Print date 09/06/30
V5 2007/03/26
V6 2009/06/24
Multilayer Ceramic Antenna
for 433 MHz (small size) CAN4311 129 XX0431K
Tommy Chen Page 7 sheet
190-7
A4
Willing Change
Oscar Lu Yageo R&D Technology Center / HF Ceramic
RELIABILITY DATA (Reference to IEC Specification)
IEC
384-10/
CECC 32 100
CLAUSE
IEC
6006868-2
TEST
METHOD
TEST PROCEDURE REQUIREMEN
TS
4.4 Mounting The antenna can be mounted on
printed-circuit boards or ceramic
substrates by applying wave
soldering, reflow soldering (including
vapour phase soldering) or
conductive adhesive
No visible
damage
4.5 Visual inspection
and dimension
check
Any applicable method using × 10
magnification In accordance
with
specification
(no chip off 3
mm)
4.6.1 Antenna Central Frequency
at 20 oC Standard test
board in page 4
4.8 Adhesion A force of 5 N applied for 10 s to the
line joining the terminations and in a
plane parallel to the substrate
No visible
damage
4.9 Bond strength of
plating on end
face
Mounted in accordance with CECC
32 100, paragraph 4.4
No visible
damage
Conditions: bending 0.25 mm at a
rate of 1mm/s, radius jig. 340 mm,1
mm warp on FR4 board of 90 mm
length
No visible
damage
4.10 Tb Resistance to
soldering heat 260 ± 5 °C for 10 ± 0.5 s in a static
solder bath The
terminations
shall be well
tinned after
recovery and
Central Freq.
Change
± 6%
Resistance to
leaching 260 ± 5 °C for 30 ± 1 s in a static
solder bath Using visual
enlargement of
× 10,
dissolution of
the termination
shall not
exceed 10%