VND5004BSP30TR-E - STMicroelectronics

May 2009 Doc ID 15702 Rev 1 1/33

VND5004B-E

VND5004BSP30-E

Double 4mΩ high side driver with analog current sense

for automotive applications

Features

■General

– Inrush current active management by

power limitation

– Very low standby current

– 3.0 V CMOS compatible input

– Optimized electromagnetic emission

– Very low electromagnetic susceptibility

– In compliance with the 2002/95/EC

European directive

■Diagnostic functions

– Proportional load current sense

– Current sense disable

– Thermal shutdown indication

■Protection

– Undervoltage shutdown

– Overvoltage clamp

– Load current limitation

– Thermal shutdown

– Self limiting of fast thermal transients

– Protection against loss of ground and loss

of VCC

– Reverse battery protection with self switch

on of the Power MOSFET (see Figure 22)

– Electrostatic discharge protection

application

■All types of resistive, inductive and capacitive

loads

■Suitable for power management applications

Description

The VND5004BTR-E and VND5004BSP30-E are

devices made using STMicroelectronics VIPower

technology. They are intended for driving resistive

or inductive loads with one side connected to

ground. Active VCC pin voltage clamp and load

dump protection circuit protect the devices

against transients on the Vcc pin (see ISO7637

transient compatibility table). These devices

integrate an analog current sense which delivers

a current proportional to the load current

(according to a known ratio) when CS_DIS is

driven low or left open. When CS_DIS is driven

high, the CURRENT SENSE pin is high

impedance. Output current limitation protects the

devices in overload condition. In case of long

duration overload, the devices limit the dissipated

power to a safe level up to thermal shutdown

intervention. Thermal shutdown with automatic

restart allows the device to recover normal

operation as soon as a fault condition disappears.

Parameters Symbol Value

Max transient supply voltage VCC 41 V

Operating voltage range VCC 4.5 to 28 V

Max on-state resistance RON 4mΩ

Current limitation (typ) ILIMH 100 A

Off-state supply current IS2µA

(1)

1. Typical value with all loads connected.

MultiPowerSO-30

PQFN

12x12 Power lead-less

Table 1. Devices summary

Package Order codes

Tube Tape and reel Tray

PQFN-12x12 power lead-less - VND5004BTR-E VND5004B-E

MultiPowerSO-30 VND5004BSP30-E VND5004BSP30TR-E -

www.st.com

         
Contents VND5004B-E, VND5004BSP30-E
2/33  Doc ID 15702 Rev 1
Contents
Block diagram and pin configurations  . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Absolute maximum ratings  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
2 Thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9
4 Electrical characteristics curves  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Application information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1 Microcontroller I/Os protection  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
3 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . .  19
Package and PC board thermal data  . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1 MultiPowerSO-30 thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
2 PQFN - 12x12 power lead-less thermal data  . . . . . . . . . . . . . . . . . . . . . .  22
Package and packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1 ECOPACK® packages  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  25
2 MultiPowerSO-30 mechanical data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  25
3 PQFN - 12x12 power lead-less mechanical data  . . . . . . . . . . . . . . . . . . .  27
4 MultiPowerSO-30 packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . .  29
5 PQFN - 12x12 power lead-less packing information   . . . . . . . . . . . . . . . .  30
Revision history   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

VND5004B-E, VND5004BSP30-E List of tables
Doc ID 15702 Rev 1 3/33
         
List of tables
Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Suggested connections for unused and not connected pins  . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. Thermal parameters for PQFN - 12x12 power lead-less  . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 13. MultiPowerSO-30 mechanical data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 14. PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 15. Document revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

         
List of figures VND5004B-E, VND5004BSP30-E
4/33  Doc ID 15702 Rev 1
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (not in scale)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Switching characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 15. Undervoltage shutdown  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. ILIMH vs Tcase  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 18. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. CS_DIS high level voltage  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 20
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on). . . 21
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30  . . . . . . . . . . . . . . . . 21
Figure 28. 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 23
Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse      
(one channel on). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less   . . . . . 24
Figure 32. MultiPowerSO-30 outline  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 33. PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 34. MultiPowerSO-30 tube shipment (no suffix)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”)  . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . 31

VND5004B-E, VND5004BSP30-E Block diagram and pin configurations

Doc ID 15702 Rev 1 5/33

1 Block diagram and pin configurations

Figure 1. Block diagram

Table 2. Pin functions

Name Function

VCC Battery connection

OUTPUT1,2 Power output

GND Ground connection

INPUT1,2 Voltage controlled input pin with hysteresis, CMOS compatible. Controls

output switch state

CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current

CS_DIS Active high CMOS compatible pin, to disable the current sense pins

PwCLAMP

IOUT1

GND

INPUT2

VCC

OUTPUT1

CURRENT

SENSE1

CS_DIS

INPUT1

Under

voltage

VCC

clamp

ILIM

Overtemp.

DRIVER

Pwr

LIM

PwCLAMP

IOUT2

OUTPUT2

CURRENT

SENSE2

ILIM

DRIVER

Pwr

LIM

CS_DIS

Reverse

battery

protection

LOGIC

Overtemp.

Block diagram and pin configurations VND5004B-E, VND5004BSP30-E

6/33 Doc ID 15702 Rev 1

Figure 2. Configuration diagram (not in scale)

Table 3. Suggested connections for unused and not connected pins

Connection/pin Current sense N.C. Output Input CS_DIS For test only

Floating Not allowed X X X X X

To ground Through 1 kΩ

resistor XNot

allowed

Through

10 kΩ resistor

Through

10 kΩ resistor Not allowed

1 NC

2 NC

3 NC

4 GND

5 CS_DIS

6 CURRENT SENSE 2

7 CURRENT SENSE 1

8 INPUT 2

9 INPUT 1

10 NC

11 NC

12 NC

13 FOR TEST ONLY

14 VCC

15 OUTPUT 1

16 OUTPUT 2

OUTPUT 2

OUTPUT 1

OUTPUT 2

OUTPUT 1

OUTPUT 2

OUTPUT 1

15 16

MultiPowerSO-30

GND

INPUT 2

FOR TEST ONLY

CS_DIS

CURRENT SENSE 2

CURRENT SENSE 1

INPUT 1

FOR TEST ONLY

Heat Slug1

(top view)

PQFN -12x12 Power

less

(bottom view)

lead -

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 7/33

2 Electrical specifications

Figure 3. Current and voltage conventions

2.1 Absolute maximum ratings

Stress values that exceed those listed in the “Absolute maximum ratings” table can cause

permanent damage to the device. These are stress ratings only, and operation of the device

at these, or any other conditions greater than those, indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics sure

program and other relevant quality documents.

GND

SENSE1,2

OUTPUT1,2

OUT1,2

CURRENT I

SENSE1,2

INPUT1,2

IN1,2

OUT1,2

GND

CS_DIS

CSD

SENSE1,2

Table 4. Absolute maximum ratings

Symbol Parameter Value Unit

VCC DC supply voltage 28 V

VCCPK Transient supply voltage (T<400 ms, Rload>0.5 Ω) 41 V

-VCC Reverse DC supply voltage 16 V

IOUT DC output current Internally limited A

- IOUT Reverse DC output current 70 A

IIN DC input current -1 to 10 mA

ICSD DC current sense disable input current -1 to 10 mA

VCSENSE Current sense maximum voltage (Vcc>0 V) Vcc-41

+VCC

EMAX

Maximum switching energy (single pulse)

(L=0.3 mH; RL=0 Ω; Vbat=13.5 V; Tjstart=150 ºC;

IOUT = IlimL(typ.))

342 mJ

VESD

Electrostatic discharge (Human Body Model: R=1.5 kΩ;

C=100 pF) 2000 V

Electrical specifications VND5004B-E, VND5004BSP30-E

8/33 Doc ID 15702 Rev 1

2.2 Thermal data

VESD Charge device model (CDM-AEC-Q100-011) 750 V

TjJunction operating temperature -40 to 150 °C

TSTG Storage temperature -55 to 150 °C

Table 4. Absolute maximum ratings (continued)

Symbol Parameter Value Unit

Table 5. Thermal data

Symbol Parameter

Value

Unit

MultiPowerSO-30 12x12 PLLP

Rthj-case

Thermal resistance junction-case (MAX)

(with one channel ON) 0.35 0.35 °C/W

Rthj-amb Thermal resistance junction-ambient (MAX) 58(1)

1. PCB FR4 area 58 mmx58 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.

39(2)

2. PCB FR4 area 78 mmx78 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.

°C/W

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 9/33

2.3 Electrical characteristics

Values specified in this section are for 8 V<VCC<24 V, -40 °C<Tj<150 °C, unless otherwise

stated.

Table 6. Electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

Power section

VCC

Operating supply

voltage 4.5 13 28 V

VUSD

Undervoltage

shutdown 3.5 4.5 V

VUSDhyst

Undervoltage

shutdown hysteresis 0.5 V

RON

On-state

resistance(1)

IOUT=15 A; Tj=25 °C

IOUT=15 A; Tj=150 °C

IOUT=15 A; VCC=5 V; Tj=25 °C

mΩ

RON REV

Rdson in reverse

battery condition VCC=-13 V; IOUT=-15 A; Tj=25 °C 4 mΩ

Vclamp VCC clamp voltage ICC=20 mA; IOUT1,2=0 A 41 46 52 V

ISSupply current

Off-state; VCC=13 V; Tj=25 °C;

VIN=VOUT=VSENSE=VCSD=0 V

On-state; VCC=13 V; VIN=5 V; IOUT=0 A

2(2)

3.5

5(2)

µA

IL(off)

Off-state output

current(1)

VIN=VOUT=0 V; VCC=13 V; Tj=25 °C

VIN=VOUT=0 V; VCC=13 V; Tj=125 °C

0.01 3

5µA

Switching (VCC = 13V; Tj= 25°C)

td(on) Turn-on delay time RL= 0.87 Ω (see Figure 5)25µs

td(off) Turn-on delay time RL= 0.87 Ω (see Figure 5)35µs

(dVOUT/dt)on Turn-on voltage slope RL= 0.87 ΩSee

Figure 16 V/µs

(dVOUT/dt)off Turn-off voltage slope RL= 0.87 ΩSee

Figure 18 V/µs

WON

Switching energy

losses during twon

RL= 0.87 Ω (see Figure 5)5.4mJ

WOFF

Switching energy

losses during twoff

RL= 0.87 Ω (see Figure 5)2.3mJ

Logic inputs

VIL1,2

Input low level

voltage 0.9 V

IIL1,2

Low level input

current VIN=0.9 V 1 µA

VIH1,2

Input high level

voltage 2.1 V

Electrical specifications VND5004B-E, VND5004BSP30-E

10/33 Doc ID 15702 Rev 1

IIH1,2

High level input

current VIN=2.1 V 10 µA

VI(hyst)1,2

Input hysteresis

voltage 0.25 V

VICL1,2 Input clamp voltage IIN=1 mA

IIN=-1 mA

5.5

-0.7

VCSDL

CS_DIS low level

voltage 0.9 V

ICSDL

Low level CS_DIS

current VCSD=0.9 V 1 µA

VCSDH

CS_DIS high level

voltage 2.1 V

ICSDH

High level CS_DIS

current VCSD=2.1 V 10 µA

VCSD(hyst)

CS_DIS hysteresis

voltage 0.25 V

VCSCL

CS_DIS clamp

voltage

ICSD=1 mA

ICSD=-1 mA

5.5

-0.7

Protections and diagnostics (3)

IlimH Short circuit current VCC=13 V

5V<V

CC<24 V

70 100 140

140

IlimL

Short circuit current

during thermal

cycling

VCC=13 V; TR<Tj<TTSD 40 A

TTSD

Shutdown

temperature 150 175 200 °C

TRReset temperature TRS+1 TRS+5 °C

TRS

Thermal reset of

STATUS 135 °C

THYST

Thermal hysteresis

(TTSD-TR)7°C

VDEMAG

Turn-off output

voltage clamp IOUT=2 A; VIN=0; L=6 mH VCC-28 VCC-32 VCC-35 V

Current sense (8 V<VCC<16 V)

K0IOUT/ISENSE

IOUT=10 A; VSENSE=4 V; VCSD=0 V;

Tj= -40°C...150°C

Tj= 25 °C...150 °C

7500

11000

16000

23000

20900

K1IOUT/ISENSE

IOUT=15 A; VSENSE=4 V; VCSD=0 V;

Tj= -40°C...150°C

Tj= 25 °C...150 °C

10300

12500

16000

19500

Table 6. Electrical characteristics (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 11/33

Figure 4. Current sense delay characteristics

K2IOUT/ISENSE

IOUT=30A; VSENSE=4V; VCSD=0V;

Tj= -40°C...150°C

Tj= 25°C...150°C

12400

14000

16500

19000

ISENSE0 Analog sense current

IOUT=0 A; VSENSE=0 V;

VCSD=5 V; VIN=0 V; Tj=-40 °C to 150 °C

VCS D=0 V; VIN=5 V; Tj=-40 °C to 150°C

400

µA

VSENSE

Max analog sense

output voltage IOUT=45 A; VCSD=0 V; RSENSE=3.9 kΩ 5V

VSENSEH

Analog sense output

voltage in over

temperature

condition

VCC=13 V; RSENSE=3.9 kΩ9V

ISENSEH

Analog sense output

current in over

temperature

condition

Vcc=13 V; VSENSE=5 V 8 mA

tDSENSE1H

Delay response time

from falling edge of

CS_DIS pin

VSENSE<4 V, 5 A<Iout<30 A

ISENSE=90% of ISENSE max

(see Figure 4)

50 100 µs

tDSENSE1L

Delay response time

from rising edge of

CS_DIS pin

VSENSE<4V, 5A<Iout<30A

ISENSE=10% of ISENSE max

(see Figure 4)

520µs

tDSENSE2H

Delay response time

from rising edge of

INPUT pin

VSENSE<4V, 5A<Iout<30A

ISENSE=90% of ISENSE max

(see Figure 4)

270 600 µs

tDSENSE2L

Delay response time

from falling edge of

INPUT pin

VSENSE<4V, 5A<Iout<30A

ISENSE=10% of ISENSE max

(see Figure 4)

100 250 µs

1. For each channel.

2. PowerMOS leakage included.

3. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals

must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must

limit the duration and number of activation cycles.

Table 6. Electrical characteristics (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

SENSE CURRENT

INPUT

LOAD CURRENT

CS_DIS

tDSENSE2H tDSENSE2L

tDSENSE1L tDSENSE1H

Electrical specifications VND5004B-E, VND5004BSP30-E

12/33 Doc ID 15702 Rev 1

Figure 5. Switching characteristics

Table 7. Truth table

Conditions InputnOutputn

SENSEn (VCSD=0 V)(1)

(see Figure 4)

1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and

the external circuit.

Normal operation L

Nominal

Over temperature L

VSENSEH

Undervoltage L

Short circuit to GND

(RSC ≤ 10 mΩ)

0 if Tj < TTSD

VSENSEH if Tj > TTSD

Short circuit to VCC

< Nominal

Negative output voltage clamp L L 0

OUT

/dt

(on)

80%

10% t

OUT

/dt

(off)

d(off)

d(on)

INPUT

90%

Won

Woff

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 13/33

Table 8. Electrical transient requirements (part 1/3)

ISO 7637-2:

2004(E)

test pulse

Test levels(1) Number of

pulses or

test times

Burst cycle/pulse repetition

time

Delays and

impedance

III IV

1 -75 V -100 V 5000 pulses 0.5 s 5 s 2 ms, 10 Ω

2a +37 V +50 V 5000 pulses 0.2 s 5 s 50 µs, 2 Ω

3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω

3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω

4 -6 V -7 V 1 pulse 100 ms, 0.01 Ω

5b(2) +65 V +87 V 1 pulse 400 ms, 2 Ω

Table 9. Electrical transient requirements (part 2/3)

ISO 7637-2: 2004(E)

test pulse

Test level results(1)

III IV

1C C

2a C C

3a C C

3b C C

4C C

5b(2) (3) CC

1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b

2. Valid in case of external load dump clamp: 40V maximum referred to ground.

3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.: Absolute maximum

ratings.

Table 10. Electrical transient requirements (part 3/3)

Class Contents

C All functions of the device are performed as designed after exposure to disturbance.

EOne or more functions of the device are not performed as designed after exposure to

disturbance and cannot be returned to proper operation without replacing the device.

Electrical specifications VND5004B-E, VND5004BSP30-E

14/33 Doc ID 15702 Rev 1

Figure 6. Waveforms

SENSE CURRENTn

INPUTn

NORMAL OPERATION

UNDERVOLTAGE

VCC VUSD

VUSDhyst

INPUTn

SENSE CURRENTn

LOAD CURRENTn

OVERLOAD OPERATION

INPUTn

SENSE CURRENTn

TTSD

LOAD CURRENTn

INPUTn

LOAD VOLTAGEn

SENSE CURRENTn

LOAD CURRENTn

<Nominal <Nominal

OUTPUT SHORT TO VCC

CS_DIS

TRS

ILIMH

ILIML

VSENSEH

thermal cycling

power

limitation

current

limitation

SHORTED LOAD NORMAL LOAD

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 15/33

2.4 Electrical characteristics curves

Figure 7. Off-state output current Figure 8. High level input current

Figure 9. Input clamp voltage Figure 10. Input low level

Figure 11. Input high level Figure 12. Input hysteresis voltage

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.6

1.2

1.8

2.4

3.6

4.2

4.8

5.4

Iloff (uA)

Off State

Vcc=13V

Vin=Vout=0V

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

0.5

1.5

2.5

3.5

4.5

Iih (uA)

Vin=2.1V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

5.25

5.5

5.75

6.25

6.5

6.75

Vicl (V)

Iin=1mA

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

Vil (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

0.5

1.5

2.5

3.5

Vih (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

Vihyst (V)

Electrical specifications VND5004B-E, VND5004BSP30-E

16/33 Doc ID 15702 Rev 1

Figure 13. On-state resistance vs Tcase Figure 14. On-state resistance vs VCC

Figure 15. Undervoltage shutdown Figure 16. Turn-on voltage slope

Figure 17. ILIMH vs Tcase Figure 18. Turn-off voltage slope

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

1.8

2.4

3.6

4.2

4.8

5.4

Ron (mOhm)

Iout=15A

Vcc=13V

0 4 8 12 16 20 24 28

Vcc

1.8

2.4

3.6

4.2

4.8

5.4

Ron (mOhm)

Tc=150°C

Tc=125°C

Tc=25°C

Tc=-40°C

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Vusd (V)

-50-25 0 255075100125150175

Tc (°C)

100

150

200

250

300

350

400

450

500

(dVout/dt)on (V/ms)

Vcc=13V

RI=0.87Ohm

-50-25 0 255075100125150175

Tc (°C)

100

110

120

130

140

150

Ilimh (A)

Vcc=13V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

100

150

200

250

300

350

400

450

500

(dVout/dt)off (V/ms)

Vcc=13V

RI=0.87Ohm

VND5004B-E, VND5004BSP30-E Electrical specifications

Doc ID 15702 Rev 1 17/33

Figure 19. CS_DIS high level voltage Figure 20. CS_DIS clamp voltage

Figure 21. CS_DIS low level voltage

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

0.5

1.5

2.5

3.5

Vcsdh (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

4.5

5.5

6.5

7.5

Vcsdcl (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (° C)

0.5

1.5

2.5

3.5

Vcsdl (V)

Application information VND5004B-E, VND5004BSP30-E

18/33 Doc ID 15702 Rev 1

3 Application information

Figure 22. Application schematic

3.1 Microcontroller I/Os protection

When negative transients are present on the VCC line, the control pins will be pulled

negative to approximately -1.5 V.

ST suggests the insertion of resistors (Rprot) in the lines to prevent the µC I/Os pins from

latching up.

The values of these resistors provide a compromise between the leakage current of the µC,

the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the

µC I/Os.

-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH) / IIHmax

Calculation example:

For VCCpeak= - 1.5 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V

75 Ω ≤ Rprot ≤ 240 kΩ.

Recommended values: Rprot =10 kΩ, CEXT=10 nF

3.2 Load dump protection

Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the

VCCPK max rating. The same applies if the device will be subject to transients on the VCC

line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.

VCC

GND

OUTPUT

+5V

CS_DIS

INPUT

Rprot

20V

Dld

Rprot

RSENSE

CURRENT SENSE

MCU

45V

Cext

VND5004B-E, VND5004BSP30-E Application information

Doc ID 15702 Rev 1 19/33

3.3 Maximum demagnetization energy (VCC = 13.5 V)

Figure 23. Maximum turn-off current versus inductance

Note: Values are generated with RL = 0 Ω.

In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse

must not exceed the temperature specified above for curves A and B.

100

1 10 100L (mH)

I (A)

Demagnetization Demagnetization Demagnetization

VIN, IL

C: Tjstart = 125°C repetitive pulse

A: Tjstart = 150°C single pulse

B: Tjstart = 100°C repetitive pulse

Package and PC board thermal data VND5004B-E, VND5004BSP30-E

20/33 Doc ID 15702 Rev 1

4 Package and PC board thermal data

4.1 MultiPowerSO-30 thermal data

Figure 24. MultiPowerSO-30 PC board

Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4

area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness=70 µm (front and back side),

Copper areas: from minimum pad lay-out to 4 cm2).

Figure 25.

thj-amb

vs PCB copper area in open box free air condition (one channel on)

012345

RTHj_amb(°C/W)

PCB Cu heatsink area (cm^2)

VND5004B-E, VND5004BSP30-E Package and PC board thermal data

Doc ID 15702 Rev 1 21/33

Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one

channel on)

Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30(a)

a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded

protections (power limitation or thermal cycling during thermal shutdown) are not triggered.

0.01

0.1

100

1000

0.0001 0.001 0.01 0.1 1 10 100 1000

Time (s)

ZT H (°C/W)

Footprint

4 cm

Package and PC board thermal data VND5004B-E, VND5004BSP30-E

22/33 Doc ID 15702 Rev 1

Equation 1: pulse calculation formula

where δ = tP/T

4.2 PQFN - 12x12 power lead-less thermal data

Figure 28. 12x12 Power lead-less package PC board

Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4

area= 78 mm x 78 mm, PCB thickness=2mm, Cu thickness=70 µm (front and back side),

Copper areas: from minimum pad lay-out to 16 cm2).

Table 11. Thermal parameters for MultiPowerSO-30

Area/island (cm2)Footprint4

R1 (°C/W) 0.05

R2 (°C/W) 0.3

R3 (°C/W) 0.5

R4 (°C/W) 1.3

R5 (°C/W) 14

R6 (°C/W) 44.7 23.7

R7 (°C/W) 0.05

R8 (°C/W) 0.3

C1 (W.s/°C) 0.005

C2 (W.s/°C) 0.008

C3 (W.s/°C) 0.01

C4 (W.s/°C) 0.3

C5 (W.s/°C) 0.6

C6 (W.s/°C) 5 11

C7 (W.s/°C) 0.005

C8 (W.s/°C) 0.008

ZTHδRTH δZTHtp 1δ–()+⋅=

VND5004B-E, VND5004BSP30-E Package and PC board thermal data

Doc ID 15702 Rev 1 23/33

Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel

on)

Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction

ambient single pulse (one channel on)

0 5 10 15 20

PCB Cu heatsink area (cm^ 2)

0,1

100

0,001 0,01 0,1 1 10 100 1000time (s)

°C/W

Footprint

4 cm

8 cm

16 cm

Package and PC board thermal data VND5004B-E, VND5004BSP30-E

24/33 Doc ID 15702 Rev 1

Figure 31.

Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-

less

(b)

Equation 2: pulse calculation formula

where δ = tP/T

b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded

protections (power limitation or thermal cycling during thermal shutdown) are not triggered.

Table 12. Thermal parameters for PQFN - 12x12 power lead-less

Area/island (cm2)Footprint 4 8 16

R1 (°C/W) 0.3

R2 (°C/W) 0.15

R3 (°C/W) 4.2

R4 (°C/W) 9.6 9.4 9.2 9

R5 (°C/W) 15.1 10.5 8.5 5.5

R6 (°C/W) 16.7 12 9 6

R7 (°C/W) 0.3

R8 (°C/W) 0.15

C1 (W.s/°C) 0.021

C2 (W.s/°C) 0.015

C3 (W.s/°C) 0.2

C4 (W.s/°C) 1.9 2.2 2.32 2.45

C5 (W.s/°C) 2.45 7.3 13.7 20

C6 (W.s/°C) 11.85 22 25 30

C7 (W.s/°C) 0.021

C8 (W.s/°C) 0.015

ZTHδRTH δZTHtp 1δ–()+⋅=

VND5004B-E, VND5004BSP30-E Package and packing information

Doc ID 15702 Rev 1 25/33

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.2 MultiPowerSO-30 mechanical data

Figure 32. MultiPowerSO-30 outline

Package and packing information VND5004B-E, VND5004BSP30-E

26/33 Doc ID 15702 Rev 1

Table 13. MultiPowerSO-30 mechanical data

Symbol

Millimeters

Min. Typ. Max.

A2.35

A2 1.85 2.25

A3 0 0.1

B 0.42 0.58

C 0.23 0.32

D 17.1 17.2 17.3

E 18.85 19.15

E1 15.9 16 16.1

“e” 1

F6 14.3

F7 5.45

F8 0.73

L 0.8 1.15

N10 Deg

S 0 Deg 7 Deg

VND5004B-E, VND5004BSP30-E Package and packing information

Doc ID 15702 Rev 1 27/33

5.3 PQFN - 12x12 power lead-less mechanical data

Figure 33. PQFN - 12x12 power lead-less outline

Package and packing information VND5004B-E, VND5004BSP30-E

28/33 Doc ID 15702 Rev 1

Table 14. PQFN - 12x12 power lead-less mechanical data

Symbol

Millimeters

Min. Typ. Max.

A2 2.2

A1 0 0.05

b 0.35 0.47

C0.50

D 11.90 12.10

Dh1 4.65 4.95

Dh2 10.45 10.65

Dh3 4.80 5

Dh4 4.80 5

E 11.90 12.10

Eh1 2.15 2.45

Eh2 5.15 5.45

Eh3 1.70 2

e1 0.90

e2 3.45

e3 1.10

f0.50

f1 0.60

L 0.75 0.95

L1 1.65 1.90

L2 0.76 0.78

M 11.10 11.30

N 11.10 11.30

v0.1

w0.05

y0.05

y1 0.1

VND5004B-E, VND5004BSP30-E Package and packing information

Doc ID 15702 Rev 1 29/33

5.4 MultiPowerSO-30 packing information

The devices can be packed in tube or tape and reel shipments (see the Devices summary

on page 1 for packaging quantities).

Figure 34. MultiPowerSO-30 tube shipment (no suffix)

Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”)

Tube dimension

Dimension mm

Base Q.ty 29

Bulk Q.ty 435

Tube length (± 0.5) 532

A3.82

B23.6

C (± 0.13) 0.8

Reel dimension

Dimension mm

Base Q.ty 1000

Bulk Q.ty 1000

A (max) 330

B (min) 1.5

C (± 0.2) 13

D (min) 20.2

G (+ 2 / -0) 32

N (min) 100

T (max) 38.4

Top

cover

tape

Start

No componentsNo components Components

500 mm min

Empty components pockets

User direction of feed

Tape dimensions

According to Electronic Industries Association

(EIA) Standard 481 rev. A, Feb 1986

Description Dimension mm

Tape width W 32

Tape Hole Spacing P0 (± 0.1) 4

Component Spacing P 24

Hole Diameter D (± 0.1/-0) 1.5

Hole Diameter D1 (min) 2

Hole Position F (± 0.1) 14.2

Compartment Depth K (max) 2.2

End

Package and packing information VND5004B-E, VND5004BSP30-E

30/33 Doc ID 15702 Rev 1

5.5 PQFN - 12x12 power lead-less packing information

The devices can be packed in tray or tape and reel shipments (see the Devices summary on

page 1 for packaging quantities).

Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix)

Tray information

Parameter

Base Q.ty 189

Bulk Q.ty 945

VND5004B-E, VND5004BSP30-E Package and packing information

Doc ID 15702 Rev 1 31/33

Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”)

Tape dimensions

Dimension mm

A0 ± 0.1 12.30

B0 ± 0.1 12.30

K0 ± 0.1 2.15

F ± 0.1 11.50

E ± 0.1 1.75

W ± 0.3 24

P2 ± 0.1 2

P0 ± 0.1 4

P1 ± 0.1 16

T ± 0.05 0.30

D1.50

D1 (min) 1.50

Reel dimensions

Dimension mm

Base Q.ty 1500

Bulk Q.ty 1500

A (max) 330

B (min) 1.5

C (± 0.2) 13

D (min) 20.2

G (+ 2 / -0) 32

N (min) 100

T (max) 38.4

Revision history VND5004B-E, VND5004BSP30-E

32/33 Doc ID 15702 Rev 1

6 Revision history

Table 15. Document revision history

Date Revision Changes

13-May-2009 1 Initial release.

VND5004B-E, VND5004BSP30-E

Doc ID 15702 Rev 1 33/33

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