MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
Mar. 2002
PS12038 INTEGRATED FUNCTIONS AND FEATURES
3 phase IGBT inverter bridge configured by the latest 3rd.
generation IGBT and diode technology.
Inverter output current capability IO (Note 1):
APPLICATION
Acoustic noise-less 3.7kW/400V AC Class 3 phase inverters, motor control applications, and
motors with built-in small size inverter package
PACKAGE OUTLINES
Type Name
PS12038 IO (100%)
9.2Arms IO
(150%; 60sec)
13.8Arms
Motor Rating
3.7 kW/400V AC
(Note 1) : The inverter output current is assumed to be sinu-
soidal and the peak current value of each of the
above loading cases is defined as : IOP = IO × 2,
TC < 100°C
(Fig. 1)
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS:
P-Side IGBTs : Drive circuit, high-level-shift circuit, Bootstrap circuit supply scheme for single control-power-source drive, and Under
voltage (UV) protection,
N-Side IGBTs : Drive circuit, DC-Link current sense and amplifier circuits for over-current protection, Control-supply under-voltage
(UV) protection, and fault output (FO) signaling circuit.
Fault Output : N-side IGBT short circuit (SC), over-current (OC), and control supply under-voltage (UV).
Inverter Analog Current Sense : N-Side IGBT DC-Link Current Sense.
Input Interface : 5V CMOS/TTL compatible, Schmitt Trigger input, and Arm-Shoot-Through interlock protective function.
Terminals Assignment :
1. P
2. N
3. NC
4. U
5. V
6. W
7. F
O
8. Vamp
9. GND
10. WN
11. VN
12. UN
13. WP
14. VP
15. UP
16. TH
17. VD
18. NC
19. CBW
20. CBW+
21. CBV
22. CBV+
23. CBU
24. CBU+
LABEL
9
12.5
17
20.4
3
15 77
Detail : A
2
2
0~1.0
4-φ4
40.52
A
84
12 12
62
77
33.5 26
24
22
9.5
32
6.5
9
54
3 3
79
2.5 2.5
47
±0.2
95
±0.2
103
81
0.5
0.5
1
1.4
(1) (3)(2) (5)(4) (6)
(7)
(18)(19)
(21)(24)
7.62 7.62 7.62 7.62
8-R1
4-R4
4-R2
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
Mar. 2002
+
W
V
N
P
U
VD
UP
VP
WP
UN
VN
WN
FO
V(amp)
GND
Input signal conditioning
(Interlock circuit)
Level shifter
Drive circuit
Drive circuit
UV Protection
Fo Circuit
OC/SC Protection
TH
UV Protection
INTERNAL FUNCTIONS BLOCK DIAGRAM
MAXIMUM RATINGS (Tj = 25°C)
INVERTER PART
CONTROL PART
(Fig. 2)
Condition
Symbol Item Ratings Unit
Applied between P-N
Applied between P-N, Surge-value
Applied between P-U.V.W, U.V.W-N
Applied between P-U.V.W, U.V.W-N
(Pulse)
TC = 25°C, ( ) means IC peak value
VCC
VCC(surge)
VP or VN
VP(S) or
VN(S)
±Ic(±Icp)
Supply voltage
Supply voltage (surge)
Each IGBT collector-emitter static voltage
Each IGBT collector-emitter switching
voltage
Each IGBT collector current
900
1000
1200
1200
±25 (±50)
V
V
V
V
A
Symbol Item Ratings Unit
VD, VDB
VCIN
VFO
IFO
Iamp
Supply voltage
Input signal voltage
Fault output supply voltage
Fault output current
DC-Link IGBT current signal Amp output current
0.5 ~ 20
0.5 ~ +7.5
0.5 ~ +7.5
15
1
V
V
V
mA
mA
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
Mar. 2002
TOTAL SYSTEM
(Note 2) : The indicated values are specified considering the safe operation of all the parts within the ASIPM. The max. ratings for the ASIPM
power chips (IGBT & FWDi) is Tj < 150.
THERMAL RESISTANCE
ELECTRICAL CHARACTERISTICS (Tj = 25°C, VD = 15V, VDB = 15V unless otherwise noted)
(Fig. 3)
CASE TEMPERATURE MEASUREMENT POINT
ConditionSymbol Item Ratings Unit
(Note 2)
(Fig. 3)
60 Hz sinusoidal AC applied between all terminals and
the base plate for 1 minute.
Mounting screw: M3.5
Tj
Tstg
TC
VISO
Junction temperature
Storage temperature
Module case operating temperature
Isolation voltage
Mounting torque
20 ~ +125
40 ~ +125
20 ~ +100
2500
0.78 ~ 1.27
°C
°C
°C
Vrms
N·m
ConditionSymbol Item Ratings
Inverter IGBT (1/6)
Inverter FWDi (1/6)
Case to fin, thermal grease applied (1 Module)
Rth(jc)Q
Rth(jc)F
Rth(cf)
Junction to case Thermal
Resistance
Contact Thermal Resistance
Min. °C/W
°C/W
°C/W
Typ. Max.
1.5
2.0
0.045
Unit
Short circuit endurance
(Output, Arm, and Load, Short Circuit Modes)
Switching SOA
Tj = 25°C, Input = ON, Ic = 5A, VD = VDB = 15V
(Shunt voltage drop not included)
Tj = 25°C, IC = 25A
1/2 Bridge inductive, Input = 5V 0V
VCC = 600V, IC = 5A, Tj = 125°C
VD = 15V, VDB = 15V
Note: ton, toff include delay time of the internal control
circuit.
Condition
Symbol Item Ratings
Min.
V
V
µs
µs
µs
µs
µs
Typ. Max.
0.3
1.2
0.5
2.2
0.9
0.2
3.6
3.5
2.0
1.4
4.0
1.6
No destruction
FO output by protection operation
No destruction
No protecting operation
No FO output
Collector-emitter saturation
voltage
FWDi forward voltage
Switching times
FWDi reverse recovery time
VCE(sat)
VEC
ton
tc(on)
toff
tc(off)
trr @VCC 800V, Input = 5V 0V (One-Shot)
20˚C Tj(start) 125°C, 13.5V VD = VDB 16.5V
@VCC 800V, Input = 5V 0V, Tj 150°C
IC < OC trip level, 13.5V VD = VDB 16.5V
Unit
Tc
LABEL
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
Mar. 2002
200
1
2
3
4
5
300
1000
0
Vamp (V)
Vamp (200%)
Vamp (100%)
VD = 15V
Tj = 25°C
Vamp
DC-LINK IGBT Current (%), (IC = IO 2)
(Fig. 4)
INVERTER DC-LINK IGBT CURRENT ANALOGUE
SIGNALING OUTPUT (TYPICAL)
RECOMMENDED OPERATING CONDITIONS
V
V
V
V/µs
V
V
µs
°C
kHz
µs
800
16.5
16.5
+1
0.8
5.0
100
15
13.5
13.5
1
0
4.0
4.0
1
Applied across P-N terminals
Applied between VD-GND
Applied between CBU+ & CBU, CBV+ & CBV, CBW+ & CBW
Applied between UP VP WP UN VN WN and
GND
Relates to corresponding inputs
TC 100°C, Tj 125°C
Condition
Symbol Item Ratings
VCC
VD
VDB
VD, VDB
VCIN(ON)
VCIN(OFF)
tdead
TC
fPWM
tXX
Supply voltage
Supply voltage
Supply voltage
Supply voltage ripple
Input on voltage
Input off voltage
Arm shoot-through blocking time
Module case operating temperature
PWM Input frequency
Allowable input on-pulse width
Min. Typ. Max.
600
15.0
15.0
Unit
ELECTRICAL CHARACTERISTICS (Tj = 25°C, VD = 15V, VDB = 15V unless otherwise noted)
(Note 3) : The dead-time has to be set externally by the CPU; it is not part of the ASIPM internal functions.
(Note 4) : Fault output signaling is given only when the internal OC, SC, & UV protection circuits are activated.
The OC, SC and UV protection (and fault output) operate for the lower arms only. The OC and SC protection Fault output is given
in a pulse format while that of UV protection is maintained throughout the duration of the under-voltage condition.
Tj = 25°C, VD = 15V, Vin = 5V
Tj = 25°C, VD = VDB = 15V, Vin = 5V
Applied between input terminal-Inside power supply
TC 100°C, Tj 125°C
Relates to corresponding inputs
TC = 20°C ~ +100°C (Note 3)
Relates to corresponding input (Fig. 6)
IC = IOP(100%) VD = 15V
IC = IOP(200%) Tj = 25°C (Fig. 4)
IC = IOP(250%) VD = 15V
IC = 0A (Fig. 4)
Tj = 25°C (Fig. 5)
Tj = 25°C (Fig. 5)
Tj = 25°C (Fig. 5)
Tj = 25°C (Fig. 5)
20°C ~ 100°C
TC = Tj = 25°C
Tj = 25°C (Note 4)
Open drain output (Note 4)
Tc = 25°C
Resistance at 25°C, 50°C
Circuit current
Circuit current
Input on threshold voltage
Input off threshold voltage
Input pull-up resistor
PWM input frequency
Arm shoot-through blocking time
Input interlock sensing
Inverter DC-Link IGBT current sense voltage
output signal
Inverter DC-Link IGBT current sense voltage
output limit
Over current trip level
Over current delay time
Short circuit trip level
Short circuit delay timeVD UV trip level
VD UV reset level
VDB UV trip level
VDB UV reset level
UV delay time
Fault output pulse width
Fault output current
Thermistor Resistance
Thermistor B constant
Condition
Symbol Ratings
ID
IDB
Vth(on)
Vth(off)
Ri
fPWM
tdead
tint
Vamp(100%)
Vamp(200%)
Vamp(250%)
Vamp(0)
OC
tOC
SC
tSC
UVD
UVDr
UVDB
UVDBr
tdV
tFO
IFo(H)
IFo(L)
RTH
B
Min. mA
mA
V
V
k
kHz
µs
ns
V
V
V
mV
A
µs
A
µs
V
V
V
V
µs
ms
µA
mA
k
K
Typ. Max.
0.8
2.5
4.0
1.5
3.0
5.0
39
11.0
11.5
10.1
10.6
1.0
9.5
1.4
3.0
50
10
100
2.0
4.0
50
46.5
10
69.7
2
12.0
12.5
10.8
11.3
10
1.8
10
3450
50
5
2.0
4.0
15
2.5
5.0
100
12.75
13.25
11.6
12.1
1
15
10.5
Unit
Supply circuit under
voltage protection
Item
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS12038
FLAT-BASE TYPE
INSULATED TYPE
Mar. 2002
SC
Ic(A)
OC
tw (µs)
Over current trip level
Collector current
Short circuit trip level
102
0
CURRENT ABNORMALITY PROTECTIVE FUNCTIONS
ARM-SHOOT-THROUGH INTER-LOCK PROTECTIVE FUNCTION
Protection is achieved by monitoring and filtering the N-side DC-Bus
current. When a current trip-level is exceeded all the N-side IGBTs are
intercepted (turned OFF) and a fault-signal is output. After the fault-sig-
nal output duration (1.8msec (typ.)@25°C), the interception is Reset at
the following OFF input signal level (more than 4.0V).
(Fig. 5)
P-Side Input Signal : VCIN(p)
N-Side Input Signal : VCIN(n)
ON
ON
P-Side IGBT Gate : VGE(p)
N-Side IGBT Gate : VGE(n)
a1 b4
b3
b2
b1
a4
a3
a2
0
0
(Fig. 6)
Description:
(1) During the ON-State of either of the upper-arm or the lower-arm IGBT, the inter-lock protection circuit blocks any erroneous ON pulses (re-
sulting from input noise) from triggering the other arm IGBT and thus it prevents the arm-shoot-through situation.
(2) When two ON-signals are received for both the upper and the lower arms, the signal received first will be passed to the IGBT and the sec-
ond signal will be blocked. The second signal will be passed to its corresponding IGBT immediately after the first signal is OFF.
Note: This protective function provides no fault signaling output. The Dead-Time has to be set using the micro-controller (CPU).
b1. N-side normal ON-signal N-side IGBT gate turns ON.
b2. Simultaneous ON-signals P-side IGBT gate remains OFF.
b3. N-side receives OFF-signal N-side IGBT gate turns OFF.
b4. Immediately after (b3) P-side IGBT gate turns ON.
Operation:
a1. P-side normal ON-signal P-side IGBT gate turns ON.
a2. N-side erroneous ON-signal N-side IGBT gate remains OFF.
a3. While P-side ON-signal remains P-side IGBT gate remains ON.
a4. N-side normal ON-signal N-side IGBT gate turns ON.
5V
5V
CPU F
O
Vamp
5.1k
10k
0.1nF GND
ASIPM
VD(15V)
Up, Vp, Wp, Un, Vn, Wn
RECOMMENDED I/O INTERFACE CIRCUIT
(Fig. 7)