INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1002N-R07 1
CPC1002N
60V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1002N 4-Pin SOP (100/tube)
CPC1002NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 700 mADC
On-Resistance (max) 0.55
LED Current to operate 2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Designed for use in Security Systems Complying
with EN50130-4
• Only 2mA of LED Current Required to Operate
• Small 4-Pin SOP Package
• 100% Solid State
• High Reliability
• Arc-Free With No Snubbing Circuits
• 1500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
The CPC1002N is a miniature, normally-open
(1-Form-A) DC solid state relay in a 4-pin SOP
package that employs optically coupled MOSFET
technology to provide 1500Vrms of input to output
isolation. The super-efficient MOSFET switches and
photovoltaic die use IXYS Integrated Circuits' patented
OptoMOS architecture. The optically coupled output is
controlled by the input's highly efficient infrared LED.
The CPC1002N uses IXYS Integrated Circuits' state of
the art double-molded vertical construction packaging
to produce one of the world’s smallest relays. The
CPC1002N offers board space savings of at least 20%
over the competitor’s larger 4-pin SOP relay.
1
2
3
4
+ Control
– Control
DC +
DC -
Switching Characteristics
of Normally-Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R07
CPC1002N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 170 mW
Total Power Dissipation 2400 mW
Isolation Voltage Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current, Continuous 1IF=2mA IL- - 700 mADC
Peak Load Current t=10ms ILPK --1A
P
On-Resistance 2IL=100mA RON - 0.35 0.55
Off-State Leakage Current VL=60VPILEAK --1A
Switching Speeds
Turn-On IF=3mA, VL=10V ton - 1.3 5 ms
Turn-Off toff - 0.41 2
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 -pF
Input Characteristics
Input Control Current to Activate 3IL=100mA IF- 0.55 2 mA
Input Control Current to Deactivate - IF0.3 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 -pF
1 Load current derates linearly from 700mA @ 25oC to 420mA @80oC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC1002N
www.ixysic.com 3
R07
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
35
30
25
20
15
10
5
0
68 70 72 7469 71 73
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
0.32 0.34 0.36 0.380.33 0.35 0.37
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=100mA)
On-Resistance (:)
1.0 1.2 1.4 1.61.1 1.3 1.5
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=3mA, IL=100mA)
0.38 0.40 0.42 0.440.430.410.39
Turn-Off Time (ms
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=3mA, IL=100mA)
35
30
25
20
15
10
5
0
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
Typical IF for Switch Operation
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
0.50 0.60 0.700.45 0.55 0.65 0.75
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=20mA
IF=50mA
LED Current (mA)
-40
1.50
1.25
1.00
0.75
0.50
0.25
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
LED Current (mA)
-40
1.50
1.25
1.00
0.75
0.50
0.25
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R07
CPC1002N
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
Turn-On Time (ms)
-40
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
-20 0 20 40 60 80 100
Typical Turn-On Time vs. Temperature
(IF=3mA, IL=100mA)
Temperature (ºC)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IF=3mA, IL=100mA)
Temperature (ºC)
-40
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(IL=100mA)
Temperature (ºC)
On-Resistance (:)
I
F
=2mA
I
F
=5mA
Load Current (mA)
900
800
700
600
500
400
300
200
100
0
Typical Maximum Load Current
vs. Temperature
-40 -20 0 20 40 60 80 120100
Temperature (ºC)
IF=5mA
IF=2mA
Blocking Voltage (VP)
-40
76
74
72
70
68
66
64
62
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Leakage (PA)
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=60V)
Time
Load Current (A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 100ms 1s10ms 10s 100s
Energy Rating Curve
Load Voltage (V)
Load Current (mA)
600
500
400
300
200
100
0
0 0.05 0.10 0.15 0.20 0.25 0.30
Typical Load Current vs. Load Voltage
(IF=2mA)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
10
9
8
7
6
5
4
3
2
1
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
INTEGRATED CIRCUITS DIVISION
CPC1002N
www.ixysic.com 5
R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1002N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1002N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1002N-R07
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/1/2018
For additional information please visit our website at: www.ixysic.com
6
CPC1002N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1002N
CPC1002NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
3.85
(0.152)
1.54
(0.061)
0.60
(0.024)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 ± 0.025
(0.015 ± 0.001)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(
0-0.004
)
0.481
(0.019)
0.203 ± 0.025
(0.008 ± 0.001)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
