Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
30
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES Surface Mount Heat Sinks D2PAK, TO-220, SOT-223, SOL-20
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Package Package Natural Forced
P/N in. (mm) in. (mm) Format Quantity Convection Convection)
217-36CT6 G.390 (9.9) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTR6G.390 (9.9) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W 16.0°C/W @ 200 LFM
Material: Copper, Tin, Lead Plated
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
•Copper with tin-lead plating for improved solderability and assembly
•Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
•EIA standards and ESD protection are specified
•Can be used with water soluble or no clean SMT solder creams or other pastes
REEL DETAILS
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
SECTION A-A
TAPE DETAILS
217-36CT6
217 HEAT SINK WITH
DDPAK DEVICE
KEY: LDevice only, NC RDevice + HS, NC GDevice + HS, 100 lfm lDevice + HS, 200 lfm rDevice + HS, 300 lfm
MECHANICAL DIMENSIONS
Device Power Dissipation. W
THERMAL PERFORMANCE
6 LAYER BOARD, D'PAK
125°C LEAD, 40°C AMBIENT
Dimensions: in.
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 31
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES Surface Mount Heat Sinks D2PAK, TO-220, SOL-20
230 AND 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Height Above Footprint Solderable Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Tab Mounting Natural Forced
P/N in. (mm) in. (mm) Configuation Option Style Convection Convection)
230-75AB G.750 (19.1) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT PENDING
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
230 SERIES
234 SERIES
230-75AB-05
230-75AB-10
230-75AB-01
234 SERIES
234-75AB 234-75AB-01 234-75AB-05
230 AND 234 SERIES
Dimensions: in. (mm)
217-36CT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
MECHANICAL DIMENSIONS
TUBE: 16.25 Inches Long,
Min. ESDMaterial with Nail
Stops
20 Pieces per Tube
217-36CTT6
217 SERIES
TUBE DETAILS
BOARD LAYOUT RECOMMENDATIONS
Dimensions: in.
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
32
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 AND 236 SERIES Self-Locking Wavesolderable Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
233-60AB G.600 (15.2) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60AB-01 .600 (15.2) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60AB-05 .500 (12.7) .600 (15.2) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60AB-10 G.725 (18.4) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 58°C @ 2W 4.80°C/W @ 400 LFM
236-150AB-01 1.500 (38.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 58°C @ 2W 4.80°C/W @ 400 LFM
236-150AB-05 G.500 (12.7) 1.500 (38.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 58°C @ 2W 4.80°C/W @ 400 LFM
236-150AB-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Vetrical 10 Clip/Mtg Hole 58°C @ 2W 4.80°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
233 AND 236 SERIES NATURAL AND FORCED
CONVECTION CHARACTERISTICS
233-60AB
233-60AB-05
236-150AB-05
236-150AB
233-60AB-01
236-150AB-01 233-60AB-10
236-150AB-10
275 AND 231 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
275-75AB .750 (19.1) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 44 C @ 2W 7.9°C/W @ 400 LFM
275-75AB-01 .750 (19.1) .835 (21.2) x .400 (12.7) Vertical 01 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM
275-75AB-10 .875 (12.7) .835 (21.2) x .400 (14.5) Vertical 10 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM
231-69PAB .690 (18.4) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-69PAB-13H .400 (38.1) .690 (17.5) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-69PAB-XXX .690 (38.1) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-75PAB .750 (12.7) .835 (21.2) x .400 (14.5) Vert./Horiz. No Tab Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
231-75PAB-13H .400 (41.3) .750 (19.1) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
(14V G) 231-75PAB-XXX .750 (34.9) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
231-137PAB 1.375 (10.2) .835 (21.2 x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
231-137PAB-13H .400 (10.2) 1.375 (34.9) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
(15VG) 231-137PAB-XXX 1.375 (10.2) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
All versions No Tab
275 AND 231 SERIES
TAB
14V TAB
13V
TAB 13H
TAB 13H
TAB 01 TAB 10
TAB 15V
PATENT PENDING
PATENT 5381041
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 33
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
235-85AB G.850 (21.6) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85AB-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85AB-05 .500 (12.7) .850 (21.6) x1.000 (25.4) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85AB-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Vertical 10 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT 5381041
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235 SERIES
235-85AB-10
235-85AB-01
235-85AB
235-85AB-05
243 SERIES Labor-Saving Clip-On Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) Vert./Horiz. No Tab Clip 50°C@ 2W 4.5°C/W @ 400 LFM
243-3PAB G.800 (20.3) .800 (20.3) x .270 (6.9) Verl./Horiz. No Tab Clip 78°C@ 2W 8.2°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black
TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
VIEW B-B
SECTION A-A
243 SERIES
239 SERIES Snap-Down Self-Locking Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) Vert./Horiz No Tab Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
239-75AB-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 03 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
239-75AB-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 04 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT PENDING
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
239 SERIES
SECTION A-A
239-75AB
239-75AB-03
239-75AB-04
Board Level
Heat Sinks
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34
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks TO-218, TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
273-AB G.375 (9.5) .750 (19.1) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
273-AB-01 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 01 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
273-AB-02 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 02 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
273-AB 273-AB-01 273-AB-02
273 SERIES
274 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
274-1AB G.375 (9.5) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-1AB-01 G.375 (9.5) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-1AB-02 .375 (9.5) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-2AB G.500 (12.7) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-2AB-01 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-2AB-02 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-3AB G.250 (6.4) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
274-3AB-01 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
274-3AB-02 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
281-1AB .375 (9.5) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
281-2AB .500 (12.7) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
274-XAB-01 274-XAB-02
274 SERIES
240 SERIES Labor-Saving Twisted Fin Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
240-118ABH-22 G1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Hole 55°C @ 4W 5.3°C/W @ 400 LFM
240-118ABS-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Slot 55°C @ 4W 5.3°C/W @ 400 LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
240-118ABH-22
240-118ABS-22
240 SERIES
Dimensions: in. (mm)
Material: Aluminum,
Black Anodized
Dimensions: in. (mm)
274 SERIES
281 SERIES
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 35
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
242-125AB-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Vertical 22 Mtg Hole 48°C @ 2W 6.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
242-125AB-22 242 SERIES
232 AND 238 SERIES Staggered Fin Heat Sinks for Vertical Mounting
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
232-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Twisted Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
232-200AB-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Solderable Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
238-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Twisted Mtg Slot 48°C @ 4W 3.3°C/W @ 400 LFM
238-200AB-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Solderable Mtg Slot 48°C @ 4W 3.3°C/W @ 400 LFM
TO-202, TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
232-200AB-23
238-200AB 238-200AB-23
232-200AB 238 SERIES 232 AND 238 SERIES
251 SERIES Slim-Profile Heat Sinks With Integral Clips
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 66°C @ 3W 66°C/W @ 400 LFM
251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 64°C @ 3W 66°C/W @ 400 LFM
251-80AB-19 .875 (22.2) .910 (23.1) x .380 (9.7) Vertical 19 Clip 64°C @ 3W 66°C/W @ 400 LFM
Material: Aluminum, Black Anodized
15 Lead Multiwatt
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
251-62AB 251-80AB 251-80AB-19
251 SERIES
Material: Aluminum,
Black Anodized
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
36
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
244 SERIES
245 SERIES
246 SERIES
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT
MULTIWATT
MULTIWATT
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) Vert/Horiz, No Tab 44°C @ 4W 4.4°C/W @ 400 LFM .0160 (7.25)
244-145AB-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Vertical 50 44°C @ 4W 4.4°C/W @ 400 LFM .0170 (7.20)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) Ver.t/Horiz. No Tab 38°C @ 4W 3.2°C/W @ 400 LFM .0160 (7.25)
245-145AB-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Vertical 50 38°C @ 4W 3.2°C/W @ 400 LFM .0170 (7.20)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. No Tab 35°C @ 4W 2.8°C/W @ 400 LFM .0240 (10.90)
246-197AB-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical 50 35°C @ 4W 2.8°C/W @ 400 LFM .0250 (11.40)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 37
248 SERIES
249 SERIES
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. No Tab 25°C@ 4W 2.4°C/W @ 400 LFM .0330 (15.10)
247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical 50 25°C@ 4W 2.4°C/W @ 400 LFM .0340 (15.60)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vert/Horiz. No Tab 35°C @ 4w 2.5°C/W @ 400 LFM .026 (11.60)
248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vertical 50 35°C @ 4w 2.5°C/W @ 400 LFM .027 (12.20)
Order SpeedClip™ 285SC or 330SC separately.
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
Order SpeedClips™ separatley for use
with Series 246, 247, 248 or 249
MECHANICAL DIMENSIONS
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, No Tab 35°C@ 4W 3.29°C/W @ 400 LFM .020 (8.90)
249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical 50 35°C@ 4W 3.29°C/W @ 400 LFM .021 (9.40)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MULTIWATT
MULTIWATT
MULTIWATT
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
38
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
288-1AB G1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) 85°C @ 4W 12°C/W @ 200 LFM 0.0057 (2.59)
TO-220, TO-202
271 SERIES Top-Mount Booster Heat Sinks for Use with 270/272/280 Series TO-220
Horizontal
Height Above Mounting Footprint Thermal Performance at Typical Load
Standard Semiconductor Case Dimensions Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
271-AB G0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) 62°C @ 4W (NOTE A) 5.1°C/W @ 400 LFM 0.0052 (2.36)
31 °C @ 4W (NOTE B) 1.8°C/W 400 LFM (NOTE B)
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for
improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown
with (2) 271-AB types added to (1) 272-AB type.
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semicon-
ductor packages. These heat sinks are designed for use where minimum PC
board space is available. The 288-1AB is a stamped aluminum heat sink, black
anodized, designed for applications requiring good heat dissipation from a heat
sink occupying minimum space, available at minimum cost.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
271 SERIES
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
288 SERIES
Dimensions: in. (mm)
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 39
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
270/272/280 SERIES Small Footprint Low-Cost Heat Sinks TO-220, TO-202
Height Above Horizontal Mounting Thermal Performance at Typical Load
Standard PC Board Maximum Footing Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams)
270-AB G0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) — 70°C @ 4W 6.0°C/W @ 400 LFM 0.0052 (2.36)
272-AB G0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 01,02 42°C @ 4W 3.6°C/W @ 400 LFM 0.0105 (5.72)
280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) — 70°C @ 4W 6.0°C/W @ 400 LFM 0.0048 (2.18)
Material: Aluminum, Black Anodized
These exceptionally low-cost heat sinks can be mounted horizontally under a
TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4).
For added performance, a 271 Series heat sink can also be used for double-sided heat dissi-
pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for
two power semiconductors. Specify solderable tab options for the 272 Series by the addition
of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
289 AND 290 SERIES Low-Cost Single or Dual Package Heat Sinks TO-218, TO-202, TO-220
Height Above Horizontal Mounting Thermal Performance at Typical Load
Standard PC Board Maximum Footing Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
289-AB G0.500 (12.7) 1.000 (25.4) x O.710 (18.1) 50°C @ 2W 44°C/W @ 400 LFM 0.0055 (2.49)
289-AP 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 44°C/W @ 400 LFM 0.0055 (2.49)
290-1AB G0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 35°C/W @ 400 LFM 0.0082 (3.72)
290-2AB G0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 35°C/W @ 400 LFM 0.0081 (3.67)
Material: Aluminum, Black Anodized
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate
one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
270 SERIES 280 SERIES
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
289 SERIES 290 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
272 SERIES 272AB01 272AB02
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
40
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Multiwatt
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip 50°C @ 4W 3.7°C/W @ 400 LFM
250-122AB-09 G1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vertical 09 Clip 50°C @ 4W 3.7°C/W @ 400 LFM
250-122AB-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Vertical 25 Clip 50°C @ 4W 3.7°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
250-122AB
250-122AB-09 250-122AB-25
250 SERIES
237 AND 252 SERIES High-Performance, High-Power Vertical Mount Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
237-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
252-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
227-167
237-167AB3
252-167AB3
237-167AB3
252-167 237-167AB2
252-167AB2 237-167AB2-24
252-167AB2-24
237 AND 252 SERIES
237 AND 252 SERIES
Dimensions: in. (mm)
252-167AB3
291 SERIES Labor-Saving Clip-on Heat Sinks TO-220
Vertical
Height Above Mounting Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Natural Forced Weight
P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams)
291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) TO-220 (Clip) 80°C @ 2W 24°C/W @ 600 LFM 0.0026 (1.18)
291-H36AB G0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) TO-220 (Mtg. Hole) 68°C @ 2W 16°C/W @ 600 LFM 0.0026 (1.18))
Material: Aluminum, Black Anodized
Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks
employ a unique clip for attachment of TO-220 case styles. One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting
hole only.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
291 SERIES
Dimensions: in. (mm) 291-C2 291-H
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 41
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Height Above Thermal Performance at Typical Load
Standard PC Board Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams)
286-AB G1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized 58°C @ 4W 7.4°CW @ 200 LFM 0.0085 (3.86)
286-CBT G1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Black 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34)
286-CT 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Tinned 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34)
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-
drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili- t y. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
286 SERIES
Dimensions: in. (mm)
287 SERIES Wave-Solderable Low-Cost Heat Sinks
Height Above Maximum Thermal Performance at Typical Load
Standard P/N PC Board Footprint “A” Natural Forced Weight
Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams)
287-1AB G287-1ABH G1.180 (30.0) 1.000 (25.4) x 0.500 (12.7) 65°C @ 4W 7.8°CW @ 200 LFM 0.0090 (4.08)
287-2AB G287-2ABH G1.180 (30.0) 1.000 (25.4) x 1.000 (25.4) 55°10 @ 4W 6.4°CW @ 200 LFM 0.0140 (6.35)
Material: Aluminum, Black Anodized
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
287 SERIES
Dimensions: in. (mm)
Standard P/N Dim. “A”
287-1AB 0.500 (12.7)
287-2AB 1.000 (25.4)
287-1ABH 0.500 (12.7)
287-2ABH 1.000 (25.4)
695 SERIES Space-Saving Heat Sinks for Small Stud-Mounted Diodes STUD-MOUNT
Maximum Thermal Performance at Typical Load
Standard Width Height Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
695-1B G1.330 (33.8) 0.530 (13.7) 72°C @ 4.0W 5.2°C/W @ 400 LFM 0.0030 (1.36)
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
provides good heat dissipation for use where height is limited above the print-
ed circuit board or base plate.
MECHANICAL
DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
695 SERIES
Dimensions: in. (mm)
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
42
256 SERIES Thermal Retainers
Height (Less
Standard Mounting Tab) Weight
P/N in. (mm) Material lbs. (grams)
256-DM G0.190 (4.0) Beryllium Copper 0.0005 (0.23)
TO-92
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
260 SERIES Cup Clips for TO-5 Case Style Semiconductors TO-5
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE Outline Dimension
Standard Insulation L x W x I.D. Weight Case
P/N Type in. (mm) lbs. (grams) Style
260-4T5E GEpoxy Insulated 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.0024 (1.09) TO-5
260-4TH5E GEpoxy Insulatad 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0031 (1.41) TO-5
260-6SH5E GEpoxy Insulated 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0037 (1.68) TO-5
260-1OSH5E Epoxy Insulated 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0042 (1.91) TO-5
260-4TH5B GBeryllium Oxide Insulated 0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0042 (1.91) TO-5
260-6SH5B GBeryllium Oxide Insulated 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0039 (1.77) TO-5
260-10SH5B Beryllium Oxide Insulated 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0043 (1.95) TO-5
T h r e a d
S i z e : 4 = #4-40 UNC Base Style: H = h e x
6 = #6-32 UNC S e m i c o n d u c t o r
10 = #10-32 UNF Case Style: 5 = T O - 5
M o u n t i n g T = t a p p e d I n s u l a t i o n E = e p o x y
S t y l e : S = s t u d Ty p e : B = b e ry l l i u m
P = p l a i n
Characteristics TO-5
Thermal Resistance – Epoxy Insulated 14° C/W
Thermal Resistance – Beryllium Oxide Insulated 16° C/W
Breakdown Voltage – Epoxy Type (VAC), 60 Hz 500
Breakdown Voltage – Beryllium Type (VAC), 60 Hz 1000
Recommended Operating Voltage, AC or DC
Clean Conditions: % Hipot Rating 50
Dusty Conditions: % Hipot Rating 30
Dirty Conditions: % Hipot Rating 10 to 20
Temperature Range — Continuous (C°) -73/+149
Depth of
Model Tapped Base
260-4T5E 0.093 (2.36)
260-4TH5E 0.125 (3.18)
260-4TH5B 0.125 (3.18)
Base Mounting Configurations — TO-5
Plain Ty p e — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care
should be taken not to use too long a screw, which could short against the
semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base +Panel Thickness +Washer Thickness
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not
supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) = Depth of Base +Panel Thickness +Washer Thickness
Epoxy Insulated For TO-5 Beryllium Oxide Insulated For TO-5
G260-4T5E G260-4TH5E 260-6SH5E
260-10SH5E
G260-4TH5B
G260-6SH5B
260-10SH5B
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide
256-DM
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 43
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors
Available Semiconductor Heat Sink Heat Sink Heat Sink Natural Applicable
Standard P/N Case Diameter Inside Dia. Outside Dia. Height Convection Forced Power
& Finish Min/Max “A” “B” “C” Case Rise Convection Semiconductor
Types in. (mm) in. (mm) in. (mm) in. (mm) Above Ambient (ΘCA@200 LFM) Case Types
G201CB, 201AB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.640 (16.2) 0.187 (4.8) 65°C @ 1W 31°C/W TO-18, TO-24, TO-28,
202CB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.490 (12.5) 0.187 (4.8) 73°C @ 1W 43°C/W TO-40, TO-44
203CB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.640 (16.2) 0.375 (9.5) 53°C @ 1W 23°C/W
204CB G, 204SB 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.550 (4.8) 0.187 (4.8) 68°C @ 1W 35°C/W TO-5, TO-9, TO-11,
205CB G, 205SB 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.187 (4.8) 59°C @ 1W 28°C/W TO-12, TO-26, TO-29,
205AB, 205AP 0,275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.187 (4.8) 68°C @ 1W 28°C/W TO-33, TO-43, TO-45
207CB G, 207SB G0.275 (7.0)/0.370 (9.4) 0.255 (6,5) 0.720 (18.3) 0.375 (9.5) 46°C @ 1W 20°C/W
207AB G, 207AP 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.375 (9.5) 53°C @ 1W 20°C/W
209CB, 209SB 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 1.280 (32.5) 0.437 (11.1) 30°C @ 1W 13°C/W
211CB 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.187 (4.8) 50°C @ 1W 24°C/W TO-8, TO-38
213CB, 213SB 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.375 (9.5) 44°C @ 1W 19°C/W
213AB, 213AP 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.375 (9.5) 51°C @ 1W 19°C/W
215CB, 215AB 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 1.400 (35.6) 0.437 (11.1) 28°C @ 1W 15°C/W
215AP 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 1.400 (35.6) 0.437 (11.1) 32°C @ 1W 15°C/W
Single-Level Star
201,202,204,205,211 Series Dual-Level Star
203,207,213 Series Dual-Level Sunburst
209, 215 Series
Materials and
Finishes Available
for 200 Series:
CB Beryllium cop-
per; black ebonol
"C" Finish
SB Silver-bearing
copper; black
ebonol "C"
AB Aluminum, black
anodized
AP Aluminum, no
finish applied
NATURAL AND FORCED CONVECTION CHARACTERISTICS
258 SERIES Thermal Links for Fused Glass Diodes DIODES
Standard Dimensions Weight
P/N in. (mm) Material Finish lbs. (grams)
258 G0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoate™ 151 on all surfaces 0.0018 (0.82)
except solder pads and base
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
258 SERIES
292 SERIES Heat Sink for Single TO-92 TO-92
Height Above Overall
Standard PC Board Fin Width Thermal Performance Weight
P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams)
292-AB G0.750 (19.1) 0. 600 (15.3) 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS 292 SERIES NATURAL AND FORCED
CONVECTION CHARACTERISTICS
The thermal resistance from diode leads to chassis
or heat sink is 12°C/watt, when unit is mounted
with TYPE 120 Joint Compound. If a 10°C/watt
chassis or sink to ambient impedance is available,
the thermal resistance from the diode leads to
ambient is reduced from about 150°C/watt to
22°C/watt.
Power semiconductors packaged in a TO-92 style
plastic case can be cooled effectively at little addi-
tional cost with the addition of the 292-AB heat
sink. The 292-AB is effective over the typical power
range of such devices. Material: Aluminum, Black
Anodized.
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
44
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Standard Height Above Footprint
P/N PC Board Dimensions Weight
Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)
634-10ABP G634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48)
634-15ABP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21)
634-20ABP G634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95)
Material: Aluminum, Black Anodized.
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
TO-220 and TO-218
MECHANICAL DIMENSIONS 634 SERIES TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above Thermal Performance at Typical Load
Standard PC Board “A” Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
637-10ABP G1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43)
637-15ABP G1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM 0.035 (15.88)
637-20ABP G2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68)
637-25ABP G2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.
Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for
thermal interface materials, thermal compounds, and other accessories products.
TO-220
MECHANICAL DIMENSIONS 637 SERIES
(EXTRUSION PROFILE 5183) NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
Notes:
1. Thermal compound is
assumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
46
626 AND 627 SERIES High-Efficiency Heat Sinks for Vertical Board Mounting TO-218, TO-220
Height Above Maximum Thermal Performance at Typical Load
Standard Standard PC Board “A” Footprint Natural Forced
P/N P/N in. (mm) in. (mm) Convection Convection
626-10ABP 627-10ABP 1.000 (25.4) 1.375 (34.9) x .500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM
626-15ABP 627-15ABP 1.500 (38.1) 1.375 (34.9) x .500 (12.7) 65°C @ 6W 5.5°C/W @ 200 LFM
626-20ABP 627-20ABP 2.000 (50.8) 1.375 (34.9) x .500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM
626-25ABP 627-25ABP 2.500 (63-5) 1.375 (34.9) x .500 (12.7) 48°C @ 6W 4.2°C/M @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
626 AND 627 SERIES
Dimensions: in. (mm)
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES High-Performance Heat Sinks for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs (grams)
657-10ABP G1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM 0.0515 (23.36)
657-15ABP G1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM 0.0760 (34.60)
657-20ABP G2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM 0.1030 (47.00)
657-25ABP G2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM 0.1250 (57.00)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 47
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
657-10ABPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM
657-15ABPN G1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM
657-20ABPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM
657-25ABPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
657 SERIES High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
657-10ABPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM
657-15ABPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM
657-20ABPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM
657-25ABPSC G2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
677 SERIES High-Performance, High-Power Heat Sinks for Vertical Board Mounting TO-218, TO-220, TO-247
15-LEAD Multiwatt
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
677-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 52°C @ 6W 3.1°C/W @ 200 LFM
677-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 46°C @ 6W 2.8°C/W @ 200 LFM
677-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 40°C @ 6W 2.5°C/W @ 200 LFM
677-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 35°C @ 6W 2.2°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
677 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
677 SERIES
(EXTRUSION PROFILE 8719)
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums. GNormally stocked
48
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above Thermal Performance at Typical Load Semiconductor
Standard PC Board Outline Dimensions Natural Forced Mounting Weight
P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams)
690-3B G1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75)
690-66B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-66 0.0700 (31.75)
690-220B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75)
Material: Aluminum, Black Anodized
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
TO-3, TO-66, TO-220
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
690 SERIES
Dimensions: in. (mm)
680 SERIES Maximum Efficiency Omnidirectional Heat Sinks
Height Above Horizontal Mounting Thermal Performance at Typical Load Semiconductor
Standard PC Board “A” Footprint Dimensions Natural Forced Mounting Weight
P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams)
680-5A G0.500 (12.7) 1.810 (46.0)-sq 70°C @ 7.5W 3.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75)
680-75A G0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (1) TO-3 0.0900 (40.82)
680-10A G1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0980 (44.45)
680-125A G1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (1) TO-3 0.1100 (49.90)
680-5220 0.500 (12.7) 1.810 (46.0)-sq 7O°C @ 7.5W 3.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75)
680-75220 0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (2) TO-220 0.0900 (40.82)
680-10220 G1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0980 (44.45)
680-125220 G1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (2) TO-220 0.1100 (49.90)
Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed
c i rcuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style
cases, when this low-cost heat sink is used. Any mounting attitude will provide free circ u l a t i o n
of air in natural convection applications. These 680 Series heat sinks can also be specified with-
out any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
TO-3, TO-220
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
680 SERIES
Dimensions: in. (mm)
TO-3 TO-66 *TWO TO-220’S
TO-3
A220 K
*TWO TO-220’S
Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
GNormally stocked 49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
601 AND 603 SERIES Low-Height Heat Sinks DO-4/DO-5 Diodes
Footprint Mounting Thermal Performance at Typical Load
Standard Dimensions Height Hole Dia. Natural Forced Weight
P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams)
601E 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.200 (5.1) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
601F 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.270 (6.9) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
601K 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) None 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
603K 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) None 41°C @ 5.0W 4.0°C/W @ 175 LFM 0.0810 (36.74)
Material: Aluminum Alloy, Black Anodized
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The 601 and 603 Series may also be attached to enclosure pan-
els or brackets using isolation hardware where necessary.
635 SERIES Space-Saving Low-Cost Heat Sinks
Height Above Outline Thermal Performance at Typical Load Semiconductor
Standard PC Board “A” Dimensions Natural Forced Mounting Weight
P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams)
635-5B2 0.500 (12.7) 1.900 (48.3) x 1.420 (36.0) 90°C @ 8.0W 6.0°C/W @ 300 LFM TO-3 0.0200 (9.07)
635-75B2 0.750 (19.1) 1.900 (48.3) x 1.420 (36.0) 77°C @ 8.0W 4.8°C/W @ 300 LFM TO-3 0.0220 (9.98)
635-10B2 1.000 (25.4) 1.900 (48.3) x 1.420 (36.0) 61°C @ 8.0W 3.6°C/W @ 300 LFM TO-3 0.024 (10.89)
635-125B2 1.250 (31.8) 1.900 (48.3) x 1.420 (36.0) 53°C @ 8.0W 3.1°C/W @ 300 LFM T0-3 0.028 (12.70)
Material: Aluminum Alloy, Black Anodized
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed cir-
cuit board, where two or more TO-3s must be placed in proximity and minimum space is available for heat sinking. Four different heights are available, all with TO-3 mounting hole
pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.
TO-3
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
635 SERIES
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
601 SERIES
(EXTRUSION PROFILE 1284)
603 SERIES
(EXTRUSION PROFILE 1284)
K E F
Dimensions: in. (mm)
Dimensions: in. (mm)
