HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6310-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 1/4 HMPSA55 PNP SILICON TRANSISTOR Description The HMPSA55 is designed for using in a amplifier applications. Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -60 V VCEO Collector to Emitter Voltage .................................................................................... -60 V VEBO Emitter to Base Voltage ............................................................................................ -4 V IC Collector Current ..................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO ICEO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Min. -60 -60 -4 50 50 50 Typ. - Max. -100 -100 -0.25 -1.2 - Unit V V V nA nA V V MHz Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-100uA, IC=0 VCB=-60V, IE=0 VCE=-60V, IB=0 IC=-100mA, IB=-10mA IC=-100mA, VCE=-1V IC=-10mA, VCE=-1V IC=-100mA, VCE=-1V IC=-100mA, VCE=-1V, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6310-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current & Collector Current Saturation Voltage & Collector Current 1000 Saturation Voltage (mV) Current Gain-hFE 1000 100 VCE=1V 100 VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 0.1 1000 1 On Voltage & Collector Current 100 1000 Cutoff Frequency & Collector Current 1000 Cutoff Frequency (MHz) 10000 On Voltage (mV) 10 Collector Current-IC (mA) Collector Current-IC (mA) 1000 VBE(on) @ VCE=1V 100 VCE=2V 100 10 0.1 1 10 100 1000 1 10 Collector Current-IC (mA) 100 1000 Collector Current-IC (mA) Safe Operating Area Capacitance & Reverse-Biased Voltage 10000 100 Collector Current-IC (mA) Capacitance (pF) PT=1ms Cob 10 1 PT=100ms 1000 PT=1s 100 10 1 0.1 1 10 Reverse Biased Voltage (V) 100 1 10 100 Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6310-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 Power Dissipation-PD(mW) 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6310-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension 2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank 3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark 1 Style : Pin 1.Emitter 2.Base 3.Collector E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification