BAV99WT
200mW 75Volt
Plastic-Encapsulate
Diode
Features
Low Current Leakage
Low Cost
Small Outline Surface Mount Package
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage VR
75V
Average Rectified
Output Current IO
150mA
Power Dissipation PTOT 200mW
Maximum
Instantaneous
Forward Voltage VF855mV IFM = 10mA;
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR2.5µAVR=75Volts
TJ = 25°C
Typical Junction
Capacitance CJ
2.0pF Measured at
1.0MHz, VR=0V
Reverse Recovery
Time Trr
4nS IF=10mA
VR = 0V
RL=100
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
KJG
C/A
A C
Pin Configuration
Top View
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MCC
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Revision: 3 2006/05/13
SOT-323
Suggested Solder
Pad Layout
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .071 .087 1.80 2.20
B .045 .053 1.15 1.35
C .079 .087 2.00 2.20
D .026 Nominal 0.65Nominal
E .047 .055 1.20 1.40
F .012 .016 .30 .40
G .000 .004 .000 .100
H .035 .039 .90 1.00
J .004 .010 .100 .250
K .012 .016 .30 .40
A
C
B
D
E
F
G
H
J
1.90
0.70
0.90
0.65
0.65
DIMENSIONS
K
1000mV IFM = 50mA;
1250mV IFM = 150mA;
715mV IFM = 1mA;
TM
Micro Commercial Components
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
1 of 3
BAV99WT MCC
1
10
100
1000
10,000
0 100 200
I , LEAKAGE CURRENT (nA)
R
T , JUNCTION TEMPERATURE (°C)
Fig. 2 Leakage Current vs Junction Temperature
j
V = 20V
R
10
1.0
100
1000
0.1
0.01
01
I , INSTANTANE
US F
RWARD CURRENT (mA)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Forward Characteristics
F
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Revision: 3 2006/05/13
TM
Micro Commercial Components
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MCC
www.mccsemi .com
Revision: 3 2006/05/13
TM
Micro Commercial Components
www.mccsemi.com
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products are represented on our website, harmless against all damages.
***APPLICATIONS DISCLAIMER***
***IMPORTANT NOTICE***
Aerospace or Military Applications.
Products offer by Micro Commercial Components Corp .are not intended for use in Medical,
Micro Commercial Components Corp
. reserves the right to make changes without further notice to any
product herein to make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components Corp .does not assume any liability arising out of the application or
use of any product described herein; neither does it convey any license under its patent rights ,nor
the rights of others . The user of products in such applications shall assume all risks of such use
and will agree to hold Micro Commercial Components Corp .and all the companies whose