© 2005 Fairchild Semiconductor Corporation DS005213 www.fairchildsemi.com
September 1983
Revised May 2005
MM74HC574 3-STATE Octal D-Type Edge-Triggered Flip-Flop
MM74HC574
3-STATE Octal D-Type Edge-Triggered Flip-Flop
General Descript ion
The MM74HC574 high speed octal D-type flip-flops utilize
advanced silicon-gate P-well CMOS technology. Th ey pos-
sess the hi gh noise immun ity an d low power consu mption
of standard CMOS integrated circuits, as well as the ability
to drive 15 LS-TTL loads. Due to the large output drive
capability and t he 3-STATE feature, these devices are id e-
ally suited for interfacing with bus lines in a bus organized
system.
These devices are positive edge triggered flip-flops. Data
at the D inputs, meeting the set-up and hold time require-
ments, are transferred to the Q outputs on positive going
transitions of the CLOCK (CK) input. When a high logic
level is applied to the OUTPUT CONTROL (OC) input, all
outputs go to a high impedance state, regardless of what
signals are present at th e other inputs and the state of the
storage elements.
The 74H C logic f amily is sp eed, functio n, and pi nout com -
patible with the standard 74LS logic family. All inputs are
protect ed from damage due to static di scharge by in ternal
diode clamps to VCC and ground.
Features
Typical propagation delay: 18 ns
Wide operat i ng voltage range: 2V– 6V
Low input current: 1
P
A maximum
Low quiescent current: 80
P
A maximum
Compatible with bus-oriented systems
Output drive capability: 15 LS-TTL loads
Ordering Code:
Devices also available in Tape and Reel. Specify by ap pending th e s uffix let t er X to th e ordering co de.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP a nd TSSOP
Top View
Truth Table
H
HIGH Level
L
LOW Le vel
X
Don't Care
n
Transition f rom LOW-to-HIGH
Z
High Impedance State
Q0
The level of the output before steady state input conditions were
established
Order Number Package Number Package Description
MM74HC574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
MM74HC574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC574N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Output Clock Data Output
Control
L
n
HH
L
n
LL
LLXQ
0
HXXZ
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MM74HC574
Absolute Maximum Ratings(Note 1)
(Note 2) Recommended Operating
Conditions
Note 1: Maximum Ratings are those values beyond which damage to the
device may occur.
Note 2: Unless ot herw ise sp ec ified all vo lt ages are referenced to gr ound.
Note 3: Power Dis sipation temp erature de rating plastic N package:
12 mW/
q
C from 65
q
C to 85
q
C.
DC Electrical Characteristics (Note 4)
Note 4: For a power supply of 5V
r
10% the worst-case output voltages (VOH, and VOL) occur for HC a t 4.5V. Thus the 4.5V values should be use d when
designing with this supply. Worst-case VIH and VIL occur at VCC
5.5V and 4.5V respectively. (The VIH value at 5. 5V is 3.85 V.) The worst-cas e leakage cur-
rent (IIN, ICC, and IOZ) occur for CMOS at the hi gher voltage and so the 6.0V valu es s hould be u s ed.
Supply Voltage (VCC)
0.5 to
7.0V
DC Input Voltage (VIN)
1.5 to VCC
1.5V
DC Output Voltage (VOUT)
0.5 to VCC
0.5V
Clamp Diode Current (IIK, IOK)
r
20 mA
DC Output Current, per pin (IOUT)
r
35 mA
DC VCC or GND Current, per pin (ICC)
r
70 mA
Storage Temperature Range (TSTG)
65
q
C to
150
q
C
Power Dissipation (PD)
(Note 3) 600 mW
S.O. Package only 500 mW
Lead Temperature (TL)
(Soldering 10 seconds) 260
q
C
Min Max Units
Supply Voltage (VCC)26V
DC Input or Output Voltage 0 VCC V
(VIN,VOUT)
Operating Temperature Range (TA)
40
85
q
C
Input Rise or Fall Times
(tr, tf) V
CC
2.0V 1000 ns
VCC
4.5V 500 ns
VCC
6.0V 400 ns
Symbol Parameter Conditions VCC TA
25
q
CT
A
40 to 85
q
CT
A
55 to 125
q
CUnits
Typ Guar ant eed Lim i ts
VIH Minimum HIGH Level Input 2.0V 1.5 1.5 1.5 VVoltage 4.5V 3.15 3.15 3.15
6.0V 4.2 4.2 4.2
VIL Maximum LOW Level Input 2.0V 0.5 0.5 0.5 VVoltage 4.5V 1.35 1.35 1.35
6.0V 1.8 1.8 1.8
VOH Minimum HIGH Level Output VIN
VIH or VIL
Voltage |IOUT|
d
20
P
A 2.0V 2.0 1.9 1.9 1.9 V4.5V 4.5 4.4 4.4 4.4
6.0V 6.0 5.9 5.9 5.9
VIN
VIH or VIL
|IOUT|
d
6.0 mA 4.5V 4.2 3.98 3.84 3.7 V
|IOUT|
d
7.8 mA 6.0V 5.7 5.48 5.34 5.2
VOL Maximum LOW Level Output VIN
VIH or VIL
Voltage |IOUT|
d
20
P
A 2.0V 0 0.1 0.1 0.1 V4.5V 0 0.1 0.1 0.1
6.0V 0 0.1 0.1 0.1
VIN
VIH or VIL
|IOUT|
d
6.0 mA 4.5V 0.2 0.26 0.33 0.4 V
|IOUT|
d
7.8 mA 6.0V 0.2 0.26 0.33 0.4
IIN Maximum Input Current VIN
VCC or GND 6.0V
r
0.1
r
1.0
r
1.0
P
A
IOZ Maxim um 3-STATE VOUT
VCC or GND
Output Leakage Current OC
VIH 6.0V
r
0.5
r
5.0
r
10
P
A
ICC Maximum Quiescent Supply VIN
VCC or GND
Current IOUT
0
P
A 6.0V 8.0 80 160
P
A
'
ICC Quiescent Supply Current V CC
5.5V OE 1.0 1.5 1.8 2.0 mAper Input Pin VIN
2.4V CLK 0.6 0.8 1.0 1.1
or 0.4V (Note 4) DATA 0.4 0.5 0.6 0.7
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MM74HC574
AC Electrical Characteristics
VCC
5V, TA
25
q
C, tr
tf
6 ns
AC Electrical Characteristics
VCC
2.0
6.0V, CL
50 pF, tr
tf
6 ns (unless otherwise specified)
Symbol Parameter Conditions Typ Guaranteed Units
Limit
fMAX Maximum Operating Frequency 60 33 MHz
tPHL, tPLH Maximum Propagation Delay, Clock to Q CL
45 pF 17 27 ns
tPZH, tPZL Maximum Output Enable Time RL
1 k
:
19 28 ns
CL
45 pF
tPHZ, tPLZ Maximum Output Disable Time RL
1 k
:
14 25 ns
CL
5 pF
tSMinimum Setup Time, Data to Clock 10 12 ns
tHMinimum Hold Time, Clock to Data
35ns
tWMinimum Pulse Cl ock Width 8 15 ns
Symbol Parameter Conditions VCC TA
25
q
CT
A
40 to 85
q
CT
A
55 to 125
q
CUnits
Typ Guaranteed Limits
fMAX Maximum Operating Frequency CL
50 pF 2.0V 33 28 23 MHz4.5V 30 24 20
6.0V 35 28 23
tPHL, tPLH Maximum Propagation CL
50 pF 2.0V 18 30 38 45 ns
Delay, Clock to Q CL
150 pF 2.0V 51 155 194 233
CL
50 pF 4.5V 13 23 29 35 ns
CL
150 pF 4.5V 19 31 47 47
CL
50 pF 6.0V 12 20 25 30 ns
CL
150 pF 6.0V 18 27 34 41
tPZH, tPZL Maximum Output Enable RL
1 k
:
Time CL
50 pF 2.0V 22 30 38 45 ns
CL
150 pF 2.0V 59 180 225 270
CL
50 pF 4.5V 14 28 35 42 ns
CL
150 pF 4.5V 20 36 45 54
CL
50 pF 6.0V 12 24 30 36 ns
CL
150 pF 6.0V 18 31 39 47
tPHZ, tPLZ Maximum Output Disable Time RL
1 k
:
2.0V 15 30 38 45 nsCL
50 pF 4.5V 12 25 31 38
6.0V 10 21 27 32
tSMinimum Setup Time 2.0V 6 12 15 18 nsData to Clock 4.5V 20 25 30
6.0V 17 21 25
tHMinimum Hold Time 2.0V
15 6 8 nsC lock to Data 4.5V 0 0 0
6.0V 0 0 0
tTHL, tTLH Maximum Output Rise CL
50 pF 2.0V 6 12 15 18 nsand Fall Time 4.5V 7 12 15 18
6.0V 6 10 13 15
tWMinimum Clock Pulse Width 2.0V 30 15 20 24 ns4.5V 9 16 20 24
6.0V 8 14 18 20
tr,tfMaximum Clock Input Rise 2.0V 1000 1000 1000 nsand Fall Time 4.5V 500 500 500
6.0V 400 400 400
CPD Power Dissipation Capacitance OC
VCC 5pF
(Note 5) (per latch) OC
GND 58
CIN Maximum Input Capacitance 5 10 10 10 pF
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MM74HC574
AC Electrical Characteristi cs (Continued)
Note 5: CPD determines the no load dynam ic pow er cons um ption, PD
CPD VCC2 f
ICC VCC, and th e no load dy namic current co ns um ption ,
IS
CPD VCC f
ICC.
Symbol Parameter Conditions VCC TA
25
q
CT
A
40 to 85
q
CT
A
55 to 125
q
CUnits
Typ Guaranteed Limits
COUT Maximum Output 15 20 20 20 pF
Capacitance
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MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
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MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ T YPE II, 5.3mm Wide
Package Number M20D
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MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lea d Th in S hri nk Sm all Ou tlin e Pack age (TSSOP ), JED EC MO-1 53, 4.4mm Wide
Package Number MTC20
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MM74HC574 3-STATE Octal D-Type Edge-Triggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N20A
Fairchild does no t assume any responsibility for use of any circui try described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life suppor t de vices o r systems a re devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical compon ent in any componen t of a life support
device or system whose failure to perform can be rea-
sonabl y ex pect ed to cause the fa ilu re of the li fe su pp ort
device or system, or to affect its safety or effectiveness.
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