NXP Semiconductors Data Sheet: Technical Data MKW41Z/31Z/21Z Data Sheet A Bluetooth(R) Low Energy, IEEE(R) Standard 802.15.4, Generic FSK System on a Chip (SoC) Supports the following: MKW41Z512VHT4, MKW31Z512VHT4, MKW21Z512VHT4, MKW41Z256VHT4, MKW31Z256VHT4, MKW21Z256VHT4,MKW41Z512CAT4,MKW31Z512CAT4 MKW41Z512 Rev. 4, 03/2018 MKW41Z512 MKW31Z512 MKW21Z512 MKW41Z256 MKW31Z256 MKW21Z256 48 LQFN 7 x 7 x 0.98 mm Pitch 0.5 mm 75 WLCSP 3.893 x 3.797 x 0.564 mm Pitch 0.4 mm Multi-Standard Radio System peripherals * 2.4 GHz Bluetooth Low Energy ver. 4.2 compliant * Nine MCU low-power modes to provide power supporting up to 2 simultaneous hardware connections optimization based on application requirements * IEEE Std. 802.15.4 compliant with dual-PAN support * DC-DC Converter supporting Buck, Boost, and * Generic FSK modulation Bypass operating modes * Data Rate: 250, 500 and 1000 kbps * Direct memory access(DMA) Controller * Modulations: GFSK BT = 0.3, 0.5, 0.7; FSK/MSK * Computer operating properly(COP) watchdog * Modulation Index: 0.32, 0.5, or 0.7 * Serial wire debug(SWD) Interface and Micro Trace * Typical Receiver Sensitivity (BLE) = -95 dBm buffer * Typical Receiver Sensitivity (802.15.4) = -100 dBm * Bit Manipulation Engine (BME) * Typical Receiver Sensitivity (250 kbps GFSK-BT=0.5, Analog Modules h=0.5) = -100 dBm * 16-bit Analog-to-Digital Converter (ADC) * Prog Transmitter Output Power: -30 dBm to 3.5 dBm * 12-bit Digital-to-Analog Converter (DAC) * Low external component counts for low cost application * 6-bit High Speed Analog Comparator (CMP) * On-chip balun with single ended bidirectional RF port * 1.2 V voltage reference (VREF) MCU and Memories Timers * Up to 48 MHz ARM(R) Cortex-M0+ core * 16-bit low-power timer (LPTMR) * On-chip 512/256 KB Flash memory * 3 Timers Modules(TPM): One 4 channel TPM and * On-chip 128/64 KB SRAM two 2 channel TPMs Low Power Consumption * Programmable Interrupt Timer (PIT) * Transceiver current (DC-DC buck mode, 3.6 V supply) * Real-Time Clock (RTC) * Typical Rx Current: 6.8 mA Communication interfaces * Typical Tx current: 6.1 mA (0 dBm output) * 2 serial peripheral interface (SPI) modules * Low Power Mode (VLLS0) Current: 182 nA * 2 inter-integrated circuit (I2C) modules NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Clocks * 26 and 32 MHz supported for BLE and FSK modes * 32 MHz supported for IEEE Standard 802.15.4 * 32.768 kHz Crystal Oscillator Operating Characteristics * Voltage range: 0.9 V to 4.2 V * Temperature range: * -40 to 105 C (Laminate-QFN) * -40 to 85 C (WLCSP) Human-machine interface * Touch sensing input * General-purpose input/output 2 NXP Semiconductors * Low Power UART module * Carrier Modulator Timer (CMT) Security * AES-128 Hardware Accelerator (AESA) * True Random Number Generator (TRNG) * Advanced flash security * 80-bit unique identification number per chip * 40-bit unique media access control (MAC) subaddress * Bluetooth-LE v4.2 Secure Connections * IEEE Standard 802.15.4-2011 compliant security MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Table of Contents 1 Introduction......................................................................... 4 2 Ordering Information........................................................... 5 3 Feature Descriptions........................................................... 5 3.1 Block Diagram..............................................................5 3.2 Radio features..............................................................6 3.3 Microcontroller features............................................... 7 3.4 System features........................................................... 8 3.5 Peripheral features.......................................................11 3.6 Security Features.........................................................15 4 Transceiver Description.......................................................17 4.1 Key Specifications........................................................17 4.2 Channel Map Frequency Plans ...................................18 4.2.1 4.2.2 Channel Plan for Bluetooth Low Energy.......... 18 Channel Plan for IEEE 802.15.4 in 2.4GHz ISM and MBAN frequency bands.....................19 4.2.3 Other Channel Plans .......................................20 4.3 Transceiver Functions..................................................21 5 Transceiver Electrical Characteristics................................. 21 5.1 Radio operating conditions.......................................... 21 5.2 Receiver Feature Summary......................................... 22 5.3 Transmit and PLL Feature Summary...........................25 6 System and Power Management........................................ 28 6.1 Power Management.....................................................28 6.1.1 DC-DC Converter.............................................29 6.2 Modes of Operation..................................................... 29 6.2.1 Power modes................................................... 29 7 MCU Electrical Characteristics............................................32 7.1 AC electrical characteristics.........................................32 7.2 Nonswitching electrical specifications..........................32 7.2.1 Voltage and current operating requirements....32 7.2.2 LVD and POR operating requirements............ 33 7.2.3 Voltage and current operating behaviors......... 34 7.2.4 Power mode transition operating behaviors.....35 7.2.5 7.2.6 7.2.7 7.2.8 Power consumption operating behaviors......... 36 Diagram: Typical IDD_RUN operating behavior........................................................... 44 SoC Power Consumption.................................45 Designing with radiated emissions in mind...... 46 MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 7.2.9 Capacitance attributes..................................... 46 7.3 Switching electrical specifications................................46 7.3.1 Device clock specifications.............................. 46 7.3.2 General switching specifications...................... 47 7.4 Thermal specifications................................................. 48 7.4.1 Thermal operating requirements...................... 48 7.4.2 Thermal attributes............................................ 48 7.5 Peripheral operating requirements and behaviors....... 49 7.5.1 Core modules...................................................49 7.5.2 System modules.............................................. 51 7.5.3 Clock modules................................................. 51 7.5.4 Memories and memory interfaces....................54 7.5.5 Security and integrity modules......................... 56 7.5.6 Analog.............................................................. 56 7.5.7 Timers.............................................................. 67 7.5.8 Communication interfaces................................67 7.5.9 Human-machine interfaces (HMI).................... 72 7.6 DC-DC Converter Operating Requirements................ 73 7.7 Ratings.........................................................................76 7.7.1 Thermal handling ratings................................. 76 7.7.2 Moisture handling ratings................................. 76 7.7.3 ESD handling ratings....................................... 76 7.7.4 Voltage and current operating ratings.............. 77 8 Pin Diagrams and Pin Assignments.................................... 77 8.1 Pinouts......................................................................... 77 8.2 Signal Multiplexing and Pin Assignments.................... 79 8.3 Module Signal Description Tables............................... 83 8.3.1 Core Modules...................................................83 8.3.2 Radio Modules................................................. 83 8.3.3 System Modules.............................................. 84 8.3.4 Clock Modules................................................. 85 8.3.5 Analog Modules............................................... 86 8.3.6 Timer Modules................................................. 87 8.3.7 Communication Interfaces............................... 87 8.3.8 Human-Machine Interfaces(HMI)..................... 89 9 Package Information........................................................... 89 9.1 Obtaining package dimensions....................................89 10 Revision History.................................................................. 90 3 NXP Semiconductors Introduction 1 Introduction The KW41Z/31Z/21Z (called KW41Z throughout this document) is an ultra low-power, highly integrated single-chip device that enables Bluetooth low energy (BLE), Generic FSK (at 250, 500 and 1000 kbps) or IEEE Standard 802.15.4 RF connectivity for portable, extremely low-power embedded systems. Applications include portable health care devices, wearable sports and fitness devices, AV remote controls, computer keyboards and mice, gaming controllers, access control, security systems, smart energy and home area networks. The KW41Z SoC integrates a radio transceiver operating in the 2.36 GHz to 2.48 GHz range supporting a range of FSK/GFSK and O-QPSK modulations, an ARM CortexM0+ CPU, up to 512 KB Flash and up to 128 KB SRAM, BLE Link Layer hardware, 802.15.4 packet processor hardware and peripherals optimized to meet the requirements of the target applications. The KW41Z SoC's radio frequency transceiver is compliant with Bluetooth version 4.2 for Low Energy (aka Bluetooth Smart or BLE), Generic FSK and the IEEE Standard 802.15.4 using O-QPSK in the 2.4 GHz ISM band. NXP provides fully certified Bluetooth Low Energy and IEEE Standard 802.15.4 protocol stacks, including Zigbee 3.0, Thread, and application profiles to support KW41Z. The KW41Z SoC can be used in applications as a "BlackBox" modem by simply adding BLE or IEEE Standard 802.15.4 connectivity to an existing embedded controller system, or used as a stand-alone smart wireless sensor with embedded application where no host controller is required. KW41Z has 512/256 KB of on-chip Flash and 128/64 KB of on-chip SRAM memory available to be used by customer applications and chosen communication protocol stack using a choice of either NXP or 3rd party software development tools. The RF section of the KW41Z SoC is optimized to require very few external components, achieving the smallest RF footprint possible on a printed circuit board. Extremely long battery life is achieved though efficiency of code execution in the Cortex-M0+ CPU core and the multiple low power operating modes of the KW41Z SoC. Additionally, an integrated DC-DC converter enables a wide operating range from 0.9 V to 4.2 V. The DC-DC in Buck mode enables KW41Z to operate from a single coin cell battery with a significant reduction of peak Rx and Tx current consumption. The DC-DC in boost mode enables a single alkaline battery to be used throughout its entire useful voltage range of 0.9 V to 1.795 V. 4 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Ordering Information 2 Ordering Information Table 1. Orderable parts details Device Part Marking Memory Configuration MKW21Z512VHT4(R) M21W9VT4 512 KB Flash MKW21Z256VHT4(R) M21W8VT4 128 KB SRAM Package Description 48-pin Laminate QFN IEEE 802.15.4 75-pin WLCSP Bluetooth Low Energy and Generic FSK 48-pin Laminate QFN Bluetooth Low Energy and Generic FSK 75-pin WLCSP Bluetooth Low Energy and IEEE 802.15.4 and Generic FSK 48-pin Laminate QFN Bluetooth Low Energy and IEEE 802.15.4 and Generic FSK 256 KB Flash 64 KB SRAM MKW31Z512CAT4R MKW31Z512CAT4 512 KB Flash 128 KB SRAM MKW31Z512VHT4(R) M31W9VT4 512 KB Flash 128 KB SRAM MKW31Z256VHT4(R) M31W8VT4 256 KB Flash 64 KB SRAM MKW41Z512CAT4R MKW41Z512CAT4 512 KB Flash 128 KB SRAM MKW41Z512VHT4(R) M41W9VT4 512 KB Flash 128 KB SRAM MKW41Z256VHT4(R) M41W8VT4 256 KB Flash 64 KB SRAM 3 Feature Descriptions This section provides a simplified block diagram and highlights the KW41Z features. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 5 NXP Semiconductors Feature Descriptions 3.1 Block Diagram ARM Cortex M0+ Core Serial Wire Debug DAP MDM DWT MTB Unified Bus NVIC WIC IOPORT MCG DMA MUX FLL 4ch DMA AHBLite IRC 4 MHz 32K Osc IRC 32 kHz 26M or 32M OSC AHBLite M2A M0 Crossbar-Lite Switch (XBS) S2 S0 S1 128/64 KB SIM Flash Controller SRAM SMC ADC GPIO PIT TPM x3 CMP I2C x2 BME LPUART AIPS-Lite Flash 512/256 KB RCM DAC TRNG LPTMR SPI x2 PMC VREF TSI RTC CMT Radio IPS VDCDC_IN DCDC IPS APB Figure 1. KW41Z Detailed Block Diagram 3.2 Radio features Operating frequencies: * 2.4 GHz ISM band (2400-2483.5 MHz) * MBAN 2360-2400 MHz Supported standards: * Bluetooth v4.2 Low Energy compliant 1 Mbps GFSK modulation supporting up to 2 simultaneous connections in hardware (master-slave, master-master, slave-slave) * IEEE Standard 802.15.4-2011 compliant O-QPSK modulation and security features * Zigbee 3.0 * Thread Networking Stack * Bluetooth Low Energy(BLE) Application Profiles Receiver performance: * Receive sensitivity of -95 dBm for BLE * Receive sensitivity of -100 dBm typical for IEEE Standard 802.15.4 * Receive sensitivity of up to -100 dBm for a 250 kbps GFSK mode with a modulation index of 0.5. Receive sensitivity in generic FSK modes depends on mode selection and data rate. Other features: 6 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Feature Descriptions * * * * * * * * * * * * * Programmable transmit output power from -30 dBm to 3.5 dBm Integrated on-chip balun Single ended bidirectional RF port shared by transmit and receive Low external component count Supports transceiver range extension using external PA and/or LNA 26 and 32 MHz supported for BLE and FSK modes 32 MHz supported for IEEE Standard 802.15.4 Bluetooth Low Energy ver. 4.2 Link Layer hardware with 2 independent hardware connection engines Hardware acceleration for IEEE Standard 802.15.4 packet processing/link layer Hardware acceleration for Generic FSK packet processing Supports dual PAN for IEEE Standard 802.15.4 with hardware-assisted address matching acceleration Generic FSK modulation at 250, 500 and 1000 kbps Supports antenna diversity option for IEEE Std. 802.15.4 3.3 Microcontroller features ARM Cortex-M0+ CPU * Up to 48 MHz CPU * As compared to Cortex-M0, the Cortex-M0+ uses an optimized 2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per instruction) * Supports up to 32 interrupt request sources * Binary compatible instruction set architecture with the Cortex-M0 core * Thumb instruction set combines high code density with 32-bit performance * Serial Wire Debug (SWD) reduces the number of pins required for debugging * Micro Trace Buffer (MTB) provides lightweight program trace capabilities using system RAM as the destination memory Nested Vectored Interrupt Controller (NVIC) * 32 vectored interrupts, 4 programmable priority levels * Includes a single non-maskable interrupt Wake-up Interrupt Controller (WIC) * Supports interrupt handling when system clocking is disabled in low power modes MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 7 NXP Semiconductors Feature Descriptions * Takes over and emulates the NVIC behavior when correctly primed by the NVIC on entry to very-deep-sleep * A rudimentary interrupt masking system with no prioritization logic signals for wake-up as soon as a non-masked interrupt is detected Debug Controller * * * * Two-wire Serial Wire Debug (SWD) interface Hardware breakpoint unit for 2 code addresses Hardware watchpoint unit for 2 data items Micro Trace Buffer for program tracing On-Chip Memory * 512/256 KB * Firmware distribution protection. Program flash can be marked execute-only on a per-sector (8 KB) basis to prevent firmware contents from being read by third parties * Flash implemented as two equal blocks each of 256 KB block. Code can execute or read from one block while the other block is being erased or programmed. * 128/64 KB SRAM * Security circuitry to prevent unauthorized access to RAM and flash contents through the debugger 3.4 System features Power Management Control Unit (PMC) * * * * * * * * * * Programmable power saving modes Available wake-up from power saving modes via internal and external sources Integrated Power-on Reset (POR) Integrated Low Voltage Detect (LVD) with reset (brownout) capability Selectable LVD trip points Programmable Low Voltage Warning (LVW) interrupt capability Individual peripheral clocks can be gated off to reduce current consumption Internal Buffered bandgap reference voltage Factory programmed trim for bandgap and LVD 1 kHz Low Power Oscillator (LPO) DC-DC Converters 8 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Feature Descriptions * Internal switched mode power supply supporting Buck, Boost, and Bypass operating modes * Buck operation supports external voltage sources of 2.1 V to 4.2 V. This reduces peak current consumption during Rx and Tx by ~25%, ideal for single coin-cell battery operation (typical CR2032 cell). * Boost operation supports external voltage sources of 0.9 V to 1.795 V, which is efficiently increased to the static internal core voltage level, ideal for single battery operation (typical AA or AAA alkaline cell). * When DC-DC is not used, the device supports an external voltage range of 1.5 V to 3.6 V (1.5 - 3.6 V on VDD_RF1, VDD_RF2, VDD_XTAL and VDD_1P5OUT_PMCIN pins. 1.71 - 3.6 V on VDD_0, VDD_1 and VDDA pins) * An external inductor is required to support the Buck or Boost modes * The DC-DC Converter 1.8 V output current drive for external devices (MCU in RUN mode, Radio is enabled, other peripherals are disabled) * Up to 44 mA in buck mode with VDD_1P8 = 1.8 V * Up to 31.4 mA in buck mode with VDD_1P8 = 3.0 V Direct Memory Access (DMA) Controller * All data movement via dual-address transfers: read from source, write to destination * Programmable source and destination addresses and transfer size * Support for enhanced addressing modes * 4-channel implementation that performs complex data transfers with minimal intervention from a host processor * Internal data buffer, used as temporary storage to support 16- and 32-byte transfers * Connections to the crossbar switch for bus mastering the data movement * Transfer control descriptor (TCD) organized to support two-deep, nested transfer operations * 32-byte TCD stored in local memory for each channel * An inner data transfer loop defined by a minor byte transfer count * An outer data transfer loop defined by a major iteration count * Channel activation via one of three methods: * Explicit software initiation * Initiation via a channel-to-channel linking mechanism for continuous transfers * Peripheral-paced hardware requests, one per channel * Fixed-priority and round-robin channel arbitration * Channel completion reported via optional interrupt requests MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 9 NXP Semiconductors Feature Descriptions * One interrupt per channel, optionally asserted at completion of major iteration count * Optional error terminations per channel and logically summed together to form one error interrupt to the interrupt controller * Optional support for scatter/gather DMA processing * Support for complex data structures DMA Channel Multiplexer (DMA MUX) * 4 independently selectable DMA channel routers * 2 periodic trigger sources available * Each channel router can be assigned to 1 of the peripheral DMA sources COP Watchdog Module * Independent clock source input (independent from CPU/bus clock) * Choice between two clock sources * LPO oscillator * Bus clock System Clocks * Both 26 MHz and 32 MHz crystal reference oscillator supported for BLE and FSK radio modes * 32 MHz crystal reference oscillator supported for IEEE 802.15.4 radio mode * MCU can derive its clock either from the crystal reference oscillator or the frequency locked loop (FLL)1 * 32.768 kHz crystal reference oscillator used to maintain precise Bluetooth radio time in low power modes * Multipurpose Clock Generator (MCG) * Internal reference clocks -- Can be used as a clock source for other on-chip peripherals * On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 2% accuracy across full temperature range * On-chip 4MHz oscillator with 5% accuracy across full temperature range * Frequency-locked loop (FLL) controlled by internal or external reference * 20 MHz to 48 MHz FLL output Unique Identifiers * 10 bytes(or 80-bits) of the Unique ID represents a unique identifier for each chip * 40 bits of unique media access control (MAC) address, which can be used to build a unique 48-bit Bluetooth-LE or 64-bit IEEE 802.15.4 device address 1. Clock options can have restrictions based on the chosen SoC configuration. 10 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Feature Descriptions 3.5 Peripheral features 16-bit Analog-to-Digital Converter (ADC) * * * * * * * * * * * * * * * * Linear successive approximation algorithm with 16-bit resolution Output formatted in differential-ended 16-, 13-, 11-, and 9-bit mode Output formatted in single-ended 16-, 12-, 10-, and 8-bit mode Single or continuous conversion Configurable sample time and conversion speed / power Conversion rates in 16-bit mode with no averaging up to ~500Ksamples/sec Input clock selection Operation in low power modes for lower noise operation Asynchronous clock source for lower noise operation Selectable asynchronous hardware conversion trigger Automatic compare with interrupt for less-than, or greater than, or equal to programmable value Temperature sensor Battery voltage measurement Hardware average function Selectable voltage reverence Self-calibration mode 12-Bit Digital-to-Analog Converter (DAC) * 12-bit resolution * Guaranteed 6-sigma monotonicity over input word * High- and low-speed conversions * 1 s conversion rate for high speed, 2 s for low speed * Power-down mode * Automatic mode allows the DAC to generate its own output waveforms including square, triangle, and sawtooth * Automatic mode allows programmable period, update rate, and range * DMA support with configurable watermark level High-Speed Analog Comparator (CMP) * 6-bit DAC programmable reference generator output * Up to eight selectable comparator inputs; each input can be compared with any input by any polarity sequence * Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator output MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 11 NXP Semiconductors Feature Descriptions * Two performance modes: * Shorter propagation delay at the expense of higher power * Low power, with longer propagation delay * Operational in all MCU power modes except VLLS0 mode Voltage Reference(VREF1) * Programmable trim register with 0.5 mV steps, automatically loaded with factory trimmed value upon reset * Programmable buffer mode selection: * Off * Bandgap enabled/standby (output buffer disabled) * High power buffer mode (output buffer enabled) * 1.2 V output at room temperature * VREF_OUT output signal Low Power Timer (LPTMR) * One channel * Operation as timer or pulse counter * Selectable clock for prescaler/glitch filter * 1 kHz internal LPO * External low power crystal oscillator * Internal reference clock * Configurable glitch filter or prescaler * Interrupt generated on timer compare * Hardware trigger generated on timer compare * Functional in all power modes Timer/PWM (TPM) * * * * * * * * * TPM0: 4 channels, TPM1 and TPM2: 2 channels each Selectable source clock Programmable prescaler 16-bit counter supporting free-running or initial/final value, and counting is up or up-down Input capture, output compare, and edge-aligned and center-aligned PWM modes Input capture and output compare modes Generation of hardware triggers TPM1 and TPM2: Quadrature decoder with input filters Global time base mode shares single time base across multiple TPM instances Programmable Interrupt Timer (PIT) 12 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Feature Descriptions * Up to 2 interrupt timers for triggering ADC conversions * 32-bit counter resolution * Clocked by bus clock frequency Real-Time Clock (RTC) * 32-bit seconds counter with 32-bit alarm * Can be invalidated on detection of tamper detect * 16-bit prescaler with compensation * Register write protection * Hard Lock requires MCU POR to enable write access * Soft lock requires POR or software reset to enable write/read access * Capable of waking up the system from low power modes Inter-Integrated Circuit (I2C) * * * * * * * * * * * Two channels Compatible with I2C bus standard and SMBus Specification Version 2 features Up to 400 kHz operation Multi-master operation Software programmable for one of 64 different serial clock frequencies Programmable slave address and glitch input filter Interrupt driven byte-by-byte data transfer Arbitration lost interrupt with automatic mode switching from master to slave Calling address identification interrupt Bus busy detection broadcast and 10-bit address extension Address matching causes wake-up when processor is in low power mode LPUART * * * * * * * * * * * * One channel Full-duplex operation Standard mark/space non-return-to-zero (NRZ) format 13-bit baud rate selection with fractional divide of 32 Programmable 8-bit or 9-bit data format Programmable 1 or 2 stop bits Separately enabled transmitter and receiver Programmable transmitter output polarity Programmable receive input polarity 13-bit break character option 11-bit break character detection option Two receiver wakeup methods: MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 13 NXP Semiconductors Feature Descriptions * * * * * * * * * Idle line wakeup * Address mark wakeup Address match feature in receiver to reduce address mark wakeup ISR overhead Interrupt or DMA driven operation Receiver framing error detection Hardware parity generation and checking Configurable oversampling ratio to support from 1/4 to 1/32 bit-time noise detection Operation in low power modes Hardware Flow Control RTS\CTS Functional in Stop/VLPS modes Serial Peripheral Interface (DSPI) * * * * * * * * * * Two independent SPI channels Master and slave mode Full-duplex, three-wire synchronous transfers Programmable transmit bit rate Double-buffered transmit and receive data registers Serial clock phase and polarity options Slave select output Control of SPI operation during wait mode Selectable MSB-first or LSB-first shifting Support for both transmit and receive by DMA Carrier Modulator Timer (CMT) * Four modes of operation * Time; with independent control of high and low times * Baseband * Frequency shift key (FSK) * Direct software control of CMT_IRO signal * Extended space operation in time, baseband, and FSK modes * Selectable input clock divider * Interrupt on end of cycle * Ability to disable CMT_IRO signal and use as timer interrupt General Purpose Input/Output (GPIO) * * * * Hysteresis and configurable pull up device on all input pins Independent pin value register to read logic level on digital pin All GPIO pins can generate IRQ and wakeup events Configurable drive strength on some output pins 14 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Feature Descriptions Touch Sensor Input (TSI) * * * * * * * * * Support up to 16 external electrodes Automatic detection of electrode capacitance across all operational power modes Internal reference oscillator for high-accuracy measurement Configurable software or hardware scan trigger Capability to wake MCU from low power modes Compensate for temperature and supply voltage variations High sensitivity change with 16-bit resolution register Configurable up to 4096 scan times Support DMA data transfer Keyboard Interface * GPIO can be configured to function as a interrupt driven keyboard scanning matrix * In the 48-pin package there are a total of 26 digital pins * These pins can be configured as needed by the application as GPIO, LPUART, SPI, I2C, ADC, timer I/O as well as other functions 3.6 Security Features Advanced Encryption Standard Accelerator(AES-128 Accelerator) The advanced encryption standard accelerator (AESA) module is a standalone hardware coprocessor capable of accelerating the 128-bit advanced encryption standard (AES) cryptographic algorithms. The AESA engine supports the following cryptographic features. LTC includes the following features: * Cryptographic authentication * Message authentication codes (MAC) * Cipher-based MAC (AES-CMAC) * Extended cipher block chaining message authentication code (AESXCBC-MAC) * Auto padding * Integrity Check Value(ICV) checking * Authenticated encryption algorithms * Counter with CBC-MAC (AES-CCM) * Galois counter mode (AES-GCM) MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 15 NXP Semiconductors Feature Descriptions * Symmetric key block ciphers * AES (128-bit keys) * Cipher modes: * AES-128 modes * Electronic codebook (ECB) * Cipher block chaining (CBC) * Counter (CTR) * DES modes * Electronic codebook (ECB) * Cipher block chaining (CBC) * Cipher feedback (CFB) * Output Feedback (OFB) * Secure scan True Random Number Generator (TRNG) True Random Number Generator (TRNG) is a hardware accelerator module that constitutes a high-quality entropy source. * TRNG generates a 512-bit (4x 128-bit) entropy as needed by an entropy-consuming module, such as a deterministic random number generator. * TRNG output can be read and used by a deterministic pseudo-random number generator (PRNG) implemented in software. * TRNG-PRNG combination achieves NIST compliant true randomness and cryptographic-strength random numbers using the TRNG output as the entropy source. * A fully FIPS 180 compliant solution can be realized using the TRNG together with a FIPS compliant deterministic random number generator and the SoC-level security. Flash Memory Protection The on-chip flash memory controller enables the following useful features: * Program flash protection scheme prevents accidental program or erase of stored data. * Program flash access control scheme prevents unauthorized access to selected code segments. * The flash can be protected from mass erase even when the MCU is not secured. * Automated, built-in, program and erase algorithms with verify. * Read access to one program flash block is possible while programming or erasing data in the other program flash block. 16 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Description 4 Transceiver Description * * * * * Direct Conversion Receiver Constant Envelope Transmitter 2.36 GHz to 2.483 GHz PLL Range Low Transmit and Receive Current Consumption Low BOM 4.1 Key Specifications The KW41Z SoC meets or exceeds all Bluetooth Low Energy v4.2 and IEEE 802.15.4 performance specifications applicable to 2.4 GHz ISM and MBAN (Medical Band Area Network) bands. Key specification for the KW41 are: Frequency Band: * ISM Band: 2400 to 2483.5MHz * MBAN Band: 2360 to 2400MHz Bluetooth Low Energy v4.2 modulation scheme: * * * * Symbol rate: 1000 kbps Modulation: GFSK Receiver sensitivity: -95 dBm, typical Programmable transmitter output power: -30 dBm to 3.5 dBm IEEE Standard 802.15.4 2.4 GHz modulation scheme: * * * * * * Chip rate: 2000 kbps Data rate: 250 kbps Symbol rate: 62.5 kbps Modulation: OQPSK Receiver sensitivity: -100 dBm, typical (@1% PER for 20 byte payload packet) Single ended bidirectional RF input/output port with integrated transmit/receive switch * Programmable transmitter output power: -30 dBm to 3.5 dBm Generic FSK modulation scheme: * Symbol rate: 250, 500 and 1000 kbps MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 17 NXP Semiconductors Transceiver Description * Modulation(s): GFSK (modulation index = 0.32, 0.5, and 0.7, BT =0.5, 0.3 and 0.7), MSK * Receiver Sensitivity: Mode and data rate dependant. -100 dBm typical for GFSK (r=250 kbps, BT = 0.5, h = 0.5) 4.2 Channel Map Frequency Plans 4.2.1 Channel Plan for Bluetooth Low Energy This section describes the frequency plan / channels associated with 2.4GHz ISM and MBAN bands for Bluetooth Low Energy. 2.4 GHz ISM Channel numbering: * Fc=2402 + k * 2 MHz, k=0,.........,39. MBAN Channel numbering: * Fc=2363 + 5*k in MHz, for k=0,.....,6 * Fc=2367 + 5*(k-7) in MHz, for k=7,8.....,13) where k is the channel number. Table 2. 2.4 GHz ISM and MBAN frequency plan and channel designations 2.4 GHz ISM1 MBAN2 2.4GHz ISM + MBAN Channel Freq (MHz) Channel Freq (MHz) Channel Freq (MHz) 0 2402 0 2360 28 2390 1 2404 1 2361 29 2391 2 2406 2 2362 30 2392 3 2408 3 2363 31 2393 4 2410 4 2364 32 2394 5 2412 5 2365 33 2395 6 2414 6 2366 34 2396 7 2416 7 2367 35 2397 8 2418 8 2368 36 2398 9 2420 9 2369 0 2402 10 2422 10 2370 1 2404 Table continues on the next page... 18 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Description Table 2. 2.4 GHz ISM and MBAN frequency plan and channel designations (continued) 2.4 GHz ISM1 MBAN2 2.4GHz ISM + MBAN Channel Freq (MHz) Channel Freq (MHz) Channel Freq (MHz) 11 2424 11 2371 2 2406 12 2426 12 2372 3 2408 13 2428 13 2373 4 2410 14 2430 14 2374 5 2412 15 2432 15 2375 6 2414 16 2434 16 2376 7 2416 17 2436 17 2377 8 2418 18 2438 18 2378 9 2420 19 2440 19 2379 10 2422 20 2442 20 2380 11 2424 21 2444 21 2381 12 2426 22 2446 22 2382 13 2428 23 2448 23 2383 14 2430 24 2450 24 2384 15 2432 25 2452 25 2385 16 2434 26 2454 26 2386 17 2436 27 2456 27 2387 18 2438 28 2458 28 2388 19 2440 29 2460 29 2389 20 2442 30 2462 30 2390 21 2444 31 2464 31 2391 22 2446 32 2466 32 2392 23 2448 33 2468 33 2393 24 2450 34 2470 34 2394 25 2452 35 2472 35 2395 26 2454 36 2474 36 2396 27 2456 37 2476 37 2397 37 2476 38 2478 38 2398 38 2478 39 2480 39 2399 39 2480 1. ISM frequency of operation spans from 2400.0 MHz to 2483.5 MHz 2. Per FCC guideline rules, IEEE (R) 802.15.1 and Bluetooth Low Energy single mode operation is allowed in these channels. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 19 NXP Semiconductors Transceiver Description 4.2.2 Channel Plan for IEEE 802.15.4 in 2.4GHz ISM and MBAN frequency bands This section describes the frequency plan / channels associated with 2.4GHz ISM and MBAN bands for IEEE 802.15.4. 2.4GHz ISM Channel numbering: * Fc=2405 + 5*(k-11) MHz, k=11, 12, ..,26. MBAN Channel numbering: * Fc=2363.0 + 5*k in MHz, for k=0,.....,6 * Fc=2367.0 + 5*(k-7) in MHz, for k=7,.....,14 where k is the channel number. Table 3. 2.4 GHz ISM and MBAN frequency plan and channel designations MBAN1 2.4 GHz ISM Channel # Frequency (MHz) Channel # Frequency (MHz) 11 2405 0 2363 12 2410 1 2368 13 2415 2 2373 14 2420 3 2378 15 2425 4 2383 16 2430 5 2388 17 2435 6 2393 18 2440 7 2367 19 2445 8 2372 20 2450 9 2377 21 2455 10 2382 22 2460 11 2387 23 2465 12 2392 24 2470 13 2397 25 2475 14 2395 26 2480 1. Usable channel spacing to assit in co-existence. 20 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Electrical Characteristics 4.2.3 Other Channel Plans The RF synthesizer can be configured to use any channel frequency between 2.36 and 2.487 GHz. 4.3 Transceiver Functions Receive The receiver architecture is Zero IF (ZIF) where the received signal after passing through RF front end is down-converted to a baseband signal. The signal is filtered and amplified before it is fed to analog-to-digital converter. The digital signal is then decimated to a baseband clock frequency before it is digitally processed, demodulated and passed on to packet processing/link-layer processing. Transmit The transmitter transmits O-QPSK or GFSK/FSK modulation having power and channel selection adjustment per user application. After the channel of operation is determined, coarse and fine tuning is executed within the Frac-N PLL to engage signal lock. After signal lock is established, the modulated buffered signal is then routed to a multi-stage amplifier for transmission. The differential signals at the output of the PA (RF_P, RF_N) are converted to a single ended(SE) output signal by an onchip balun. 5 Transceiver Electrical Characteristics 5.1 Radio operating conditions Table 4. Radio operating conditions Characteristic Symbol Min Typ Max Unit Input Frequency fin Ambient Temperature Range TA 2.360 -- 2.480 GHz -40 25 105 C Logic Input Voltage Low VIL 0 -- 30% VDDINT V 1 Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 21 NXP Semiconductors Transceiver Electrical Characteristics Table 4. Radio operating conditions (continued) Characteristic Symbol Min Typ Max Unit VIH 70% VDDINT -- VDDINT V SPI Clock Rate fSPI -- -- 12.0 MHz RF Input Power Pmax -- -- 10 dBm Logic Input Voltage High Crystal Reference Oscillator Frequency (40 ppm over operating conditions to meet the 802.15.4 Standard.) fref 26 MHz or 32 MHz 1. VDDINT is the internal LDO regulated voltage supplying various circuit blocks, VDDINT=1.2 V 5.2 Receiver Feature Summary Table 5. Top Level Receiver Specifications (TA=25C, nominal process unless otherwise noted) Characteristic1 Symbol Min. Typ. Max. Unit Supply current power down on VDD_RFx supplies Ipdn -- 200 1000 nA Supply current Rx On with DC-DC converter enable (Buck; VDDDCDC_in = 3.6 V) , 2 IRxon -- 6.76 -- mA Supply current Rx On with DC-DC converter disabled (Bypass) 2 IRxon -- 16.2 -- mA fin 2.360 -- 2.4835 GHz SENSGFSK -- -100 -- dBm SENSBLE -- -95 -- dBm SENS15.4 -- -100 -- dBm NFHG -- 7.5 -- dB RSSIRange -100 -- 5 dBm RSSIRes -- 1 -- dBm Typical RSSI variation over frequency -2 -- 2 dB Typical RSSI variation over temperature -2 -- 2 dB -3 -- 3 dB Input RF Frequency GFSK Rx Sensitivity(250 kbps GFSK-BT=0.5, h=0.5) BLE Rx Sensitivity 3 IEEE 802.15.4 Rx Sensitivity 4 Noise Figure for max gain mode @ typical sensitivity Receiver Signal Strength Indicator Range5 Receiver Signal Strength Indicator Resolution Narrowband RSSI accuracy6 RSSIAcc BLE Co-channel Interference (Wanted signal at -67 dBm , BER <0.1%. Measurement resolution 1 MHz). BLEco-channel -7 dB IEEE 802.15.4 Co-channel Interference (Wanted signal 3 dB over reference sensitivity level) 15.4co-channel -- -2 -- dB SELBLE, 1 MHz -- 2 -- dB Adjacent/Alternate Channel Performance7 BLE Adjacent +/- 1 MHz Interference offset (Wanted signal at -67 dBm , BER <0.1%. Measurement resolution 1 MHz.) Table continues on the next page... 22 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Electrical Characteristics Table 5. Top Level Receiver Specifications (TA=25C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit BLE Adjacent +/- 2 MHz Interference offset (Wanted signal at -67 dBm , BER <0.1%. Measurement resolution 1 MHz.) SELBLE, 2 MHz -- 40 -- dB BLE Alternate +/-3 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLE, 3 MHz -- 50 -- dB IEEE 802.15.4 Adjacent +/- 5 MHz Interference offset (Wanted signal 3 dB over reference sensitivity level , PER <1%) SEL15.4,5 MHz -- 45 -- dB IEEE 802.15.4 Alternate +/- 10 MHz Interference offset (Wanted signal 3 dB over reference sensitivity level , PER <1%.) SEL15.4,5 MHz -- 60 -- dB BLE Intermodulation with continuous wave interferer at 3MHz and modulated interferer is at 6MHz (Wanted signal at -67 dBm , BER<0.1%.) -- -42 -- dBm BLE Intermodulation with continuous wave interferer at 5MHz and modulated interferer is at 10MHz (Wanted signal at -67 dBm , BER<0.1%.) -- -35 -- dBm Intermodulation Performance Blocking Performance7 BLE Out of band blocking from 30 MHz to 1000 MHz and 4000 MHz to 5000 MHz (Wanted signal at -67 dBm , BER<0.1%. Interferer continuous wave signal.)8 -- -- -5 -- dBm BLE Out of band blocking from 1000 MHz to 2000 MHz and 3000 MHz to 4000MHz (Wanted signal at -67 dBm , BER<0.1%. Interferer continuous wave signal.) -- -- -12 -- dBm BLE Out of band blocking from 2001 MHz to 2339MHz and 2484 MHz to 2999 MHz (Wanted signal at -67 dBm , BER<0.1%. Interferer continuous wave signal.) -- -- -20 -- dBm BLE Out of band blocking from 5000 MHz to 12750 MHz (Wanted signal at -67 dBm , BER<0.1%. Interferer continuous wave signal.)8 -- -- 0 -- dBm IEEE 802.15.4 Out of band blocking for frequency offsets > 10 MHz and <= 80 MHz(Wanted signal 3 dB over reference sensitivity level , PER <1%. Interferer continuous wave signal.)9 -- -36 -- dBm IEEE 802.15.4 Out of band blocking from carrier frequencies in 1GHz to 4GHz range excluding frequency offsets < 80 MHz (Wanted signal 3 dB over reference sensitivity level , PER <1%. Interferer continuous wave signal.) -- -25 -- dBm IEEE 802.15.4 Out of band blocking frequency from carrier frequencies < 1 GHz and > 4 GHz (Wanted signal 3 dB over reference sensitivity level , PER <1%. Interferer continuous wave signal.8 -- -15 -- dBm Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 23 NXP Semiconductors Transceiver Electrical Characteristics Table 5. Top Level Receiver Specifications (TA=25C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit Spurious Emission < 1.6 MHz offset (Measured with 100 kHz resolution and average detector. Device transmit on RF channel with center frequency fc and spurious power measured in 1 MHz at RF frequency f), where |f-fc|< 1.6 MHz -- -- -54 -- dBc Spurious Emission > 2.5 MHz offset (Measured with 100 kHz resolution and average detector. Device transmit on RF channel with center frequency fc and spurious power measured in 1 MHz at RF frequency f), where |f-fc|> 2.5 MHz10 -- -- -70 -- dBc 1. 2. 3. 4. 5. 6. 7. 8. 9. All the RX parameters are measured at the KW41 RF pins Transceiver power consumption Measured at 0.1% BER using 37 byte long packets in max gain mode and nominal conditions In max gain mode and nominal conditions RSSI performance in narrowband mode With one point calibration over frequency and temperature BLE Adjacent and Block parameters are measured with modulated interference signals Exceptions allowed for carrier frequency harmonics. Exception to the 10 MHz > freq offset <= 80 MHz out-of-band blocking limit allowed for frequency offsets of twice the reference frequency(fref). 10. Exceptions allowed for twice the reference clock frequency(fref) multiples. Table 6. Receiver Specifications with Generic FSK Modulations Adjacent/Alternate Channel Selectivity (dB)1 Modulation Type Data Rate (kbps) Channel BW (kHz) Typical Sensitivity (dBm) GFSK BT = 0.5, h=0.5 1000 2000 -95 -67 45 50 52 52 -7 500 1000 -97 -85 33 44 49 51 -7 250 500 -100 -85 20 33 42 46 -7 1000 1000 -89 -67 30 36 41 42 -7 500 800 -91 -85 25 36 37 43 -13 250 500 -93 -85 25 25 37 37 -13 1000 2000 -96 -85 35 45 50 55 -7 500 1000 -98 -85 32 44 47 50 -7 250 600 -99 -85 30 34 46 45 -7 1000 1600 -91 -85 35 40 45 50 -8 500 800 -93 -85 30 40 40 45 -7 250 500 -95 -85 20 32 32 40 -7 1000 2000 -96 -85 35 45 50 55 -7 500 1000 -97 -85 30 45 48 50 -7 GFSK, BT = 0.5, h=0.3 GFSK, BT = 0.5, h=0.7 GMSK BT=0.3 GMSK, BT = 0.7 Desired Interferer Interferer Interferer Interferer signal at -/+1* at -/+ 2* at -/+ 3* at -/+ 4* level channel channel channel channel (dBm) BW offset BW offset BW offset BW offset Cochannel Table continues on the next page... 24 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Electrical Characteristics Table 6. Receiver Specifications with Generic FSK Modulations (continued) Adjacent/Alternate Channel Selectivity (dB)1 Modulation Type Data Rate (kbps) Channel BW (kHz) Typical Sensitivity (dBm) 250 600 -99 -85 30 33 45 45 -7 1000 3000 -96 -85 39 50 58 63 -7 500 1600 -98 -85 38 47 50 55 -7 250 800 -99 -85 30 46 45 50 -7 Generic MSK Desired Interferer Interferer Interferer Interferer signal at -/+1* at -/+ 2* at -/+ 3* at -/+ 4* level channel channel channel channel (dBm) BW offset BW offset BW offset BW offset Cochannel 1. Selectivity measured with an unmodulated blocker 5.3 Transmit and PLL Feature Summary * Supports constant envelope modulation of 2.4 GHz ISM and 2.36 GHz MBAN frequency bands * Fast PLL Lock time: < 25 s * Reference Frequency: * 26 and 32 MHz supported for BLE and FSK modes * 32 MHz supported for IEEE Standard 802.15.4 Table 7. Top level Transmitter Specifications (TA=25C, nominal process unless otherwise noted) Characteristic1 Symbol Min. Typ. Max. Unit Supply current power down on VDD_RFx supplies Ipdn -- 200 -- nA Supply current Tx On with PRF = 0dBm and DC-DC converter enabled (Buck; VDDDCDC_in = 3.6 V) , 2 ITxone -- 6.08 -- mA Supply current Tx On with PRF = 0 dBm and DC-DC converter disabled (Bypass) 2 ITxond -- 14.7 -- mA fc 2.360 -- 2.4835 GHz PRF,max -- 3.5 -- dBm PRF,min -- -30 -- dBm RF Output power control range PRFCR -- 34 -- dB IEEE 802.15.4 Peak Frequency Deviation Fdev15.4 -- 500 -- kHz EVM15.4 4.5 8 % OEVM15.4 0.5 2 % Output Frequency Maximum RF Output power 3 Minimum RF Output power IEEE 802.15.4 Error Vector 3 Magnitude4 IEEE 802.15.4 Offset Error Vector Magnitude5 IEEE 802.15.4 TX spectrum level at 3.5MHz offset4, 6 BLE TX Output Spectrum 20dB BW TXPSD15.4 TXBWBLE 1.0 -40 dBc -- MHz Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 25 NXP Semiconductors Transceiver Electrical Characteristics Table 7. Top level Transmitter Specifications (TA=25C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit BLE average frequency deviation using a 00001111 modulation sequence f1avg,BLE 250 kHz BLE average frequency deviation using a 01010101 modulation sequence f2avg,BLE 220 kHz BLE RMS FSK Error FSKerr,BLE 3% BLE Maximum Deviation of the Center Frequency7 Fcdev,BLE -- 10 -- kHz BLE Adjacent Channel Transmit Power at 2MHz offset6 PRF2MHz,BLE -- -- -50 dBm BLE Adjacent Channel Transmit Power at >= 3MHz offset6 PRF3MHz,BLE -- -- -55 dBm BLE Frequency Hopping Support YES 2nd Harmonic of Transmit Carrier Frequency (Pout = PRF,max), 8 TXH2 -- -46 -- dBm/MHz 3rd Harmonic of Transmit Carrier Frequency (Pout = PRF,max)8 TXH3 -- -58 -- dBm/MHz 1. 2. 3. 4. 5. All the TX parameters are measured at test hardware SMA connector Transceiver power consumption Measured at the KW41Z RF pins Measured as per IEEE Standard 802.15.4 Offset EVM is computed at one point per symbol, by combining the I value from the beginning of each symbol and the Q value from the middle of each symbol into a single complex value for EVM computations 6. Measured at Pout = 5dBm and recommended TX match 7. Maximum drift of carrier frequency of the PLL during a BLE packet with a nominal 32MHz reference crystal 8. Harmonic Levels based on recommended 2 component match. Transmit harmonic levels depend on the tolerances and quality of the matching components. Transmit PA driver output as a function of the PA_POWER[5:0] field when measured at the IC pins is as follows: 26 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Transceiver Electrical Characteristics Table 8. Transmit Output Power as a function of PA_POWER[5:0] TX Pout (dBm) PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 1 -30.1 -31.1 -32.6 2 -24.0 -25.0 -26.4 4 -17.9 -19.0 -20.4 6 -14.5 -15.6 -17.0 8 -12.0 -13.1 -14.5 10 -10.1 -11.2 -12.6 12 -8.5 -9.6 -11.0 14 -7.2 -8.3 -9.7 16 -6.1 -7.2 -8.6 18 -5.1 -6.2 -7.6 Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 27 NXP Semiconductors System and Power Management Table 8. Transmit Output Power as a function of PA_POWER[5:0] (continued) TX Pout (dBm) PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 20 -4.2 -5.3 -6.7 22 -3.4 -4.5 -5.9 24 -2.7 -3.8 -5.2 26 -2.0 -3.1 -4.5 28 -1.4 -2.5 -3.9 30 -0.8 -1.9 -3.3 32 -0.3 -1.4 -2.8 34 0.2 -1.0 -2.4 36 0.6 -0.5 -1.9 38 1.1 -0.1 -1.5 40 1.5 0.3 -1.1 42 1.9 0.7 -0.7 44 2.2 1.1 -0.3 46 2.6 1.4 0.0 48 2.9 1.8 0.3 50 3.2 2.1 0.6 52 3.5 2.4 0.9 54 3.7 2.6 1.2 56 3.9 2.9 1.5 58 4.2 3.1 1.7 60 4.4 3.3 1.9 62 4.5 3.5 2.1 6 System and Power Management 6.1 Power Management The KW41Z includes internal power management features that can be used to control the power usage. The power management of the KW41Z includes power management controller (PMC) and a DC-DC converter which can operate in a buck, boost or bypass configuration. The PMC is designed such that the RF radio will remain in state- 28 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 System and Power Management retention while the core is in various stop modes. It can make sure the device can stay in low current consumption mode while the RF radio can wakeup quick enough for communication. 6.1.1 DC-DC Converter The features of the DC-DC converter include the following: * Single inductor, multiple outputs. * Boost mode (pin selectable; CFG=GND). * Buck mode (pin selectable; CFG=VDCDC_IN). * Continuous or pulsed operation (hardware/software configurable). * Power switch input to allow external control of power up, and to select bypass mode. * Output signal to indicate power stable. Purpose is for the rest of the chip to be used as a POR. * Scaled battery output voltage suitable for SAR ADC utilization. * Internal oscillator for support when the reference oscillator is not present. * 1.8 V output is capable of supplying the external device a maximum of 38.9 mA (VDD_1P8OUT = 1.8 V, VDCDC_IN = 3.0 V) and 20.9 mA (VDD_1P8OUT = 3.0 V, VDCDC_IN = 3.0 V), with MCU in RUN mode, peripherals are disabled. 6.2 Modes of Operation The ARM Cortex-M0+ core in the KW41Z has three primary modes of operation: Run, Wait, and Stop modes. For each run mode, there is a corresponding wait and stop mode. Wait modes are similar to ARM sleep modes. Stop modes are similar to ARM deep sleep modes. The very low power run (VLPR) operation mode can drastically reduce runtime power when the maximum bus frequency is not required to handle the application needs. The WFI instruction invokes both wait and stop modes. The primary modes are augmented in a number of ways to provide lower power based on application needs. 6.2.1 Power modes The power management controller (PMC) provides multiple power options to allow the user to optimize power consumption for the level of functionality needed. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 29 NXP Semiconductors System and Power Management Depending on the stop requirements of the user application, a variety of stop modes are available that provide state retention, partial power down or full power down of certain logic and/or memory. I/O states are held in all modes of operation. The following table compares the various power modes available. For each run mode there is a corresponding wait and stop mode. Wait modes are similar to ARM sleep modes. Stop modes (VLPS, STOP) are similar to ARM sleep deep mode. The very low power run (VLPR) operating mode can drastically reduce runtime power when the maximum bus frequency is not required to handle the application needs. The three primary modes of operation are run, wait and stop. The WFI instruction invokes either wait or stop depending on the SLEEPDEEP bit in Cortex-M0+ System Control Register. The primary modes are augmented in a number of ways to provide lower power based on application needs. Table 9. Power modes (At 25 deg C) Power mode Description Normal Run (all peripherals clock off) Allows maximum performance of chip. CPU recovery method Radio -- Radio can be active Normal Wait - via WFI Allows peripherals to function, while allowing CPU to go to sleep reducing power. Interrupt Normal Stop - via WFI Places chip in static state. Lowest power mode that retains all registers while maintaining LVD protection. Interrupt PStop2 (Partial Stop 2) Core and system clocks are gated. Bus clock remains active. Masters and slaves clocked by bus clock remain in Run or VLPRun mode. The clock generators in MCG and the on-chip regulator in the PMC also remain in Run or VLPRun mode. Interrupt PStop1 (Partial Stop 1) Core, system clocks and bus clock are gated. All bus masters and slaves enter Stop mode. The clock generators in MCG and the on-chip regulator in the PMC also remain in Run or VLPRun mode. Interrupt VLPR (Very Low Power Run) (all peripherals off) Reduced frequency (1MHz) Flash access mode, regulator in low power mode, LVD off. Internal oscillator can provide low power 4 MHz source for core. (Values @2MHz core/ 1MHz bus and flash, module off, execution from flash). -- Biasing is disabled when DC-DC is configured for continuous mode in VLPR/W VLPW (Very Low Similar to VLPR, with CPU in sleep to further reduce Power Wait) - via WFI power. (Values @4MHz core/ 1MHz bus, module off) (all peripherals off) Biasing is disabled when DC-DC is configured for continous mode in VLPR/W Radio operation is possible only when DC-DC is configured for continuous mode.1 However, there may be insufficient MIPS with a 4MHz MCU to support much in the way of radio operation. Interrupt Table continues on the next page... 30 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 System and Power Management Table 9. Power modes (At 25 deg C) (continued) Power mode Description CPU recovery method VLPS (Very Low Power Stop) via WFI Places MCU in static state with LVD operation off. Lowest power mode with ADC and all pin interrupts functional. LPTMR, RTC, CMP, TSI can be operational. Interrupt Radio Biasing is disabled when DC-DC is configured for continuous mode in VLPS LLS3 (Low Leakage Stop) State retention power mode. LLWU, LPTMR, RTC, CMP, TSI can be operational. All of the radio Sea of Gates (SOG) logic is in state retention Wakeup Interrupt LLS2 (Low Leakage Stop) State retention power mode. LLWU, LPTMR, RTC, CMP, TSI can be operational. 16 KB or 32 KB of programmable RAM can be powered on. All of the radio SOG logic is in state retention Wakeup Interrupt VLLS3 (Very Low Leakage Stop3) Full SRAM retention. LLWU, LPTMR, RTC, CMP, TSI can be operational. All of the radio SOG logic is in state retention Wakeup Reset VLLS2 (Very Low Leakage Stop2) Partial SRAM retention. 16 KB or 32 KB of programmable RAM can be powered on.. LLWU, LPTMR, RTC, CMP, TSI can be operational.All of the radio SOG logic is in state retention - Wakeup Reset VLLS1 (Very Low Leakage Stop1) with RTC + 32 kHz OSC All SRAM powered off. The 32-byte system register file remains powered for customer-critical data. LLWU, LPTMR, RTC, CMP can be operational. Radio logic is power gated. Wakeup Reset VLLS1 (Very Low Leakage Stop1) with LPTMR + LPO All SRAM powered off. The 32-byte system register file remains powered for customer-critical data. LLWU, LPTMR, RTC, CMP, TSI can be operational. Wakeup Reset VLLS0 (Very Low Leakage Stop0) with Brown-out Detection VLLS0 is not supported with DC-DC Wakeup Reset VLLS0 (Very Low Leakage Stop0) without Brown-out Detection VLLS0 is not supported with DC-DC buck/boost configuration but is supported with bypass configuration The 32-byte system register file remains powered for customer-critical data. Disable all analog modules in PMC and retains I/O state and DGO state. LPO disabled, POR brown-out detection enabled, Pin interrupt only. Radio logic is power gated. Radio SOG is in state retention in LLSx. The BLE/ 802.15.4/Generic FSK DSM2 logic can be active using the 32 kHz clock Radio SOG is in state retention in VLLS3/2. The BLE/802.15.4/Generic FSK DSM logic can be active using the 32 kHz clock Radio operation not supported. The Radio SOG is power-gated in VLLS1/0. Radio state is lost at VLLS1 and lower power states Radio operation not supported. The Radio digital is power-gated in VLLS1/0 Wakeup Reset The 32-byte system register file remains powered for customer-critical data. Disable all analog modules in PMC and retains I/O state and DGO state. LPO disabled, POR brown-out detection disabled, Pin interrupt only. Radio logic is power gated. 1. Biasing is disabled, but the Flash is in a low power mode for VLPx, so this configuration can realize some power savings over use of Run/Wait/Stop 2. DSM refers to Radio's deepsleep mode. DSM does not refer to the ARM sleep deep mode. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 31 NXP Semiconductors MCU Electrical Characteristics 7 MCU Electrical Characteristics 7.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Input Signal High Low VIH 80% 50% 20% Midpoint1 VIL Fall Time Rise Time The midpoint is VIL + (VIH - VIL) / 2 Figure 2. Input signal measurement reference All digital I/O switching characteristics, unless otherwise specified, assume that the output pins have the following characteristics. * CL=30 pF loads * Slew rate disabled * Normal drive strength 7.2 Nonswitching electrical specifications 7.2.1 Voltage and current operating requirements Table 10. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD - VDDA VDD-to-VDDA differential voltage -0.1 0.1 V VSS - VSSA VSS-to-VSSA differential voltage -0.1 0.1 V VIH Notes Input high voltage Table continues on the next page... 32 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 10. Voltage and current operating requirements (continued) Symbol VIL Description Min. Max. Unit * 2.7 V VDD 3.6 V 0.7 x VDD -- V * 1.7 V VDD 2.7 V 0.75 x VDD -- V * 2.7 V VDD 3.6 V -- 0.35 x VDD V * 1.7 V VDD 2.7 V -- 0.3 x VDD V 0.06 x VDD -- V -3 -- mA -25 -- mA Input low voltage VHYS Input hysteresis IICIO IO pin negative DC injection current -- single pin 1 * VIN < VSS-0.3V IICcont Notes Contiguous pin DC injection current --regional limit, includes sum of negative injection currents of 16 contiguous pins * Negative current injection VODPU Open drain pullup voltage level VDD VDD V VRAM VDD voltage required to retain RAM 1.2 -- V 2 1. All I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R = (VIO_MIN - VIN)/|IICIO|. 2. Open drain outputs must be pulled to VDD. 7.2.2 LVD and POR operating requirements Table 11. VDD supply LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V VLVDH Falling low-voltage detect threshold -- high range (LVDV = 01) 2.48 2.56 2.64 V Low-voltage warning thresholds -- high range VLVW1H * Level 1 falling (LVWV = 00) VLVW2H * Level 2 falling (LVWV = 01) VLVW3H * Level 3 falling (LVWV = 10) VLVW4H * Level 4 falling (LVWV = 11) VHYSH Low-voltage inhibit reset/recover hysteresis -- high range VLVDL Falling low-voltage detect threshold -- low range (LVDV=00) Notes 1 2.62 2.70 2.78 V 2.72 2.80 2.88 V 2.82 2.90 2.98 V 2.92 3.00 3.08 V -- 60 -- mV 1.54 1.60 1.66 V Low-voltage warning thresholds -- low range 1 Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 33 NXP Semiconductors MCU Electrical Characteristics Table 11. VDD supply LVD and POR operating requirements (continued) Symbol Description VLVW1L * Level 1 falling (LVWV = 00) VLVW2L * Level 2 falling (LVWV = 01) VLVW3L * Level 3 falling (LVWV = 10) VLVW4L * Level 4 falling (LVWV = 11) VHYSL Low-voltage inhibit reset/recover hysteresis -- low range Min. Typ. Max. Unit 1.74 1.80 1.86 V 1.84 1.90 1.96 V 1.94 2.00 2.06 V 2.04 2.10 2.16 V -- 40 -- mV VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low power oscillator period -- factory trimmed 900 1000 1100 s Notes 1. Rising thresholds are falling threshold + hysteresis voltage 7.2.3 Voltage and current operating behaviors Table 12. Voltage and current operating behaviors Symbol VOH Description Min. Output high voltage -- Normal drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -5 mA * 1.71 V VDD 2.7 V, IOH = -2.5 mA VOH Output high voltage -- High drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -20 mA * 1.71 V VDD 2.7 V, IOH = -10 mA IOHT Output high current total for all ports VOL Output low voltage -- Normal drive pad VOL Max. Unit Notes 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V -- 100 mA 1 * 2.7 V VDD 3.6 V, IOL = 5 mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 2.5 mA -- 0.5 V Output low voltage -- High drive pad 1 * 2.7 V VDD 3.6 V, IOL = 20 mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 10 mA -- 0.5 V Output low current total for all ports -- 100 mA IIN Input leakage current (per pin) for full temperature range -- 500 nA 3 IIN Input leakage current (per pin) at 25 C -- 0.025 A 3 IIN Input leakage current (total all pins) for full temperature range -- 5 A 3 IOLT Table continues on the next page... 34 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 12. Voltage and current operating behaviors (continued) Symbol RPU Description Internal pullup resistors Min. Max. Unit Notes 20 50 k 4 1. PTB0-1 and PTC0-3, PTC6, PTC7, PTC17, PTC18 I/O have both high drive and normal drive capability selected by the associated PTx_PCRn[DSE] control bit. All other GPIOs are normal drive only. 2. The reset pin only contains an active pull up device when configured as the RESET signal or as a GPIO. When configured as a GPIO output, it acts as a pseudo open drain output. 3. Measured at VDD = 3.6 V 4. Measured at VDD supply voltage = VDD min and Vinput = VSS 7.2.4 Power mode transition operating behaviors All specifications except tPOR and VLLSxRUN recovery times in the following table assume this clock configuration: * CPU and system clocks = 48 MHz * Bus and flash clock = 24 MHz * FEI clock mode POR and VLLSxRUN recovery use FEI clock mode at the default CPU and system frequency of 21 MHz, and a bus and flash clock frequency of 10.5 MHz. Table 13. Power mode transition operating behaviors Symbol tPOR Description Max. Unit Notes After a POR event, amount of time from the point VDD reaches 1.8 V to execution of the first instruction across the operating temperature range of the chip. 300 s 1 147 s 144 s 76 s 76 s 5.8 s 5.8 s * VLLS0 RUN * VLLS1 RUN * VLLS2 RUN * VLLS3 RUN * LLS2 RUN * LLS3 RUN Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 35 NXP Semiconductors MCU Electrical Characteristics Table 13. Power mode transition operating behaviors (continued) Symbol Description * VLPS RUN Max. Unit 6.2 s 6.2 s Notes * STOP RUN 1. Normal boot (FTFA_FOPT[LPBOOT]=11). When the DC-DC converter is in bypass mode, TPOR will not meet the 300s spec when 1) VDD_1P5 < 1.6V at 25C and C. 2) 1.5V VDD_1P5 1.8V. For the bypass mode special case where VDD_1P5 = VDD_1P8, TPOR did not meet the 300s maximum spec when the supply slew rate <=100V/s. 7.2.5 Power consumption operating behaviors Table 14. Power consumption operating behaviors - Bypass Mode Symbol IDDA Description Analog supply current IDD_RUNCO_C Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus disabled, LPTMR running M using LPO clock at 1kHz, CoreMark benchmark code executing from flash at 3.0 V IDD_RUNCO IDD_RUN IDD_RUN Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V Typ. Max. Unit Notes -- See note mA 1 2 7.79 8.64 mA 3 4.6 5.45 mA 3 5.6 6.45 mA Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 3, 4 at 25 C 6.9 7.2 mA at 85 C 7.2 8 mA at 105 C 7.7 8.5 mA IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 4.2 5.05 mA IDD_WAIT Wait mode current - core disabled / 24 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 3.5 4.35 mA 2.7 3.55 mA 760 960 A IDD_PSTOP2 Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus at 3.0 V IDD_VLPRCO_ Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock CM disabled, LPTMR running using LPO clock at 1 kHz reference clock, CoreMark benchmark code executing from flash at 3.0 V 3 3 3 5 Table continues on the next page... 36 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 14. Power consumption operating behaviors - Bypass Mode (continued) Symbol Description IDD_VLPRCO Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V Typ. Max. Unit 157 357 A 6 IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V 195 395 A IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 250 450 A IDD_VLPW Very-low-power wait mode current - core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 142 342 A IDD_STOP Stop mode current at 3.0 V at 25 C 0.204 0.294 mA at 70 C 0.275 0.692 mA at 85 C 0.434 0.716 mA at 105 C 0.561 1.3 mA at 25 C 4.3 18 A at 70 C 17 42 A at 85 C 86.2 166 A at 105 C 157 328 A at 25 C 2.7 5 A at 70 C 9 16.5 A at 85 C 36.6 78.1 A at 105 C 69 128 A at 25 C 2 3.13 A at 70 C 3.2 10.5 A at 85 C 20.8 45.6 A at 105 C 39 65.5 A at 25 C 2.3 4 A at 70 C 15 28.5 A at 85 C 31.8 69.3 A IDD_VLPS IDD_LLS3 IDD_LLS2 IDD_VLLS3 Notes 6 4, 6 6 Very-low-power stop mode current at Bypass mode(3.0 V), Low-leakage stop mode 3 current at Bypass mode(3.0 V), Low-leakage stop mode 2 current at Bypass mode(3.0 V), Very-low-leakage stop mode 3 current at Bypass mode(3.0 V), Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 37 NXP Semiconductors MCU Electrical Characteristics Table 14. Power consumption operating behaviors - Bypass Mode (continued) Symbol Description Typ. Max. Unit 58 108 A at 25 C 1.5 2.21 A at 70 C 6.3 11.8 A at 85 C 14.5 33.5 A at 105 C 27 42.6 A at 25C 0.56 1.3 A at 70C 3 9.4 A at 85C 8.8 23.2 A at 105C 16.8 27.1 A at 25 C 0.36 0.949 A at 70 C 2.7 8.2 A at 85 C 7.4 14.3 A at 105 C 16.5 27 A at 105 C IDD_VLLS2 IDD_VLLS1 IDD_VLLS0 IDD_VLLS0 Notes Very-low-leakage stop mode 2 current at Bypass mode(3.0 V), Very-low-leakage stop mode 1 current at Bypass mode(3.0 V), Very-low-leakage stop mode 0 current (SMC_STOPCTRL[PORPO] = 0) at 3.0 V Very-low-leakage stop mode 0 current (SMC_STOPCTRL[PORPO] = 1) at 3.0 V 7 at 25 C 0.182 0.765 A at 70 C 2.5 6.7 A at 85 C 7.2 13.3 A at 105 C 16.3 26 A 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. MCG configured for FEImode. CoreMark benchmark compiled using IAR 7.70 with optimization level high, optimized for balanced. 3. MCG configured for FEI mode. 4. Incremental current consumption from peripheral activity is not included. 5. MCG configured for BLPI mode. CoreMark benchmark compiled using IAR 7.70 with optimization level high, optimized for balanced. 6. MCG configured for BLPI mode. 7. No brownout Table 15. Power consumption operating behaviors - Buck Mode Symbol IDDA Description Analog supply current Typ. Max. Unit Notes -- See note mA 1 Table continues on the next page... 38 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 15. Power consumption operating behaviors - Buck Mode (continued) Symbol IDD_RUNCO IDD_RUN IDD_RUN Description Typ. Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V Max. Unit 2 3.1 -- mA 2 3.85 -- mA Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 2, 3 at 25 C 4.8 -- mA at 85 C 5.3 -- mA at 105 C 5.7 -- mA IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 3.1 -- mA IDD_WAIT Wait mode current - core disabled / 24 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 2.9 -- mA 1.9 -- mA 137 -- A IDD_PSTOP2 Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus at 3.0 V IDD_VLPRCO Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V 2 2 2 4 IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V 154 -- A IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 216 -- A IDD_VLPW Very-low-power wait mode current - core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 131 -- A IDD_STOP Stop mode current at 3.0 V at 25 C 1.61 2.32 mA at 70 C 1.73 4.35 mA at 105 C 2.02 4.68 mA at 25 C 3.58 14.98 A at 70 C 15.08 37.27 A at 105 C 116.94 244.30 A IDD_VLPS IDD_LLS3 Notes -1 3, 4 4 Very-low-power stop mode current at Buck mode(3.0 V), Low-leakage stop mode 3 current at Buck mode(3.0 V), Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 39 NXP Semiconductors MCU Electrical Characteristics Table 15. Power consumption operating behaviors - Buck Mode (continued) Symbol IDD_LLS2 IDD_VLLS3 IDD_VLLS2 IDD_VLLS1 Description Typ. Max. Unit at 25 C 2.20 4.08 A at 70 C 7.44 13.63 A at 105 C 48.78 90.49 A at 25 C 1.86 2.91 A at 70 C 3.19 10.48 A at 105 C 31.44 52.80 A at 25 C 1.79 3.12 A at 70 C 12 22.8 A at 105 C 37.49 69.81 A at 25 C 1.09 1.60 A at 70 C 5.56 10.40 A at 105 C 18.71 29.52 A at 25 C 0.46 1.07 A at 70 C 2.17 6.8 A at 105 C 14.08 22.71 A Notes Low-leakage stop mode 2 current at Buck mode(3.0 V), Very-low-leakage stop mode 3 current at Buck mode(3.0 V), Very-low-leakage stop mode 2 current at Buck mode(3.0 V), Very-low-leakage stop mode 1 current at Buck mode(3.0 V), 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. MCG configured for FEI mode. 3. Incremental current consumption from peripheral activity is not included. 4. MCG configured for BLPI mode. Table 16. Power consumption operating behaviors - Boost Mode Symbol IDDA IDD_RUNCO IDD_RUN IDD_RUN Description Analog supply current Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 1.3 V Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 1.3 V Typ. Max. Unit Notes -- See note mA 1 2 8.1 -- mA 2 9.76 -- Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 1.3 V mA 2, 3 Table continues on the next page... 40 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 16. Power consumption operating behaviors - Boost Mode (continued) Symbol Description Typ. Max. Unit at 25 C 13.2 -- mA at 85 C 14.1 -- mA at 105 C 15.2 -- mA IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 1.3 V 6.9 -- mA IDD_WAIT Wait mode current - core disabled / 24 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 1.3 V 5.8 -- mA 8.3 -- mA 378 -- A IDD_PSTOP2 Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus at 1.3 V IDD_VLPRCO Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 1.3 V 2 2 2 4 IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 1.3 V 476 -- A IDD_VLPR Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 1.3 V 606 -- A IDD_VLPW Very-low-power wait mode current - core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 1.3 V 357 -- A IDD_STOP Stop mode current at 1.3 V 3.22 4.64 mA 3.56 8.96 mA 3.74 9.73 mA at 25 C 29.89 125.13 A at 70 C 191.62 473.41 A at 105 C 1429.24 2985.93 A at 25 C 12.16 22.53 A at 70 C 84.61 155.12 A at 105 C 534.09 990.79 A at 25 C 12.05 18.86 A at 70 C 17.36 56.96 A at 25 C at 70 C Notes 4 3, 4 4 at 105 C IDD_VLPS IDD_LLS3 IDD_LLS2 Very-low-power stop mode current at Boost mode(1.3 V), Low-leakage stop mode 3 current at Boost mode(1.3 V), Low-leakage stop mode 2 current at Boost mode(1.3 V), Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 41 NXP Semiconductors MCU Electrical Characteristics Table 16. Power consumption operating behaviors - Boost Mode (continued) Symbol Description Typ. Max. Unit 221.29 371.66 A at 25 C 7.99 13.89 A at 70 C 88.4 167.96 A at 105 C 287.14 534.67 A at 25 C 7.09 10.45 A at 70 C 23.38 43.79 A at 105 C 95.67 150.94 A at 25 C 3.63 8.44 A at 70 C 16.23 50.86 A at 105 C 67.77 109.32 A at 105 C IDD_VLLS3 IDD_VLLS2 IDD_VLLS1 Notes Very-low-leakage stop mode 3 current at Boost mode(1.3 V), Very-low-leakage stop mode 2 current at Boost mode(1.3 V), Very-low-leakage stop mode 1 current at Boost mode(1.3 V), 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. MCG configured for FEI mode. 3. Incremental current consumption from peripheral activity is not included. 4. MCG configured for BLPI mode. Table 17. Low power mode peripheral adders -- typical value Symbol Description Temperature (C) Unit -40 25 50 70 85 IIREFSTEN4MHz 4 MHz internal reference clock (IRC) adder. Measured by entering STOP or VLPS mode with 4 MHz IRC enabled. 46 46 47 47 47 A IIREFSTEN32KHz 32 kHz internal reference clock (IRC) adder. Measured by entering STOP mode with the 32 kHz IRC enabled. 88 91 90 89 88 A IEREFSTEN32KHz External 32 kHz crystal clock adder by means of the RTC bits. Measured by entering all modes with the crystal enabled. VLLS1 1.4 1.3 1.6 2.4 4.1 VLLS2 1.6 1.5 1.9 4.2 7.7 VLLS3 2.7 1.9 2.9 7.7 15 LLS2 1.8 1.4 1.7 4.1 8 LLS3 2.6 1.7 2.8 7.6 15.2 A Table continues on the next page... 42 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 17. Low power mode peripheral adders -- typical value (continued) Symbol Description Temperature (C) Unit -40 25 50 70 85 ICMP CMP peripheral adder measured by placing the device in VLLS1 mode with CMP enabled using the 6-bit DAC and a single external input for compare. Includes 6-bit DAC power consumption. 22 19 20 21 21 A IRTC RTC peripheral adder measured by placing the device in VLLS1 mode with external 32 kHz crystal enabled by means of the RTC_CR[OSCE] bit and the RTC ALARM set for 1 minute. Includes ERCLK32K (32 kHz external crystal) power consumption. 1.4 1.3 1.6 2.4 4.3 A ILPUART LPUART peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source waiting for RX data at 115200 baud rate. Includes selected clock source power consumption. 53 54 54 54 54 A 30 30 30 85 100 nA 58 59 59 59 59 A MCGIRCLK (4 MHz internal reference clock) ILPTMR ITPM LPTMR peripheral adder measured by placing the device in VLLS1 mode with LPTMR enabled using LPO. TPM peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source configured for output compare generating 100 Hz clock signal. No load is placed on the I/O generating the clock signal. Includes selected clock source and I/O switching currents. MCGIRCLK (4 MHz internal reference clock) IBG Bandgap adder when BGEN bit is set and device is placed in VLPx, LLS, or VLLSx mode. 76 82 85 87 87 A IADC ADC peripheral adder combining the measured values at VDD and VDDA by placing the device in STOP or VLPS mode. ADC is configured for low-power mode using the internal clock and continuous conversions. 331 327 327 327 328 A MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 43 NXP Semiconductors MCU Electrical Characteristics 7.2.6 Diagram: Typical IDD_RUN operating behavior The following data was measured from previous devices with same MCU core (ARM(R) Cortex-M0+) under these conditions: * No GPIOs toggled * Code execution from flash with cache enabled * For the ALLOFF curve, all peripheral clocks are disabled except FTFA Figure 3. Run mode supply current vs. core frequency 44 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Figure 4. VLPR mode current vs. core frequency 7.2.7 SoC Power Consumption Full KW41Z/31Z/21Z system-on-chip (SoC) power consumption is a function of the many configurations possible for the MCU platform and its peripherals including the 2.4GHz radio and the DC-DC converter. A few measured SoC configurations are as follows: Table 18. SoC Power Consumption MCU State Flash State Radio State DCDC State Typical Average IC current Unit STOP Doze Rx Buck(VDDDCDC_in=3.6 V) 8.4 mA STOP Doze Tx(at 0 dBm) Buck(VDDDCDC_in=3.6 V) 7.6 mA RUN Enabled Rx Buck(VDDDCDC_in=3.6 V) 10.2 mA Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 45 NXP Semiconductors MCU Electrical Characteristics Table 18. SoC Power Consumption (continued) MCU State Flash State Radio State DCDC State Typical Average IC current Unit RUN Enabled Tx(at 0 dBm) Buck(VDDDCDC_in=3.6 V) 9.6 mA STOP Doze Rx Disabled/Bypass 16.6 mA STOP Doze Tx(at 0 dBm) Disabled/Bypass 15.2 mA RUN Enabled Rx Disabled/Bypass 19.7 mA RUN Enabled Tx(at 0 dBm) Disabled/Bypass 19.2 mA 7.2.8 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.nxp.com 2. Perform a keyword search for "EMC design." 7.2.9 Capacitance attributes Table 19. Capacitance attributes Symbol CIN Description Input capacitance Min. Max. Unit -- 7 pF Min. Max. Unit 7.3 Switching electrical specifications 7.3.1 Device clock specifications Table 20. Device clock specifications Symbol Description Normal run mode fSYS System and core clock -- 48 MHz fBUS Bus clock -- 24 MHz Flash clock -- 24 MHz fFLASH Table continues on the next page... 46 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 20. Device clock specifications (continued) Symbol Description fLPTMR LPTMR clock VLPR and VLPS Min. Max. Unit -- 24 MHz modes1 fSYS System and core clock -- 4 MHz fBUS Bus clock -- 1 MHz fFLASH Flash clock -- 1 MHz fLPTMR LPTMR clock2 -- 24 MHz fERCLK External reference clock -- 16 MHz -- 16 MHz TPM asynchronous clock -- 8 MHz LPUART0 asynchronous clock -- 12 MHz fLPTMR_ERCLK LPTMR external reference clock fTPM fLPUART0 1. The frequency limitations in VLPR and VLPS modes here override any frequency specification listed in the timing specification for any other module. These same frequency limits apply to VLPS, whether VLPS was entered from RUN or from VLPR. 2. The LPTMR can be clocked at this speed in VLPR or VLPS only when the source is an external pin. 7.3.2 General switching specifications These general-purpose specifications apply to all signals configured for GPIO, LPUART, CMT and I2C signals. Table 21. General switching specifications Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) -- Synchronous path 1.5 -- Bus clock cycles 1, 2 NMI_b pin interrupt pulse width (analog filter enabled) -- Asynchronous path 200 -- ns 3 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) -- Asynchronous path 20 -- ns 3 External RESET_b input pulse width (digital glitch filter disabled) 100 -- ns -- 25 ns -- 16 ns -- 8 ns -- 6 ns Port rise and fall time(high drive strength) * Slew enabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V * Slew disabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V Port rise and fall time(low drive strength) 4, 5 6, 7 * Slew enabled MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 47 NXP Semiconductors MCU Electrical Characteristics Table 21. General switching specifications Description * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V * Slew disabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V Min. Max. Unit -- 24 ns -- 16 ns 10 -- 1. 2. 3. 4. 5. 6. 7. ns 6 -- Notes ns This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry in run modes. The greater of synchronous and asynchronous timing must be met. This is the minimum pulse width that is guaranteed to be recognized. PTB0, PTB1, PTC0, PTC1, PTC2, PTC3, PTC6, PTC7, PTC17, PTC18. 75 pF load. Ports A, B, and C. 25 pF load. 7.4 Thermal specifications 7.4.1 Thermal operating requirements Table 22. Thermal operating requirements Symbol TJ Description Min. Max. Unit Notes Die junction temperature -40 125 C -40 95 C -40 105 C 1 -40 85 C 1 * For Laminate QFN package TJ Die junction temperature * For WLCSP package TA Ambient temperature * For Laminate QFN package TA Ambient temperature * For WLCSP package 1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed the maximum. The simplest method to determine TJ is: TJ = TA + RJA x chip power dissipation. 48 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics 7.4.2 Thermal attributes Table 23. Thermal attributes Board type Symbol Single-layer (1S) RJA Four-layer (2s2p) 48-pin Laminate QFN 75-pin WLCSP Unit Notes Thermal resistance, junction to ambient (natural convection) 59.3 106.7 C/W 2, 1 RJA Thermal resistance, junction to ambient (natural convection) 42.9 57.2 C/W 2, 1 Single-layer (1S) RJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 51.6 88.0 C/W 2, 1 Four-layer (2s2p) RJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 38.9 51.7 C/W 2, 1 -- RJB Thermal resistance, junction to board 37.7 24.7 C/W 3 -- RJC Thermal resistance, junction to case 0.48 4.3 C/W 4 -- JT Thermal characterization parameter, junction to package top outside center (natural convection) 0.2 0.2 C/W 5 -- 13.7 C/W 6 -- Description RJB_CSB Thermal characterization parameter, junction to package bottom outside center (natural convection) 1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions--Forced Convection (Moving Air). 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions--Junction-to-Board. Board temperature is measured on the top surface of the board near the package. 4. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate temperature used for the case temperature. The value includes the thermal resistance of the interface material between the top of the package and the cold plate. 5. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air). 6. Thermal resistance between the die and the central solder balls on the bottom of the package based on simulation. 7.5 Peripheral operating requirements and behaviors 7.5.1 Core modules MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 49 NXP Semiconductors MCU Electrical Characteristics 7.5.1.1 Symbol J1 SWD electricals Table 24. SWD full voltage range electricals Description Min. Max. Unit Operating voltage 1.71 3.6 V 0 25 MHz 1/J1 -- ns 20 -- ns SWD_CLK frequency of operation * Serial wire debug J2 SWD_CLK cycle period J3 SWD_CLK clock pulse width * Serial wire debug J4 SWD_CLK rise and fall times -- 3 ns J9 SWD_DIO input data setup time to SWD_CLK rise 10 -- ns J10 SWD_DIO input data hold time after SWD_CLK rise 0 -- ns J11 SWD_CLK high to SWD_DIO data valid -- 32 ns J12 SWD_CLK high to SWD_DIO high-Z 5 -- ns J2 J3 J3 SWD_CLK (input) J4 J4 Figure 5. Serial wire clock input timing 50 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics SWD_CLK J9 SWD_DIO J10 Input data valid J11 SWD_DIO Output data valid J12 SWD_DIO J11 SWD_DIO Output data valid Figure 6. Serial wire data timing 7.5.2 System modules There are no specifications necessary for the device's system modules. 7.5.3 Clock modules 7.5.3.1 Symbol MCG specifications Table 25. MCG specifications Description Min. Typ. Max. Unit Notes fints_ft Internal reference frequency (slow clock) -- factory trimmed at nominal VDD and 25 C -- 32.768 -- kHz fints_t Internal reference frequency (slow clock) -- user trimmed 31.25 -- 39.0625 kHz -- 0.3 0.6 %fdco 1 -- +0.5/-0.7 3 %fdco 1, 2 fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using C3[SCTRIM] and C4[SCFTRIM] fdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 51 NXP Semiconductors MCU Electrical Characteristics Table 25. MCG specifications (continued) Symbol Description fdco_t fintf_ft fintf_ft fintf_t Min. Typ. Max. Unit Notes Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0-70 C -- 0.4 1.5 %fdco 1, 2 Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25 C -- 4 -- MHz Frequency deviation of internal reference clock (fast clock) over temperature and voltage -- factory trimmed at nominal VDD and 25 C -- +1/-2 3 %fintf_ft Internal reference frequency (fast clock) -- user trimmed at nominal VDD and 25 C 3 -- 5 MHz 2 floc_low Loss of external clock minimum frequency -- RANGE = 00 (3/5) x fints_t -- -- kHz floc_high Loss of external clock minimum frequency -- RANGE = 01, 10, or 11 (16/5) x fints_t -- -- kHz 31.25 -- 39.0625 kHz 20 20.97 25 MHz 40 41.94 48 MHz -- 23.99 -- MHz -- 47.97 -- MHz -- 180 -- ps 7 -- -- 1 ms 8 FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS = 00) 3, 4 640 x ffll_ref Mid range (DRS = 01) 1280 x ffll_ref fdco_t_DMX3 DCO output frequency 2 Low range (DRS = 00) 5, 6 732 x ffll_ref Mid range (DRS = 01) 1464 x ffll_ref Jcyc_fll FLL period jitter * fVCO = 48 MHz tfll_acquire FLL target frequency acquisition time 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. The deviation is relative to the factory trimmed frequency at nominal VDD and 25 C, fints_ft. 3. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 0. 4. The resulting system clock frequencies must not exceed their maximum specified values. The DCO frequency deviation (fdco_t) over voltage and temperature must be considered. 5. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 1. 6. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 7. This specification is based on standard deviation (RMS) of period or frequency. 8. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 7.5.3.2 Reference Oscillator Specification 52 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics The KW41Z has been designed to meet targeted specifications with a +/-20 ppm frequency error over the life of the part, which includes the temperature, mechanical and aging excursions. The table below shows the recommended crystal specifications. Note that these are recommendations only and deviation may be allowed. However, deviations may result in degraded RF performance or possibly a failure to meet RF protocol certification standards. Designers should do due diligence to ensure that the crystal(s) they use will meet the requirements of their application. Table 26. Recommended Crystal Specification Symbol Description Comment 32M Min Operating Temperature Faging iFacc Frequency accuracy over aging 1st year Initial Frequency with respect accuracy to XO across temperature, mechanical , load and voltage changes Typ 26M Typ Unit Max Min Max -40 105 -40 105 -5 5 -5 5 ppm 1st yr -10 10 -10 10 ppm -10 10 -10 10 ppm Fstab Frequency stability CL Values of CL supported(Integr ated on die and programmable) 7 10 13 7 10 13 pF Co Shunt parasitic capacitance 0.469 0.67 0.871 0.42 0.6 0.78 pF Cm1 Motional capacitance Cm1 1.435 2.05 2.665 1.435 2.05 2.665 fF Lm1 Motional inductance Lm1 8.47 12.1 15.73 12.81 18.3 23.79 mH TS Trim Sensitivity (TS) for the supported [Co,CL] values 6.30 9.00 11.70 6.39 9.12 11.86 ppm/pF TOSC Oscillator Startup Time -- 680 -- -- 680 -- s Rm1 ESR: Maximum value of Rm1 25 60 35 60 Ohms 200 W Maximum crystal drive level limit MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 200 53 NXP Semiconductors MCU Electrical Characteristics Figure 7. Crystal Electrical Block Diagram 7.5.3.3 32 kHz Oscillator Frequency Specifications Table 27. 32 kHz oscillator frequency specifications Symbol Description Min. Typ. Max. Unit Notes fosc_lo Oscillator crystal -- 32.768 -- kHz tstart Crystal start-up time -- 1000 -- ms 1 fec_extal32 Externally provided input clock frequency -- 32.678 -- kHz 2 vec_extal32 Externally provided input clock amplitude 700 -- VDD mV 2, 3 1. Proper PC board layout procedures must be followed to acheive specifications. 2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The oscillator remains enabled and XTAL32 must be left unconnected. 3. The parameter specified is a peak-to-peak value and VIH and VIL specifications do not apply. The voltage of the applied clock must be within the range of VSS to VDD. 7.5.4 Memories and memory interfaces 54 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics 7.5.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 7.5.4.1.1 Flash timing specifications -- program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 28. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit Notes thvpgm4 Longword Program high-voltage time -- 7.5 18 s -- thversscr Sector Erase high-voltage time -- 13 113 ms 1 -- 104 904 ms 1 Unit Notes thversblk256k Erase Block high-voltage time for 256 KB 1. Maximum time based on expectations at cycling end-of-life. 7.5.4.1.2 Symbol Flash timing specifications -- commands Table 29. Flash command timing specifications Description Min. Typ. Max. Read 1s Block execution time trd1blk256k * 256 KB program flash 1 -- -- 1.7 ms trd1sec2k Read 1s Section execution time (flash sector) -- -- 60 s 1 tpgmchk Program Check execution time -- -- 45 s 1 trdrsrc Read Resource execution time -- -- 30 s 1 tpgm4 Program Longword execution time -- 65 145 s -- Erase Flash Block execution time tersblk256k * 256 KB program flash 2 -- 250 1500 ms tersscr Erase Flash Sector execution time -- 14 114 ms 2 trd1all Read 1s All Blocks execution time -- -- 1.8 ms 1 trdonce Read Once execution time -- -- 30 s 1 Program Once execution time -- 100 -- s -- tersall Erase All Blocks execution time -- 500 3000 ms 2 tvfykey Verify Backdoor Access Key execution time -- -- 30 s 1 tersallu Erase All Blocks Unsecure execution time -- 500 3000 ms 2 tpgmonce 1. Assumes 25 MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 55 NXP Semiconductors MCU Electrical Characteristics 7.5.4.1.3 Flash high voltage current behaviors Table 30. Flash high voltage current behaviors Symbol Description IDD_PGM IDD_ERS 7.5.4.1.4 Symbol Min. Typ. Max. Unit Average current adder during high voltage flash programming operation -- 2.5 6.0 mA Average current adder during high voltage flash erase operation -- 1.5 4.0 mA Reliability specifications Table 31. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 -- years -- tnvmretp1k Data retention after up to 1 K cycles 20 100 -- years -- nnvmcycp Cycling endurance 10 K 50 K -- cycles 2 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25 C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at -40 C Tj 125 C. 7.5.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 7.5.6 Analog 7.5.6.1 ADC electrical specifications All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. The following specification is defined with the DC-DC converter operating in Bypass mode. 7.5.6.1.1 16-bit ADC operating conditions Table 32. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V Notes Table continues on the next page... 56 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 32. 16-bit ADC operating conditions (continued) Symbol Description Conditions Min. Typ.1 Max. Unit Notes VDDA Supply voltage Delta to VDD (VDD - VDDA) -100 0 +100 mV 2 VSSA Ground voltage Delta to VSS (VSS - VSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V 3 VREFL ADC reference voltage low VSSA VSSA VSSA V 3 VADIN Input voltage * 16-bit differential mode VSSA -- 31/32 x VREFH V * All other modes VSSA -- * 16-bit mode -- 8 10 * 8-bit / 10-bit / 12-bit modes -- 4 5 -- 2 5 CADIN RADIN RAS Input capacitance Input series resistance VREFH pF k Analog source resistance (external) 13-bit / 12-bit modes fADCK < 4 MHz -- -- 5 k fADCK ADC conversion clock frequency 13-bit mode 1.0 -- 18.0 MHz 5 fADCK ADC conversion clock frequency 16-bit mode 2.0 -- 12.0 MHz 5 Crate ADC conversion rate 13-bit modes No ADC hardware averaging 4 6 20.000 -- 818.330 kS/s Continuous conversions enabled, subsequent conversion time Crate ADC conversion rate 16-bit mode No ADC hardware averaging 6 37.037 -- 461.467 kS/s Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production. 2. DC potential difference. 3. For packages without dedicated VREFH and VREFL pins, VREFH is internally tied to VDDA, and VREFL is internally tied to VSSA. 4. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as possible. The results in this data sheet were derived from a system that had < 8 analog source resistance. The RAS/CAS time constant should be kept to < 1 ns. 5. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 6. For guidelines and examples of conversion rate calculation, download the ADC calculator tool. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 57 NXP Semiconductors MCU Electrical Characteristics SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage ZAS RAS RADIN ADC SAR ENGINE VADIN CAS VAS RADIN INPUT PIN RADIN INPUT PIN RADIN INPUT PIN CADIN Figure 8. ADC input impedance equivalency diagram 7.5.6.1.2 16-bit ADC electrical characteristics Table 33. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description Conditions1 Min. Typ.2 Max. Unit Notes 0.215 -- 1.7 mA 3 * ADLPC=1, ADHSC=0 1.2 2.4 3.9 MHz * ADLPC=1, ADHSC=1 2.4 4.0 6.1 tADACK = 1/fADACK * ADLPC=0, ADHSC=0 3.0 5.2 7.3 * ADLPC=0, ADHSC=1 4.4 6.2 9.5 LSB4 5 LSB4 5 IDDA_ADC Supply current ADC asynchronous clock source fADACK Sample Time TUE DNL See Reference Manual chapter for sample times Total unadjusted error * 12-bit modes -- 4 6.8 * <12-bit modes -- 1.4 2.1 Differential nonlinearity * 12-bit mode; Buck Mode6 * 12-bit mode; Boost Mode6 * 12-bit mode; Bypass Mode -- 0.7 -1.1 to +1.9 -- 0.5 -1.1 to +1.9 -- 0.5 -1.1 to +1.9 Table continues on the next page... 58 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 33. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description INL Integral nonlinearity EFS Full-scale error EQ Quantization error ENOB Conditions1 Min. Typ.2 Max. Unit Notes LSB4 5 LSB4 VADIN = VDDA5 * 12-bit mode; Buck Mode6 * 12-bit mode; Boost Mode6 * 12-bit mode; Bypass Mode -- 1.0 -2.7 to +1.9 -- 0.7 -2.7 to +1.9 -- 0.6 -2.7 to +1.9 * 12-bit modes -- -4 -5.4 * <12-bit modes -- -1.4 -1.8 * 16-bit modes -- -1 to 0 -- * 13-bit modes -- -- 0.5 LSB4 Effective number of 16-bit differential mode; Buck bits Mode6 * Avg = 32 * Avg = 4 7 12 12.75 -- 11.25 11.75 -- 11 11.5 -- 9.5 10.5 -- 11.5 12 -- 9.75 11 -- 11 11.5 -- 9.75 10.5 -- 12.5 13 -- 11.25 12 -- 11 11.75 -- 10 10.5 -- bits 16-bit single-ended mode; Buck Mode6 * Avg = 32 * Avg = 4 16-bit differential mode; Boost Mode6 * Avg = 32 * Avg = 4 16-bit single-ended mode; Boost Mode6 * Avg = 32 * Avg = 4 16-bit differential mode; Bypass Mode * Avg = 32 * Avg = 4 16-bit single-ended mode; Bypass Mode * Avg = 32 * Avg = 4 SINAD THD Signal-to-noise plus See ENOB distortion Total harmonic distortion 6.02 x ENOB + 1.76 dB 16-bit differential mode; Buck Mode6 * Avg = 32 8 -- -90 -- dB Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 59 NXP Semiconductors MCU Electrical Characteristics Table 33. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description Conditions1 16-bit single-ended mode; Buck Mode6 Min. Typ.2 Max. -- -88 -- -- -89 -- -89 -- -89 -- -87 -- Unit Notes * Avg = 32 16-bit differential mode; Boost Mode6 * Avg = 32 16-bit single-ended mode; Boost Mode6 -- * Avg = 32 16-bit differential mode; Bypass Mode -- * Avg = 32 16-bit single-ended mode; Bypass Mode -- * Avg = 32 Signal-to-noise plus See ENOB SINAD distortion SFDR Spurious free dynamic range distortion 6.02 x ENOB + 1.76 dB 16-bit differential mode; Buck Mode6 * Avg = 32 8 85 89 -- 85 87 -- 78 86 -- 85 87 -- 87 94 -- 85 88 -- dB 16-bit single-ended mode; Buck Mode6 * Avg = 32 16-bit differential mode; Boost Mode6 * Avg = 32 16-bit single-ended mode; Boost Mode6 * Avg = 32 16-bit differential mode; Bypass Mode * Avg = 32 16-bit single-ended mode; Bypass Mode * Avg = 32 EIL Input leakage error IIn x RAS mV IIn = leakage current Table continues on the next page... 60 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 33. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Conditions1 Symbol Description Min. Typ.2 Max. Unit Notes (see Voltage and current operating ratings) Temp sensor slope Across the full temperature range of the device VTEMP25 Temp sensor voltage 25 C 1.67 1.74 1.81 mV/ C 9 706 716 726 mV 9 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA. 2. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and ADC_CFG1[ADLPC] (low power). For lowest power operation, ADC_CFG1[ADLPC] must be set, the ADC_CFG2[ADHSC] bit must be clear with 1 MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N. 5. ADC conversion clock < 16 MHz, maximum hardware averaging (AVGE = %1, AVGS = %11). 6. VREFH = Output of Voltage Reference(VREF). 7. Input data is 100 Hz sine wave. ADC conversion clock < 12 MHz. 8. Input data is 1 kHz sine wave. ADC conversion clock < 12 MHz. 9. ADC conversion clock < 3 MHz. 7.5.6.2 Voltage reference electrical specifications Table 34. VREF full-range operating requirements Symbol Description Min. Max. Unit VDDA Supply voltage 1.71 3.6 V TA Temperature CL Output load capacitance -40 to 105 C 100 nF Notes 1, 2 1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external reference. 2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of the device. Table 35. VREF full-range operating behaviors Symbol Description Min. Typ. Max. Unit Notes Vout Voltage reference output with factory trim at nominal VDDA and temperature=25C 1.190 1.1950 1.2 V 1 Vout Voltage reference output with user trim at nominal VDDA and temperature=25C 1.1945 1.1950 1.1955 V 1 Vstep Voltage reference trim step -- 0.5 -- mV 1 Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 61 NXP Semiconductors MCU Electrical Characteristics Table 35. VREF full-range operating behaviors (continued) Symbol Min. Typ. Max. Unit Notes Temperature drift (Vmax -Vmin across the full temperature range) -- -- 20 mV 1 Ibg Bandgap only current -- -- 80 A Ilp Low-power buffer current -- -- 360 uA 1 Ihp High-power buffer current -- -- 1 mA 1 V 1, 2 Vtdrift VLOAD Description Load regulation * current = 1.0 mA Tstup Buffer startup time Tchop_osc_st Internal bandgap start-up delay with chop oscillator enabled up Vvdrift Voltage drift (Vmax -Vmin across the full voltage range) -- 200 -- -- -- 100 s -- -- 35 ms -- 2 -- mV 1 1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register. 2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load Table 36. VREF limited-range operating requirements Symbol Description Min. Max. Unit TA Temperature 0 70 C Notes Table 37. VREF limited-range operating behaviors Symbol Vtdrift 7.5.6.3 Description Temperature drift (Vmax -Vmin across the limited temperature range) Min. Max. Unit -- 15 mV Notes CMP and 6-bit DAC electrical specifications Table 38. Comparator and 6-bit DAC electrical specifications Symbol Description Min. Typ. VDD Supply voltage Max. Unit 1.71 -- 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) -- -- 200 A IDDLS Supply current, low-speed mode (EN=1, PMODE=0) -- -- 20 A VAIN Analog input voltage VSS - 0.3 -- VDD V VAIO Analog input offset voltage -- -- 20 mV -- 5 -- mV VH Analog comparator hysteresis1 * CR0[HYSTCTR] = 00 Table continues on the next page... 62 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 38. Comparator and 6-bit DAC electrical specifications (continued) Symbol Description Min. Typ. Max. Unit * CR0[HYSTCTR] = 01 -- 10 -- mV * CR0[HYSTCTR] = 10 -- 20 -- mV * CR0[HYSTCTR] = 11 -- 30 -- mV VCMPOh Output high VDD - 0.5 -- -- V VCMPOl Output low -- -- 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns Analog comparator initialization delay2 -- -- 40 s 6-bit DAC current adder (enabled) -- 7 -- A IDAC6b INL 6-bit DAC integral non-linearity -0.5 -- 0.5 LSB3 DNL 6-bit DAC differential non-linearity -0.3 -- 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6 V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL], CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 0.08 0.07 CMP Hystereris (V) 0.06 HYSTCTR Setting 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 Vin level (V) Figure 9. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 0) MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 63 NXP Semiconductors MCU Electrical Characteristics 0.18 0.16 0.14 CMP Hysteresis (V) 0.12 HYSTCTR Setting 0.1 00 01 10 11 0.08 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 10. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 1) 7.5.6.4 7.5.6.4.1 Symbol 12-bit DAC electrical characteristics 12-bit DAC operating requirements Table 39. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V 1 2 CL Output load capacitance -- 100 pF IL Output load current -- 1 mA Notes 1. The DAC reference can be selected to be VDDA or VREF_OUT. 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC. 64 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics 7.5.6.4.2 Symbol 12-bit DAC operating behaviors Table 40. 12-bit DAC operating behaviors Description IDDA_DACL Supply current -- low-power mode Min. Typ. Max. Unit -- -- 250 A -- -- 900 A Notes P IDDA_DACH Supply current -- high-speed mode P tDACLP Full-scale settling time (0x080 to 0xF7F) -- low-power mode -- 100 200 s 1 tDACHP Full-scale settling time (0x080 to 0xF7F) -- high-power mode -- 15 30 s 1 -- 0.7 1 s 1 tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) -- low-power mode and highspeed mode Vdacoutl DAC output voltage range low -- highspeed mode, no load, DAC set to 0x000 -- -- 100 mV Vdacouth DAC output voltage range high -- highspeed mode, no load, DAC set to 0xFFF VDACR -100 -- VDACR mV INL Integral non-linearity error -- high speed mode -- -- 8 LSB 2 DNL Differential non-linearity error -- VDACR > 2 V -- -- 1 LSB 3 DNL Differential non-linearity error -- VDACR = VREF_OUT -- -- 1 LSB 4 -- 0.4 0.8 %FSR 5 Gain error -- 0.1 0.6 %FSR 5 Power supply rejection ratio, VDDA 2.4 V 60 -- 90 dB TCO Temperature coefficient offset voltage -- 3.7 -- V/C TGE Temperature coefficient gain error -- 0.000421 -- %FSR/C Rop Output resistance (load = 3 k) -- -- 250 SR Slew rate -80h F7Fh 80h VOFFSET Offset error EG PSRR BW 1. 2. 3. 4. 5. 6. 6 V/s * High power (SPHP) 1.2 1.7 -- * Low power (SPLP) 0.05 0.12 -- 3dB bandwidth kHz * High power (SPHP) 550 -- -- * Low power (SPLP) 40 -- -- Settling within 1 LSB The INL is measured for 0 + 100 mV to VDACR -100 mV The DNL is measured for 0 + 100 mV to VDACR -100 mV The DNL is measured for 0 + 100 mV to VDACR -100 mV with VDDA > 2.4 V Calculated by a best fit curve from VSS + 100 mV to VDACR - 100 mV VDDA = 3.0 V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode (DACx_C0:LPEN = 0), DAC set to 0x800, temperature range is across the full range of the device MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 65 NXP Semiconductors MCU Electrical Characteristics 8 6 4 DAC12 INL (LSB) 2 0 -2 -4 -6 -8 0 500 1000 1500 2000 2500 3000 3500 4000 Digital Code Figure 11. Typical INL error vs. digital code 66 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics 1.499 DAC12 Mid Level Code Voltage 1.4985 1.498 1.4975 1.497 1.4965 1.496 -40 55 25 85 105 125 Temperature C Figure 12. Offset at half scale vs. temperature 7.5.7 Timers See General switching specifications. 7.5.8 Communication interfaces MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 67 NXP Semiconductors MCU Electrical Characteristics 7.5.8.1 DSPI switching specifications (limited voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. See the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 41. Master mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation -- 12 MHz 2 x tBUS -- ns Notes DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 2 -- ns 1 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 2 -- ns 2 DS5 DSPI_SCK to DSPI_SOUT valid -- 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 16.2 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The delay is programmable in SPIx_CTARn[PCSSCK] and SPIx_CTARn[CSSCK]. 2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. SPI_PCSn DS3 SPI_SCK DS7 (CPOL=0) SPI_SIN DS4 DS8 First data SPI_SOUT DS1 DS2 Data Last data DS5 First data DS6 Data Last data Figure 13. DSPI classic SPI timing -- master mode Table 42. Slave mode DSPI timing (limited voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 2.7 3.6 V 6 MHz Table continues on the next page... 68 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 42. Slave mode DSPI timing (limited voltage range) (continued) Num Description Min. Max. Unit 4 x tBUS -- ns (tSCK/2) - 2 (tSCK/2) + 2 ns -- 21.4 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 2.6 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7.0 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 14 ns DS10 DS9 SPI_SS SPI_SCK DS15 (POL=0) SPI_SOUT DS12 First data DS13 SPI_SIN DS16 DS11 Last data Data DS14 First data Data Last data Figure 14. DSPI classic SPI timing -- slave mode 7.5.8.2 DSPI switching specifications (full voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. See the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 43. Master mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time Min. Max. Unit Notes 1.71 3.6 V 1 -- 12 MHz 2 x tBUS -- ns (tSCK/2) - 4 (tSCK/2) + 4 ns Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 69 NXP Semiconductors MCU Electrical Characteristics Table 43. Master mode DSPI timing (full voltage range) (continued) Num Description Min. Max. Unit Notes DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 4 -- ns 2 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 4 -- ns 3 DS5 DSPI_SCK to DSPI_SOUT valid -- 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -1.2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 23.3 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 2. The delay is programmable in SPIx_CTARn[PCSSCK] and SPIx_CTARn[CSSCK]. 3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. SPI_PCSn DS3 SPI_SCK DS7 (CPOL=0) SPI_SIN DS1 DS2 DS4 DS8 First data SPI_SOUT Data Last data DS5 First data DS6 Data Last data Figure 15. DSPI classic SPI timing -- master mode Table 44. Slave mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 1.71 3.6 V -- 6 MHz 4 x tBUS -- ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS11 DSPI_SCK to DSPI_SOUT valid -- 29.1 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 3.2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7.0 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 25 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 25 ns 70 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics SPI_SS DS10 DS9 SPI_SCK DS15 (POL=0) SPI_SOUT DS12 First data DS13 SPI_SIN DS16 DS11 Last data Data DS14 First data Data Last data Figure 16. DSPI classic SPI timing -- slave mode 7.5.8.3 Inter-Integrated Circuit Interface (I2C) timing Table 45. I 2C timing Characteristic Symbol Standard Mode Fast Mode Minimum Maximum Minimum Maximum Unit SCL Clock Frequency fSCL 0 100 0 400 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated. tHD; STA 4 -- 0.6 -- s LOW period of the SCL clock tLOW 4.7 -- 1.3 -- s HIGH period of the SCL clock tHIGH 4 -- 0.6 -- s Set-up time for a repeated START condition tSU; STA 4.7 -- 0.6 -- s Data hold time for I2C bus devices tHD; DAT 01 3.452 03 0.91 s tSU; DAT 2504 -- 1002, 5 Data set-up time Rise time of SDA and SCL signals tr -- 1000 -- ns 6 300 ns 5 20 +0.1Cb Fall time of SDA and SCL signals tf -- 300 20 +0.1Cb 300 ns Set-up time for STOP condition tSU; STO 4 -- 0.6 -- s Bus free time between STOP and START condition tBUF 4.7 -- 1.3 -- s Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0 50 ns 1. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL lines. 2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal. 3. Input signal Slew = 10 ns and Output Load = 50 pF. 4. Set-up time in slave-transmitter mode is 1 IP Bus clock period, if the TX FIFO is empty. 5. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line trmax MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 71 NXP Semiconductors MCU Electrical Characteristics + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released. 6. Cb = total capacitance of the one bus line in pF. SDA tf tSU; DAT tr tLOW tf tHD; STA tSP tr tBUF SCL HD; STA S tHD; DAT tHIGH tSU; STA tSU; STO SR P S Figure 17. Timing definition for fast and standard mode devices on the I2C bus 7.5.8.4 LPUART See General switching specifications. 7.5.9 Human-machine interfaces (HMI) 7.5.9.1 TSI electrical specifications Table 46. TSI electrical specifications Symbol Description Min. Typ. Max. Unit Ta Temperature -30 -- 105 C TSI_RUNF Fixed power consumption in run mode -- 100 -- A TSI_RUNV Variable power consumption in run mode (depends on oscillator's current selection) 1.0 -- 128 A TSI_EN Power consumption in enable mode -- 100 -- A TSI_DIS Power consumption in disable mode -- 1.2 -- A TSI_TEN TSI analog enable time -- 66 -- s TSI_CREF TSI reference capacitor -- 1.0 -- pF TSI_DVOLT Voltage variation of VP & VM around nominal values 0.19 -- 1.03 V 7.5.9.2 GPIO The maximum input voltage on PTC0/1/2/3 is VDD+0.3V. For rest of the GPIO specification, see General switching specifications. 72 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics 7.6 DC-DC Converter Operating Requirements Table 47. DC-DC Converter Recommended operating conditions Characteristic Symbol Min Typ Max Unit Bypass Mode Supply Voltage (RF and Analog) VDDRF1, VDDRF2, VDDRF3 1.425 -- 3.6 Vdc VDDX, VDCDC_IN, VDDA 1.71 -- 3.6 Vdc VDDDCDC_IN 1.12 -- 1.795 Vdc VDDDCDC_IN 2.1 -- 4.25 Vdc Bypass Mode Supply Voltage (Digital) Boost Mode Supply Voltage 1 Buck Mode Supply Voltage3, 1, 4 External Inductor5 L_DCDC 10 uH Inductor Resistance in Buck Mode ESR -- 0.2 0.5 Ohms Inductor Resistance in Boost Mode ESR -- -- 0.2 Ohms 1. VDD_1P5 is 1.8 V by default in Boost mode. VDD_1P8OUT should supply to VDD1, VDD2 and VDDA. VDD_1P5OUT_PMCIN should supply to VDD_RF1 and VDD_RF2. VDDXTAL can be either supplied by 1.5 V or 1.8 V 2. In boost mode, DC-DC converter needs minimum 1.1 V to start, the supply can drop to 0.9 V after the DC-DC converter settles. 3. In Buck mode, DC-DC converter needs 2.1 V min to start, the supply can drop to 1.8 V after DC-DC converter settles 4. When 3.6 V < VDDDCDC_IN / DCDC_CFG / PSWITCH <= 4.25 V, TA and TJ are constrained to a maximum of +45 C and +65 C respectively (typical Li-ion maximum temperatures when charging). When VDDDCDC_IN / DCDC_CFG / PSWITCH <= 3.6 V, TA and TJ are constrained to a maximum of +105 C and +125 C respectively. 5. In both Buck and Boost modes, LN and LP are connected to external inductor. In boost mode, LP is also shorted to VDCDC_IN. Table 48. DC-DC Converter Specifications Characteristics Conditions Symbol Min Typ Max Unit Total power output of 1P8V and 1P5V Pdcdc_out -- -- 1251 mW Switching Frequency2 DCDC_FREQ -- 2 -- MHz Half FET Threshold I_half_FET -- 5 -- mA Double FET Threshold I_double_FET -- 40 -- mA mV DC-DC Converter Output Power Boost Mode Enable Threshold EN_THRESH_b oost - 50 - DC-DC Conversion Efficiency DCDC_EFF_bo ost - 90 % - 1.8 V Output Voltage VDD_1P8_boos t 1.71 1.83 3.5 Vdc Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 73 NXP Semiconductors MCU Electrical Characteristics Table 48. DC-DC Converter Specifications (continued) Characteristics Conditions Symbol Min Typ Max Unit VDD_1P8 = 1.8 V, VDCDC_IN = 1.7 V IDD_1P8_boost 1 -- -- 45 mA VDD_1P8 = 3.0 V, VDCDC_IN = 1.7 V IDD_1P8_boost 2 -- -- 27 mA VDD_1P8 = 1.8 V, VDCDC_IN = 0.9 V IDD_1P8_boost 3 -- -- 20 mA VDD_1P8 = 3.0 V, VDCDC_IN = 0.9 V IDD_1P8_boost 4 -- -- 10 mA 1.5V Output Voltage VDD_1P5_boos t 1.4256, 7 1.86, 7 2.0 Vdc 1.5 V Output Current4, 8 VDD_1P5_boos t -- -- 30 mA t_DCDCboost_L S SRUN -- 50 -- us TDCDC_ON_boost -- 2.39 -- ms TDCDC_SETTLE_bo -- 0.271 -- ms -- (C*(V1-V2)/I2 -- s DCDC_EFF_bu ck -- 90 % -- -- VDD_1P8_buck 1.71 -- min(VDCDC _IN_buck, 3.5)10, 3 Vdc IDD_1P8_buck1 -- -- 45 mA 1.8 V Output Current4, 5 DCDC Transition Operating LSSRun Behavior DCDC Turn on Time DCDC Settling Time for increasing voltage ost C = capacitance attached to the DCDC V1P8 output rail. TDCDC_SETTLE_bo ost V1 = the initial output voltage of DCDC Settling Time for the DCDC. decreasing voltage V2 = the final output voltage of the DCDC. I2 = the load on the DCDC output expressed in Amperes. Buck Mode DC-DC Conversion Efficiency 1.8 V Output Voltage VDD_1P8 = 1.8 1.8 V Output Current4, 5 V, VDC_1P5 = 1.5 V Table continues on the next page... 74 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 MCU Electrical Characteristics Table 48. DC-DC Converter Specifications (continued) Characteristics 1.5 V Output Voltage Conditions Symbol Min Typ Max Unit VDD_1P8 = 3.0 V, VDC_1P5 = 1.5 V IDD_1P8_buck2 -- -- 27 mA Radio section requires 1.5 V VDD_1P5_buck 1.42511 1.511 1.65 Vdc IDD_1P5_buck -- -- 30 mA t_DCDCbuck_L S SRUN -- 50 -- us TDCDC_ON_buck -- 2.29 -- ms TDCDC_SETTLE_bu -- 0.371 -- ms -- (C*(V1-V2)/I2 -- s 1.5 V Output Current4, 8 DCDC Transition Operating LSSRun Behavior DCDC Turn on Time DCDC Settling Time for increasing voltage ck C = capacitance attached to the DCDC V1P8 output rail. TDCDC_SETTLE_bu ck V1 = the initial output voltage of DCDC Settling Time for the DCDC decreasing voltage V2 = the final output voltage of the DCDC I2 = the load on the DCDC output expressed in Amperes. 1. This is the steady state DC output power. It requires VDCDC_IN >= 1.7V in boost mode. Excessive transient current load from external device will cause 1p8V and 1P5 output voltage unregulated temporary. 2. This is the frequency that will be observed at LN and LP pins. 3. The voltage output level can be controlled by programming DCDC_VDD1P8CTRL_TRG field in DCDC_REG3. 4. The output current specification in both buck and boost modes represents the maximum current the DC-DC converter can deliver. The KW41Z radio and MCU blocks current consumption is not excluded. Note that the maxium output power of the DC-DC converter is 125mW. The available supply current for external device depends on the energy consumed by the internal peripherals in KW41Z. 5. When using DC-DC in low power mode(pulsed mode), current load must be less than 0.5 mA. 6. The minimum VDD_1P5_boost is the maximum of either what is programmed using DCDC_VDD1P5CTRL_TRG_BOOST field in DCDC_REG3 or VDCDC_IN_boost + 0.05V. For example, if VDCDC_IN = 0.9V, minimum VDD_1P5 is as programmed in DCDC_VDD1P5CTRL_ TRG_BOOST. If VDCDC_IN = 1.5V, minimum VDD_1P5 = 1.5 + 0.05V is 1.55V. 7. 1.8 V is the default value of the DC-DC 1.5 V output voltage in boost mode. The user can program DCDC_VDD1P5CTRL_TRG_BOOST field in register DCDC_REG3 to control 1.5 V output voltage level. For reliable radio operation, a voltage level of 1.425 V is required. VDD_1P5 must not be programmed higher than VDD_1P8. 8. 1.5 V is intended to supply power to KW41Z only. It is not designed to supply power to an external device. 9. Turn on time is measured from the application of power (to DCDC_IN) to when the DCDC_REG0[DCDC_STS_DC_OK] bit is set. Code execution may begin before the DCDC_REG0[DCDC_STS_DC_OK] bit is set. Full device specification is not guaranteed until the bit sets. 10. In Buck mode, the maximum VDD_1P8 output is the minimum of either VDCDC_IN_BUCK minus 50 mV or 3.5 V. For example, if VDCDC_IN = 1.85V, maximum VDD_1P8 is 1.8V. If VDCDC_IN = 4.2V, maximum VDD_1P8 is 3V. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 75 NXP Semiconductors MCU Electrical Characteristics 11. 1.5 V is the default value of DCDC VDD_1P5 in buck mode. The user can program DCDC_VDD1P5CTRL_TRG_BUCK field in register DCDC_REG3 to control 1P5 output voltage level. For Radio operation, minimum 1.425 V is required. VDD_1P5 must not be programmed higher than VDD_1P8. 7.7 Ratings 7.7.1 Thermal handling ratings Table 49. Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 C 1 TSDR Solder temperature, lead-free -- 260 C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 7.7.2 Moisture handling ratings Table 50. Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes -- 3 -- 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 7.7.3 ESD handling ratings Table 51. ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105 C -100 +100 mA 3 ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 76 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments 7.7.4 Voltage and current operating ratings Table 52. Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage -0.3 3.8 V IDD Digital supply current -- 120 mA VIO IO pin input voltage -0.3 VDD + 0.3 V Instantaneous maximum current single pin limit (applies to all port pins) -25 25 mA VDD - 0.3 VDD + 0.3 V GND VDCDC V ID VDDA VIO_DCDC Analog supply voltage IO pins in the DCDC voltage domain (DCDC_CFG and PSWITCH) 8 Pin Diagrams and Pin Assignments 8.1 Pinouts Device pinout are shown in figures below. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 77 NXP Semiconductors PTC19 PTC18 PTC17 PTC16 VDD_1 PTC7 PTC6 PTC5 PTC4 PTC3 PTC2 PTC1 48 47 46 45 44 43 42 41 40 39 38 37 Pin Diagrams and Pin Assignments PTA0 1 36 VDD_RF1 PTA1 2 35 VDD_RF2 PTA2 3 34 GANT PTA16 4 33 ANT PTA17 5 32 VDD_RF3 PTA18 6 31 XTAL PTA19 7 30 EXTAL PSWITCH 8 29 XTAL_OUT DCDC_CFG 9 28 VDDA VDCDC_IN 10 27 VREFH/VREF_OUT DCDC_LP 11 26 VSSA DCDC_LN 12 25 ADC0_DM0 61 63 62 57 59 58 53 60 55 54 56 51 14 15 16 17 18 19 20 21 22 23 24 VDD_1P8OUT VDD_1P5OUT_PMCIN PTB0 PTB1 PTB2 PTB3 VDD_0 PTB16 PTB17 PTB18 ADC0_DP0 52 13 50 DCDC_GND 49 64 *pin 49 - 64 are ground Figure 18. 48-pin Laminate QFN pinout diagram 78 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments 1 2 3 A 4 5 6 7 8 9 VSS PTC3 PTC4 PTC7 PTC16 PTC18 B GANT ANT VDD_RF2 VDD_RF1 VSS PTC2 PTC6 PTC17 PTA1 C XTAL VDD_RF3 VSS VSS PTC0 PTC1 PTC5 PTC19 PTA2 D EXTAL VSS VSS VSS VSS VSS VDD_1 PTA0 PTA17 E XTAL_OUT VSS VSS VSS VSS VDD_1 PTA16 PTA18 PTA19 F VDDA VREFH_VREF OUT PTB18 VSS VSS VSS VSS DCDC_CFG PSWITCH G VSSA VSSA VSS VSS PTB3 PTB2 VDD_1P8OUT DCDC_GND VDCDC_IN H ADC0_DM0 VSS PTB17 PTB16 VSS PTB1 VDD_1P5_P MCIN DCDC_LN DCDC_LP J ADC0_DP0 VSS VDD_0 PTB0 VSS VDD_1P5_C AP = No Ball Figure 19. KW41 75-pin WLCSP Pinout Diagram 8.2 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and locations of these pins on the packages supported by this device. The Port Control Module is responsible for selecting which ALT functional is available on each PTxy pin. MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 79 NXP Semiconductors Pin Diagrams and Pin Assignments NOTE On the 75 WLCSP, VDD_1P5_CAP and VDD_1P5_PMCIN should be tied together external to the device. Table 53. KW41Z Pin Assignments KW41 KW41 Z(48 (WLCSP LGA / ) Lamin ate QFN) Pin Name DEFAUL T ALT0 ALT1 ALT2 ALT3 ALT4 ALT 5 AL T6 ALT7 1 D8 PTA0 SWD_DIO TSIO_CH8 PTA0 SPI0_P CS1 TPM 1_CH 0 SWD_ DIO 2 B9 PTA1 SWD_CL K PTA1 SPI1_P CS0 TPM 1_CH 1 SWD_ CLK 3 C9 PTA2 RESET_b TPM 0_CH 3 RESE T_b 4 E7 PTA16 DISABLE D TSI0_CH10 PTA16/ LLWU_P4 SPI1_S OUT TPM 0_CH 0 5 D9 PTA17 DISABLE D TSI0_CH11 PTA17/ LLWU_P5/ RF_RESET SPI1_SI N TPM _CLK IN1 6 E8 PTA18 DISABLE D TSI0_CH12 PTA18/ LLWU_P6 SPI1_S CK TPM 2_CH 0 7 E9 PTA19 DISABLE D TSI0_CH13/ ADC0_SE5 PTA19/ LLWU_P7 SPI1_P CS0 TPM 2_CH 1 8 F9 PSWITCH PSWITCH PSWITCH 9 F8 DCDC_C DCDC_CF DCDC_CFG FG G 10 G9 VDCDC_I VDCDC_I VDCDC_IN N N 11 H9 DCDC_L P DCDC_LP DCDC_LP 12 H8 DCDC_L N DCDC_LN DCDC_LN 13 G8 DCDC_G DCDC_G ND ND 14 G7 VDD_1P8 VDD_1P8 VDD_1P8OUT OUT OUT 15 TSI0_CH9 PTA2 DCDC_GND VDD_1P5 VDD_1P5 VDD_1P5OUT_ OUT_PM OUT_PM PMCIN CIN CIN Table continues on the next page... 80 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments Table 53. KW41Z Pin Assignments (continued) KW41 KW41 Z(48 (WLCSP LGA / ) Lamin ate QFN) Pin Name DEFAUL T ALT0 J8 VDD_1P5 VDD_1P5 VDD_1P5_CAP _CAP _CAP H7 VDD_1P5 VDD_1P5 VDD_1P5_PM _PMCIN _PMCIN CIN 16 J6 PTB0 DISABLE D 17 H6 PTB1 DISABLE D ADC0_SE1/ CMP0_IN5 18 G6 PTB2 DISABLE D 19 G5 PTB3 20 J5 21 ALT1 ALT2 PTB0/ LLWU_P8/ XTAL_OUT_E N ALT3 ALT4 ALT 5 AL T6 ALT7 I2C0_ CMP0_ TPM SCL OUT 0_CH 1 CLKO UT PTB1 DTM_R I2C0_ LPTM TPM X SDA R0_AL 0_CH T1 2 CMT_I RO ADC0_SE3/ CMP0_IN3 PTB2 RF_NO DTM_ T_ALLO TX WED DISABLE D ADC0_SE2/ CMP0_IN4 PTB3 VDD_0 VDD_0 VDD_0 H4 PTB16 EXTAL32 EXTAL32K K PTB16 I2C1_ SCL TPM 2_CH 0 22 H3 PTB17 XTAL32K XTAL32K PTB17 I2C1_ SDA TPM 2_CH 1 BSM_ CLK 23 F3 PTB18 NMI_b PTB18 I2C1_ TPM_ TPM SCL CLKIN 0_CH 0 0 NMI_b 24 J1 ADC0_DP ADC0_DP ADC0_DP0/ 0 0/ CMP0_IN0 CMP0_IN 0 25 H1 ADC0_D M0 ADC0_DM ADC0_DM0/ 0/ CMP0_IN1 CMP0_IN 1 26 G1, G2 VSSA VSSA 27 F2 VREFH/ VREF_O UT VREFH/ VREFH/ VREF_OU VREF_OUT T 28 F1 VDDA VDDA 29 E1 XTAL_OU XTAL_OU XTAL_OUT T T DAC0_OUT/ ADC0_SE4/ CMP0_IN2 TPM 1_CH 0 CLKO UT TPM 1_CH 1 RTC_ CLKO UT VSSA VDDA Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 81 NXP Semiconductors Pin Diagrams and Pin Assignments Table 53. KW41Z Pin Assignments (continued) KW41 KW41 Z(48 (WLCSP LGA / ) Lamin ate QFN) Pin Name DEFAUL T ALT0 ALT1 ALT2 ALT3 ALT4 ALT 5 AL T6 ALT7 30 D1 EXTAL EXTAL EXTAL 31 C1 XTAL XTAL XTAL 32 C2 VDD_RF3 VDD_RF3 VDD_RF3 33 B2 ANT ANT ANT 34 B1 GANT GANT GANT 35 B3 VDD_RF2 VDD_RF2 VDD_RF2 36 B4 VDD_RF1 VDD_RF1 VDD_RF1 C5 PTC0 DISABLE D PTC0/ LLWU_P9 ANT_A I2C0_ LPUAR TPM SCL T0_CT 0_CH S_b 1 37 C6 PTC1 DISABLE D PTC1 ANT_B I2C0_ LPUAR TPM SDA T0_RT 0_CH S_b 2 BLE_ RF_A CTIVE 38 B6 PTC2 DISABLE D TSI0_CH14/ DIAG1 PTC2/ LLWU_P10 TX_SWI I2C1_ LPUAR CMT TCH SCL T0_RX _IRO DTM_ RX 39 A5 PTC3 DISABLE D TSI0_CH15/ DIAG2 PTC3/ LLWU_P11 RX_SWI I2C1_ LPUAR TPM TCH SDA T0_TX 0_CH 1 DTM_ TX 40 A6 PTC4 DISABLE D TSI0_CH0/ DIAG3 PTC4/ LLWU_P12 ANT_A EXTR LPUAR TPM G_IN T0_CT 1_CH S_b 0 BSM_ DATA 41 C7 PTC5 DISABLE D TSI0_CH1/ DIAG4 PTC5/ LLWU_P13 RF_NO LPTM LPUAR TPM T_ALLO R0_A T0_RT 1_CH WED LT2 S_b 1 BSM_ CLK 42 B7 PTC6 DISABLE D TSI0_CH2 PTC6/ LLWU_P14/ XTAL_OUT_E N I2C1_ LPUAR TPM SCL T0_RX 2_CH 0 BSM_ FRAM E 43 A7 PTC7 DISABLE D TSI0_CH3 PTC7/ LLWU_P15 SPI0_P CS2 I2C1_ LPUAR TPM SDA T0_TX 2_CH 1 BSM_ DATA 44 E6, D7 VDD_1 VDD_1 VDD_1 45 A8 PTC16 DISABLE D TSI0_CH4 PTC16/ LLWU_P0 SPI0_S CK I2C0_ LPUAR TPM SDA T0_RT 0_CH S_b 3 46 B8 PTC17 DISABLE D TSI0_CH5 PTC17/ LLWU_P1 SPI0_S OUT I2C1_ LPUAR BSM SCL T0_RX _FRA ME DTM_ RX 47 A9 PTC18 DISABLE D TSI0_CH6 PTC18/ LLWU_P2 SPI0_SI I2C1_ LPUAR BSM N SDA T0_TX _DAT A DTM_ TX Table continues on the next page... 82 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments Table 53. KW41Z Pin Assignments (continued) KW41 KW41 Z(48 (WLCSP LGA / ) Lamin ate QFN) Pin Name DEFAUL T 48 C8 PTC19 DISABLE D 49-64 A4, B5, C3, C4, D2, D3, D4, D5, D6, E2, E3, E4, E5, F4, F5, F6, F7, G3, G4, H2, H5, J2, J7 Ground NA ALT0 ALT1 ALT2 TSI0_CH7 PTC19/ LLWU_P3 SPI0_P CS0 ALT3 ALT4 ALT 5 I2C0_ LPUAR BSM SCL T0_CT _CLK S_b AL T6 ALT7 BLE_ RF_A CTIVE 8.3 Module Signal Description Tables The following sections correlate the chip-level signal name with the signal name used in the module's chapter. They also briefly describe the signal function and direction. 8.3.1 Core Modules This section contains tables describing the core module signal descriptions. Table 54. SWD Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SWD_DIO SWD_DIO Serial Wire Debug Data Input/Output1 I/O SWD_CLK SWD_CLK Serial Wire Clock2 I 1. Pulled up internally by default 2. Pulled down internally by default MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 83 NXP Semiconductors Pin Diagrams and Pin Assignments 8.3.2 Radio Modules This section contains tables describing the radio signals. Table 55. Radio Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O ANT ANT Antenna O GANT GANT Antenna ground I BLE_RF_ACTIVE BLE_RF_ACTIVE Signal to indicate future BLE O activity. Refer BLE Link Layer for more details. RF_NOT_ALLOWED RF_NOT_ALLOWED Radio off signal, intended for WiFi coexistence control I RF_RESET RF_RESET Radio reset signal I DTM_RX DTM_RX Direct Test Mode Receive I DTM_TX DTM_TX Direct Test Mode Transmit O BSM_CLK BSM_CLK Bit Streaming Mode (BSM) O Clock signal, 802.15.4 packet data stream clock line BSM_FRAME BSM_FRAME Bit Streaming Mode Frame signal, 802.15.4 packet data stream frame line O BSM_DATA BSM_DATA Bit Streaming Mode Data signal, 802.15.4 packet data stream data line I/O ANT_A ANT_A Antenna selection A for Front O End Module support ANT_B ANT_B Antenna selection B for Front O End Module support TX_SWITCH TX_SWITCH Front End Module Transmit mode signal O RX_SWITCH RX_SWITCH Front End Module Receive mode signal O 8.3.3 System Modules This section contains tables describing the system signals. Table 56. System Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O NMI_b -- Non-maskable interrupt I RESET_b -- Reset bidirectional signal I/O VDD_[1:0] VDD Power supply I Table continues on the next page... 84 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments Table 56. System Module Signal Descriptions (continued) SoC Signal Name Module Signal Name Description I/O Ground VSS Ground I VDD_RF[3:1] VDD_RF Radio power supply I VDCDC_IN VDCDC_IN VDCDC_IN I VDD_1P8OUT VDD_1P8 DCDC 1.8 V Regulated Output / Input in bypass I/O VDD_1P5OUT_PMCIN VDD_1P5/VDD_PMC DCDC 1.5 V Regulated I/O Output / PMC Input in bypass (LQFN only) VDD_1P5_CAP1 VDD_1P5 DCDC 1.5V Regulated output O (WLCSP Only) VDD_1P5_PMCIN1 VDD_PMC PMC Input (WLCSP Only) I PSWITCH PSWITCH DCDC enable switch I DCDC_CFG DCDC_CFG DCDC switch mode select I DCDC_LP DCDC_LP DCDC inductor input positive I/O DCDC_LN DCDC_LN DCDC inductor input negative I/O DCDC_GND DCDC_GND DCDC ground I 1. VDD_1P5_CAP and VDD_1P5_PMCIN should always be connected together via PCB trace. System designers should take care to ensure this connection is as short as possible. Table 57. LLWU Module Signal Descriptions SoC Signal Name LLWU_P[15:0] Module Signal Name LLWU_P[15:0] Description Wakeup inputs I/O I 8.3.4 Clock Modules This section contains tables for Clock signal descriptions. Table 58. Clock Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O EXTAL EXTAL 26 MHz/32 MHz External clock/Oscillator input I XTAL XTAL 26 MHz/32 MHz Oscillator input I XTAL_OUT XTAL_OUT 26 MHz/32 MHz Clock output O XTAL_OUT_EN XTAL_OUT_ENABLE 26 MHz/32 MHz Clock I output enable for XTAL_OUT Table continues on the next page... MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 85 NXP Semiconductors Pin Diagrams and Pin Assignments Table 58. Clock Module Signal Descriptions (continued) SoC Signal Name Module Signal Name Description I/O EXTAL32K EXTAL32K 32 kHz External clock/ Oscillator input I XTAL32K XTAL32K 32 kHz Oscillator input I CLKOUT CLKOUT Internal clocks monitor O 8.3.5 Analog Modules This section contains tables for Analog signal descriptions. Table 59. ADC0 Signal Descriptions SoC Signal Name Module Signal Name Description I/O ADC0_DM0 DADM0 ADC Channel 0 Differential Input Negative I ADC0_DP0 DADP0 ADC Channel 0 Differential Input Positive I ADC0_SE[5:1] AD[5:1] ADC Channel 0 Single-ended I Input n VREFH VREFSH Voltage Reference Select High I VDDA VDDA Analog Power Supply I VSSA VSSA Analog Ground I Table 60. CMP0 Signal Descriptions SoC Signal Name Module Signal Name Description I/O CMP0_IN[5:0] IN[5:0] Analog voltage inputs I CMP0_OUT CMP0 Comparator output O Table 61. DAC0 Signal Descriptions SoC Signal Name DAC0_OUT Module Signal Name VOUT Description DAC output I/O O Table 62. VREF Signal Descriptions SoC Signal Name VREF_OUT 86 NXP Semiconductors Module Signal Name VREF_OUT Description Internally generated voltage reference output I/O O MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Pin Diagrams and Pin Assignments 8.3.6 Timer Modules This section contains tables describing timer module signals. Table 63. TPM0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM0_CH[3:0] TPM_CH[3:0] TPM channel I/O Table 64. TPM1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM1_CH[1:0] TPM_CH[1:0] TPM channel I/O Table 65. TPM2 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM2_CH[1:0] TPM_CH[1:0] TPM channel I/O Table 66. LPTMR0 Module Signal Descriptions SoC Signal Name LPTMR0_ALT[2:1] Module Signal Name LPTMR0_ALT[2:1] Description Pulse counter input pin I/O I Table 67. RTC Module Signal Descriptions SoC Signal Name RTC_CLKOUT Module Signal Name RTC_CLKOUT MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Description 1 Hz square-wave output I/O O 87 NXP Semiconductors Pin Diagrams and Pin Assignments 8.3.7 Communication Interfaces This section contains tables for the signal descriptions for the communication modules. Table 68. SPI0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SPI0_PCS0 PCS0/SS Chip Select/Slave Select I/O SPI0_PCS[2:1] PCS[2:1] Chip Select O SPI0_SCK SCK Serial Clock I/O SPI0_SIN SIN Data In I SPI0_SOUT SOUT Data Out O Table 69. SPI1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SPI1_PCS0 SPI1_PCS0 Chip Select/Slave Select I/O SPI1_SCK SCK Serial Clock I/O SPI1_SIN SIN Data In I SPI1_SOUT SOUT Data Out O Table 70. I2C0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O I2C0_SCL SCL I2C serial clock line I/O I2C0_SDA SDA I2C serial data line I/O Table 71. I2C1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O I2C1_SCL SCL I2C serial clock line I/O I2C1_SDA SDA I2C serial data line I/O Table 72. LPUART0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O LPUART0_CTS_b LPUART CTS Clear To Send I LPUART0_RTS_b LPUART RTS Request To Send O LPUART0_RX LPUART RxD Receive Data I LPUART0_TX LPUART TxD Transmit Data1 I/O 1. This pin is normally an output, but is an input (tristated) in single wire mode whenever the transmitter is disabled or transmit direction is configured for receive data 88 NXP Semiconductors MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 Package Information 8.3.8 Human-Machine Interfaces(HMI) This section contains tables describing the HMI signals. Table 73. GPIO Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O PTA[19:16][2:0] PORTA19-16, 2-0 General Purpose Input/ Output I/O PTB[18:16][3:0] PORTB18-16, 3-0 General Purpose Input/ Output I/O PTC[19:16][7:1] PORTC19-16, 7-1 General Purpose Input/ Output I/O Table 74. TSI0 Module Signal Descriptions SoC Signal Name TSI0_CH[15:0] Module Signal Name TSI[15:0] Description Touch Sensing Input capacitive pins I/O I/O 9 Package Information 9.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to nxp.com and perform a keyword search for the drawing's document number: Table 75. Packaging Dimensions If you want the drawing for this package Then use this document number 48-pin Laminate QFN (7x7) 98ASA00694D 75-pin WLCSP (3.893x3.797) 98ASA00956D MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 89 NXP Semiconductors Revision History 10 Revision History Table 76. MKW41Z Revision History Rev. No. Date Substantial Changes 4 03/2018 Rev 3 07/2017 Added "32 kHz oscillator frequency specifications" table in Clock Modules section. Rev 2 07/2017 * Added WLCSP package details * Updated "DC-DC Converter Specifications" table Rev 1 10/2016 90 NXP Semiconductors * Added Zigbee 3.0 in supported standards * Updated Flash memory protection features * Updated Table 12 Voltage and current operating behaviors footnotes * Corrected Table 21 typos * Updated Table 26 Reference crystal specifications verbiage * Updated Temperature sensor slow information (Table 33 16-bit ADC characteristics) * Updated DCDC converter operating requirements and specifications * Added DCDC pin voltage operating range to Table 52. Voltage and current operating ratings Initial Release MKW41Z/31Z/21Z Data Sheet, Rev. 4, 03/2018 How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Information in this document is provided solely to enable system and software implementers to use NXP products. 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