BZX84C2V4L
Zener Diode Data sheet
                                                               Outline
PD250 mW    
 
 
 
 
 
 
 
 
    
Feature Inner Circuit
High reliability
Small mold type
Application Packaging Specification
Voltage regulation Packing Embossed Tape
Reel Size(mm) 180
Taping Width(mm) 8
Structure Basic Ordering Unit(pcs) 3000
Silicon Epitaxial Planar Taping Code T116
Marking D3C
Absolute Maximum Rating (Ta = 2C)
Parameter Symbol Condition Limits Unit
Power dissipation PDon Glass-epoxy substrate 250 mW
2.0 mW/°C
Junction temperature Tj- 150
Storage temperature Tstg - -65 150 
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© 2017 ROHM Co., Ltd. All rights reserved. 1/5
        
 2018/09/26_Rev.003
Not Recommended for
New Designs
BZX84C Series                        Data sheet
Characteristic (Ta = 2C)                             
P/N
Symbol
Zener Voltage:VZ(V) Reverse Current:
IRA)
Dynamic
Impedance:ZZ)
Temperature
Coefficientz
(mV/)
MIN. MAX. Iz
(mA) MAX. VR(V) MAX. Iz
(mA) MIN. MAX. Iz
(mA)
BZX84C2V4L 2.20 2.60 5 50 1.0 100 5 -3.0 0.0 5
BZX84C2V7L 2.50 2.90 5 20 1.0 100 5 -3.0 0.0 5
BZX84C3V0L 2.80 3.20 5 10 1.0 95 5 -3.0 0.0 5
BZX84C3V3L 3.10 3.50 5 5 1.0 95 5 -3.0 0.0 5
BZX84C3V6L 3.40 3.80 5 5 1.0 90 5 -3.0 0.0 5
BZX84C3V9L 3.70 4.10 5 3 1.0 90 5 -3.0 0.0 5
BZX84C4V3L 4.00 4.60 5 3 1.0 90 5 -3.0 0.0 5
BZX84C4V7L 4.40 5.00 5 3 2.0 80 5 -2.5 1.1 5
BZX84C5V1L 4.80 5.40 5 2 2.0 60 5 -1.5 2.6 5
BZX84C5V6L 5.20 6.00 5 1 2.0 40 5 -1.0 3.1 5
BZX84C6V2L 5.80 6.60 5 3 4.0 10 5 0.9 3.8 5
BZX84C6V8L 6.40 7.20 5 2 4.0 15 5 1.5 4.5 5
BZX84C7V5L 7.00 7.90 5 1 5.0 15 5 2.2 5.0 5
BZX84C8V2L 7.70 8.70 5 0.7 5.0 15 5 3.2 6.1 5
BZX84C9V1L 8.50 9.60 5 0.5 6.0 15 5 3.9 6.9 5
BZX84C10VL 9.40 10.60 5 0.2 7.0 20 5 5.0 8.0 5
BZX84C11VL 10.40 11.60 5 0.1 8.0 20 5 5.8 8.8 5
BZX84C12VL 11.40 12.70 5 0.1 8.0 25 5 6.8 9.8 5
BZX84C13VL 12.40 14.10 5 0.1 8.0 30 5 7.9 11.0 5
BZX84C15VL 13.80 15.60 5 0.1 10.0 30 5 9.4 12.6 5
BZX84C16VL 15.30 17.10 5 0.1 11.0 40 5 11.0 14.3 5
BZX84C18VL 16.80 19.10 5 0.1 13.0 45 5 12.6 15.8 5
BZX84C20VL 18.80 21.20 5 0.1 14.0 55 5 14.3 17.3 5
BZX84C22VL 20.80 23.30 5 0.1 15.0 55 5 15.8 19.3 5
BZX84C24VL 22.80 25.60 5 0.1 17.0 70 5 17.3 22.6 5
BZX84C27VL 25.10 28.90 2 0.1 19.0 80 2 19.3 25.8 2
BZX84C30VL 28.00 32.00 2 0.1 21.0 80 2 22.6 28.5 2
BZX84C33VL 31.00 35.00 2 0.1 23.0 80 2 25.8 31.1 2
BZX84C36VL 34.00 38.00 2 0.1 25.0 90 2 28.5 34.0 2
V
Z test time is 40ms                              
Marking      
P/N Marking P/N Marking
BZX84C2V4L D3C BZX84C10VL D3T
BZX84C2V7L D3D BZX84C11VL D3U
BZX84C3V0L D3E BZX84C12VL D3V
BZX84C3V3L D3F BZX84C13VL D3W
BZX84C3V6L D3G BZX84C15VL D3X
BZX84C3V9L D3H BZX84C16VL D3Y
BZX84C4V3L D3J BZX84C18VL D3Z
BZX84C4V7L D3K BZX84C20VL D5A
BZX84C5V1L D3L BZX84C22VL D5B
BZX84C5V6L D3M BZX84C24VL D5C
BZX84C6V2L D3N BZX84C27VL D5D
BZX84C6V8L D3P BZX84C30VL D5E
BZX84C7V5L D3Q BZX84C33VL D5F
BZX84C8V2L D3R BZX84C36VL D5G
BZX84C9V1L D3S                                        
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© 2017 ROHM Co., Ltd. All rights reserved. 2/5
        
2018/09/26_Rev.003
Not Recommended for
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BZX84C2V4L                        Data sheet
Characteristic Curves
                                             
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© 2017 ROHM Co., Ltd. All rights reserved. 3/5 2018/09/26_Rev.003
Not Recommended for
New Designs
BZX84C2V4L                        Data sheet
Characteristic Curves
                                             
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© 2017 ROHM Co., Ltd. All rights reserved. 4/5
        
2018/09/26_Rev.003
Not Recommended for
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BZX84C2V4L                        Data sheet
Dimension (SSD3 SOT-23 )
Taping (Unit:mm)
                                             
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© 2017 ROHM Co., Ltd. All rights reserved. 5/5  
2018/09/26_Rev.003
Not Recommended for
New Designs
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
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(Note1) Medical Equipment Classification of the Specific Applications
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7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
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Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
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2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
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For details, please refer to ROHM Mounting specification
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Notice-PGA-E Rev.004
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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