1
3
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
33
INDUCTORS
／
POWER INDUCTORS
METAL CORE SMD POWER INDUCTORS (MCOILTM MD series)
■PARTS NUMBER
M D K K 1 6 1 6 T 1 R 0 M M △△＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series name
Code Series name
MD Metal base ｃoil specification
②Dimensions（H）
Code Dimensions（H）［mm］
KK 1.0
MK 1.2
③Dimensions（L×W）
Code Dimensions（L×W）［mm］
1616 1.6×1.6
2020 2.0×2.0
4040 4.0×4.0
④Packaging
Code 包装
T Taping
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
R47 0.47
1R0 1.0
4R7 4.7
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
M ±20％
⑦Special code
Code Special code
F Ferrite coating
M Metal coating
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS
Type L W H e f Standard quantity
[pcs] Taping
MDKK1616 1.64±0.1
(0.065±0.004)
1.64±0.1
(0.065±0.004)
1.0 max
(0.039 max)
0.40 ＋0.2/－0.1
(0.016 +0.008/-0.004)
1.0±0.2
(0.039±0.008) 2500
MDMK2020 2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
1.2 max
(0.047 max)
0.50±0.2
(0.02±0.008)
1.25±0.2
(0.049±0.008) 2500
MDMK4040 4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
1.2 max
(0.047 max)
1.1±0.2
(0.043±0.008)
2.5±0.2
(0.098±0.008) 1000
Unit：mm(inch)
■PARTS NUMBER
●MDKK1616 type
Saturation current
Idc1
Temperature rise current
Idc2
MDKK1616TR47MM RoHS 0.47 ±20％ - 0.095 3,300 1,500 1
MDKK1616T1R0MM RoHS 1.0 ±20％ - 0.140 2,200 1,200 1
MDKK1616T1R5MM RoHS 1.5 ±20％ - 0.185 1,750 1,100 1
MDKK1616T2R2MM RoHS 2.2 ±20％ - 0.250 1,500 950 1
MDKK1616T3R3MM RoHS 3.3 ±20％ - 0.515 1,150 650 1
MDKK1616T4R7MM RoHS 4.7 ±20％ - 0.640 950 550 1
●MDMK2020 type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK2020TR47MM RoHS 0.47 ±20％ - 0.046 4,200 2,300 1
MDMK2020T1R0MM RoHS 1.0 ±20％ - 0.064 2,550 1,900 1
MDMK2020T1R5MM RoHS 1.5 ±20％ - 0.086 2,000 1,650 1
MDMK2020T2R2MM RoHS 2.2 ±20％ - 0.109 1,750 1,450 1
MDMK2020T3R3MM RoHS 3.3 ±20％ - 0.178 1,350 1,150 1
MDMK2020T4R7MM RoHS 4.7 ±20％ - 0.242 1,150 950 1
●MDMK4040 type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK4040TR47MF RoHS 0.47 ±20％ - 0.029 7,500 4,600 100
MDMK4040T1R0MF RoHS 1.0 ±20％ - 0.047 5,200 3,500 100
MDMK4040T1R2MF RoHS 1.2 ±20％ - 0.047 4,200 3,500 100
MDMK4040T1R5MF RoHS 1.5 ±20％ - 0.065 3,700 3,300 100
MDMK4040T2R2MF RoHS 2.2 ±20％ - 0.092 3,200 2,500 100
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Rated current ※） ［ｍA］Measuring
frequency［kHz］
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Measuring
frequency［MHz］
Parts number EHS
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Measuring
frequency［MHz］
Self-resonant
frequency
［MHｚ］（min.）
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Nominal inductance
［μH］Inductance tolerance DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
Rated current ※） ［ｍA］
METAL CORE SMD POWER INDUCTORS(MCOILTM MD SERIES)
REFLOW
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PACKAGING
①Minimum Quantity
Type Standard Quantity [pcs]
Tape ＆ Reel
MDKK 1616 2500
MDMK 2020 2500
MDMK 4040 1000
②Tape Material
●Embossed Tape
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MDKK 1616 1.79±0.1
(0.071±0.004)
1.79±0.1
(0.071±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.1±0.1
(0.043±0.004)
MDMK 2020 2.2±0.1
（0.102±0.004）
2.2±0.1
（0.102±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.3±0.1
（0.051±0.004）
Unit：mm（inch）
●Embossed tape 12mm wide (0.47 inches wide)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MDMK 4040 4.3±0.1
（0.169±0.004）
4.3±0.1
（0.169±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
1.6±0.1
（0.063±0.004）
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-01
④Leader and Blank portion
⑤Reel size
Type Reel size (Reference values)
φD φd W
MDKK 1616 180±0.5
（7.087±0.019）
60±1.0
（2.36±0.04）
10.0±1.5
（0.394±0.059）
MDMK 2020
MDMK 4040 180±3.0
（7.087±0.118）
60±2.0
（2.36±0.08）
14.0±1.5
（0.551±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.3N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
MDKK 1616
－40～＋125℃ MDMK 2020
MDMK 4040
Test Methods and
Remarks Including self-generated heat
2. Storage Temperature Range
Specified Value
MDKK 1616
－40～＋85℃ MDMK 2020
MDMK 4040
Test Methods and
Remarks －5 to 40℃ for the product with taping.
3. Rated current
Specified Value
MDKK 1616
Within the specified tolerance MDMK 2020
MDMK 4040
4. Inductance
Specified Value
MDKK 1616
Within the specified tolerance MDMK 2020
MDMK 4040
Test Methods and
Remarks
Measuring equipment : LCR Meter （HP 4285A or equivalent）
Measuring frequency : 100kHz, 1V
5. DC Resistance
Specified Value
MDKK 1616
Within the specified tolerance MDMK 2020
MDMK 4040
Test Methods and
Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MDKK 1616
－ MDMK 2020
MDMK 4040
7. Temperature characteristic
Specified Value
MDKK 1616
Inductance change : Within ±10% MDMK 2020
MDMK 4040
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-01
8. Resistance to flexure of substrate
Specified Value
MDKK 1616
No damage MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size : 100×40×1.0 mm
Test board material : glass epoxy-resin
Solder cream thickness : 0.10 mm
9. Insulation resistance : between wires
Specified Value
MDKK 1616
－ MDMK 2020
MDMK 4040
10. Insulation resistance : between wire and core
Specified Value
MDKK 1616
－ MDMK 2020
MDMK 4040
11. Withstanding voltage : between wire and core
Specified Value
MDKK 1616
－ MDMK 2020
MDMK 4040
12. Adhesion of terminal electrode
Specified Value
MDKK 1616
Shall not come off PC board MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force : 10N to X and Y directions.
Duration : 5s.
Solder cream thickness : 0.15mm.
13. Resistance to vibration
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range 10～55Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on each X, Y, and Z axis. Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-01
14. Solderability
Specified Value
MDKK 1616
At least 90％ of surface of terminal electrode is covered by new solder. MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperatue 245±5℃
Time 5±1.0 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.
Test board material : glass epoxy-resin
Test board thickness : 1.0mm
16. Thermal shock
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step Temperature (℃) Duration (min)
1 －40±3 30±3
2 Room temperature Within 3
3 ＋85±2 30±3
4 Room temperature Within 3
17. Damp heat
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature 60±2℃
Humidity 90～95%RH
Time 500＋24/－0 hour
18. Loading under damp heat
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 500＋24/－0 hour
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-01
19. Low temperature life test
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature －40±2℃
Time 500＋24/－0 hour
20. High temperature life test
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature 105±3℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MDKK 1616
Inductance change : Within ±10%
No significant abnormality in appearance.
MDMK 2020
MDMK 4040
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in
below table.
Temperature 85±2℃
Applied current Rated current
Time 500＋24/－0 hour
22. Standard condition
Specified Value
MDKK 1616 Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
MDMK 2020
MDMK 4040
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions ◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Recommended conditions for using a soldering iron (NR10050 Type)
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
Technical
considerations
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
・NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type
Recommended reflow condition (Pb free solder)
5. Cleaning
Precautions ◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Board mounting
1. There shall be no pattern or via between terminals at the bottom of product.
2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
◆Board mounting
1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change.
2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or
characteristics change.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : －5～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
