Data Sheet
TM
16A: SIP Non-Isolated DC-DC Power Modules
3Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 16A Output Current
January 20, 2016 ©2016 General Electric Company. All rights reserved. Page 14
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should always be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Fig. 33. Note that the
airflow is parallel to the long axis of the module as shown in
Fig. 34. The derating data applies to airflow in either direction
of the module’s long axis.
Figure 33. Thermal Test Set-up.
The thermal reference point, Tref used in the specifications is
shown in Figure 33. For reliable operation this temperature
should not exceed 115 oC. The output power of the module
should not exceed the rated power of the module (Vo,set x
Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Thermal derating curves showing the
maximum output current that can be delivered at different
local ambient temperature (TA) for airflow conditions ranging
from natural convection and up to 2m/s (400 ft./min) are
shown in the Characteristics Curves section.
Figure 34. Tref Temperature measurement location
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual wave
soldering machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave soldering
processes. A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the Pb-free
solder pot is 270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole Pb or Pb-
free reflow process. If additional information is needed, please
consult with your GE technical representative for more details.