
1996 Sep 18 5
Philips Semiconductors Product specification
High-speed diodes PMLL4150; PMLL4151; PMLL4153
THERMAL CHARACTERISTICS
Note
1. Device mounted on an FR4 printed-circuit board.
trr reverse recovery time when switched from IF= 10 mA to
IR= 1 mA; RL= 100 Ω; measured at
IR= 0.1 mA; see Fig.7
PMLL4150 −6ns
when switched from IF= 10 mA to
200 mA to IR= 10 mA to 200 mA;
RL= 100 Ω; measured at IR= 0.1 ×IF;
see Fig.7
−4ns
when switched from IF= 200 mA to
400 mA to IR= 200 mA to 400 mA;
RL= 100 Ω; measured at IR= 0.1 ×IF;
see Fig.7
−6ns
t
rr reverse recovery time when switched from IF= 10 mA to
IR= 10 mA; RL= 100 Ω; measured at
IR= 1 mA; see Fig.7
PMLL4151 −4ns
when switched from IF= 10 mA to
IR= 60 mA; RL= 100 Ω; measured at
IR= 1 mA; see Fig.7
−2ns
t
rr reverse recovery time when switched from IF= 10 mA to
IR= 10 mA; RL= 100 Ω; measured at
IR= 1 mA; see Fig.7
PMLL4153 −4ns
when switched from IF= 10 mA to
IR= 60 mA; RL= 100 Ω; measured at
IR= 1 mA; see Fig.7
−2ns
t
fr forward recovery time when switched to IF= 200 mA; tr= 0.4 ns;
measured at VF= 1 V; see Fig.8 −10 ns
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-tp thermal resistance from junction to tie-point 300 K/W
Rth j-a thermal resistance from junction to ambient note 1 350 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT