To our custo mers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corpor ation took over all the business of both
companies. Therefore, althoug h the old company name remains in t his document, it is a valid
Renesas Electronics document. W e appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electr onics Corporat ion (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume an y liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
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incurred by you resulting from errors in or omissions from the information included herein.
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“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equ ipment; submersible repeaters; nuclear reactor control systems; medical equi pment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific chara cterist ics such as the o ccurren ce of failure at a certai n rate and mal functi on s under certai n u se cond itions. Further,
Renesas Electronics pr oducts are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sal es office for details as to environmental matters such as t he environmental
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Electronics.
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document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Ren esas E lectro nics Corpor ation and also inclu des its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 1 of 6
2SK1519, 2SK1520
Silicon N Channel MOS FET REJ03G0948-0400
Rev.4.00
May 13, 2009
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
Built-in fast recovery diode (trr = 120 ns)
Suitable for motor control, switching regulator, DC-DC converter
Outline
RENESAS Package code: PRSS0004ZF-A
(Package name: TO-3PL)
1. Gate
2. Drain
3. Source
D
G
S
123
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
2SK1519 450 Drain to source voltage 2SK1520 VDSS 500 V
Gate to source voltage VGSS ±30 V
Drain current ID 30 A
Drain peak current ID(pulse)*1 120 A
Body to drain diode reverse drain current IDR 30 A
Channel dissipation Pch*2 200 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1%
2. Valu e at TC = 25°C
2SK1519, 2SK1520
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 2 of 6
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
2SK1519 450
Drain to source
breakdown voltage 2SK1520 V(BR)DSS 500 — — V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS ±30 — V IG = ±100 µA, VDS = 0
Gate to source leak current IGSS ±10 µA VGS = ±25 V, VDS = 0
2SK1519 VDS = 360 V, VGS = 0
Zero gate voltage drain
current 2SK1520 IDSS — 250 µA VDS = 400 V, VGS = 0
Gate to source cutoff voltage VGS(off) 2.0 3.0 V ID = 1 mA, VDS = 10 V
2SK1519 — 0.11 0.15
Static drain to source on
state resistance 2SK1520 RDS(on) — 0.12 0.16 I
D = 15 A, VGS = 10 V *3
Forward transfer admittance |yfs| 15 25 S ID = 15 A, VDS = 10 V *3
Input capacitance Ciss 5800 pF
Output capacitance Coss 1550 pF
Reverse transfer capacitance Crss 170 pF
VDS = 10 V, VGS = 0,
f = 1 MHz
Turn-on delay time td(on) 65 ns
Rise time tr170 ns
Turn-off delay time td(off)415 ns
Fall time tf200 ns
ID = 15 A, VGS = 10 V,
RL = 2
Body to drain diode forward voltage VDF1.1 V IF = 30 A, VGS = 0
Body to drain diode reverse recover y
time trr120 ns
IF = 30 A, VGS = 0,
diF/dt = 100 A/µs
Note: 3. Pulse test
2SK1519, 2SK1520
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 3 of 6
Main Characteristics
300
200
100
0 50 100 150
Case Temperature TC (°C)
Power vs. Temperature Derating
Channel Dissipation Pch (W)
1,000
30
3
0.1
10 100 1,000
Drain to Source Voltage VDS (V)
Drain Current ID (A)
Maximum Safe Operation Area
300
0.3
1 3 30 300
Ta = 25°C
10 µs
100 µs
DC Operation (T
C
= 25
°
C)
1 ms
PW = 10 ms (1 Shot)
100
10
1
Operation in this area
is limited by R
DS (on)
2SK1520
2SK1519
50
820
Drain to Source Voltage VDS (V)
Typical Output Characteristics
40
10
412 16
Pulse Test
0
20
30
4.5 V
V
GS
= 4 V
Drain Current ID (A)
5 V
6 V
10 V
50
410
Gate to Source Voltage VGS (V)
Drain Current ID (A)
Typical Transfer Characteristics
40
10
268
–25°C
0
20
30
V
DS
= 10 V
Pulse Test
25°C
T
C
= 75°C
10
410
Gate to Source Voltage VGS (V)
Drain to Source Saturation Voltage VDS (on) (V)
8
2
2680
4
6
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
20 A
I
D
= 50 A
Pulse Test
10 A
5
200
Drain Current ID (A)
Static Drain to Source on State Resistance
RDS (on) ()
2
0.1
5 20 1002
0.5
1
Static Drain to Source on State
Resistance vs. Drain Current
0.2
0.05
50
V
GS
= 10 V, 15 V
Pulse Test
10
2SK1519, 2SK1520
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 4 of 6
0.5
40 160
Case Temperature T
C
(°C)
Static Drain to Source on State Resistance
R
DS (on)
()
0.4
0.1
0 80 120
0
0.2
0.3
Static Drain to Source on State
Resistance vs. Temperature
I
D
= 50 A
V
GS
= 10 V
Pulse Test
–40
20 A
10 A
100
150
Drain Current I
D
(A)
Forward Transfer Admittance yfs (S)
50
5
0.5 2 10
1
10
20
Forward Transfer Admittance
vs. Drain Current
V
DS
= 10 V
Pulse Test
2
520
75°C
25°C
T
C
= –25°C
500
10
Reverse Drain Current I
DR
(A)
Reverse Recovery Time trr (ns)
200
20
1
50
100
Body to Drain Diode Reverse
Recovery Time
di/dt = 100 A/µs, V
GS
= 0
Pulse Test
10
0.5 2 20 505
1,000 10,000
20 50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
100
10 30 40
Typical Capacitance vs.
Drain to Source Voltage
0
10
Crss
Coss
Ciss
V
GS
= 0
f = 1 MHz
1,000
1,000
160 400
Gate Charge Qg (nC)
Drain to Source Voltage V
DS
(V)
800
80 2400 320
600
400
200 I
D
= 30 A
Pulse Test
V
DD
= 400 V
Dynamic Input Characteristics
250 V
V
GS
20
Gate to Source Voltage V
GS
(V)
16
12
8
4
0
0
V
DS
100 V
V
DD
= 100 V
250 V
400 V
1,000
250
Drain Current I
D
(A)
Switching Time t (ns)
500
50
1520
10
100
200
0.5
20
10
Switching Characteristics
t
f
t
d (off)
t
r
V
GS
= 10 V, PW = 2 µs
duty < 1%, V
DD
30 V
=
..
t
d (on)
2SK1519, 2SK1520
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 5 of 6
50
2.0
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A)
40
0.4 0.8 1.6
0
20
30
0
10
1.2
Pulse Test
10 V
V
GS
= 0, –5 V
Reverse Drain Current vs.
Source to Drain Voltage
3
Pulse Width PW (S)
Normalized Transient Thermal Impedance γ
S
(t)
1
0.1
0.3
D = 1
10 µ
0.03
0.01
100 µ10 m 100 m 1 101 m
T
C
= 25°C
0.5
0.2
0.1
0.05
0.02
0.01
1 Shot Pulse
Normalized Transient Thermal Impedance vs. Pulse Width
TPW
P
DM
D = T
PW
θch–c (t) = γ
S
(t) θch–c
θch–c = 0.625°C/W, T
C
= 25°C
Switching Time Test Circuit
Vin Monitor
Vin
10 V
50
D.U.T
Vout Monitor
V
DD
30 V
=
..
R
L
Waveforms
Vin
Vout
t
d (on)
10%
t
r
t
f
10%
90%
10%
90%
t
d (off)
90%
2SK1519, 2SK1520
REJ03G0948-0400 Rev.4.00 Ma y 13, 2009
Page 6 of 6
Package Dimensions
20.0 ± 0.3
φ3.3 ± 0.2
1.4
2.2
3.0
1.2
5.45 ± 0.5
5.45 ± 0.5
1.0
3.8
7.4
2.8 ± 0.2
0.6
5.0 ± 0.2
6.0 ± 0.2
26.0 ± 0.3
20.0 ± 0.6
2.5 ± 0.3
+0.25
–0.1
+0.25
–0.1
Previous Code
PRSS0004ZF-A TO-3PL / TO-3PLV
MASS[Typ.]
9.9g
RENESAS CodeJEITA Package Code
Unit: mm
Package Name
TO-3PL
Ordering Information
Part Name Quantity Shipping Container
2SK1519-E 250 pcs Box (Tube)
2SK1520-E 250 pcs Box (Tube)
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
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Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
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Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2009. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2