www.latticesemi.com
5-1
DS1018_01.1
June 2008 Data Sheet DS1018
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other
brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without
notice.
®
Features
■
Monitor and Control Multiple Power Supplies
• Simultaneously monitors up to 10 power
supplies
• Provides up to 14 output control signals
• Programmable digital and analog circuitry
■
AEC-Q100 Tested and Qualified
■
Embedded PLD for Sequence Control
• 24-macrocell CPLD implements both state
machines and combinatorial logic functions
■
Embedded Programmable Timers
• Four independent timers
• 32µs to 2 second intervals for timing sequences
■
Analog Input Monitoring
• 10 independent analog monitor inputs
• Two programmable threshold comparators per
analog input
• Hardware window comparison
• 10-bit ADC for I
2
C monitoring (LA-ispPAC-
POWR1014A only)
■
High-Voltage FET Drivers
• Power supply ramp up/down control
• Programmable current and voltage output
• Independently configurable for FET control or
digital output
■
2-Wire (I
2
C/SMBus™ Compatible) Interface
• Comparator status monitor
• ADC readout
• Direct control of inputs and outputs
• Power sequence control
• Only available with LA-ispPAC-POWR1014A
■
3.3V Operation, Wide Supply Range 2.8V to
3.96V
• In-system programmable through JTAG
• Automotive temperature range: -40°C to +105°C
• 48-pin TQFP package, lead-free option
Application Block Diagram
Description
Lattice’s Power Manager II LA-ispPAC-POWR1014/A is
a general-purpose power-supply monitor and sequence
controller, incorporating both in-system programmable
logic and in-system programmable analog functions
implemented in non-volatile E
2
CMOS
®
technology. The
LA-ispPAC-POWR1014/A device provides 10 indepen-
dent analog input channels to monitor up to 10 power
supply test points. Each of these input channels has
two independently programmable comparators to sup-
port both high/low and in-bounds/out-of-bounds (win-
dow-compare) monitor functions. Four general-purpose
digital inputs are also provided for miscellaneous con-
trol functions.
The LA-ispPAC-POWR1014/A provides 14 open-drain
digital outputs that can be used for controlling DC-DC
converters, low-drop-out regulators (LDOs) and opto-
couplers, as well as for supervisory and general-pur-
pose logic interface functions. Two of these outputs
(HVOUT1-HVOUT2) may be configured as high-voltage
POL#1
POL#N
CPU
LA-ispPAC-POWR1014A
Signals
4 Timers
ADC*
*LA-ispPAC-POWR1014A only.
4 Digital
Inputs
I
2
C
Interface
I
2
C
Bus*
10 Analog Inputs
and Voltage Monitors
Di
g
ital Monitorin
g
Other Board Circuitry
Voltage
Monitoring
Enables
Primary
Supply
Primary
Supply
Primary
Supply
Primary
Supply
Primary
Supply
12 Digital
Outputs
Other Control/Supervisory
CPLD
24 Macrocells
53 Inputs
2 MOSFET
Drivers
3.3V
2.5V
1.8V
LA-ispPAC-POWR1014/A
Automotive Family
In-System Programmable Power Supply Supervisor,
Reset Generator and Sequencing Controller
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-2
MOSFET drivers. In high-voltage mode these outputs can provide up to 8V for driving the gates of n-channel MOS-
FETs so that they can be used as high-side power switches controlling the supplies with a programmable ramp rate
for both ramp up and ramp down.
The LA-ispPAC-POWR1014/A incorporates a 24-macrocell CPLD that can be used to implement complex state
machine sequencing for the control of multiple power supplies as well as combinatorial logic functions. The status
of all of the comparators on the analog input channels as well as the general purpose digital inputs are used as
inputs by the CPLD array, and all digital outputs may be controlled by the CPLD. Four independently programmable
timers can create delays and time-outs ranging from 32µs to 2 seconds. The CPLD is programmed using Logi-
Builder™, an easy-to-learn language integrated into the PAC-Designer
®
software. Control sequences are written to
monitor the status of any of the analog input channel comparators or the digital inputs.
The on-chip 10-bit A/D converter is used to monitor the V
MON
voltage through the I
2
C bus of the LA-ispPAC-
POWR1014A device.
The I
2
C bus/SMBus interface allows an external microcontroller to measure the voltages connected to the V
MON
inputs, read back the status of each of the V
MON
comparator and PLD outputs, control logic signals IN2 to IN4 and
control the output pins (LA-ispPAC-POWR1014A only).
Figure 5-1. LA-ispPAC-POWR1014/A Block Diagram
CPLD
24 MACROCELLS
53 INPUTS
JTAG LOGIC CLOCK
OSCILLATOR
TIMERS
(4)
I
2
C
INTERFACE
ADC* MEASUREMENT
CONTROL LOGIC*
*LA-ispPAC-POWR1014A only.
L
A
T
I
G
I
D
4
S
T U
P
N
I
S T U
P
N
I
G
O
L
A
N
A
0
1
S
R
O
T
I
N O M
E G
A
T
L
O
V
D
N
A
T E
F
2
S
R E
V
I
R
D
N
I A
R
D
-
N
E
P
O
2
1
S
T
U
P
T U
O
L A
T I
G I D
G N I T U
O
R
T
U
P
T
U
O
L
O
O
P
VMON1
VMON2
VMON3
VMON4
VMON5
VMON6
VMON7
VMON8
VMON9
VMON10
IN1
IN2
IN3
IN4
OUT3/(SMBA*)
OUT4
OUT5
OUT6
OUT7
OUT8
OUT9
OUT10
OUT11
OUT12
OUT13
OUT14
HVOUT1
HVOUT2
J
C
C
V
O
D
T
S M
T
K
C
T
TDISEL
K
L
C D
L
P
I
D
T
I
D
T
A
K
L
C
M
SDA (POWR1014A only)
SCL (POWR1014A only)
b
T E
S E
R
G
O
R
P
C
C
V
GNDD (2)
GNDA
VCCA
VCCD (2)
VCCINP
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-3
Pin Descriptions
Number Name Pin Type Voltage Range Description
44 IN1 Digital Input VCCINP
1, 2
PLD Logic Input 1 Registered by MCLK
46 IN2 Digital Input VCCINP
1, 3
PLD Logic Input 2 Registered by MCLK
47 IN3 Digital Input VCCINP
1, 3
PLD Logic Input 3 Registered by MCLK
48 IN4 Digital Input VCCINP
1, 3
PLD Logic Input 4 Registered by MCLK
25 VMON1 Analog Input -0.3V to 5.87V
4
Voltage Monitor 1 Input
26 VMON2 Analog Input -0.3V to 5.87V
4
Voltage Monitor 2 Input
27 VMON3 Analog Input -0.3V to 5.87V
4
Voltage Monitor 3 Input
28 VMON4 Analog Input -0.3V to 5.87V
4
Voltage Monitor 4 Input
32 VMON5 Analog Input -0.3V to 5.87V
4
Voltage Monitor 5 Input
33 VMON6 Analog Input -0.3V to 5.87V
4
Voltage Monitor 6 Input
34 VMON7 Analog Input -0.3V to 5.87V
4
Voltage Monitor 7 Input
35 VMON8 Analog Input -0.3V to 5.87V
4
Voltage Monitor 8 Input
36 VMON9 Analog Input -0.3V to 5.87V
4
Voltage Monitor 9 Input
37 VMON10 Analog Input -0.3V to 5.87V
4
Voltage Monitor 10 Input
7, 31 GNDD
5
Ground Ground Digital Ground
30 GNDA
5
Ground Ground Analog Ground
41, 23 VCCD
6
Power 2.8V to 3.96V Core VCC, Main Power Supply
29 VCCA
6
Power 2.8V to 3.96V Analog Power Supply
45 VCCINP Power 2.25V to 5.5V VCC for IN[1:4] Inputs
20 VCCJ Power 2.25V to 3.6V VCC for JTAG Logic Interface Pins
24 VCCPROG Power 3.0V to 3.6V VCC for E
2
Programming when the Device is Not
Powered by V
CCD
and V
CCA
15 HVOUT1
Open Drain Output
7
0V to 8V Open-Drain Output 1
Current Source/Sink 12.5µA to 100µA Source
100µA to 3000µA Sink High-voltage FET Gate Driver 1
14 HVOUT2
Open Drain Output
7
0V to 8V Open-Drain Output 2
Current Source/Sink 12.5µA to 100µA Source
100µA to 3000µA Sink High-voltage FET Gate Driver 2
13 SMBA_OUT3 Open Drain Output
7
0V to 5.5V Open-Drain Output 3, (SMBUS Alert Active Low,
LA-ispPAC-POWR1014A only).
12 OUT4 Open Drain Output
7
0V to 5.5V Open-Drain Output 4
11 OUT5 Open Drain Output
7
0V to 5.5V Open-Drain Output 5
10 OUT6 Open Drain Output
7
0V to 5.5V Open-Drain Output 6
9 OUT7 Open Drain Output
7
0V to 5.5V Open-Drain Output 7
8 OUT8 Open Drain Output
7
0V to 5.5V Open-Drain Output 8
6 OUT9 Open Drain Output
7
0V to 5.5V Open-Drain Output 9
5 OUT10 Open Drain Output
7
0V to 5.5V Open-Drain Output 10
4 OUT11 Open Drain Output
7
0V to 5.5V Open-Drain Output 11
3 OUT12 Open Drain Output
7
0V to 5.5V Open-Drain Output 12
2 OUT13 Open Drain Output
7
0V to 5.5V Open-Drain Output 13
1 OUT14 Open Drain Output
7
0V to 5.5V Open-Drain Output 14
40 RESETb
8
Digital I/O 0V to 3.96V Device Reset (Active Low) - Internal pull-up
42 PLDCLK Digital Output 0V to 3.96V 250kHz PLD Clock Output (Tristate), CMOS
Output - Internal pull-up
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-4
43 MCLK Digital I/O 0V to 3.96V 8MHz Clock I/O (Tristate), CMOS Drive - Internal
Pull-up
21 TDO Digital Output 0V to 5.5V JTAG Test Data Out
22 TCK Digital Input 0V to 5.5V JTAG Test Clock Input
16 TMS Digital Input 0V to 5.5V JTAG Test Mode Select - Internal Pull-up
18 TDI Digital Input 0V to 5.5V JTAG Test Data In, TDISEL pin = 1 - Internal
Pull-up
17 ATDI Digital Input 0V to 5.5V JTAG Test Data In (Alternate), TDISEL Pin = 0 -
Internal Pull-up
19 TDISEL Digital Input 0V to 5.5V Select TDI/ATDI Input - Internal Pull-up
39 SCL
9
Digital Input 0V to 5.5V I
2
C Serial Clock Input (LA-ispPAC-POWR1014A
Only)
38 SDA
9
Digital I/O 0V to 5.5V I
2
C Serial Data, Bi-directional Pin, Open Drain
(LA-ispPAC-POWR1014A Only)
1. [IN1...IN4] are inputs to the PLD. The thresholds for these pins are referenced by the voltage on VCCINP. Unused INx inputs should be tied
to GNDD.
2. IN1 pin can also be controlled through JTAG interface.
3. [IN2..IN4] can also be controlled through I
2
C/SMBus interface (LA-ispPAC-POWR1014A only).
4. The VMON inputs can be biased independently from VCCA. Unused VMON inputs should be tied to GNDD.
5. GNDA and GNDD pins must be connected together on the circuit board.
6. VCCD and VCCA pins must be connected together on the circuit board.
7. Open-drain outputs require an external pull-up resistor to a supply.
8. The RESETb pin should only be used for cascading two or more LA-ispPAC-POWR1014/A devices.
9. These pins should be connected to GNDD (LA-ispPAC-POWR1014 device only).
Pin Descriptions (Cont.)
Number Name Pin Type Voltage Range Description
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-5
Absolute Maximum Ratings
Absolute maximum ratings are shown in the table below. Stresses beyond those listed may cause permanent dam-
age to the device. Functional operation of the device at these or any other conditions beyond those indicated in the
recommended operating conditions of this specification is not implied.
Recommended Operating Conditions
Analog Specifications
Symbol Parameter Conditions Min. Max. Units
V
CCD
Core supply -0.5 4.5 V
V
CCA
Analog supply -0.5 4.5 V
V
CCINP
Digital input supply (IN[1:4]) -0.5 6 V
V
CCJ
JTAG logic supply -0.5 6 V
V
CCPROG
E
2
programming supply -0.5 4 V
V
IN
Digital input voltage (all digital I/O pins) -0.5 6 V
V
MON
V
MON
input voltage -0.5 6 V
V
TRI
Voltage applied to tri-stated pins HVOUT[1:2] -0.5 8.8 V
OUT[3:14] -0.5 6 V
I
SINKMAXTOTAL
Maximum sink current on any output 23 mA
T
S
Storage temperature -65 150
o
C
T
A
Ambient temperature -65 125
o
C
Symbol Parameter Conditions Min. Max. Units
V
CCD,
V
CCA
Core supply voltage at pin 2.8 3.96 V
V
CCINP
Digital input supply for IN[1:4] at pin 2.25 5.5 V
V
CCJ
JTAG logic supply voltage at pin 2.25 3.6 V
V
CCPROG
E
2
programming supply at pin During E
2
programming 3.0 3.6 V
V
IN
Input voltage at digital input pins -0.3 5.5 V
V
MON
Input voltage at V
MON
pins -0.3 5.9 V
V
OUT
Open-drain output voltage
OUT[3:14] pins -0.3 5.5 V
HVOUT[1:2] pins in open-drain
mode -0.3 8.4 V
T
APROG
Ambient temperature during
programming -40 85
o
C
T
A
Ambient temperature Power applied -40 105
o
C
T
J
Junction temperature Power applied -40 110
o
C
Symbol Parameter Conditions Min. Typ. Max. Units
I
CC
1
Core and analog supply current 20 mA
I
CCINP
V
CCINP
supply current 5mA
I
CCJ
JTAG supply current 1mA
I
CCPROG
Core and analog supply current During programming cycle 20 mA
1. Includes currents on V
CCD
and V
CCA
supplies.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-6
Voltage Monitors
High Voltage FET Drivers
Symbol Parameter Conditions Min. Typ. Max. Units
R
IN
Input resistance 55 65 75 k
Ω
C
IN
Input capacitance 8 pF
V
MON
Range Programmable trip-point range 0.075 5.867 V
V
Z
Sense Near-ground sense threshold 70 75 80 mV
VMON Accuracy Absolute accuracy of any trip-point10.3 1.1 %
HYST Hysteresis of any trip-point (relative to
setting) 1%
1. Guaranteed by characterization across VCCA range, operating temperature, process.
Symbol Parameter Conditions Min. Typ. Max. Units
VPP Gate driver output voltage 8V setting 7.6 8 8.4 V
6V setting 5.7 6 6.3
IOUTSRC Gate driver source current
(HIGH state) Four settings in software
12.5
µA
25
50
100
IOUTSINKGate driver sink current
(LOW state)
FAST OFF mode 1500 3000
µA
Controlled ramp settings
100
250
500
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-7
ADC Characteristics1
ADC Error Budget Across Entire Operating Temperature Range1
Power-On Reset
Symbol Parameter Conditions Min. Typ. Max. Units
ADC resolution 10 Bits
TCONVERT Conversion time Time from I2C request 100 µs
VINInput range full scale Programmable attenuator = 1 0 2.048 V
Programmable attenuator = 3 0 5.92V
ADC Step Size LSB Programmable attenuator = 1 2 mV
Programmable attenuator = 3 6 mV
Eattenuator Error due to attenuator Programmable attenuator = 3 +/- 0.1 %
1. LA-ispPAC-POWR1014A only.
2. Maximum voltage is limited by VMONX pin (theoretical maximum is 6.144V).
Symbol Parameter Conditions Min. Typ. Max. Units
TADC Error Total Measurement Error at
Any Voltage2
Measurement Range 600 mV - 2.048V,
Attenuator =1 -10 +/-4 10 mV
1. LA-ispPAC-POWR1014A only.
2. Total error, guaranteed by characterization, includes INL, DNL, Gain, Offset, and PSR specifications of the ADC.
Symbol Parameter Conditions Min. Typ. Max. Units
TRST Delay from VTH to start-up state 100 µs
TSTART Delay from RESETb HIGH to PLDCLK rising
edge 510µs
TGOOD Power-on reset to valid VMON comparator
output and AGOOD is true. 500 µs
TBRO Minimum duration brown out required to trig-
ger RESETb 15µs
TPOR Delay from brown out to reset state. 11 µs
VTL Threshold below which RESETb is LOW12.3 V
VTH Threshold above which RESETb is HIGH12.7 V
VTThreshold above which RESETb is valid10.8 V
CLCapacitive load on RESETb for master/slave
operation 200 pF
1. Corresponds to VCCA and VCCD supply voltages.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-8
Figure 5-2. LA-ispPAC-POWR1014/A Power-On Reset
VCC
VT
VTL
VTH
RESETb
AGOOD (Internal)
TGOOD
MCLK
PLDCLK
TBRO
TSTART
Analog Calibration
Reset
State
TRST
Start Up
State
TPOR
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-9
AC/Transient Characteristics
Over Recommended Operating Conditions
Symbol Parameter Conditions Min. Typ. Max. Units
Voltage Monitors
tPD16 Propagation delay input to
output glitch filter OFF 16 µs
tPD64 Propagation delay input to
output glitch filter ON64 µs
Oscillators
fCLK Internal master clock
frequency (MCLK) 7.6 8 8.4 MHz
fCLKEXT Externally applied master
clock (MCLK) 7.2 8.8 MHz
fPLDCLK PLDCLK output frequency fCLK = 8MHz 250 kHz
Timers
Timeout Range Range of programmable
timers (128 steps) fCLK = 8MHz 0.032 1966 ms
Resolution Spacing between available
adjacent timer intervals 13 %
Accuracy Timer accuracy fCLK = 8MHz -6.67 -12.5 %
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-10
Digital Specifications
Over Recommended Operating Conditions
Symbol Parameter Conditions Min. Typ. Max. Units
IIL,IIH Input leakage, no pull-up/pull-down +/-10 µA
IOH-HVOUT Output leakage current
HVOUT[1:2] in open
drain mode and pulled
up to 8V
35 100 µA
IPU
Input pull-up current (TMS, TDI,
TDISEL, ATDI, MCLK, PLDCLK,
RESETb)
70 µA
VIL Voltage input, logic low1
TDI, TMS, ATDI,
TDISEL, 3.3V supply 0.8
V
TDI, TMS, ATDI,
TDISEL, 2.5V supply 0.7
SCL, SDA 30% VCCD
IN[1:4] 30% VCCINP
VIH Voltage input, logic high1
TDI, TMS, ATDI,
TDISEL, 3.3V supply 2.0
V
TDI, TMS, ATDI,
TDISEL, 2.5V supply 1.7
SCL, SDA 70% VCCD VCCD
IN[1:4] 70% VCCINPVCCINP
VOL
HVOUT[1:2] (open drain mode), ISINK = 10mA 0.8
VOUT[3:14] ISINK = 20mA 0.8
TDO,MCLK,PLDCLK ISINK = 4mA 0.4
VOH TDO, MCLK, PLDCLK ISRC = 4mA VCCD - 0.4 V
ISINKTOTAL2All digital outputs 67 mA
1. IN[1:4] referenced to VCCINP; TDO, TDI, TMS, ATDI, TDISEL referenced to VCCJ; SCL, SDA referenced to VCCD.
2. Sum of maximum current sink from all digital outputs combined. Reliable operation is not guaranteed if this value is exceeded.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-11
I2C Port Characteristics1
Symbol Definition
100KHz 400KHz
UnitsMin. Max. Min. Max.
FI2CI2C clock/data rate 10024002kHz
TSU;STA After start 4.7 0.6 us
THD;STA After start 4 0.6 us
TSU;DAT Data setup 250 100 ns
TSU;STO Stop setup 4 0.6 us
THD;DAT Data hold; SCL= Vih_min = 2.1V 0.3 3.45 0.3 0.9 us
TLOW Clock low period 4.7 10 1.3 10 us
THIGH Clock high period 4 0.6 us
TFFall time; 2.25V to 0.65V 300 300 ns
TRRise time; 0.65V to 2.25V 1000 300 ns
TTIMEOUT Detect clock low timeout 25 35 25 35 ms
TPOR Device must be operational after power-on reset 500 500 ms
TBUF Bus free time between stop and start condition 4.7 1.3 us
1. Applies to LA-ispPAC-POWR1014A only.
2. If FI2C is less than 50kHz, then the ADC DONE status bit is not guaranteed to be set after a valid conversion request is completed. In this
case, waiting for the TCONVERT minimum time after a convert request is made is the only way to guarantee a valid conversion is ready for
readout. When FI2C is greater than 50kHz, ADC conversion complete is ensured by waiting for the DONE status bit.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-12
Timing for JTAG Operations
Figure 5-3. Erase (User Erase or Erase All) Timing Diagram
Figure 5-4. Programming Timing Diagram
Symbol Parameter Conditions Min. Typ. Max. Units
tISPENProgram enable delay time 10 — — µs
tISPDIS Program disable delay time 30 — — µs
tHVDIS High voltage discharge time, program 30 — — µs
tHVDIS High voltage discharge time, erase 200 — — µs
tCENFalling edge of TCK to TDO active — — 10 ns
tCDIS Falling edge of TCK to TDO disable — — 10 ns
tSU1 Setup time 5 — — ns
tHHold time 10 — — ns
tCKH TCK clock pulse width, high 20 — — ns
tCKL TCK clock pulse width, low 20 — — ns
fMAX Maximum TCK clock frequency — — 25 MHz
tCO Falling edge of TCK to valid output — — 10 ns
tPWV Verify pulse width 30 — — µs
tPWP Programming pulse width 20 — — ms
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Erase) Select-DR Scan
Clock to Shift-IR state and shift in the Discharge
Instruction, then clock to the Run-Test/Idle state
Run-Test/Idle (Discharge)
Specified by the Data Sheet
TMS
TCK
State
t
H
t
H
t
H
t
H
t
H
t
H
t
SU1
t
SU1
t
SU1
t
SU1
t
SU1
t
SU1
t
SU2
t
CKH
t
CKH
t
CKH
t
CKH
t
CKH
t
GKL
t
GKL
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Program) Select-DR Scan
Clock to Shift-IR state and shift in the next
Instruction, which will stop the discharge process
Update-IR
tSU1 tSU1 tSU1 tSU1
tSU1
tHtHtHtH
tH
tCKL tPWP
tCKH tCKH tCKH tCKH
tCKL
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-13
Figure 5-5. Verify Timing Diagram
Figure 5-6. Discharge Timing Diagram
Theory of Operation
Analog Monitor Inputs
The LA-ispPAC-POWR1014/A provides 10 independently programmable voltage monitor input circuits as shown in
Figure 5-7. Two individually programmable trip-point comparators are connected to an analog monitoring input.
Each comparator reference has 372 programmable trip points over the range of 0.672V to 5.867V. Additionally, a
75mV ‘zero-detect’ threshold is selectable which allows the voltage monitors to determine if a monitored signal has
dropped to ground level. This feature is especially useful for determining if a power supply’s output has decayed to
a substantially inactive condition after it has been switched off.
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Program) Select-DR Scan
Clock to Shift-IR state and shift in the next Instruction
Update-IR
tH
tH
tH
tH
tH
tCKH
tCKH
tCKH tCKL tPWV tCKH
tCKL
tSU1
tSU1
tSU1
tSU1 tSU1
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Erase or Program)
Select-DR Scan
Clock to Shift-IR state and shift in the Verify
Instruction, then clock to the Run-Test/Idle state
Run-Test/Idle (Verify)
Specified by the Data Sheet
Actual
tH
tH
tH
tH
tH tH tSU1
tCKH
tHVDIS (Actual)
tCKH
tCKH
tCKH tCKL tPWP tPWV tCKH
tCKL
tPWV
tSU1
tSU1
tSU1
tSU1 tSU1
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-14
Figure 5-7. LA-ispPAC-POWR1014/A Voltage Monitors
Figure 5-7 shows the functional block diagram of one of the 10 voltage monitor inputs - ‘x’ (where x = 1...10). Each
voltage monitor can be divided into three sections: Analog Input, Window Control, and Filtering.
The voltage input is monitored by two individually programmable trip-point comparators, shown as CompA and
CompB. Table 5-1 shows all trip points and the range to which any comparator’s threshold can be set.
Each comparator outputs a HIGH signal to the PLD array if the voltage at its positive terminal is greater than its pro-
grammed trip point setting, otherwise it outputs a LOW signal.
A hysteresis of approximately 1% of the setpoint is provided by the comparators to reduce false triggering as a
result of input noise. The hysteresis provided by the voltage monitor is a function of the input divider setting.
Table 5-3 lists the typical hysteresis versus voltage monitor trip-point.
AGOOD Logic Signal
All the VMON comparators auto-calibrate immediately after a power-on reset event. During this time, the digital
glitch filters are also initialized. This process completion is signalled by an internally generated logic signal:
AGOOD. All logic using the VMON comparator logic signals must wait for the AGOOD signal to become active.
Programmable Over-Voltage and Under-Voltage Thresholds
Figure 5-8 (a) shows the power supply ramp-up and ramp-down voltage waveforms. Because of hysteresis, the
comparator outputs change state at different thresholds depending on the direction of excursion of the monitored
power supply.
Glitch
Filter
MUX
Trip Point A
+
–
+
–
Comp A
Comp B
Comp A/Window
Select
VMONxB
Logic
Signal
VMONx
Trip Point B
Analog InputWindow Control Filtering
LA-ispPAC-POWR1014/A
To ADC
(LA-ispPAC-POWR1014A on
VMONxA
Logic
Signal
PLD
Array
VMONx Status
I
2
C Interface
Unit (LA-ispPAC-
POWR1014A only)
Glitch
Filter
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-15
Figure 5-8. (a) Power Supply Voltage Ramp-up and Ramp-down Waveform and the Resulting Comparator
Output, (b) Corresponding to Upper and Lower Trip Points
During power supply ramp-up the comparator output changes from logic 0 to 1 when the power supply voltage
crosses the upper trip point (UTP). During ramp down the comparator output changes from logic state 1 to 0 when
the power supply voltage crosses the lower trip point (LTP). To monitor for over voltage fault conditions, the UTP
should be used. To monitor under-voltage fault conditions, the LTP should be used.
Tables 1 and 2 show both the under-voltage and over-voltage trip points, which are automatically selected in soft-
ware depending on whether the user is monitoring for an over-voltage condition or an under-voltage condition.
UTP
LTP
Monitored Power Supply Votlage
Comparator Logic Output
(a)
(b)
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-16
Table 5-1. Trip Point Table Used For Over-Voltage Detection
Coarse Range Setting
Fine
Range
Setting 123456789101112
1 0.806 0.960 1.143 1.360 1.612 1.923 2.290 2.719 3.223 3.839 4.926 5.867
2 0.802 0.955 1.137 1.353 1.603 1.913 2.278 2.705 3.206 3.819 4.900 5.836
3 0.797 0.950 1.131 1.346 1.595 1.903 2.266 2.691 3.190 3.799 4.875 5.806
4 0.793 0.945 1.125 1.338 1.586 1.893 2.254 2.677 3.173 3.779 4.849 5.775
5 0.789 0.940 1.119 1.331 1.578 1.883 2.242 2.663 3.156 3.759 4.823 5.745
6 0.785 0.935 1.113 1.324 1.570 1.873 2.230 2.649 3.139 3.739 4.798 5.714
7 0.781 0.930 1.107 1.317 1.561 1.863 2.219 2.634 3.122 3.719 4.772 5.683
8 0.776 0.925 1.101 1.310 1.553 1.853 2.207 2.620 3.106 3.699 4.746 5.653
9 0.772 0.920 1.095 1.303 1.544 1.843 2.195 2.606 3.089 3.679 4.721 5.622
10 0.768 0.915 1.089 1.296 1.536 1.833 2.183 2.592 3.072 3.659 4.695 5.592
11 0.764 0.910 1.083 1.289 1.528 1.823 2.171 2.578 3.055 3.639 4.669 5.561
12 0.760 0.905 1.077 1.282 1.519 1.813 2.159 2.564 3.038 3.619 4.644 5.531
13 0.755 0.900 1.071 1.275 1.511 1.803 2.147 2.550 3.022 3.599 4.618 5.500
14 0.751 0.895 1.065 1.268 1.502 1.793 2.135 2.535 3.005 3.579 4.592 5.470
15 0.747 0.890 1.059 1.261 1.494 1.783 2.123 2.521 2.988 3.559 4.567 5.439
16 0.743 0.885 1.053 1.254 1.486 1.773 2.111 2.507 2.971 3.539 4.541 5.408
17 0.739 0.880 1.047 1.246 1.477 1.763 2.099 2.493 2.954 3.519 4.515 5.378
18 0.734 0.875 1.041 1.239 1.469 1.753 2.087 2.479 2.938 3.499 4.490 5.347
19 0.730 0.870 1.035 1.232 1.460 1.743 2.075 2.465 2.921 3.479 4.464 5.317
20 0.726 0.865 1.029 1.225 1.452 1.733 2.063 2.450 2.904 3.459 4.438 5.286
21 0.722 0.860 1.024 1.218 1.444 1.723 2.052 2.436 2.887 3.439 4.413 5.256
22 0.718 0.855 1.018 1.211 1.435 1.713 2.040 2.422 2.871 3.419 4.387 5.225
23 0.713 0.850 1.012 1.204 1.427 1.703 2.028 2.408 2.854 3.399 4.361 5.195
24 0.709 0.845 1.006 1.197 1.418 1.693 2.016 2.394 2.837 3.379 4.336 5.164
25 0.705 0.840 1.000 1.190 1.410 1.683 2.004 2.380 2.820 3.359 4.310 5.133
26 0.701 0.835 0.994 1.183 1.402 1.673 1.992 2.365 2.803 3.339 4.284 5.103
27 0.697 0.830 0.988 1.176 1.393 1.663 1.980 2.351 2.787 3.319 4.259 5.072
28 0.692 0.825 0.982 1.169 1.385 1.653 1.968 2.337 2.770 3.299 4.233 5.042
29 0.688 0.820 0.976 1.161 1.377 1.643 1.956 2.323 2.753 3.279 4.207 5.011
30 0.684 0.815 0.970 1.154 1.368 1.633 1.944 2.309 2.736 3.259 4.182 4.981
31 0.680 0.810 0.964 1.147 — 1.623 1.932 2.295 — 3.239 4.156 4.950
Low-V
Sense 75mV
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-17
Table 5-2. Trip Point Table Used For Under-Voltage Detection
Fine
Range
Setting 123456789101112
1 0.797 0.950 1.131 1.346 1.595 1.903 2.266 2.691 3.190 3.799 4.875 5.806
2 0.793 0.945 1.125 1.338 1.586 1.893 2.254 2.677 3.173 3.779 4.849 5.775
3 0.789 0.940 1.119 1.331 1.578 1.883 2.242 2.663 3.156 3.759 4.823 5.745
4 0.785 0.935 1.113 1.324 1.570 1.873 2.230 2.649 3.139 3.739 4.798 5.714
5 0.781 0.930 1.107 1.317 1.561 1.863 2.219 2.634 3.122 3.719 4.772 5.683
6 0.776 0.925 1.101 1.310 1.553 1.853 2.207 2.620 3.106 3.699 4.746 5.653
7 0.772 0.920 1.095 1.303 1.544 1.843 2.195 2.606 3.089 3.679 4.721 5.622
8 0.768 0.915 1.089 1.296 1.536 1.833 2.183 2.592 3.072 3.659 4.695 5.592
9 0.764 0.910 1.083 1.289 1.528 1.823 2.171 2.578 3.055 3.639 4.669 5.561
10 0.760 0.905 1.077 1.282 1.519 1.813 2.159 2.564 3.038 3.619 4.644 5.531
11 0.755 0.900 1.071 1.275 1.511 1.803 2.147 2.550 3.022 3.599 4.618 5.500
12 0.751 0.895 1.065 1.268 1.502 1.793 2.135 2.535 3.005 3.579 4.592 5.470
13 0.747 0.890 1.059 1.261 1.494 1.783 2.123 2.521 2.988 3.559 4.567 5.439
14 0.743 0.885 1.053 1.254 1.486 1.773 2.111 2.507 2.971 3.539 4.541 5.408
15 0.739 0.880 1.047 1.246 1.477 1.763 2.099 2.493 2.954 3.519 4.515 5.378
16 0.734 0.875 1.041 1.239 1.469 1.753 2.087 2.479 2.938 3.499 4.490 5.347
17 0.730 0.870 1.035 1.232 1.460 1.743 2.075 2.465 2.921 3.479 4.464 5.317
18 0.726 0.865 1.029 1.225 1.452 1.733 2.063 2.450 2.904 3.459 4.438 5.286
19 0.722 0.860 1.024 1.218 1.444 1.723 2.052 2.436 2.887 3.439 4.413 5.256
20 0.718 0.855 1.018 1.211 1.435 1.713 2.040 2.422 2.871 3.419 4.387 5.225
21 0.713 0.850 1.012 1.204 1.427 1.703 2.028 2.408 2.854 3.399 4.361 5.195
22 0.709 0.845 1.006 1.197 1.418 1.693 2.016 2.394 2.837 3.379 4.336 5.164
23 0.705 0.840 1.000 1.190 1.410 1.683 2.004 2.380 2.820 3.359 4.310 5.133
24 0.701 0.835 0.994 1.183 1.402 1.673 1.992 2.365 2.803 3.339 4.284 5.103
25 0.697 0.830 0.988 1.176 1.393 1.663 1.980 2.351 2.787 3.319 4.259 5.072
26 0.692 0.825 0.982 1.169 1.385 1.653 1.968 2.337 2.770 3.299 4.233 5.042
27 0.688 0.820 0.976 1.161 1.377 1.643 1.956 2.323 2.753 3.279 4.207 5.011
28 0.684 0.815 0.970 1.154 1.368 1.633 1.944 2.309 2.736 3.259 4.182 4.981
29 0.680 0.810 0.964 1.147 1.360 1.623 1.932 2.295 2.719 3.239 4.156 4.950
30 0.676 0.805 0.958 1.140 1.352 1.613 1.920 2.281 2.702 3.219 4.130 4.919
31 0.672 0.800 0.952 1.133 - 1.603 1.908 2.267 - 3.199 4.105 4.889
Low-V
Sense 75mV
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-18
Table 5-3. Comparator Hysteresis vs. Trip-Point
The window control section of the voltage monitor circuit is an AND gate (with inputs: an inverted COMPA “ANDed”
with COMPB signal) and a multiplexer that supports the ability to develop a ‘window’ function without using any of
the PLD’s resources. Through the use of the multiplexer, voltage monitor’s ‘A’ output may be set to report either the
status of the ‘A’ comparator, or the window function of both comparator outputs. The voltage monitor’s ‘A’ output
indicates whether the input signal is between or outside the two comparator thresholds. Important: This windowing
function is only valid in cases where the threshold of the ‘A’ comparator is set to a value higher than that of the ‘B’
comparator. Table 5-4 shows the operation of window function logic.
Table 5-4. Voltage Monitor Windowing Logic
Note that when the ‘A’ output of the voltage monitor circuit is set to windowing mode, the ‘B’ output continues to
monitor the output of the ‘B’ comparator. This can be useful in that the ‘B’ output can be used to augment the win-
dowing function by determining if the input is above or below the windowing range.
The third section in the LA-ispPAC-POWR1014/A’s input voltage monitor is a digital filter. When enabled, the com-
parator output will be delayed by a filter time constant of 64 µs, and is especially useful for reducing the possibility
of false triggering from noise that may be present on the voltages being monitored. When the filter is disabled, the
comparator output will be delayed by 16µs. In both cases, enabled or disabled, the filters also provide synchroniza-
tion of the input signals to the PLD clock. This synchronous sampling feature effectively eliminates the possibility of
race conditions from occurring in any subsequent logic that is implemented in the LA-ispPAC-POWR1014/A’s inter-
nal PLD logic.
The comparator status can be read from the I2C interface (LA-ispPAC-POWR1014A only). For details on the I2C
interface, please refer to the I2C/SMBUS Interface section of this data sheet.
Trip-point Range (V)
Hysteresis (mV)Low Limit High Limit
0.672 0.806 8
0.800 0.960 10
0.952 1.143 12
1.133 1.360 14
1.346 1.612 17
1.603 1.923 20
1.908 2.290 24
2.267 2.719 28
2.691 3.223 34
3.199 3.839 40
4.105 4.926 51
4.889 5.867 61
75 mV 0 (Disabled)
Input Voltage Comp A Comp B
Window
(B and Not A) Comment
VIN < Trip-point B < Trip-point A 0 0 0 Outside window, low
Trip-point B < VIN < Trip-point A 0 1 1 Inside window
Trip-point B < Trip-point A < VIN1 1 0 Outside window, high
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-19
VMON Voltage Measurement with the On-chip Analog to Digital Converter
(ADC, LA-ispPAC-POWR1014A Only)
The LA-ispPAC-POWR1014A has an on-chip analog to digital converter that can be used for measuring the volt-
ages at the VMON inputs.
Figure 5-9. ADC Monitoring VMON1 to VMON10
Figure 5-9 shows the ADC circuit arrangement within the LA-ispPAC-POWR1014A device. The ADC can measure
all analog input voltages through the multiplexer, ADC MUX. The programmable attenuator between the ADC mux
and the ADC can be configured as divided-by-3 or divided-by-1 (no attenuation). The divided-by-3 setting is used to
measure voltages from 0V to 6V range and divided-by-1 setting is used to measure the voltages from 0V to 2V
range.
A microcontroller can place a request for any VMON voltage measurement at any time through the I2C bus (LA-isp-
PAC-POWR1014A only). Upon the receipt of an I2C command, the ADC will be connected to the I2C selected
VMON through the ADC MUX. The ADC output is then latched into the I2C readout registers.
Calculation
The algorithm to convert the ADC code to the corresponding voltage takes into consideration the attenuation bit
value. In other words, if the attenuation bit is set, then the 10-bit ADC result is automatically multiplied by 3 to cal-
culate the actual voltage at that VMON input. Thus, the I2C readout register is 12 bits instead of 10 bits. The follow-
ing formula can always be used to calculate the actual voltage from the ADC code.
Voltage at the VMONx Pins
VMON = I2C Readout Register (12 bits1, converted to decimal) * 2mV
1Note: ADC_VALUE_HIGH (8 bits), ADC_VALUE_LOW (4 bits) read from I2C/SMBUS interface (LA-ispPAC-POWR1014A only).
VMON1
VMON2
VMON3
VMON10
VDDA
VCCINP
ADC
MUX ADC
Programmable Analog
Attenuator
Programmable
Digital Multiplier
Internal
VREF- 2.048V
4
10
x3 / x1
÷3 / ÷1
12
To I2C Readout Register
(LA-ispPAC-POWR1014A Only)
5
From I2C ADC MUX Register
(LA-ispPAC-POWR1014A Only)
1
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-20
PLD Block
Figure 5-10 shows the LA-ispPAC-POWR1014/A PLD architecture, which is derived from the Lattice's ispMACH™
4000 CPLD. The PLD architecture allows the flexibility in designing various state machines and control functions
used for power supply management. The AND array has 53 inputs and generates 123 product terms. These 123
product terms are divided into three groups of 41 for each of the generic logic blocks, GLB1, GLB2, and GLB3.
Each GLB is made up of eight macrocells. In total, there are 24 macrocells in the LA-ispPAC-POWR1014/A device.
The output signals of the LA-ispPAC-POWR1014/A device are derived from GLBs as shown in Figure 5-10. GLB3
generates timer control.
Figure 5-10. LA-ispPAC-POWR1014/A PLD Architecture
Macrocell Architecture
The macrocell shown in Figure 5-11 is the heart of the PLD. The basic macrocell has five product terms that feed
the OR gate and the flip-flop. The flip-flop in each macrocell is independently configured. It can be programmed to
function as a D-Type or T-Type flip-flop. Combinatorial functions are realized by bypassing the flip-flop. The polarity
control and XOR gates provide additional flexibility for logic synthesis. The flip-flop’s clock is driven from the com-
mon PLD clock that is generated by dividing the 8 MHz master clock by 32. The macrocell also supports asynchro-
nous reset and preset functions, derived from either product terms, the global reset input, or the power-on reset
signal. The resources within the macrocells share routing and contain a product term allocation array. The product
term allocation array greatly expands the PLD’s ability to implement complex logical functions by allowing logic to
be shared between adjacent blocks and distributing the product terms to allow for wider decode functions. All the
digital inputs are registered by MCLK and the VMON comparator outputs are registered by the PLD Clock to syn-
chronize them to the PLD logic.
AND Array
53 Inputs
123 PT
Global Reset
(Resetb pin)
Output
Feedback
24
VMON[1-10]
20
IN[1:4]
Timer1
Timer0
Timer2
Timer3
Timer Clock
IRP 18
PLD Clock
4
4
AGOOD GLB1
Generic Logic Block
8 Macrocell
41 PT
GLB2
Generic Logic Block
8 Macrocell
41 PT
GLB3
Generic Logic Block
8 Macrocell
41 PT
HVOUT[1..2],
OUT[3..8]
OUT[9..14]
41
41
41
Input
Register
Input
Register
MCLK
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-21
Figure 5-11. LA-ispPAC-POWR1014/A Macrocell Block Diagram
Clock and Timer Functions
Figure 5-12 shows a block diagram of the LA-ispPAC-POWR1014/A’s internal clock and timer systems. The master
clock operates at a fixed frequency of 8MHz, from which a fixed 250kHz PLD clock is derived.
Figure 5-12. Clock and Timer System
The internal oscillator runs at a fixed frequency of 8 MHz. This signal is used as a source for the PLD and timer
clocks. It is also used for clocking the comparator outputs and clocking the digital filters in the voltage monitor cir-
PT0
PT1
PT2
PT3
PT4
D/T Q
R P To PLD Output
CLK
Clock
Polarity
Macrocell flip-flop provides
D, T, or combinatorial
output with polarity
Product Term Allocation
Global Reset Power On Reset
Global Polarity Fuse for
Init Product Term
Block Init Product Term
Internal
Oscillator
8MHz
32
Timer 0
Timer 1
Timer 3
Timer 2
MCLK PLDCLK
PLD
C
lock
SW0
SW1
SW2
To/From
PLD
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-22
cuits and ADC. The LA-ispPAC-POWR1014/A can be programmed to operate in three modes: Master mode, Stan-
dalone mode and Slave mode. Table 5-5 summarizes the operating modes of LA-ispPAC-POWR1014/A.
Table 5-5. LA-ispPAC-POWR1014/A Operating Modes
A divide-by-32 prescaler divides the internal 8MHz oscillator (or external clock, if selected) down to 250kHz for the
PLD clock and for the programmable timers. This PLD clock may be made available on the PLDCLK pin by closing
SW2. Each of the four timers provides independent timeout intervals ranging from 32µs to 1.96 seconds in 128
steps.
Digital Outputs
The LA-ispPAC-POWR1014/A provides 14 digital outputs, HVOUT[1:2] and OUT[3:14]. Outputs OUT[3:14] are per-
manently configured as open drain to provide a high degree of flexibility when interfacing to logic signals, LEDs,
opto-couplers, and power supply control inputs. The HVOUT[1:2] pins can be configured as either high voltage FET
drivers or open drain outputs. Each of these outputs may be controlled either from the PLD or from the I2C bus (LA-
ispPAC-POWR1014A only). The determination whether a given output is under PLD or I2C control may be made on
a pin-by-pin basis (see Figure 5-13). For further details on controlling the outputs through I2C, please see the I2C/
SMBUS Interface section of this data sheet.
Figure 5-13. Digital Output Pin Configuration
High-Voltage Outputs
In addition to being usable as digital open-drain outputs, the LA-ispPAC-POWR1014/A’s HVOUT1-HVOUT2 output
pins can be programmed to operate as high-voltage FET drivers. Figure 5-14 shows the details of the HVOUT gate
drivers. Each of these outputs may be controlled from the PLD, or with the LA-ispPAC-POWR1014A, from the I2C
bus (see Figure 5-14). For further details on controlling the outputs through I2C, please see the I2C/SMBUS Inter-
face section of this data sheet.
Timer
Operating Mode SW0 SW1 Condition Comments
Standalone Closed Open When only one LA-ispPAC-POWR1014/A is used. MCLK pin tristated
Master Closed Closed
When more than one LA-ispPAC-POWR1014/A is
used in a board, one of them should be configured
to operate in this mode.
MCLK pin outputs 8MHz clock
Slave Open Closed
When more than one LA-ispPAC-POWR1014/As is
used in a board. Other than the master, the rest of
the LA-ispPAC-POWR1014/As should be pro-
grammed as slaves.
MCLK pin is input
OUTx
Pin
Digital Control
from PLD
Digital Control from I2C Register
(LA-ispPAC-POWR1014A only)
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-23
Figure 5-14. Basic Function Diagram for an Output in High Voltage MOSFET Gate Driver Mode
Figure 5-14 shows the HVOUT circuitry when programmed as a FET driver. In this mode the output either sources
current from a charge pump or sinks current. The maximum voltage that the output level at the pin will rise to is also
programmable. The HVOUT pin source current, which is programmable between 12.5 µA and 100 µA, is used to
control the FET turn-on rate. Similarly, the HVOUT sink current, which is programmable between 3000 µA and 100
µA, is used to control the turn-off rate.
Programmable Output Voltage Levels for HVOUT1- HVOUT2
The HVOUT output voltage can be programmed to 6V or 8V when in FET driver mode.
RESETb Signal, RESET Command via JTAG or I2C
Activating the RESETb signal (Logic 0 applied to the RESETb pin) or issuing a reset instruction via JTAG, or with
the LA-ispPAC-POWR1014A, I2C will force the outputs to the following states independent of how these outputs
have been configured in the PINS window:
• OUT3-14 will go high-impedance.
• HVOUT pins programmed for open drain operation will go high-impedance.
• HVOUT pins programmed for FET driver mode operation will pull down.
At the conclusion of the RESET event, these outputs will go to the states defined by the PINS window, and if a
sequence has been programmed into the device, it will be re-started at the first step. The analog calibration will be
re-done and consequently, the VMONs, and ADCs will not be operational until 500 microseconds (max.) after the
conclusion of the RESET event.
CAUTION: Activating the RESETb signal or issuing a RESET command through I2C or JTAG during the LA-isp-
PAC-POWR1014/A device operation, results in the device aborting all operations and returning to the power-on
reset state. The status of the power supplies which are being enabled by the LA-ispPAC-POWR1014/A will be
determined by the state of the outputs shown above.
I2C/SMBUS Interface (LA-ispPAC-POWR1014A Only)
I2C and SMBus are low-speed serial interface protocols designed to enable communications among a number of
devices on a circuit board. The LA-ispPAC-POWR1014A supports a 7-bit addressing of the I2C communications
protocol, as well as SMBTimeout and SMBAlert features of the SMBus, enabling it to easily integrated into many
types of modern power management systems. Figure 5-15 shows a typical I2C configuration, in which one or more
LA-ispPAC-POWR1014As are slaved to a supervisory microcontroller. SDA is used to carry data signals, while
SCL provides a synchronous clock signal. The SMBAlert line is only present in SMBus systems. The 7-bit I2C
address of the POWR1014A is fully programmable through the JTAG port.
I
SOURCE
(12.5 to 100 µA)
I
SINK
(100 to 500 µA)
+Fast Turn-off
(3000µA)
Charge Pump
(6 to 8V)
Input
Supply
Load
HVOUTx
Pin
Digital Control
from PLD
Digital Control from I
2
C Register
(LA-ispPAC-POWR1014A Only)
+
-
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-24
Figure 5-15. LA-ispPAC-POWR1014A in I
2C/SMBUS System
In both the I2C and SMBus protocols, the bus is controlled by a single MASTER device at any given time. This mas-
ter device generates the SCL clock signal and coordinates all data transfers to and from a number of slave devices.
The LA-ispPAC-POWR1014A is configured as a slave device, and cannot independently coordinate data transfers.
Each slave device on a given I2C bus is assigned a unique address. The LA-ispPAC-POWR1014A implements the
7-bit addressing portion of the standard. Any 7-bit address can be assigned to the LA-ispPAC-POWR1014A device
by programming through JTAG. When selecting a device address, one should note that several addresses are
reserved by the I2C and/or SMBus standards, and should not be assigned to LA-ispPAC-POWR1014A devices to
assure bus compatibility. Table 5-6 lists these reserved addresses.
Table 5-6. I
2C/SMBus Reserved Slave Device Addresses
The LA-ispPAC-POWR1014A’s I2C/SMBus interface allows data to be both written to and read from the device. A
data write transaction (Figure 5-16) consists of the following operations:
1. Start the bus transaction
2. Transmit the device address (7 bits) along with a low write bit
3. Transmit the address of the register to be written to (8 bits)
4. Transmit the data to be written (8 bits)
5. Stop the bus transaction
Address R/W bit I2C function Description SMBus Function
0000 000 0 General Call Address General Call Address
0000 000 1 Start Byte Start Byte
0000 001 x CBUS Address CBUS Address
0000 010 x Reserved Reserved
0000 011 x Reserved Reserved
0000 1xx x HS-mode master code HS-mode master code
0001 000 x NA SMBus Host
0001 100 x NA SMBus Alert Response Address
0101 000 x NA Reserved for ACCESS.bus
0110 111 x NA Reserved for ACCESS.bus
1100 001 x NA SMBus Device Default Address
1111 0xx x 10-bit addressing 10-bit addressing
1111 1xx x Reserved Reserved
MICROPROCESSOR
(I
2
C MASTER)
POWR1014A
(I
2
C SLAVE)
POWR1014A
(I
2
C SLAVE)
SDA SDA SDA
SCL SCL SCL
SCL/SMCLK (CLOCK)
SDA/SMDAT (DATA)
SMBALERT
OUT5/
SMBA
OUT5/
SMBA
To Other
I
2
C
Devices
INTERRUPT
V+
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-25
To start the transaction, the master device holds the SCL line high while pulling SDA low. Address and data bits are
then transferred on each successive SCL pulse, in three consecutive byte frames of 9 SCL pulses. Address and
data are transferred on the first 8 SCL clocks in each frame, while an acknowledge signal is asserted by the slave
device on the 9th clock in each frame. Both data and addresses are transferred in a most-significant-bit-first format.
The first frame contains the 7-bit device address, with bit 8 held low to indicate a write operation. The second frame
contains the register address to which data will be written, and the final frame contains the actual data to be writ-
ten. Note that the SDA signal is only allowed to change when the SCL is low, as raising SDA when SCL is high sig-
nals the end of the transaction.
Figure 5-16. I
2C Write Operation
Reading a data byte from the LA-ispPAC-POWR1014A requires two separate bus transactions (Figure 5-17). The
first transaction writes the register address from which a data byte is to be read. Note that since no data is being
written to the device, the transaction is concluded after the second byte frame. The second transaction performs
the actual read. The first frame contains the 7-bit device address with the R/W bit held High. In the second frame
the LA-ispPAC-POWR1014A asserts data out on the bus in response to the SCL signal. Note that the acknowledge
signal in the second frame is asserted by the master device and not the LA-ispPAC-POWR1014A.
Figure 5-17. I
2C Read Operation
The LA-ispPAC-POWR1014ALA-ispPAC-POWR1014A provides 17 registers that can be accessed through its I2C
interface. These registers provide the user with the ability to monitor and control the device’s inputs and outputs,
and transfer data to and from the device. Table 5-7 provides a summary of these registers.
ACKACKACK
START
123456789
A6 A5 A4 A3 A2 A1 A0 R7 R6 R5 R4 R3 R2 R1 R0
123456789 123456789
D7 D6 D5 D4 D3 D2 D1 D0
STOPDEVICE ADDRESS (7 BITS) REGISTER ADDRESS (8 BITS) WRITE DATA (8 BITS)
SCL
SDA R/W
Note: Shaded Bits Asserted by Slave
D5 D4 D3 D2 D1 D0D6D7
ACK
ACKACK
START
123456789
A6 A5 A4 A3 A2 A1 A0 R7 R6 R5 R4 R3 R2 R1 R0
123456789
DEVICE ADDRESS (7 BITS) REGISTER ADDRESS (8 BITS)
SCL
SDA
R/W
STOP
START
123456789
A6 A5 A4 A3 A2 A1 A0 ACK
123456789
DEVICE ADDRESS (7 BITS) READ DATA (8 BITS)
SCL
SDA
R/W
STOP
STEP 1: WRITE REGISTER ADDRESS FOR READ OPERATION
STEP 2: READ DATA FROM THAT REGISTER
Note: Shaded Bits Asserted by Slave
OPTIONAL
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-26
Table 5-7. I
2C Control Registers
Several registers are provided for monitoring the status of the analog inputs. The three registers
VMON_STATUS[0:2] provide the ability to read the status of the VMON output comparators. The ability to read both
the ‘a’ and ‘b’ comparators from each VMON input is provided through the VMON input registers. Note that if a
VMON input is configured to window comparison mode, then the corresponding VMONxA register bit will reflect the
status of the window comparison.
Figure 5-18. VMON Status Registers
It is also possible to directly read the value of the voltage present on any of the VMON inputs by using the LA-isp-
PAC-POWR1014A’s ADC. Three registers provide the I2C interface to the ADC (Figure 5-19).
Register
Address
Register
Name Read/Write Description Value After POR1, 2
0x00 vmon_status0 R VMON input status Vmon[4:1] – – – –
– – – –
0x01 vmon_status1 R VMON input status Vmon[8:5] – – – –
– – – –
0x02 vmon_status2 R VMON input status Vmon[10:9] X X X X
– – – –
0x03 output_status0 R Output status OUT[8:3], HVOUT[2:1] – – – –
– – – –
0x04 output_status1 R Output status OUT[14:9] X X – –
– – – –
0x06 input_status R Input status IN[4:1] X X X X
– – – –
0x07 adc_value_low R ADC D[3:0] and status – – – –
X X X 1
0x08 adc_value_high R ADC D[9:4] X X – –
– – – –
0x09 adc_mux R/W ADC Attenuator and MUX[3:0] X X X –
– – – –
0x0A UES_byte0 R UES[7:0] – – – –
– – – –
0x0B UES_byte1 R UES[15:8] – – – –
– – – –
0x0C UES_byte2 R UES[23:16] – – – –
– – – –
0x0D UES_byte3 R UES[31:24] – – – –
– – – –
0x0E gp_output1 R/W GPOUT[8:1] 0 0 0 0
0 1 0 0
0x0F gp_output2 R/W GPOUT[14:9] X X 0 0
0 0 0 0
0x11 input_value R/W PLD Input Register [4:2] X X X X
0 0 0 X
0x12 reset W Resets device on write N/A
1. “X” = Non-functional bit (bits read out as 1’s).
2. “–” = State depends on device configuration or input status.
VMON4B VMON4A VMON3B VMON3A VMON2B VMON2A VMON1B VMON1A
b7 b0
0x00 - VMON_STATUS0 (Read Only)
b6 b5 b4 b3 b2 b1
VMON8B VMON8A VMON7B VMON7A VMON6B VMON6A VMON5B VMON5A
b7 b0
0x01 - VMON_STATUS1 (Read Only)
b6 b5 b4 b3 b2 b1
VMON10B VMON10A VMON9B VMON9A1111
b7 b0
0x02 - VMON_STATUS2 (Read Only)
b6 b5 b4 b3 b2 b1
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-27
Figure 5-19. ADC Interface Registers
To perform an A/D conversion, one must set the input attenuator and channel selector. Two input ranges may be
set using the attenuator, 0 - 2.048V and 0 - 6.144V. Table 5-8 shows the input attenuator settings.
Table 5-8. ADC Input Attenuator Control
The input selector may be set to monitor any one of the ten VMON inputs, the VCCA input, or the VCCINP input.
Table 5-9 shows the codes associated with each input selection.
Table 5-9. VMON Address Selection Table
Writing a value to the ADC_MUX register to set the input attenuator and selector will automatically initiate a conver-
sion. When the conversion is in process, the DONE bit (ADC_VALUE_LOW.0) will be reset to 0. When the conver-
sion is complete, this bit will be set to 1. When the conversion is complete, the result may be read out of the ADC by
performing two I2C read operations; one for ADC_VALUE_LOW, and one for ADC_VALUE_HIGH. It is recom-
mended that the I2C master load a second conversion command only after the completion of the current conversion
ATTEN (ADC_MUX.4) Resolution Full-Scale Range
0 2mV 2.048 V
1 6mV 6.144 V
Select Word
Input Channel
SEL3
(ADC_MUX.3)
SEL2
(ADC_MUX.2)
SEL1
(ADC_MUX.1)
SEL0
(ADC_MUX.0)
0000VMON1
0001VMON2
0010VMON3
0011VMON4
0100VMON5
0101VMON6
0110VMON7
0111VMON8
1000VMON9
1001VMON10
1100VCCA
1101VCCINP
D3 D2 D1 D0 1 1 1 DONE
b7 b0
0x07 - ADC_VALUE_LOW
(Read Only)
b6 b5 b4 b3 b2 b1
D11 D10 D9 D8 D7 D6 D5 D4
b7 b0
0x08 - ADC_VALUE_HIGH
(Read Only)
b6 b5 b4 b3 b2 b1
X X X ATTEN SEL3 SEL2 SEL1 SEL0
b7 b0
0x09 - ADC_MUX (Read/Write)
b6 b5 b4 b3 b2 b1
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-28
command (Waiting for the DONE bit to be set to 1). An alternative would be to wait for a minimum specified time
(see TCONVERT value in the specifications) and disregard checking the DONE bit.
Note that if the I2C clock rate falls below 50kHz (see FI2C note in specifications), the only way to insure a valid ADC
conversion is to wait the minimum specified time (TCONVERT), as the operation of the DONE bit at clock rates lower
than that cannot be guaranteed. In other words, if the I2C clock rate is less than 50kHz, the DONE bit may or may
not assert even though a valid conversion result is available.
To insure every ADC conversion result is valid, preferred operation is to clock I2C at more than 50kHz and verify
DONE bit status or wait for the full TCONVERT time period between subsequent ADC convert commands. If an I2C
request is placed before the current conversion is complete, the DONE bit will be set to 1 only after the second
request is complete.
The status of the digital input lines may also be monitored and controlled through I2C commands. Figure 5-20
shows the I2C interface to the IN[1:4] digital input lines. The input status may be monitored by reading the
INPUT_STATUS register, while input values to the PLD array may be set by writing to the INPUT_VALUE register.
To be able to set an input value for the PLD array, the input multiplexer associated with that bit needs to be set to
the I2C register setting in E2CMOS memory otherwise the PLD will receive its input from the INx pin.
Figure 5-20. I
2C Digital Input Interface
The digital outputs may also be monitored and controlled through the I2C interface, as shown in Figure 5-21. The
status of any given digital output may be read by reading the contents of the associated OUTPUT_STATUS[1:0]
register. Note that in the case of the outputs, the status reflected by these registers reflects the logic signal used to
drive the pin, and does not sample the actual level present on the output pin. For example, if an output is set high
Input_Status Input_Value
3
3
3
PLD
Array
I2C Interface Unit
IN[2..4]
IN1
USERJTAG
Bit 2
3
PLD
O
utput
/
Input_Value Register
S
elect
(E2 Configuration)
IN4 IN3 IN2 IN11111
b7 b0
0x06 - INPUT_STATUS
(Read Only)
b6 b5 b4 b3 b2 b1
XXXX
b7 b0
0x11 - INPUT_VALUE (Read/Write)
b6 b5 b4 b3 b2 b1
MUX
MUX
I4 I3 I2 X
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-29
but is not pulled up, the output status bit corresponding with that pin will read ‘1’, but a high output signal will not
appear on the pin.
Digital outputs may also be optionally controlled directly by the I2C bus instead of by the PLD array. The outputs
may be driven either from the PLD output or from the contents of the GP_OUTPUT[1:0] registers with the choice
user-settable in E2CMOS memory. Each output may be independently set to output from the PLD or from the
GP_OUTPUT registers.
Figure 5-21. I
2C Output Monitor and Control Logic
The UES word may also be read through the I2C interface, with the register mapping shown in Figure 5-22.
Output_Status0
Output_Status1
GP_Output1
GP_Output2
14
14
HVOUT[1..2]
OUT[3..14]
I
2
C Interface Unit
PLD Output/GP_Output Register Select
(E
2
Configuration)
OUT8 OUT7 OUT6 OUT5 HVOUT2 HVOUT1OUT4
11
OUT3
b7 b0
0x03 - OUTPUT_STATUS0
(Read Only)
b6 b5 b4 b3 b2 b1
OUT14 OUT13 OUT12 OUT11 OUT10 OUT9
b7 b0
0x04 - OUTPUT_STATUS1
(Read Only)
b6 b5 b4 b3 b2 b1
GP8 GP7 GP6 GP5 GP4 GP3_ENb GP2 GP1
b7 b0
0x0E - GP_OUTPUT1 (Read/Write)
b6 b5 b4 b3 b2 b1
X X GP14 GP13 GP12 GP11 GP10 GP9
b7 b0
0x0F - GP_OUTPUT2 (Read/Write)
b6 b5 b4 b3 b2 b1
14
14
14
MUX
PLD
Output
Routing
Pool
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-30
Figure 5-22. I
2C Register Mapping for UES Bits
The I2C interface also provides the ability to initiate reset operations. The LA-ispPAC-POWR1014A may be reset by
issuing a write of any value to the I2C RESET register (Figure 5-23). Note: The execution of the I2C reset command
is equivalent to toggling the Resetb pin of the chip. Refer to the Resetb Signal, RESET Command via JTAG or I2C
section of this data sheet for further information.
Figure 5-23. I
2C Reset Register
UES7 UES6 UES5 UES4 UES3 UES2 UES1 UES0
b7 b0
0x0A - UES_BYTE0
(Read Only)
b6 b5 b4 b3 b2 b1
UES15 UES14 UES13 UES12 UES11 UES10 UES9 UES8
b7 b0
0x0B - UES_BYTE1
(Read Only)
b6 b5 b4 b3 b2 b1
UES23 UES22 UES21 UES20 UES19 UES18 UES17 UES16
b7 b0
0x0C - UES_BYTE2
(Read Only)
b6 b5 b4 b3 b2 b1
UES31 UES30 UES29 UES28 UES27 UES26 UES25 UES24
b7 b0
0x0D - UES_BYTE3
(Read Only)
b6 b5 b4 b3 b2 b1
XXXXXXXX
b7 b0
0x12 - RESET (Write Only)
b6 b5 b4 b3 b2 b1
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-31
SMBus SMBAlert Function
The LA-ispPAC-POWR1014A provides an SMBus SMBAlert function so that it can request service from the bus
master when it is used as part of an SMBus system. This feature is supported as an alternate function of OUT3.
When the SMBAlert feature is enabled, OUT3 is controlled by a combination of the PLD output and the GP3_ENb
bit (Figure 5-24). Note: To enable the SMBAlert feature, the SMB_Mode (EECMOS bit) should be set in software.
Figure 5-24. LA-ispPAC-POWR1014/A SMBAlert Logic
The typical flow for an SMBAlert transaction is as follows (Figure 5-24):
1. GP3_ENb bit is forced (Via I2C write) to Low
2. LA-ispPAC-POWR1014A PLD Logic pulls OUT3/SMBA Low
3. Master responds to interrupt from SMBA line
4. Master broadcasts a read operation using the SMBus Alert Response Address (ARA)
5. LA-ispPAC-POWR1014A responds to read request by transmitting its device address
6. If transmitted device address matches LA-ispPAC-POWR1014A address, it sets GP3_ENb bit high.
This releases OUT3/SMBA.
Figure 5-25. SMBAlert Bus Transaction
After OUT3/SMBA has been released, the bus master (typically a microcontroller) may opt to perform some service
functions in which it may send data to or read data from the LA-ispPAC-POWR1014A. As part of the service func-
tions, the bus master will typically need to clear whatever condition initiated the SMBAlert request, and will also
need to reset GP3_ENb to re-enable the SMBAlert function. For further information on the SMBus, the user should
consult the SMBus Standard.
PLD
Output
Routing
Pool
MUX
MUX
GP3_ENb
SMBAlert
Logic
OUT3/SMBA
I2C Interface Unit
PLD Output/GP_Output Register Select
(E2 Configuration)
OUT3/SMBA Mode Select
(E2 Configuration)
ACK A4 A3 A2 A1 A0 xA5A6
START
123456789
000110 0 ACK
123456789
ALERT RESPONSE ADDRESS
(0001 100)
SLAVE ADDRESS (7 BITS)
SCL
SDA
R/W
STOP
SMBA
Note: Shaded Bits Asserted by Slave
SLAVE
ASSERTS
SMBA
SLAVE
RELEASES
SMBA
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-32
Software-Based Design Environment
Designers can configure the LA-ispPAC-POWR1014/A using PAC-Designer, an easy to use, Microsoft Windows
compatible program. Circuit designs are entered graphically and then verified, all within the PAC-Designer environ-
ment. Full device programming is supported using PC parallel port I/O operations and a download cable connected
to the serial programming interface pins of the LA-ispPAC-POWR1014/A. A library of configurations is included with
basic solutions and examples of advanced circuit techniques are available on the Lattice web site for downloading.
In addition, comprehensive on-line and printed documentation is provided that covers all aspects of PAC-Designer
operation. The PAC-Designer schematic window, shown in Figure 5-26, provides access to all configurable LA-isp-
PAC-POWR1014/A elements via its graphical user interface. All analog input and output pins are represented.
Static or non-configurable pins such as power, ground, and the serial digital interface are omitted for clarity. Any
element in the schematic window can be accessed via mouse operations as well as menu commands. When com-
pleted, configurations can be saved, simulated, and downloaded to devices.
Figure 5-26. PAC-Designer LA-ispPAC-POWR1014/A Design Entry Screen
In-System Programming
The LA-ispPAC-POWR1014/A is an in-system programmable device. This is accomplished by integrating all E2
configuration memory and control logic on-chip. Programming is performed through a 4-wire, IEEE 1149.1 compli-
ant serial JTAG interface at normal logic levels. Once a device is programmed, all configuration information is
stored on-chip, in non-volatile E2CMOS memory cells. The specifics of the IEEE 1149.1 serial interface and all LA-
ispPAC-POWR1014/A instructions are described in the JTAG interface section of this data sheet.
Programming LA-ispPAC-POWR1014/A: Alternate Method
Some applications require that the LA-ispPAC-POWR1014/A be programmed before turning the power on to the
entire circuit board. To meet such application needs, the LA-ispPAC-POWR1014/A provides an alternate program-
ming method which enables the programming of the LA-ispPAC-POWR1014/A device through the JTAG chain with
a separate power supply applied just to the programming section of the LA-ispPAC-POWR1014/A device with the
main power supply of the board turned off.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-33
Three special purpose pins, VCCPROG, ATDI and TDISEL, enable programming of the un-programmed LA-isp-
PAC-POWR1014/A under such circumstances. The VCCPROG pin powers just the programming circuitry of the
LA-ispPAC-POWR1014/A device. The ATDI pin provides an alternate connection to the JTAG header while bypass-
ing all the un-powered devices in the JTAG chain. TDISEL pin enables switching between the ATDI and the stan-
dard JTAG signal TDI. When the internally pulled-up TDISEL = 1, standard TDI pin is enabled and when the
TDISEL = 0, ATDI is enabled.
In order to use this feature the JTAG signals of the LA-ispPAC-POWR1014/A are connected to the header as
shown in Figure 5-27. Note: The LA-ispPAC-POWR1014/A should be the last device in the JTAG chain.
Figure 5-27. LA-ispPAC-POWR1014/A Alternate TDI Configuration Diagram
Alternate TDI Selection Via JTAG Command
When the TDISEL pin held high and four consecutive IDCODE instructions are issued, LA-ispPAC-POWR1014/A
responds by making its active JTAG data input the ATDI pin. When ATDI is selected, data on its TDI pin is ignored
until the JTAG state machine returns to the Test-Logic-Reset state.
This method of selecting ATDI takes advantage of the fact that a JTAG device with an IDCODE register will auto-
matically load its unique IDCODE instruction into the Instruction Register after a Test-Logic-Reset. This JTAG capa-
bility permits blind interrogation of devices so that their location in a serial chain can be identified without having to
know anything about them in advance. A blind interrogation can be made using only the TMS and TCLK control
pins, which means TDI and TDO are not required for performing the operation. Figure 5-28 illustrates the logic for
selecting whether the TDI or ATDI pin is the active data input to LA-ispPAC-POWR1014/A.
TDI
ATDI
TCK
TDO
TMS
TDI
TCK
TDO
TMS
TDI
TCK
TMS
VCC
VCC
VCCIO
VCCJ
TDISEL
TDO
TDISEL
VCCPROG
2. Initial Power
Supply Turn-On
3. Sequenced Power
Supply Turn-on
JTAG Signal
Connector Other JTAG
Device(s)
LA-ispPAC-POWR
1014A
1. Power for
Programming
POWR1014A
VCCJ
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-34
Figure 5-28. LA-ispPAC-POWR1014/A TDI/ATDI Pin Selection Diagram
Table 5-10 shows in truth table form the same conditions required to select either TDI or ATDI as in the logic dia-
gram found in Figure 5-28.
Table 5-10. LA-ispPAC-POWR1014/A ATDI/TDI Selection Table
Please refer to the Lattice application note AN6068, Programming the ispPAC-POWR1220AT8 in a JTAG Chain
Using ATDI. The application note includes specific SVF code examples and information on the use of Lattice
design tools to verify device operation in alternate TDI mode.
VCCPROG Power Supply Pin
Because the VCCPROG pin directly powers the on-chip programming circuitry, the LA-ispPAC-POWR1014/A
device can be programmed by applying power to the VCCPROG pin (without powering the entire chip though the
VCCD and VCCA pins). In addition, to enable the on-chip JTAG interface circuitry, power should be applied to the
VCCJ pin.
When the LA-ispPAC-POWR1014/A is using the VCCPROG pin, its VCCD and VCCA pins can be open or pulled
low. Additionally, other than JTAG I/O pins, all digital output pins are in Hi-Z state, HVOUT pins configured as MOS-
FET driver are driven low, and all other inputs are ignored.
To switch the power supply back to VCCD and VCCA pins, one should turn the VCCPROG supply and VCCJ off
before turning the regular supplies on. When VCCD and VCCA are turned back on for normal operation,
VCCPROG should be left floating.
TDISEL Pin
JTAG State Machine
Test-Logic-Reset
Four Consecutive
IDCODE Commands
Loaded at Update-IR
Active JTAG
Data Input Pin
HNo Yes ATDI (TDI Disabled)
HYesNo TDI (ATDI Disabled)
L X X ATDI (TDI Disabled)
1
0
TDI
ATDI
TDISEL Q
SET
CLR
Test-Logic-Reset
4 Consecutive
IDCODE Instructions
Loaded at Update-IR
TDO
TMS TCK
JTAG
LA-ispPAC-POWR1014/A
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-35
User Electronic Signature
A user electronic signature (UES) feature is included in the E2CMOS memory of the LA-ispPAC-POWR1014/A.
This consists of 32 bits that can be configured by the user to store unique data such as ID codes, revision numbers
or inventory control data. The specifics of this feature are discussed in the IEEE 1149.1 serial interface section of
this data sheet.
Electronic Security
An electronic security “fuse” (ESF) bit is provided in every LA-ispPAC-POWR1014/A device to prevent unautho-
rized readout of the E2CMOS configuration bit patterns. Once programmed, this cell prevents further access to the
functional user bits in the device. This cell can only be erased by reprogramming the device, so the original config-
uration cannot be examined once programmed. Usage of this feature is optional. The specifics of this feature are
discussed in the IEEE 1149.1 serial interface section of this data sheet.
Production Programming Support
Once a final configuration is determined, an ASCII format JEDEC file can be created using the PAC-Designer soft-
ware. Devices can then be ordered through the usual supply channels with the user’s specific configuration already
preloaded into the devices. By virtue of its standard interface, compatibility is maintained with existing production
programming equipment, giving customers a wide degree of freedom and flexibility in production planning.
Evaluation Fixture
Because the features of an LA-ispPAC-POWR1014/A are all included in the larger ispPAC-POWR1220AT8 device,
designs implemented in an LA-ispPAC-POWR1014/A can be verified using an ispPAC-POWR1220AT8 engineering
prototype board connected to the parallel port of a PC with a Lattice ispDOWNLOAD® cable. The board demon-
strates proper layout techniques and can be used in real time to check circuit operation as part of the design pro-
cess. Input and output connections are provided to aid in the evaluation of the functionality implemented in LA-
ispPAC-POWR1014/A for a given application. (Figure 5-29).
Figure 5-29. Download from a PC
IEEE Standard 1149.1 Interface (JTAG)
Serial Port Programming Interface Communication with the LA-ispPAC-POWR1014/A is facilitated via an IEEE
1149.1 test access port (TAP). It is used by the LA-ispPAC-POWR1014/A as a serial programming interface. A brief
description of the LA-ispPAC-POWR1014/A JTAG interface follows. For complete details of the reference specifica-
tion, refer to the publication, Standard Test Access Port and Boundary-Scan Architecture, IEEE Std 1149.1-1990
(which now includes IEEE Std 1149.1a-1993).
Overview
An IEEE 1149.1 test access port (TAP) provides the control interface for serially accessing the digital I/O of the LA-
ispPAC-POWR1014/A. The TAP controller is a state machine driven with mode and clock inputs. Given in the cor-
rect sequence, instructions are shifted into an instruction register, which then determines subsequent data input,
data output, and related operations. Device programming is performed by addressing the configuration register,
ispDOWNLOAD
Cable (6')
4
Other
System
Circuitry
LA-ispPAC-
POWR1220AT8
Device
PAC-Designer
Software
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-36
shifting data in, and then executing a program configuration instruction, after which the data is transferred to inter-
nal E2CMOS cells. It is these non-volatile cells that store the configuration or the LA-ispPAC-POWR1014/A. A set of
instructions are defined that access all data registers and perform other internal control operations. For compatibil-
ity between compliant devices, two data registers are mandated by the IEEE 1149.1 specification. Others are func-
tionally specified, but inclusion is strictly optional. Finally, there are provisions for optional data registers defined by
the manufacturer. The two required registers are the bypass and boundary-scan registers. Figure 5-30 shows how
the instruction and various data registers are organized in an LA-ispPAC-POWR1014/A.
Figure 5-30. LA-ispPAC-POWR1014/A TAP Registers
TAP Controller Specifics
The TAP is controlled by the Test Clock (TCK) and Test Mode Select (TMS) inputs. These inputs determine whether
an Instruction Register or Data Register operation is performed. Driven by the TCK input, the TAP consists of a
small 16-state controller design. In a given state, the controller responds according to the level on the TMS input as
shown in Figure 5-31. Test Data In (TDI) and TMS are latched on the rising edge of TCK, with Test Data Out (TDO)
becoming valid on the falling edge of TCK. There are six steady states within the controller: Test-Logic-Reset, Run-
Test/Idle, Shift-Data-Register, Pause-Data-Register, Shift-Instruction-Register and Pause-Instruction-Register. But
there is only one steady state for the condition when TMS is set high: the Test-Logic-Reset state. This allows a
reset of the test logic within five TCKs or less by keeping the TMS input high. Test-Logic-Reset is the power-on
default state.
ADDRESS REGISTER (109 BITS)
E2CMOS
NON-VOLATILE
MEMORY
UES REGISTER (32 BITS)
IDCODE REGISTER (32 BITS)
BYPASS REGISTER (1 BIT)
INSTRUCTION REGISTER (8 BITS)
TEST ACCESS PORT (TAP)
LOGIC
OUTPUT
LATCH
TDI TCK TMS TDO
CFG ADDRESS REGISTER (12 BITS)
MULTIPLEXER
DATA REGISTER (123 BITS)
CFG DATA REGISTER (56 BITS)
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-37
Figure 5-31. TAP States
When the correct logic sequence is applied to the TMS and TCK inputs, the TAP will exit the Test-Logic-Reset state
and move to the desired state. The next state after Test-Logic-Reset is Run-Test/Idle. Until a data or instruction shift
is performed, no action will occur in Run-Test/Idle (steady state = idle). After Run-Test/Idle, either a data or instruc-
tion shift is performed. The states of the Data and Instruction Register blocks are identical to each other differing
only in their entry points. When either block is entered, the first action is a capture operation. For the Data Regis-
ters, the Capture-DR state is very simple: it captures (parallel loads) data onto the selected serial data path (previ-
ously chosen with the appropriate instruction). For the Instruction Register, the Capture-IR state will always load
the IDCODE instruction. It will always enable the ID Register for readout if no other instruction is loaded prior to a
Shift-DR operation. This, in conjunction with mandated bit codes, allows a “blind” interrogation of any device in a
compliant IEEE 1149.1 serial chain. From the Capture state, the TAP transitions to either the Shift or Exit1 state.
Normally the Shift state follows the Capture state so that test data or status information can be shifted out or new
data shifted in. Following the Shift state, the TAP either returns to the Run-Test/Idle state via the Exit1 and Update
states or enters the Pause state via Exit1. The Pause state is used to temporarily suspend the shifting of data
through either the Data or Instruction Register while an external operation is performed. From the Pause state,
shifting can resume by reentering the Shift state via the Exit2 state or be terminated by entering the Run-Test/Idle
state via the Exit2 and Update states. If the proper instruction is shifted in during a Shift-IR operation, the next entry
into Run-Test/Idle initiates the test mode (steady state = test). This is when the device is actually programmed,
erased or verified. All other instructions are executed in the Update state.
Test Instructions
Like data registers, the IEEE 1149.1 standard also mandates the inclusion of certain instructions. It outlines the
function of three required and six optional instructions. Any additional instructions are left exclusively for the manu-
facturer to determine. The instruction word length is not mandated other than to be a minimum of two bits, with only
the BYPASS and EXTEST instruction code patterns being specifically called out (all ones and all zeroes respec-
tively). The LA-ispPAC-POWR1014/A contains the required minimum instruction set as well as one from the
optional instruction set. In addition, there are several proprietary instructions that allow the device to be configured
Test-Logic-Rst
Run-Test/Idle Select-DR-Scan Select-IR-Scan
Capture-DR Capture-IR
Shift-DR Shift-IR
Exit1-DR Exit1-IR
Pause-DR Pause-IR
Exit2-DR Exit2-IR
Update-DR Update-IR
1
0
00
00
00
11
00
00
11
11
0011
00
11
11
11 1
0
Note: The value shown adjacent to each state transition in this figure
represents the signal present at TMS at the time of a rising edge at TCK.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-38
and verified. Table 5-11 lists the instructions supported by the LA-ispPAC-POWR1014/A JTAG Test Access Port
(TAP) controller:
Table 5-11. LA-ispPAC-POWR1014/A TAP Instruction Table
BYPASS is one of the three required instructions. It selects the Bypass Register to be connected between TDI and
TDO and allows serial data to be transferred through the device without affecting the operation of the LA-ispPAC-
POWR1014/A. The IEEE 1149.1 standard defines the bit code of this instruction to be all ones (11111111).
The required SAMPLE/PRELOAD instruction dictates the Boundary-Scan Register be connected between TDI
and TDO. The LA-ispPAC-POWR1014/A has no boundary scan register, so for compatibility it defaults to the
BYPASS mode whenever this instruction is received. The bit code for this instruction is defined by Lattice as shown
in Table 5-11.
The EXTEST (external test) instruction is required and would normally place the device into an external boundary
test mode while also enabling the boundary scan register to be connected between TDI and TDO. Again, since the
Instruction
Command
Code Comments
BULK_ERASE 0000 0011 Bulk erase device
BYPASS 1111 1111 Bypass - connect TDO to TDI
DISCHARGE 0001 0100 Fast VPP discharge
ERASE_DONE_BIT 0010 0100 Erases ‘Done’ bit only
EXTEST 0000 0000 Bypass - connect TDO to TDI
IDCODE 0001 0110 Read contents of manufacturer ID code (32 bits)
OUTPUTS_HIGHZ 0001 1000 Force all outputs to High-Z state, FET outputs pulled low
SAMPLE/PRELOAD 00011100 Sample/Preload. Default to bypass.
PROGRAM_DISABLE 0001 1110 Disable program mode
PROGRAM_DONE_BIT 0010 1111 Programs the Done bit
PROGRAM_ENABLE 0001 0101 Enable program mode
PROGRAM_SECURITY 0000 1001 Program security fuse
RESET 0010 0010 Resets device (refer to the RESETb Signal, RESET Command via
JTAG or I2C section of this data sheet)
IN1_RESET_JTAG_BIT 0001 0010 Reset the JTAG bit associated with IN1 pin to 0
IN1_SET_JTAG_BIT 0001 0011 Set the JTAG bit associated with IN1 pin to 1
CFG_ADDRESS 0010 1011 Select non-PLD address register
CFG_DATA_SHIFT 0010 1101 Non-PLD data shift
CFG_ERASE 0010 1001 ERASE Just the Non PLD configuration
CFG_PROGRAM 0010 1110 Non-PLD program
CFG_VERIFY 0010 1000 VRIFY non-PLD fusemap data
PLD_ADDRESS_SHIFT 0000 0001 PLD_Address register (109 bits)
PLD_DATA_SHIFT 0000 0010 PLD_Data register (123 Bits)
PLD_INIT_ADDR_FOR_PROG_INCR 0010 0001 Initialize the address register for auto increment
PLD_PROG_INCR 0010 0111 Program column register to E2 and auto increment address register
PLD_PROGRAM 0000 0111 Program PLD data register to E2
PLD_VERIFY 0000 1010 Verifies PLD column data
PLD_VERIFY_INCR 0010 1010 Load column register from E2 and auto increment address register
UES_PROGRAM 0001 1010 Program UES bits into E2
UES_READ 0001 0111 Read contents of UES register from E2 (32 bits)
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-39
LA-ispPAC-POWR1014/A has no boundary scan logic, the device is put in the BYPASS mode to ensure specifica-
tion compatibility. The bit code of this instruction is defined by the 1149.1 standard to be all zeros (00000000).
The optional IDCODE (identification code) instruction is incorporated in the LA-ispPAC-POWR1014/A and leaves it
in its functional mode when executed. It selects the Device Identification Register to be connected between TDI
and TDO. The Identification Register is a 32-bit shift register containing information regarding the IC manufacturer,
device type and version code (Figure 5-32). Access to the Identification Register is immediately available, via a
TAP data scan operation, after power-up of the device, or by issuing a Test-Logic-Reset instruction. The bit code for
this instruction is defined by Lattice as shown in Table 5-11.
Figure 5-32. LA-ispPAC-POWR1014/A ID Code
LA-ispPAC-POWR1014/A Specific Instructions
There are 25 unique instructions specified by Lattice for the LA-ispPAC-POWR1014/A. These instructions are pri-
marily used to interface to the various user registers and the E2CMOS non-volatile memory. Additional instructions
are used to control or monitor other features of the device. A brief description of each unique instruction is provided
in detail below, and the bit codes are found in Table 5-11.
PLD_ADDRESS_SHIFT – This instruction is used to set the address of the PLD AND/ARCH arrays for subsequent
program or read operations. This instruction also forces the outputs into the OUTPUTS_HIGHZ.
PLD_DATA_SHIFT – This instruction is used to shift PLD data into the register prior to programming or reading.
This instruction also forces the outputs into the OUTPUTS_HIGHZ.
PLD_INIT_ADDR_FOR_PROG_INCR – This instruction prepares the PLD address register for subsequent
PLD_PROG_INCR or PLD_VERIFY_INCR instructions.
PLD_PROG_INCR – This instruction programs the PLD data register for the current address and increments the
address register for the next set of data.
PLD_PROGRAM – This instruction programs the selected PLD AND/ARCH array column. The specific column is
preselected by using PLD_ADDRESS_SHIFT instruction. The programming occurs at the second rising edge of
the TCK in Run-Test-Idle JTAG state. The device must already be in programming mode (PROGRAM_ENABLE
instruction). This instruction also forces the outputs into the OUTPUTS_HIGHZ.
PROGRAM_SECURITY – This instruction is used to program the electronic security fuse (ESF) bit. Programming
the ESF bit protects proprietary designs from being read out. The programming occurs at the second rising edge of
the TCK in Run-Test-Idle JTAG state. The device must already be in programming mode (PROGRAM_ENABLE
instruction). This instruction also forces the outputs into the OUTPUTS_HIGHZ.
PLD_VERIFY – This instruction is used to read the content of the selected PLD AND/ARCH array column. This
specific column is preselected by using PLD_ADDRESS_SHIFT instruction. This instruction also forces the outputs
into the OUTPUTS_HIGHZ.
0000 0000 0001 0100 0101 / 0000 0100 001 / 1 (LA-ispPAC-POWR1014A)
0001 0000 0001 0100 0101 / 0000 0100 001 / 1 (LA-ispPAC-POWR1014)
MSB LSB
Part Number
(20 bits)
00145h = LA-ispPAC-POWR1014A
10145h = LA-ispPAC-POWR1014
JEDEC Manufacturer
Identity Code for
Lattice Semiconductor
(11 bits) Constant 1
(1 bit)
per 1149.1-1990
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-40
DISCHARGE – This instruction is used to discharge the internal programming supply voltage after an erase or pro-
gramming cycle and prepares LA-ispPAC-POWR1014/A for a read cycle. This instruction also forces the outputs
into the OUTPUTS_HIGHZ.
CFG_ADDRESS – This instruction is used to set the address of the CFG array for subsequent program or read
operations. This instruction also forces the outputs into the OUTPUTS_HIGHZ.
CFG_DATA_SHIFT – This instruction is used to shift data into the CFG register prior to programming or reading.
This instruction also forces the outputs into the OUTPUTS_HIGHZ.
CFG_ERASE – This instruction will bulk erase the CFG array. The action occurs at the second rising edge of TCK
in Run-Test-Idle JTAG state. The device must already be in programming mode (PROGRAM_ENABLE instruction).
This instruction also forces the outputs into the OUTPUTS_HIGHZ.
CFG_PROGRAM – This instruction programs the selected CFG array column. This specific column is preselected
by using CFG_ADDRESS instruction. The programming occurs at the second rising edge of the TCK in Run-Test-
Idle JTAG state. The device must already be in programming mode (PROGRAM_ENABLE instruction). This
instruction also forces the outputs into the OUTPUTS_HIGHZ.
CFG_VERIFY – This instruction is used to read the content of the selected CFG array column. This specific column
is preselected by using CFG_ADDRESS instruction. This instruction also forces the outputs into the
OUTPUTS_HIGHZ.
BULK_ERASE – This instruction will bulk erase all E2CMOS bits (CFG, PLD, UES, and ESF) in the LA-ispPAC-
POWR1014/A. The device must already be in programming mode (PROGRAM_ENABLE instruction). This instruc-
tion also forces the outputs into the OUTPUTS_HIGHZ.
OUTPUTS_HIGHZ – This instruction turns off all of the open-drain output transistors. Pins that are programmed as
FET drivers will be placed in the active low state. This instruction is effective after Update-Instruction-Register
JTAG state.
PROGRAM_ENABLE – This instruction enables the programming mode of the LA-ispPAC-POWR1014/A. This
instruction also forces the outputs into the OUTPUTS_HIGHZ.
IDCODE – This instruction connects the output of the Identification Code Data Shift (IDCODE) Register to TDO
(Figure 5-33), to support reading out the identification code.
Figure 5-33. IDCODE Register
PROGRAM_DISABLE – This instruction disables the programming mode of the LA-ispPAC-POWR1014/A. The
Test-Logic-Reset JTAG state can also be used to cancel the programming mode of the LA-ispPAC-POWR1014/A.
UES_READ – This instruction both reads the E2CMOS bits into the UES register and places the UES register
between the TDI and TDO pins (as shown in Figure 5-30), to support programming or reading of the user electronic
signature bits.
Figure 5-34. UES Register
TDO
Bit
0
Bit
1
Bit
2
Bit
3
Bit
4
Bit
27
Bit
28
Bit
29
Bit
30
Bit
31
TDO
Bit
0
Bit
1
Bit
2
Bit
3
Bit
4
Bit
5
Bit
6
Bit
7
Bit
8
Bit
9
Bit
10
Bit
11
Bit
12
Bit
13
Bit
14
Bit
15
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-41
UES_PROGRAM – This instruction will program the content of the UES Register into the UES E2CMOS memory.
The device must already be in programming mode (PROGRAM_ENABLE instruction). This instruction also forces
the outputs into the OUTPUTS_HIGHZ.
ERASE_DONE_BIT – This instruction clears the ‘Done’ bit, which prevents the LA-ispPAC-POWR1014/A
sequence from starting.
PROGRAM_DONE_BIT – This instruction sets the ‘Done’ bit, which enables the LA-ispPAC-POWR1014/A
sequence to start.
RESET – This instruction resets the PLD sequence and output macrocells.
IN1_RESET_JTAG_BIT – This instruction clears the JTAG Register logic input ‘IN1.’ The PLD input has to be con-
figured to take input from the JTAG Register in order for this command to have effect on the sequence.
IN1_SET_JTAG_BIT – This instruction sets the JTAG Register logic input ‘IN1.’ The PLD input has to be configured
to take input from the JTAG Register in order for this command to have effect on the sequence.
PLD_VERIFY_INCR – This instruction reads out the PLD data register for the current address and increments the
address register for the next read.
Notes:
In all of the descriptions above, OUTPUTS_HIGHZ refers both to the instruction and the state of the digital output
pins, in which the open-drains are tri-stated and the FET drivers are pulled low.
Before any of the above programming instructions are executed, the respective E2CMOS bits need to be erased
using the corresponding erase instruction.
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-42
Package Diagrams
48-Pin TQFP (Dimensions in Millimeters)
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
0.220.17b 0.27
0.16
0.23
0.200.09c
c1 0.09
b1 0.17
0.15
0.13
0.20
MAX.
1.60
0.15
0.75
1.45
e
N
L 0.45
0.50 BSC
0.60
48
E1
E
D1
D
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
A2
A1
1.35
0.05
SYMBOL
A-
MIN.
1.40
-
NOM.
-
C A-B D
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
A
3.
0.08
c
b
1
c
MC
b
A-B D
3.
D
4X
8.
e
B3.
E
D
0.20
GAUGE PLANE
A1
0.08 C
AA2
1.00 REF.
L
0.20 MIN.
B
0-7∞
B
H
E1
0.25
0.20 DA-BH D1
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-43
Part Number Description
LA-ispPAC-POWR1014/A Ordering Information
Lead-Free Packaging
Package Options
Part Number Package Pins
LA-ispPAC-POWR1014A-01TN48E Lead-Free TQFP 48
LA-ispPAC-POWR1014-01TN48E Lead-Free TQFP 48
Device Number
LA-ispPAC-POWR1014X - 01TN48E
Operating Temperature Range
E = Automotive (-40oC to +105oC TA)
Package
TN = Lead-Free 48-pin TQFP
Performance Grade
01 = Standard
ADC Support
A = ADC present
Device Family
LA-ispPAC-POWR1014A
48-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
OUT7
OUT6
OUT5
OUT4
GNDD
VMON9
VMON8
VMON7
VMON6
VMON5
GNDD
VCCA
VMON4
VMON3
VMON2
VMON1
GNDA
IN4
IN3
IN2
VCCINP
IN1
MCLK
VCCD
RESETB
SCL
SDA
VMON10
PLDCLK
SMBA_OUT3
HVOUT2
HVOUT1
TMS
ATDI
TDI
VCCJ
TDO
TCK
VCCD
VCCPROG
TDISEL
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-44
Package Options (Cont.)
Automotive Disclaimer
Products are not designed, intended or warranted to be fail-safe and are not designed, intended or warranted for
use in applications related to the deployment of airbags. Further, products are not intended to be used, designed or
warranted for use in applications that affect the control of the vehicle unless there is a fail-safe or redundancy fea-
ture and also a warning signal to the operator of the vehicle upon failure. Use of products in such applications is
fully at the risk of the customer, subject to applicable laws and regulations governing limitations on product liability.
Technical Support Assistance
Hotline: 1-800-LATTICE (North America)
+1-503-268-8001 (Outside North America)
e-mail: isppacs@latticesemi.com
Internet: www.latticesemi.com
LA-ispPAC-POWR1014
48-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
OUT7
OUT6
OUT5
OUT4
GNDD
VMON9
VMON8
VMON7
VMON6
VMON5
GNDD
VCCA
VMON4
VMON3
VMON2
VMON1
GNDA
IN4
IN3
IN2
VCCINP
IN1
MCLK
VCCD
RESETB
VMON10
GNDD
GNDD
PLDCLK
SMBA_OUT3
HVOUT2
HVOUT1
TMS
ATDI
TDI
VCCJ
TDO
TCK
VCCD
VCCPROG
TDISEL
Lattice Semiconductor LA-ispPAC-POWR1014/A Automotive Family Data Sheet
5-45
Revision History
Date Version Change Summary
January 2008 01.0 Initial release.
June 2008 01.1 Added timing diagram and timing parameters to "Power-On Reset" specifications.
Modified PLD Architecture figure to show input registers.
Updated I2C Control Registers table.
VCCPROG pin usage clarification added.
Added automotive disclaimer text section.
