Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations , and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 13 METAL CORE SMD POWER INDUCTORS(MCOILTM MD SERIES) METAL CORE SMD POWER INDUCTORS (MCOILTM MD series) REFLOW PARTS NUMBER M D K K 1 6 1 6 Series name Code MD T 1 R 0 M M Packaging Code T Series name Metal base oil specification Nominal inductance Code example R47 1R0 4R7 RDecimal point DimensionsHmm 1.0 1.2 DimensionsLxW Code 1616 2020 4040 Taping DimensionsLxWmm 1.6x1.6 2.0x2.0 4.0x4.0 Inductance tolerance Code M Nominal inductanceH POWER INDUCTORS INDUCTORS DimensionsH Code KK MK Blank space 0.47 1.0 4.7 Inductance tolerance 20 Special code Code F M Special code Ferrite coating Metal coating Internal code STANDARD EXTERNAL DIMENSIONS Type MDKK1616 MDMK2020 MDMK4040 L W H e f 1.640.1 (0.0650.004) 2.00.15 (0.0790.006) 4.00.2 (0.1570.008) 1.640.1 (0.0650.004) 2.00.15 (0.0790.006) 4.00.2 (0.1570.008) 1.0 max (0.039 max) 1.2 max (0.047 max) 1.2 max (0.047 max) 0.40 0.2/0.1 (0.016 +0.008/-0.004) 0.500.2 (0.020.008) 1.10.2 (0.0430.008) 1.00.2 (0.0390.008) 1.250.2 (0.0490.008) 2.50.2 (0.0980.008) Standard quantity [pcs] Taping 2500 2500 1000 Unitmm(inch) PARTS NUMBER MDKK1616 type EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.5 2.2 3.3 4.7 20 20 20 20 20 20 - 0.095 0.140 0.185 0.250 0.515 0.640 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.5 2.2 3.3 4.7 20 20 20 20 20 20 - 0.046 0.064 0.086 0.109 0.178 0.242 Parts number EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. MDMK4040TR47MF MDMK4040T1R0MF MDMK4040T1R2MF MDMK4040T1R5MF MDMK4040T2R2MF RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.2 1.5 2.2 20 20 20 20 20 - 0.029 0.047 0.047 0.065 0.092 Parts number MDKK1616TR47MM MDKK1616T1R0MM MDKK1616T1R5MM MDKK1616T2R2MM MDKK1616T3R3MM MDKK1616T4R7MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,300 1,500 1 2,200 1,200 1 1,750 1,100 1 1,500 950 1 1,150 650 1 950 550 1 MDMK2020 type Parts number MDMK2020TR47MM MDMK2020T1R0MM MDMK2020T1R5MM MDMK2020T2R2MM MDMK2020T3R3MM MDMK2020T4R7MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,200 2,300 1 2,550 1,900 1 2,000 1,650 1 1,750 1,450 1 1,350 1,150 1 1,150 950 1 MDMK4040 type Rated current A Saturation current Temperature rise current Idc2 Idc1 7,500 4,600 5,200 3,500 4,200 3,500 3,700 3,300 3,200 2,500 Measuring frequencykHz 100 100 100 100 100 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20) The temperature rise current valueIdc2) is the DC current value having temperature increase up to 40. (at 20) The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 33 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES PACKAGING Minimum Quantity Type MDKK 1616 MDMK 2020 MDMK 4040 Standard Quantity [pcs] Tape Reel 2500 2500 1000 Tape Material Embossed Tape Taping dimensions Embossed tape 8mm wide (0.315 inches wide) Type MDKK 1616 MDMK 2020 Chip cavity A B 1.790.1 1.790.1 (0.0710.004) (0.0710.004) 2.20.1 2.20.1 0.1020.004 0.1020.004 Insertion pitch F 4.00.1 (0.1570.004) 4.00.1 0.1570.004 Tape thickness T K 0.250.05 1.10.1 (0.0100.002) (0.0430.004) 0.250.05 1.30.1 0.0090.002 0.0510.004 Unitmminch Insertion pitch F 8.00.1 0.3150.004 Tape thickness T K 0.30.1 1.60.1 0.0120.004 0.0630.004 Unitmminch Embossed tape 12mm wide (0.47 inches wide) Type MDMK 4040 Chip cavity A B 4.30.1 4.30.1 0.1690.004 0.1690.004 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_pack_e-01 Leader and Blank portion Reel size Type MDKK 1616 MDMK 2020 MDMK 4040 D 1800.5 7.0870.019 1803.0 7.0870.118 Reel size (Reference values) d 601.0 2.360.04 602.0 2.360.08 W 10.01.5 0.3940.059 14.01.5 0.5510.059 Unitmminch Top Tape Strength The top The top tape requires a peel-off force of 0.1 to 1.3N in the direction of the arrow as illustrated below. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_pack_e-01 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES RELIABILITY DATA 1. Operating Temperature Range MDKK 1616 Specified Value MDMK 2020 40125 MDMK 4040 Test Methods and Remarks Including self-generated heat 2. Storage Temperature Range MDKK 1616 Specified Value MDMK 2020 4085 MDMK 4040 Test Methods and Remarks 5 to 40 for the product with taping. 3. Rated current MDKK 1616 Specified Value MDMK 2020 Within the specified tolerance MDMK 4040 4. Inductance MDKK 1616 Specified Value MDMK 2020 Within the specified tolerance MDMK 4040 Test Methods and Remarks Measuring equipment Measuring frequency : LCR Meter HP 4285A or equivalent : 100kHz, 1V 5. DC Resistance MDKK 1616 Specified Value MDMK 2020 Within the specified tolerance MDMK 4040 Test Methods and Remarks Measuring equipment : DC ohmmeter HIOKI 3227 or equivalent 6. Self resonance frequency MDKK 1616 Specified Value MDMK 2020 MDMK 4040 7. Temperature characteristic MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% MDMK 4040 Test Methods and Remarks Measurement of inductance shall be taken at temperature range within 40125. With reference to inductance value at 20., change rate shall be calculated. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-01 8. Resistance to flexure of substrate MDKK 1616 Specified Value MDMK 2020 No damage MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100x40x1.0 mm Test board material : glass epoxy-resin Solder cream thickness : 0.10 mm 9. Insulation resistance : between wires MDKK 1616 Specified Value MDMK 2020 MDMK 4040 10. Insulation resistance : between wire and core MDKK 1616 Specified Value MDMK 2020 MDMK 4040 11. Withstanding voltage : between wire and core MDKK 1616 Specified Value MDMK 2020 MDMK 4040 12. Adhesion of terminal electrode MDKK 1616 Specified Value MDMK 2020 Shall not come off PC board MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Applied force : 10N to X and Y directions. Duration : 5s. Solder cream thickness : 0.15mm. 13. Resistance to vibration MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 1055Hz Total Amplitude 1.5mm (May not exceed acceleration 196m/s2) Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on each X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-01 14. Solderability MDKK 1616 Specified Value MDMK 2020 At least 90 of surface of terminal electrode is covered by new solder. MDMK 4040 Test Methods and Remarks The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperatue 2455 Time 51.0 sec. Immersion depth : All sides of mounting terminal shall be immersed. 15. Resistance to soldering heat MDKK 1616 Specified Value Inductance change : Within 10% No significant abnormality in appearance. MDMK 2020 MDMK 4040 The test sample shall be exposed to reflow oven at 2305 for 40 seconds, with peak temperature at 2605 for 5 seconds, 2 times. Test Methods and Remarks Test board material Test board thickness : glass epoxy-resin : 1.0mm 16. Thermal shock MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature () Duration (min) 1 403 303 2 Room temperature Within 3 3 852 303 4 Room temperature Within 3 17. Damp heat MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 602 Humidity 9095%RH Time 50024/0 hour 18. Loading under damp heat MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 602 Humidity 9095RH Applied current Rated current Time 50024/0 hour This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-01 19. Low temperature life test MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 402 Time 50024/0 hour 20. High temperature life test MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 1053 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test MDKK 1616 Specified Value MDMK 2020 Inductance change : Within 10% No significant abnormality in appearance. MDMK 4040 Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Temperature 852 Applied current Rated current Time 50024/0 hour 22. Standard condition MDKK 1616 Specified Value MDMK 2020 MDMK 4040 Standard test condition : Unless otherwise specified, temperature is 2015 and 6520of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 202 of temperature, 655% relative humidity. Inductance is in accordance with our measured value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-01 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES PRECAUTIONS 1. Circuit Design Precautions Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations Land pattern design 1. Please refer to a recommended land pattern. Land pattern design Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Recommended conditions for using a soldering iron (NR10050 Type) Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 Duration - 3 seconds or less The soldering iron should not directly touch the inductor. Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type Recommended reflow condition (Pb free solder) Technical considerations 5. Cleaning Precautions Technical considerations Cleaning conditions 1. Washing by supersonic waves shall be avoided. Cleaning conditions 1. If washed by supersonic waves, the products might be broken. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_prec_e-01 6. Handling Precautions Handling 1. Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1. Please avoid accumulation of a packing box as much as possible. Board mounting 1. There shall be no pattern or via between terminals at the bottom of product. 2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product. Technical considerations Handling 1. There is a case that a characteristic varies with magnetic influence. Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. Board mounting 1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change. 2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or characteristics change. 7. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. Recommended conditions Ambient temperature : 540 Humidity : Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_prec_e-01