discharge (Human Body Model: R=1.5 k; C=100 pF) 2000 V Doc ID 15702 Rev 1 7/33 Electrical specifications Table 4. VND5004B-E, VND5004BSP30-E Absolute maximum ratings (continued) Symbol VESD Tj TSTG 2.2 Parameter Value Unit 750 V Junction operating temperature -40 to 150 C Storage temperature -55 to 150 C Charge device model (CDM-AEC-Q100-011) Thermal data Table 5. Thermal data Value Symbol Parameter Unit MultiPowerSO-30 12x12 PLLP Rthj-case Thermal resistance junction-case (MAX) (with one channel ON) 0.35 0.35 C/W Rthj-amb Thermal resistance junction-ambient (MAX) 58(1) 39(2) C/W 1. PCB FR4 area 58 mmx58 mm, PCB thickness 2 mm, Cu thickness 35 m, minimum pad layout. 2. PCB FR4 area 78 mmx78 mm, PCB thickness 2 mm, Cu thickness 35 m, minimum pad layout. 8/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E 2.3 Electrical specifications Electrical characteristics Values specified in this section are for 8 V<VCC<24 V, -40 C<Tj<150 C, unless otherwise stated. Table 6. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit 4.5 13 28 V 4.5 V Power section VCC Operating supply voltage VUSD Undervoltage shutdown 3.5 Undervoltage shutdown hysteresis 0.5 VUSDhyst V On-state resistance(1) IOUT=15 A; Tj=25 C IOUT=15 A; Tj=150 C IOUT=15 A; VCC=5 V; Tj=25 C 4 8 6 m m m Rdson in reverse battery condition VCC=-13 V; IOUT=-15 A; Tj=25 C 4 m VCC clamp voltage ICC=20 mA; IOUT1,2=0 A 46 52 V IS Supply current Off-state; VCC=13 V; Tj=25 C; VIN=VOUT=VSENSE=VCSD=0 V On-state; VCC=13 V; VIN=5 V; IOUT=0 A 2(2) 3.5 5(2) 6 A mA IL(off) Off-state output current(1) VIN=VOUT=0 V; VCC=13 V; Tj=25 C VIN=VOUT=0 V; VCC=13 V; Tj=125 C 0.01 3 5 A RON RON REV Vclamp 41 0 0 Switching (VCC = 13V; Tj = 25C) td(on) Turn-on delay time RL= 0.87 (see Figure 5) 25 s td(off) Turn-on delay time RL= 0.87 (see Figure 5) 35 s (dVOUT/dt)on Turn-on voltage slope RL= 0.87 See Figure 16 V/s (dVOUT/dt)off Turn-off voltage slope RL= 0.87 See Figure 18 V/s WON Switching energy losses during twon RL= 0.87 (see Figure 5) 5.4 mJ WOFF Switching energy losses during twoff RL= 0.87 (see Figure 5) 2.3 mJ Logic inputs VIL1,2 Input low level voltage IIL1,2 Low level input current VIH1,2 Input high level voltage 0.9 VIN=0.9 V Doc ID 15702 Rev 1 V 1 A 2.1 V 9/33 Electrical specifications Table 6. Symbol Electrical characteristics (continued) Parameter IIH1,2 High level input current VI(hyst)1,2 Input hysteresis voltage VICL1,2 Input clamp voltage VCSDL CS_DIS low level voltage ICSDL Low level CS_DIS current VCSDH CS_DIS high level voltage ICSDH High level CS_DIS current VCSD(hyst) CS_DIS hysteresis voltage VCSCL VND5004B-E, VND5004BSP30-E CS_DIS clamp voltage Test conditions Min. Typ. VIN=2.1 V Max. Unit 10 A 0.25 IIN=1 mA IIN=-1 mA VCSD=0.9 V V 5.5 7 V V 0.9 V -0.7 1 A 2.1 V VCSD=2.1 V 10 0.25 ICSD=1 mA ICSD=-1 mA 5.5 70 A V 7 V V 140 140 A A -0.7 Protections and diagnostics (3) IlimH Short circuit current VCC=13 V 5 V<VCC<24 V IlimL Short circuit current during thermal cycling VCC=13 V; TR<Tj<TTSD TTSD Shutdown temperature TR Reset temperature TRS Thermal reset of STATUS THYST VDEMAG 40 150 175 TRS+1 TRS+5 A 200 C 7 C IOUT=2 A; VIN=0; L=6 mH VCC-28 VCC-32 VCC-35 7500 11000 16000 16000 23000 20900 10300 12500 16000 16000 19500 19500 Current sense (8 V<VCC<16 V) 10/33 K0 IOUT/ISENSE IOUT=10 A; VSENSE=4 V; VCSD=0 V; Tj= -40 C...150 C Tj= 25 C...150 C K1 IOUT/ISENSE IOUT=15 A; VSENSE=4 V; VCSD=0 V; Tj= -40 C...150 C Tj= 25 C...150 C Doc ID 15702 Rev 1 C C 135 Thermal hysteresis (TTSD-TR) Turn-off output voltage clamp 100 V VND5004B-E, VND5004BSP30-E Table 6. Electrical characteristics (continued) Symbol K2 Electrical specifications Parameter Test conditions IOUT=30A; VSENSE=4V; VCSD=0V; Tj= -40C...150C Tj= 25C...150C IOUT/ISENSE Min. Typ. Max. 12400 14000 16500 16500 19000 19000 Unit ISENSE0 IOUT=0 A; VSENSE=0 V; Analog sense current VCSD=5 V; VIN=0 V; Tj=-40 C to 150 C VCS D=0 V; VIN=5 V; Tj=-40 C to 150C VSENSE Max analog sense output voltage IOUT=45 A; VCSD=0 V; RSENSE=3.9 k VSENSEH Analog sense output voltage in over temperature condition VCC=13 V; RSENSE=3.9 k 9 V ISENSEH Analog sense output current in over temperature condition Vcc=13 V; VSENSE=5 V 8 mA tDSENSE1H Delay response time from falling edge of CS_DIS pin VSENSE<4 V, 5 A<Iout<30 A ISENSE=90% of ISENSE max (see Figure 4) 50 100 s tDSENSE1L Delay response time from rising edge of CS_DIS pin VSENSE<4V, 5A<Iout<30A ISENSE=10% of ISENSE max (see Figure 4) 5 20 s tDSENSE2H Delay response time from rising edge of INPUT pin VSENSE<4V, 5A<Iout<30A ISENSE=90% of ISENSE max (see Figure 4) 270 600 s tDSENSE2L Delay response time from falling edge of INPUT pin VSENSE<4V, 5A<Iout<30A ISENSE=10% of ISENSE max (see Figure 4) 100 250 s 0 0 5 400 A A 5 V 1. For each channel. 2. PowerMOS leakage included. 3. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. Figure 4. Current sense delay characteristics INPUT CS_DIS LOAD CURRENT SENSE CURRENT tDSENSE2H tDSENSE1L Doc ID 15702 Rev 1 tDSENSE1H tDSENSE2L 11/33 Electrical specifications Figure 5. VND5004B-E, VND5004BSP30-E Switching characteristics VOUT tWoff tWon 90% 80% dVOUT/dt(off) dVOUT/dt(on) 10% tr tf t INPUT td(on) td(off) t Table 7. Truth table Inputn Outputn SENSEn (VCSD=0 V)(1) (see Figure 4) Normal operation L H L H 0 Nominal Over temperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 Short circuit to GND (RSC 10 m) L H H L L L 0 0 if Tj < TTSD VSENSEH if Tj > TTSD Short circuit to VCC L H H H 0 < Nominal Negative output voltage clamp L L 0 Conditions 1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and the external circuit. 12/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Table 8. Electrical specifications Electrical transient requirements (part 1/3) Test levels(1) ISO 7637-2: 2004(E) test pulse III IV Number of pulses or test times 1 -75 V -100 V 5000 pulses 0.5 s 5s 2 ms, 10 2a +37 V +50 V 5000 pulses 0.2 s 5s 50 s, 2 3a -100 V -150 V 1h 90 ms 100 ms 0.1 s, 50 3b +75 V +100 V 1h 90 ms 100 ms 0.1 s, 50 4 -6 V -7 V 1 pulse 100 ms, 0.01 +65 V +87 V 1 pulse 400 ms, 2 (2) 5b Table 9. Burst cycle/pulse repetition time Delays and impedance Electrical transient requirements (part 2/3) Test level results(1) ISO 7637-2: 2004(E) test pulse III IV 1 C C 2a C C 3a C C 3b C C 4 C C 5b(2) (3) C C 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b 2. Valid in case of external load dump clamp: 40V maximum referred to ground. 3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.: Absolute maximum ratings. Table 10. Class Electrical transient requirements (part 3/3) Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 15702 Rev 1 13/33 Electrical specifications Figure 6. VND5004B-E, VND5004BSP30-E Waveforms NORMAL OPERATION INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn UNDERVOLTAGE VUSDhyst VCC VUSD INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn OUTPUT SHORT TO VCC INPUTn CS_DIS LOAD VOLTAGEn LOAD CURRENTn SENSE CURRENTn <Nominal <Nominal OVERLOAD OPERATION Tj TR TTSD TRS INPUTn CS_DIS ILIMH ILIML LOAD CURRENTn VSENSEH SENSE CURRENTn thermal cycling current power limitation limitation SHORTED LOAD 14/33 Doc ID 15702 Rev 1 NORMAL LOAD VND5004B-E, VND5004BSP30-E 2.4 Electrical specifications Electrical characteristics curves Figure 7. Off-state output current Figure 8. Iloff (uA) High level input current Iih (uA) 6 5 5.4 4.5 Off State Vcc=13V Vin=Vout=0V 4.8 4.2 Vin=2.1V 4 3.5 3.6 3 3 2.5 2.4 2 1.8 1.5 1.2 1 0.6 0.5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) Figure 9. 50 75 100 125 150 175 125 150 175 Tc (C) Input clamp voltage Figure 10. Input low level Vicl (V) Vil (V) 7 2 1.8 6.75 Iin=1mA 1.6 6.5 1.4 6.25 1.2 1 6 0.8 5.75 0.6 5.5 0.4 5.25 0.2 5 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) Figure 11. 50 75 100 Tc (C) Input high level Figure 12. Input hysteresis voltage Vih (V) Vihyst (V) 4 1 0.9 3.5 0.8 3 0.7 2.5 0.6 2 0.5 0.4 1.5 0.3 1 0.2 0.5 0.1 0 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 15702 Rev 1 15/33 Electrical specifications VND5004B-E, VND5004BSP30-E Figure 13. On-state resistance vs Tcase Figure 14. On-state resistance vs VCC Ron (mOhm) Ron (mOhm) 6 6 5.4 5.4 Iout=15A Vcc=13V 4.8 Tc=150C 4.8 Tc=125C 4.2 4.2 3.6 3.6 3 3 2.4 2.4 1.8 Tc=25C Tc=-40C 1.8 -50 -25 0 25 50 75 100 125 150 175 0 4 8 12 16 Tc (C) 20 24 28 Vcc Figure 15. Undervoltage shutdown Figure 16. Turn-on voltage slope Vusd (V) (dVout/dt)on (V/ms) 16 500 450 14 Vcc=13V RI=0.87Ohm 400 12 350 10 300 8 250 200 6 150 4 100 2 50 0 0 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 17. ILIMH vs Tcase 75 100 125 150 175 Figure 18. Turn-off voltage slope Ilimh (A) (dVout/dt)off (V/ms) 150 500 140 450 Vcc=13V 130 Vcc=13V RI=0.87Ohm 400 120 350 110 300 100 250 90 200 80 150 70 100 60 50 50 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) 16/33 50 Tc (C) Tc (C) -50 -25 0 25 50 75 Tc (C) Doc ID 15702 Rev 1 100 125 150 175 VND5004B-E, VND5004BSP30-E Electrical specifications Figure 19. CS_DIS high level voltage Figure 20. CS_DIS clamp voltage Vcsdh (V) Vcsdcl (V) 4 8 3.5 7.5 3 7 2.5 6.5 2 6 1.5 5.5 1 5 0.5 4.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) 4 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Figure 21. CS_DIS low level voltage Vcsdl (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 15702 Rev 1 17/33 Application information 3 VND5004B-E, VND5004BSP30-E Application information Figure 22. Application schematic +5V VCC 20V Rprot CS_DIS Dld MCU Rprot Rprot INPUT OUTPUT CURRENT SENSE 45V RSENSE GND Cext 3.1 Microcontroller I/Os protection When negative transients are present on the VCC line, the control pins will be pulled negative to approximately -1.5 V. ST suggests the insertion of resistors (Rprot) in the lines to prevent the C I/Os pins from latching up. The values of these resistors provide a compromise between the leakage current of the C, the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH) / IIHmax Calculation example: For VCCpeak= - 1.5 V and Ilatchup 20 mA; VOHC 4.5 V 75 Rprot 240 k. Recommended values: Rprot =10 k, CEXT=10 nF 3.2 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCCPK max rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 18/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E 3.3 Application information Maximum demagnetization energy (VCC = 13.5 V) Figure 23. Maximum turn-off current versus inductance 100 A B C I (A) 10 1 1 L (mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL = 0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. Doc ID 15702 Rev 1 19/33 Package and PC board thermal data VND5004B-E, VND5004BSP30-E 4 Package and PC board thermal data 4.1 MultiPowerSO-30 thermal data Figure 24. MultiPowerSO-30 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness=70 m (front and back side), Copper areas: from minimum pad lay-out to 4 cm2). Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on) RTHj_amb(C/W) 60 55 50 45 40 35 0 1 2 3 PCB Cu heatsink area (cm^2) 20/33 Doc ID 15702 Rev 1 4 5 VND5004B-E, VND5004BSP30-E Package and PC board thermal data Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on) ZTH (C/W) 1000 100 Footprint 4 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30(a) a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Doc ID 15702 Rev 1 21/33 Package and PC board thermal data VND5004B-E, VND5004BSP30-E Equation 1: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Table 11. 4.2 Thermal parameters for MultiPowerSO-30 Area/island (cm2) Footprint R1 (C/W) 0.05 R2 (C/W) 0.3 R3 (C/W) 0.5 R4 (C/W) 1.3 R5 (C/W) 14 R6 (C/W) 44.7 R7 (C/W) 0.05 R8 (C/W) 0.3 C1 (W.s/C) 0.005 C2 (W.s/C) 0.008 C3 (W.s/C) 0.01 C4 (W.s/C) 0.3 C5 (W.s/C) 0.6 C6 (W.s/C) 5 C7 (W.s/C) 0.005 C8 (W.s/C) 0.008 4 23.7 11 PQFN - 12x12 power lead-less thermal data Figure 28. 12x12 Power lead-less package PC board Note: 22/33 Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 78 mm x 78 mm, PCB thickness=2mm, Cu thickness=70 m (front and back side), Copper areas: from minimum pad lay-out to 16 cm2). Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and PC board thermal data Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel on) 50 45 40 35 30 25 20 0 5 10 15 20 PCB Cu heat sink area ( cm^ 2) Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse (one channel on) 100 Footprint 4 cm2 8 cm2 16 cm2 C/W 10 1 0,1 0,001 0,01 0,1 time (s) 1 Doc ID 15702 Rev 1 10 100 1000 23/33 Package and PC board thermal data VND5004B-E, VND5004BSP30-E Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 power leadless(b) Equation 2: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Table 12. Thermal parameters for PQFN - 12x12 power lead-less Area/island (cm2) Footprint R1 (C/W) 0.3 R2 (C/W) 0.15 R3 (C/W) 4.2 R4 (C/W) 4 8 16 9.6 9.4 9.2 9 R5 (C/W) 15.1 10.5 8.5 5.5 R6 (C/W) 16.7 12 9 6 R7 (C/W) 0.3 R8 (C/W) 0.15 C1 (W.s/C) 0.021 C2 (W.s/C) 0.015 C3 (W.s/C) 0.2 C4 (W.s/C) 1.9 2.2 2.32 2.45 C5 (W.s/C) 2.45 7.3 13.7 20 C6 (W.s/C) 11.85 22 25 30 C7 (W.s/C) 0.021 C8 (W.s/C) 0.015 b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. 24/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and packing information 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 MultiPowerSO-30 mechanical data Figure 32. MultiPowerSO-30 outline Doc ID 15702 Rev 1 25/33 Package and packing information Table 13. VND5004B-E, VND5004BSP30-E MultiPowerSO-30 mechanical data Millimeters Symbol Min. Typ. A 2.35 A2 1.85 2.25 A3 0 0.1 B 0.42 0.58 C 0.23 0.32 D 17.1 E 18.85 E1 15.9 "e" 1 17.2 16 14.3 F7 5.45 F8 0.73 0.8 N S 17.3 19.15 F6 L 26/33 Max. 16.1 1.15 10 Deg 0 Deg Doc ID 15702 Rev 1 7 Deg VND5004B-E, VND5004BSP30-E 5.3 Package and packing information PQFN - 12x12 power lead-less mechanical data Figure 33. PQFN - 12x12 power lead-less outline Doc ID 15702 Rev 1 27/33 Package and packing information Table 14. VND5004B-E, VND5004BSP30-E PQFN - 12x12 power lead-less mechanical data Symbol Millimeters Min. Max. A 2 2.2 A1 0 0.05 b 0.35 0.47 C 28/33 Typ. 0.50 D 11.90 12.10 Dh1 4.65 4.95 Dh2 10.45 10.65 Dh3 4.80 5 Dh4 4.80 5 E 11.90 12.10 Eh1 2.15 2.45 Eh2 5.15 5.45 Eh3 1.70 2 e1 0.90 e2 3.45 e3 1.10 f 0.50 f1 0.60 L 0.75 0.95 L1 1.65 1.90 L2 0.76 0.78 M 11.10 11.30 N 11.10 11.30 v 0.1 w 0.05 y 0.05 y1 0.1 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E 5.4 Package and packing information MultiPowerSO-30 packing information The devices can be packed in tube or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 34. MultiPowerSO-30 tube shipment (no suffix) Tube dimension Dimension A mm 29 435 532 3.82 23.6 0.8 Base Q.ty Bulk Q.ty C Tube length ( 0.5) B A B C ( 0.13) Figure 35. MultiPowerSO-30 tape and reel shipment (suffix "TR") Reel dimension Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) mm 1000 1000 330 1.5 13 20.2 32 100 38.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Description Dimension mm Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.1) K (max) 32 4 24 1.5 2 14.2 2.2 End Start Top cover tape No components Components No components 500 mm min 500 mm min Empty components pockets User direction of feed Doc ID 15702 Rev 1 29/33 Package and packing information 5.5 VND5004B-E, VND5004BSP30-E PQFN - 12x12 power lead-less packing information The devices can be packed in tray or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix) Tray information Parameter Base Q.ty Bulk Q.ty 30/33 Doc ID 15702 Rev 1 189 945 VND5004B-E, VND5004BSP30-E Package and packing information Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix "TR") Tape dimensions Dimension A0 0.1 B0 0.1 K0 0.1 F 0.1 E 0.1 W 0.3 P2 0.1 P0 0.1 P1 0.1 T 0.05 D D1 (min) mm 12.30 12.30 2.15 11.50 1.75 24 2 4 16 0.30 1.50 1.50 Reel dimensions Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) mm 1500 1500 330 1.5 13 20.2 32 100 38.4 Doc ID 15702 Rev 1 31/33 Revision history 6 VND5004B-E, VND5004BSP30-E Revision history Table 15. 32/33 Document revision history Date Revision 13-May-2009 1 Changes Initial release. Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Please Read Carefully: Information in this document is provided solely in connection with ST products. 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