MIL-DTL-24308H
3.2.1 Quality.
3.2.1.1 Statistical process control (SPC). The contractor shall implement and use statistical process control
techniques in the manufacturing process for parts covered by this specification. The SPC program shall be
developed and maintained in accordance with SAE EIA-557. Where SPC cannot be utilized because of non-
continuous production requirements, a lot sampling plan for inspection in accordance with table XIII with c = 0 can be
utilized. The SPC and c = 0 programs shall be documented and maintained as part of the overall reliability assurance
program in accordance with SAE EIA-557 and MIL-STD-790. Evidence of such compliance shall be verified by the
qualifying activity of this specification as a prerequisite for qualification.
3.3 Materials. Materials shall be as identified herein. However, when a definite material is not specified, a material
shall be used which will enable the connectors to meet all requirements of this specification. Acceptance or approval
of any constituent material shall not be construed as a guarantee for acceptance of the finished product.
3.3.1 Interface materials, platings and proc es ses. Interface materials, platings, and processes have been
established to provide assurances that connectors manufactured to this specification will properly interface to similar
industry standard or government specified connector systems without problems of electrochemical incompatibility or
excessive interface surface wear. The manufacturers of connectors supplied to this specification may be allowed to
use alternate rec ogniz e d indus try standar d mater ial s, platings, and proces ses fro m those id entif ied in 3.3. Alternate
materials, platings and processes used must be coordinated with the qualifying activity as part of the qualification
process. Use of alternates to those referenced guidance items by the supplier must not result in inferior short or long
term performance or reliability of supplied connectors as compared with connectors manufactured using the
referenced materials, platings, or processes. Short or long term failures or reliability problems due to use of these
alternates shall be the responsibility of the supplier.
3.3.2 Dissimilar metals. When dissimilar metals are employed in intimate contact with each other, protection
against electrolytic corrosio n shall be prov ided (see 3.3.1).
3.3.3 Nonmagnetic materials (classes M and N connectors). All parts used in classes M and N connectors shall be
made from materials which are classed as nonmagnetic (see 3.5.1).
3.3.4 Conta ct materials. Classes D, G, M, and N contact bodies shall be made of suitably conductive copper
based alloys. Classes H and K contacts may be ferrous alloy material. All contacts shall be suitably protected from
corrosio n. When contact s are in-process plated in strip form, the absence of plating in the separation area is
acceptable, provided the area is nonfunctional and any corrosion products formed as a result of salt spray testing
(4.5.19) do not appear in the contact mating or termination areas.
3.3.4.1 Ac ce ssory mem ber s. Contac t accessory members such as hoods, pressure members and retaining
devices shall be made of corrosion resistant material or shall be suitably treated to resist corrosion.
3.3.4.2 Contact finish (solder contact). The finish on contact bodies shall be gold applied either overall or localized
for class G, (see 6.5). The finish on contact bodies for classes D and M shall be gold plated applied overall. The
finish on contact bodies for classes H and K shall be gold plated.
3.3.4.2.1 Overall finish. Contact bodies shall be overall gold plated in accordance with MIL-DTL-45204, or
equivalent as approved by the qualifying and preparing activities, type II, grade C, class 1, over a suitable underplate
(see 6.5). Silver shall not be used as an underplate. Nickel shall not be used as an underplate on classes M and N.
The finish on contact bodies of class H and K connectors shall be gold plated in accordance with
MIL-DTL-45204, or equivalent as approved by the qualifying and preparing activities, ty pe II , grade C, class 1.
Preliminary plating of another metal is permissible.
3.3.4.2.2 Localized finish. Contact bodies shall be overall nickel plated in accordance with SAE AMS-QQ-N-290,
except plating thickness shall be 30 to 150 microinches thick (see 6.5). Mechanical operati ons may be perfor me d
after application of plating.
3.3.4.2.2.1 Contact mating area. The contact mating area as shown on figur e 1 shall be gold plated in accordance
with MIL-DTL-45204, or equivalent as approved by the qualifying and preparing activities, type II, grade C, cla ss 1,
over nickel plating (see 3.3.4.2.2).
3.3.4.2.2.2 Terminations. Terminations shall be plated as follows: (see 6.2.d)
a. Solder cups: 100 microi nch es minimum tin-lead plated in accordance with SAE AMS-P-81728, 50 to 95
percent tin.