No.MLPGE10023 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER Fl 212P089208-T TAIYO YUDEN CO., LTD. Date:23.Aug.2010HIGH FREQUENCY MULTILAYER CHIP Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics 3-2 Inspection method (reference) 3-3 Attenuation 3-4 Environmental conditions 4. Mechanical specification 4-1 Mechanical specification 4-2 External dimensions / Structural chart 4-3 Material 4-4 Marking 4-5 Example of land pattern (reference) 5. Reliability test Condition 5-1 Reliability test 5-2 Recommended Soldering Condition 6. Packaging 7. Precautions %ROHS compliance - This product conform to "RoHS compliance. - "RoHS compliance means that the product does not contain lead, cadmium, mercury, hexavalent chromium, PBB or PBDE referring to EU Directive 2002/95/EC, except other non-restricted substances or impurities which could not be technically removed at the refining process.1 Scope This specification covers high frequency multilayer chip filter [Fl 212P089208-T]| for use in electronic appliances and electric communications equipment. 2 Part Numbering System Part number is indicated as follows. _FL A 212 P 0892 08 -T (1) (2) (3) (4) (5) (6) (7) Code Contents Example Explanation (1) Device Fl High frequency multilayer chip filter (2) Electrodes A (Space) Plating (3) Dimensions 212 2.0 1.25 mm (4) Special code P Diplexer (5) Frequency (MHz) 0892 892 MHz (6) Spec 08 Individual Spec (7) Packaging T Packaging code3 Electrical specification 3-1 Electrical Characteristics COMM (P5) LOW (P1) No. Item Specification Remarks 1 Pass band frequency 824 - 960 MHz 2 Insertion loss at pass band 0.27 dB Max. 26 deg-C 0.32 dB Max. -A0 ~ +85 deg-C 3 V.S.W.R. at pass band 2.0 Max. COMM to LOW 4 Attenuation 13 dB Min. 1710 - 2170 MHz 5 Impedance 50 ohm P2 ,P6 6 Power Capacity 33dBm Max. 824 - 960 MHz COMM (P5) - HIGH (P3) No. Item Specification Remarks 1 Pass band frequency 1710 - 2170 MHz 2 Insertion loss at pass band 0.45 dB Max. 28 deg-C 0.55 dB Max. -40 ~ +85 deg-C 3 V.S.W.R. at pass band 2.0 Max. COMM to HIGH 4 Attenuation 19 dB Min. 824 - 960 MHz 5 Impedance 50 ohm P2 , P4 6 Power Capacity 33dBm Max. 1710 - 2170 MHz LOW(P1) HIGH (P3) No. Item Specification Remarks 1 19 dB Min 824 - 960 MHz lsolation 2 13 dB Min 1710 - 2170 MHz % Unless otherwise specified , conduct inspection in accordance with the condition specified in 3-4 Environment conditions.3-2 Inspection method (reference) Electrical characteristics shall be measured on condition that test sample is set in specified measuring equipment. Measuring equipment NETWORK ANALYZER E5071B or equivalent E5071B P1 Measuring jig P5 P3 3-3 Attenuation In above measuring equipment, when inputP5 and outputP1orP3 are shorted, output shall be E1. And in case calibrated to reference level (OdB), when test sample is inserted in the equipment, output shall be E2. The loss shall be prescribed as attenuation. Attenuation (ATT.) = -20 log (E2/E1) [dB] 3-4 Environmental conditions Standard test conditions shall be temperature of 5 to 35C, relative humidity of 45 to 85% and air pressure of 86 to 106kPa. Test shall be conducted at temperature of 2042C, relative humidity of 60 to 70% and air pressure of 86 to 106kPa if test result is suspicious. Unless otherwise specified, all tests shall be conducted under standard conditions.~ 4 Mechanical specification 4-1 Mechanical specification a sign of exfoliation. No significant abnormality in appearance. No. ltem Specified Value Remarks 1 | Operating Temperature | -30 to +85C Continuous use is available in this range. Range 2 | Adhesive Force Initial performance Conforming to JIS C 60068-2-21 Appendix 2 shall be satisfied. Test sample shall be soldered to test jig and a force of 5N Terminal electrodes {0.51kgf} shall be applied from I/O side for 1041 seconds. 3 | Bending Strength have no exfoliation or | Conforming to JIS C 60068-2-21 Appendix 2 Test sample shall be soldered to test board. Soldering shall be conducted with care of avoiding an abnormality such as heat shock. Deflection test is such that force to cause deflection as much as 2.0mm is applied for 10 seconds in method shown in figure below. Board thickness shall be 0.8mm. Apply force ZB WAZ 7 Amount of Board roa . J deflection (Unit: mm]4-2 External dimensions / Structural chart (Unit: mm) L A (1) v (2) (3) (5) (4) 4-3 Material Mark Marking A Directional Input Mark Mark Dimension Mark Dimension L 2.00 +/-0.15 cl 0.20 +/-0.15 Ww 1.25 +/-0.15 c2 0.20 +/-0.15 T 0.90 +/-0.1 e 0.35 +/-0.20 a 0.30 +/-0.20 p 0.65 +/-0.20 b 0.20 +/-0.15 Terminal No. | Terminal Name (1) Low band (2) GND (3) High Band (4) GND (5) Common port (6) GND No. Name Material [1] | Terminal Electrodes (Surface) Sn Plating [2] Terminal Electrodes Ni Plating [3] External Electrodes Ag [4] internal Electrodes Ag [5] Dielectric Ceramics of Ca-Mg-Si type4-4 Marking Marking dot which means direction of product. 4-5 Example of land. pattern (reference) Thickness: 0.4mm, BT resin, Both side via hole board Electrodes pattern Resist pattern (aperture size) 0. 65 \ = ce oS \ | re S Unit : mm I So co oS ! 0. 35 Via hole Line width be designed to match 50ohm characteristic impedance.5. Reliability test Condition 5-1 Reliability test No. Item Specified Value Remarks 1 | Thermal Shock Initial performance shall | Conforming to JIS C 0025 be satisfied. Test sample shall be soldered to test board. No significant change in| Test sample shall be kept for specified time at each of appearance. temperature in steps 1 to 4 shown below in sequence. Step | Temperature (C) Time (minutes) 1 -40+3 3043 2 Normal temperature 3 max. 3 +854 2T 30+3 4 Normal temperature 3 max. Temperature cycle shall be repeated 1000 times in this method, and measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours. 2 | High Temperature Conforming to JIS C 60068-2-2 Life Test Temperature: 85 + 2C Duration: 1000 hours Measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours. 3 | Low Temperature Conforming to JIS C 60068-2-1 Life Test Temperature: -40 + 2C Duration: 1000 hours Measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours. 4 | Humidity Conforming to JIS C 60068-2-3 Temperature: 85 + 2C Relative humidity: 830~85%RH Duration: 1000 hours Measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours.5. Reliability test Condition 5-1 Reliability test No. Item Specified Value Remarks 5 | Resistance to Soldering Heat (Reflow) Resistance to Soldering Heat (Dip) Initial performance shall be satisfied. No significant change in appearance. Electrical characteristics shall be evaluated after chips passed from reflow soldering temperature profile as shown in 5-2 two times. Solder: Sn-3Ag- 0.5Cu Measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours. Conforming to JIS C 60068-2-20 Preheating temperature: 150 10C Duration: 1 to 2 minutes Solder temperature: 260 + 5C Duration: 5 + 0.5 seconds immersion depth: whole chip shall be immersed into solder Solder: Sn-3Ag- 0.5Cu Flux: Rosin that contains 25% methyl alcohol Measurement shall be conducted after test sample is kept at room temperature for 2 to 3 hours. 6 | Solderability More than 95% of terminal electrodes shall be _ covered with fresh solder. Conforming to JIS C 60068-2-20 (Eutectic solder) Solder: H63A Solder temperature: 230 + 5C Immersion duration: 4 + 1 seconds Immersion depth: whole chip shall be immersed into solder Flux: Rosin that contains 25% methyl alcohol (Pb-free solder) Solder: Sn-3Ag- 0.5Cu Solder temperature: 245 + 5C Immersion duration: 3 + 1 seconds Immersion depth: whole chip shall be immersed into solder Flux: Rosin that contains 25% methyl alcohol5-2 Recommended Soldering Condition Recommended Soldering Profiles for Lead-free Solder Paste Reflow soldering Oo 300 Peak 260C max ~> iS 10sec max eg 2 ' i 200 tonne = ' Gradually 2 \ ' ' cooling 100 : Preheating : \ I-- nee >I =>! , 150 1 3 : Heating above 230C | 60secmin i; 3 40sec max * Components should be preheated to within 100 to 130C from soldering temperature. Assured to be reflow soldering for 2 times Soldering iron 00 >! '<- 350C max Ooo | eee 3sec max ~~ 300 g Gradually @ AT cooling S 200 : ! \ re 1 i 100 ' i 60sec min ' \ 0 *K ATS190C (3216Type max) , ATS130 (3225Type min) X It is recommended to use 20W soldering iron and the tip is 1@ or less. <The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended.6-1 Packaging Taping shall be conducted as follows. Unless otherwise specified, conform to JIS C 0806. * Taping shall be right-sided wound (when the end is pulled out, sprocket hole will be at the right-hand side). Seal tape shall not be crossed over sprocket holes. And seal tape shall not be out of carrier tape. * For packaging chips by taping, blank spaces are provided on taping as shown below. Leader part: 400mm min. Leader part (Blank part): 100mm min. Trailer part (Blank part): = 160mm min. 160mm min. Trailer part 400mm min. chip packaging area Leader part $178+2.0 100mm min. Blank part Unit [mm] + Leader part of seal tape shall be sealed with adhesive tape. * Peeling strength of seal tape (or top tape) shall be 0.1~0.7N (10.2~71.4gf) when seal tape (or top tape) is peeled from carrier tape at an angle of 0 ~20 + Label indicating Parts No., Quantity, Control No. and Customer Parts No. shall be attached to reel.6-2 Dimensions of Reel Customer label 4A at A Ww Code | OA bB oc oD Dimension 178+2.0 50 min 1340.2 2140.8 Code E W t R Dimension 2.00.5 10+1.5 2.5 max 1.0 Unit [mm] Chips shall be packaged in the uniform direction; Marked side shall face sprocket holes. Chips shail not be out of mounting part of carrier tape. OO 0 0 O02 90 OO O @ @ @ @6-3 External dimensions of carrier tape (Unit: mm) 440.1 61.5+0.1 1.75+0.1 / 0 240.05 4 bb----b@b - 6 --) H- ' ro po roto ' ropa he fp=4 ropa ropa ee api pepo 840.3 t 1 ( i 1 I i t l | | | 1 f | | 6.25 teed me eed oe ee fed I Ly I gg Lp I HOOP OC OPC . 3.520.05 y , | 2.340.2 440.1 Seal tape =< ees LCOS OCIC| se Sn 0.31max. Carrier tape \S Feeding direction 6-4 Package type Customer Label One Reel 190 185 70 Unit [mm] (The size is only for reference.) - To attach labels means that all products are passed. 3,000 pcs/ Reel Customer label description 1. Manufacturer Name 2. Customer Parts No. 3. Our parts No. 4. Quantity 5. Control No. (Shipping Lot No.) 6. Manufacturing site (MADE IN OOO)7-1 Precautions 1. Do not use the product in the following environment. It may cause deterioration of the characteristics. - Areas exposed to particular gases, such as C12, NH3, SOx and NOx. * Areas exposed to volatile or combustible gases. - Areas exposed to excessive dust. * Areas exposed to water. - Areas exposed to direct sunlight. Areas exposed to freezing temperature. - Areas exposed to dew condensation due to high humidity. 2. Product is made from ceramics element. Do not apply excessive pressure and shock. 3. Do not apply excessive pressure and shock when transporting and handling print circuit board with the product mounted. 4. Be careful when handling (do not fall and hit) the product. Characteristics may be changed when electrode is damaged or chipped out. Do not touch the product with bare hands. It may cause solderability declines. 5. Please store the product under the following condition. Temperature: -10C to +40 Humidity: 15 to 85% RH Use the product within six months after the delivery. After the six months, confirm solderability before use. 6. When arranging the mounting position of the product, avoid the area where stresses are applied to the warp or deflection of the circuit board. Do not apply warp or stress to the board. When the board is bend during the process after the product is soldered, or during the board is handled, it may cause electrode peeling or chip cracks. The process after soldering the product includes cutting of circuit board, break board checker, mounting of other components, instaliation to chassis, and flow soldering to the back of reflow soldered board, etc. Separation of the sheet board should not be done manually, but by using the appropriate devices. 7. Do not apply excessive stress and shock when mounting the product on printed circuit board, in order to prevent from breaking or chipped out. 8. Use flux containing less than 0.1% wt (cl conversion) of halogen material for soldering, in order to prevent the corrosion of electrodes and the decline of insulation resistance. 9. Component shall be preheated to within 100C from soldering temperature, in order to prevent breaks of the product. 10. Ultrasonic cleaning may cause cracks on the product or its soldered part by the ultrasonic vibration, or lower the strength of terminal electrode. Prior confirmation of the cleaning condition is required.Composition of the Shipping Lot Number (ex) 0 A DIOX KAAAAAAAA jo | | Year of Month of Sequence production production number O) @ @ @yYear of production (The last numeral of the Christian era. (ex.)2010year0) @Month of production (It is due to the table below.) @Sequence number is alphanumeric including space. month 1 2 3 4 5 6 7 8 9 10 code A B Cc D EOperating conditions for guarantee of this product are as shown in the specification. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for a failure and/or abnormality which are caused by use under the conditions other than aforesaid operating conditions. a All electronic components listed in this specification are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation, (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network(telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. a Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. a The contents of this specification are applicable to the products which are purchased from our sales offices or distributors (so called TALYO YUDENs official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDENs official sales channel. uw Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this specification. Taiyo Yuden Co., Ltd. grants no license for such rights. a Caution for export Certain items in this specification may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.