(Ul Bey 5-etett (ful) Nihon inter Electronics Corporation 0.8A Avg. 600 Volts FRD EC8FS6 MSAK MAXIMUM RATINGS MOUTLINE DRAWING(mm) . Type . Rating symbol EC8FS6 Unit 5.18) gore rs + + * 4. ro2 I . Cow LE em Ty 600 V oe | oe Repetitive Peak Reverse Voltage RRM I i F VE ROR LH pox} CHIH, EEL SONE MATa =25 C off] S ae Average Substrate mounted I 0.65 Half Sine Wave, Resistive Load A }: a Rectified Alumina 0 (8 MINN are 1aO Mita =35C) A ee Oulput Current | Substrate mounted . Half Sine Wave, Resistive Load a e In : > D RMS Forward Current Trims) 1.256 A ns 4 Hho (SOHZHUL ESA Tae Lhd LIES KL) rata 12t Surge Forward Current Teso 20 Half Sine Wave, lcycle, Non-repetilive A hark Wo Pe ikke EE TH TT. AN c ot , . Operating Junction Temperature Range T; w 40 + 150 C SOLDERING SK ff tht i ac A _ Ae c - 4 Storage Temperature Range T stg 40 + 1 50 C : @ MS sass ELECTRICAL CHARACTERISTICS = MAPPROX. NET WEIGHT:0.06g Characteristic Symbol Test Condition Min. | Typ. | Max. | Unit E - 7 at = P= 95% _ Peak Reverse Surrey I = Tee Vam= Vierm Ty=25 Cc 20 Ut A e ve i ao ORY _ w~, Peak Forward Voltage Vem lew =0.8A Tj 29C 1.32 Vv i Wl itt ay iN t Ip=Ir=10mA Ta=23C 400 ns Reverse Recovery Time tr Tem = 1A -di/dt=50A/ us Ta=25C _ _ 80 ns fae ph CHE GB - Sa WH BD) Glass-Epoxy Substrate mounted * _ _ 157 | C/W Thermal Resistance Junction to Rin (j-a) - z Ambient) Alumina Substrate mounted * _ _ 108 | C/W * Soldering Lands = 2X2 mm rn ME - tthe FIG. FIG.2 FIG.3 SB QE & tt ! ee i FH MED BH a ge FH MRR - BRR EH FORWARD CURRENT VS. 40! TAGE i : AVERAGE FORWARD POWER DISSIPATION AVERAGE FORWARD CURRENT v5 AMBIENT TEMPERATURE ; aan comoue TION ANGLE. FOREARD CURRENT 144 > ee SB Se Go wR eH INSTANTANEQUS AVERAGE FORWARD POWER DISSIPATION (wt 2 28 ' "s Q 2s ? 8 ae be 0.8 og Hi ne INSTANTANEOUS FOPWARD VOLTAGE 1} AVERAGE FORWARD CUARENT 'A) ReEMRE ivi ey BER fA) FIG.4 FIG.5 tao" 3 RR - REAM EB AVERAGE FORWARD CURGENT AMBIENT TEMPERATURE Alumita Supsteate Moun gerong Lands 242ne o - MRR E SURGE CURRENT RATINGS $=59H2,Hal* Sing Wave ,Ncn-epel itive Ne Load aan EOMOLCTION ANGE = + + = & I ~ 9 S ws a 3 3 ai: Mog & ai aS & g Rg tai 2 (A) 3 ~ e902 C05 Gt 0? ag t AMBIENT TEMPERS TIE (7D) TIME (81 . Ree eC) mM is) 193 ee CONDUCTION ANGLE 2: 9 & 64 Eager p80" Po we pee se ask pee P| mE secr6a | mee PSS iar & b Po] 67h eG 25 ii Glass-Enoxy Substrate Mounted Soldering .ard=20 2mm: scaFS6 ANBIENT TEMPERATURE (*< REZ ek Co