Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 LM266x Switched Capacitor Voltage Converter 1 Features 3 Description * * * * The LM2662/LM2663 CMOS charge-pump voltage converter inverts a positive voltage in the range of 1.5 V to 5.5 V to the corresponding negative voltage. The LM2662/LM2663 uses two low cost capacitors to provide 200 mA of output current without the cost, size, and EMI related to inductor based converters. With an operating current of only 300 A and operating efficiency greater than 90% at most loads, the LM2662/LM2663 provides ideal performance for battery powered systems. The LM2662/LM2663 may also be used as a positive voltage doubler. 1 * Inverts or Doubles Input Supply Voltage 3.5- Typical Output Resistance 86% Typical Conversion Efficiency at 200 mA (LM2662) Selectable Oscillator Frequency: 20 kHz/150 kHz (LM2663) Low Current Shutdown Mode 2 Applications * * * * * * Laptop Computers Cellular Phones Medical Instruments Operational Amplifier Power Supplies Interface Power Supplies Handheld Instruments space space Voltage Inverter The oscillator frequency can be lowered by adding an external capacitor to the OSC pin. Also, the OSC pin may be used to drive the LM2662/LM2663 with an external clock. For LM2662, a frequency control (FC) pin selects the oscillator frequency of 20 kHz or 150 kHz. For LM2663, an external shutdown (SD) pin replaces the FC pin. The SD pin can be used to disable the device and reduce the quiescent current to 10 A. The oscillator frequency for LM2663 is 150 kHz. Device Information(1) PART NUMBER LM2662 LM2663 PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm x 3.91 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. space space Positive Voltage Doubler Splitting VIN in Half * Please see Positive Voltage Doubler section regarding choice of D1. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Performance Characteristics ........................ Parameter Measurement Information .................. 9 Detailed Description ............................................ 10 8.1 Overview ................................................................. 10 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 10 8.4 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Applications ................................................ 12 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 18 11.1 Layout Guidelines ................................................. 18 11.2 Layout Example .................................................... 18 12 Device and Documentation Support ................. 19 12.1 12.2 12.3 12.4 12.5 Device Support .................................................... Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 13 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2013) to Revision E * Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section .............. 1 Changes from Revision C (May 2013) to Revision D * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 15 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 5 Pin Configuration and Functions 8 Pins LM2662 SOIC (D) Top View 8 Pins LM2663 SOIC (D) Top View Pin Functions PIN NUMBE R DESCRIPTION NAME TYPE FC (LM2662) VOLTAGE INVERTER VOLTAGE DOUBLER Frequency control for internal oscillator: Input 1 FC = open, OSC = 20 kHz (typ); FC = V+, OSC = 150 kHz (typ); Same as inverter. FC has no effect when OSC pin is driven externally. 1 2 3 4 5 SD (LM2663) CAP+ GND CAP- OUT Input Shutdown control pin, tie this pin to the ground in normal operation. Same as inverter. Power Connect this pin to the positive terminal of charge-pump capacitor. Same as inverter. Ground Power supply ground input. Power supply positive voltage input. Power Connect this pin to the negative terminal of charge-pump capacitor. Same as inverter. Power Negative voltage output. Power supply ground input. Input Low-voltage operation input. Tie LV to GND when input voltage is less than 3.5 V. Above 3.5 V, LV can be connected to GND or left open. When driving OSC with an external clock, LV must be connected to GND. LV must be tied to OUT. Input Oscillator control input. OSC is connected to an internal 15-pF capacitor. An external capacitor can be connected to slow the oscillator. Also, an external clock can be used to drive OSC. Same as inverter except that OSC cannot be driven by an external clock. LV 6 OSC 7 8 V+ Power Input Power supply positive voltage input. Positive voltage output. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 3 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX Supply voltage (V+ to GND, or GND to OUT) (OUT - 0.3 V) LV (GND + 3 V) V+ and OUT continuous output current 250 Output short-circuit duration to GND (3) Power dissipation (TA = 25C) (4) (4) 1 sec. 735 mW 150 Operating ambient temperature -40 85 Operating junction temperature -40 105 Lead temperature (soldering, 10 seconds) (1) (2) (3) (4) V The least negative of (OUT - 0.3 V) or (V+ - 6 V) to (V+ + 0.3 V) FC, OSC, SD TJ max UNIT 6 C 300 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be avoided. Also, for temperatures above 85C, OUT must not be shorted to GND or V+, or device may be damaged. The maximum allowable power dissipation is calculated by using PDMax = (TJMax - TA)/RJA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and RJA is the junction-to-ambient thermal resistance of the specified package. 6.2 Handling Ratings Tstg Storage temperature range V(ESD) (1) Electrostatic discharge MIN MAX UNIT -65 150 C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX V+ (supply voltage) 2.5 5.5 Junction temperature (TJ) -40 105 Ambient temperature (TJ) -40 85 UNIT V C 6.4 Thermal Information LM2662 THERMAL METRIC (1) LM2663 SOIC (D) UNIT 8 PINS RJA (1) 4 Junction-to-ambient thermal resistance 170 170 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 6.5 Electrical Characteristics Unless otherwise specified: V+ = 5 V, FC = Open, C1 = C2 = 47 F. (1) PARAMETER V+ TEST CONDITION Supply Voltage IQ RL = 1k Supply Current ISD Shutdown Supply Current (LM2663) VSD Shutdown Pin Input Voltage (LM2663) IL Output Current ROUT Output Resistance (5) fOSC Oscillator Frequency 5.5 Inverter, LV = GND 1.5 5.5 Doubler, LV = OUT 2.5 5.5 No Load FC = V+ (LM2662) LV = Open SD = Ground (LM2663) 1.3 4 FC = Open 0.3 0.8 Shutdown Mode 2 Normal Operation OSC = Open 0.3 OSC = Open FC = Open OSC Input Current 7 20 55 150 3.5 10 27.5 75 FC = Open PEFF Power Efficiency VOEFF Voltage Conversion Efficiency RL (500) between V+ and OUT 10 90% 96% 99% 99.96% IL = 200 mA to GND (2) (3) (4) (5) (6) (7) No Load 7 2 FC = V+ mA V mA 3.5 FC = Open V (4) 200 (6) UNIT A 10 FC = V+ (1) MAX (2) 3.5 IL = 200 mA Switching Frequency (7) IOSC TYP (3) Inverter, LV = Open FC = V+ fSW MIN (2) kHz kHz A 86% In the test circuit, capacitors C1 and C2 are 47-F, 0.2- maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output voltage and efficiency. -40C to 105C TJ = 25C In doubling mode, when Vout > 5 V, minimum input high for shutdown equals Vout - 3 V. Specified output resistance includes internal switch resistance and capacitor ESR. For LM2663, the oscillator frequency is 150 kHz. The output switches operate at one half of the oscillator frequency, OSC = 2SW. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 5 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com 6.6 Typical Performance Characteristics (Circuit of Figure 14 and Figure 15) 6 Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Oscillator Frequency Figure 3. Output Source Resistance vs Supply Voltage Figure 4. Output Source Resistance vs Temperature Figure 5. Output Source Resistance vs Temperature Figure 6. Output Voltage Drop vs Load Current Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 Typical Performance Characteristics (continued) (Circuit of Figure 14 and Figure 15) Figure 7. Output Voltage vs Oscillator Frequency Figure 8. Oscillator Frequency vs External Capacitance Figure 9. Oscillator Frequency vs Supply Voltage Figure 10. Oscillator Frequency vs Supply Voltage Figure 11. Oscillator Frequency vs Temperatur Figure 12. Oscillator Frequency vs Temperature Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 7 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com Typical Performance Characteristics (continued) (Circuit of Figure 14 and Figure 15) Figure 13. Shutdown Supply Current vs Temperature (LM2663 Only) 8 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 7 Parameter Measurement Information Figure 14. LM2662 Test Circuit Figure 15. LM2663 Test Circuit Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 9 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com 8 Detailed Description 8.1 Overview The LM2662/LM2663 contains four large CMOS switches which are switched in a sequence to invert the input supply voltage. Energy transfer and storage are provided by external capacitors. Figure 16 illustrates the voltage conversion scheme. When S1 and S3 are closed, C1 charges to the supply voltage V+. During this time interval switches S2 and S4 are open. In the second time interval, S1 and S3 are open and S2 and S4 are closed, C1 is charging C2. After a number of cycles, the voltage across C2 will be pumped to V+. Since the anode of C2 is connected to ground, the output at the cathode of C2 equals -(V+) assuming no load on C2, no loss in the switches, and no ESR in the capacitors. In reality, the charge transfer efficiency depends on the switching frequency, the on-resistance of the switches, and the ESR of the capacitors. Figure 16. Voltage Inverting Principle 8.2 Functional Block Diagram LM2662 (LM2663) V+ OUT FC(SD) OSCILLATOR OSC Switch Array Switch Drivers LV CAP+ CAPGND 8.3 Feature Description 8.3.1 Changing Oscillator Frequency For the LM2662, the internal oscillator frequency can be selected using the Frequency Control (FC) pin. When FC is open, the oscillator frequency is 20 kHz; when FC is connected to V+, the frequency increases to 150 kHz. A higher oscillator frequency allows smaller capacitors to be used for equivalent output resistance and ripple, but increases the typical supply current from 0.3 mA to 1.3 mA. The oscillator frequency can be lowered by adding an external capacitor between OSC and GND (See typical performance characteristics). Also, in the inverter mode, an external clock that swings within 100 mV of V+ and GND can be used to drive OSC. Any CMOS logic gate is suitable for driving OSC. LV must be grounded when driving OSC. The maximum external clock frequency is limited to 150 kHz. The switching frequency of the converter (also called the charge pump frequency) is half of the oscillator frequency. NOTE OSC cannot be driven by an external clock in the voltage-doubling mode. 10 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 Feature Description (continued) Table 1. LM2662 Oscillator Frequency Selection FC OSC OSCILLATOR Open Open 20 kHz V+ Open 150 kHz Open or V+ External Capacitor See Typical Performance Characteristics N/A External Clock (inverter mode only) External Clock Frequency Table 2. LM2663 Oscillator Frequency Selection OSC OSCILLATOR Open 150 kHz External Capacitor See Typical Performance Characteristics External Clock (inverter mode only) External Clock Frequency 8.4 Device Functional Modes 8.4.1 Shutdown Mode For the LM2663, a shutdown (SD) pin is available to disable the device and reduce the quiescent current to 10 A. Applying a voltage greater than 2 V to the SD pin will bring the device into shutdown mode. While in normal operating mode, the SD pin is connected to ground. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 11 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LM2662/LM2663 CMOS charge-pump voltage converter inverts a positive voltage in the range of 1.5 V to 5.5 V to the corresponding negative voltage. The LM2662/LM2663 uses two low cost capacitors to provide 200 mA of output current without the cost, size, and EMI related to inductor based converters. With an operating current of only 300 A and operating efficiency greater than 90% at most loads, the LM2662/LM2663 provides ideal performance for battery powered systems. The LM2662/LM2663 may also be used as a positive voltage doubler. 9.2 Typical Applications 9.2.1 Simple Negative Voltage Converter Figure 17. Simple Negative Voltage Converter 9.2.1.1 Design Requirements The main application of LM2662/LM2663 is to generate a negative supply voltage. The voltage inverter circuit uses only two external capacitors as shown in Figure 17. The range of the input supply voltage is 1.5 V to 5.5 V. For a supply voltage less than 3.5 V, the LV pin must be connected to ground to bypass the internal regulator circuitry. This gives the best performance in low voltage applications. If the supply voltage is greater than 3.5 V, LV may be connected to ground or left open. The choice of leaving LV open simplifies the direct substitution of the LM2662/LM2663 for the LMC7660 Switched Capacitor Voltage Converter. 9.2.1.2 Detailed Design Procedure The output characteristics of this circuit can be approximated by an ideal voltage source in series with a resistor. The voltage source equals -(V+). The output resistance Rout is a function of the ON resistance of the internal MOS switches, the oscillator frequency, and the capacitance and ESR of C1 and C2. Since the switching current charging and discharging C1 is approximately twice as the output current, the effect of the ESR of the pumping capacitor C1 is multiplied by four in the output resistance. The output capacitor C2 is charging and discharging at a current approximately equal to the output current, therefore, its ESR only counts once in the output resistance. A good approximation is: (1) where RSW is the sum of the ON resistance of the internal MOS switches shown in the Voltage Inverting Principle. High value, low ESR capacitors will reduce the output resistance. Instead of increasing the capacitance, the oscillator frequency can be increased to reduce the 2/(fosc x C1) term. Once this term is trivial compared with RSW and ESRs, further increasing in oscillator frequency and capacitance will become ineffective. 12 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 Typical Applications (continued) The peak-to-peak output voltage ripple is determined by the oscillator frequency, and the capacitance and ESR of the output capacitor C2: (2) Again, using a low ESR capacitor will result in lower ripple. 9.2.1.2.1 Paralleling Devices Any number of LM2662 devicess (or LM2663 devices) can be paralleled to reduce the output resistance. Each device must have its own pumping capacitor C1, while only one output capacitor Cout is needed as shown in Figure 18. The composite output resistance is: (3) Figure 18. Lowering Output Resistance by Paralleling Devices 9.2.1.2.2 Cascading Devices Cascading the LM2662 devices (or LM2663 devices) is an easy way to produce a greater negative voltage (as shown in Figure 19). If n is the integer representing the number of devices cascaded, the unloaded output voltage Vout is (-nVin). The effective output resistance is equal to the weighted sum of each individual device: (4) A three-stage cascade circuit shown in Figure 20 generates -3 Vin, from Vin. Cascading is also possible when devices are operating in doubling mode. In Figure 21, two devices are cascaded to generate 3 Vin. An example of using the circuit in Figure 20 or Figure 21 is generating +15 V or -15 V from a +5-V input. Note that, the number of n is practically limited since the increasing of n significantly reduces the efficiency and increases the output resistance and output voltage ripple. Figure 19. Increasing Output Voltage by Cascading Devices Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 13 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com Typical Applications (continued) Figure 20. Generating -3 VIN From +VIN Figure 21. Generating +3 VIN From +VIN 9.2.1.2.3 Regulating VOUT It is possible to regulate the output of the LM2662/LM2663 by use of a low dropout regulator (such as LP2986). The whole converter is depicted in Figure 22. This converter can give a regulated output from -1.5 V to -5.5 V by choosing the proper resistor ratio: where * Vref = 1.23V (5) The error flag on pin 7 of the LP2986 goes low when the regulated output at pin 5 drops by about 5% below nominal. The LP2986 can be shutdown by taking pin 8 low. The less than 1 A quiescent current in the shutdown mode is favorable for battery powered applications. Figure 22. Combining LM2662/LM2663 With LP2986 to Make a Negative Adjustable Regulator Also, as shown in Figure 23 by operating the LM2662/LM2663 in voltage doubling mode and adding a low dropout regulator (such as LP2986) at the output, we can get +5 V output from an input as low as +3.3 V. 14 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 Typical Applications (continued) Figure 23. Generating +5 V From +3.3 V Input Voltage 9.2.1.3 Application Curves Figure 24. Efficiency vs Load Current Figure 25. Efficiency vs Oscillator Frequency Figure 26. Output Source Resistance vs Oscillator Frequency Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 15 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com Typical Applications (continued) 9.2.2 Positive Voltage Doubler Figure 27. Positive Voltage Doubler 9.2.2.1 Design Requirements The LM2662/LM2663 can operate as a positive voltage doubler (as shown in Figure 27). The doubling function is achieved by reversing some of the connections to the device. 9.2.2.2 Detailed Design Procedure The input voltage is applied to the GND pin with an allowable voltage from 2.5 V to 5.5 V. The V+ pin is used as the output. The LV pin and OUT pin must be connected to ground. The OSC pin can not be driven by an external clock in this operation mode. The unloaded output voltage is twice of the input voltage and is not reduced by the diode D1's forward drop. The Schottky diode D1 is only needed for start-up. The internal oscillator circuit uses the V+ pin and the LV pin (connected to ground in the voltage doubler circuit) as its power rails. Voltage across V+ and LV must be larger than 1.5 V to insure the operation of the oscillator. During start-up, D1 is used to charge up the voltage at V+ pin to start the oscillator; also, it protects the device from turning-on its own parasitic diode and potentially latchingup. Therefore, the Schottky diode D1 should have enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most applications. If the input voltage ramp is less than 10 V/ms, a smaller Schottky diode like MBR0520LT1 can be used to reduce the circuit size. 9.2.2.3 Application Curves See Application Curves section. 9.2.3 Splitting VIN in Half Figure 28. Splitting VIN in Half 9.2.3.1 Design Requirements Another interesting application shown in Figure 28 is using the LM2662/LM2663 as a precision voltage divider. Since the off-voltage across each switch equals VIN/2, the input voltage can be raised to +11 V. 16 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 Typical Applications (continued) 9.2.3.2 Detailed Design Procedure As discussed in the Simple Negative Voltage Converter section, the output resistance and ripple voltage are dependent on the capacitance and ESR values of the external capacitors. The output voltage drop is the load current times the output resistance, and the power efficiency is (6) IL2ROUT Where IQ(V+) is the quiescent power loss of the IC device, and switch on-resistance, the two external capacitors and their ESRs. is the conversion loss associated with the Low ESR capacitors are recommended for both capacitors to maximize efficiency, reduce the output voltage drop and voltage ripple. For convenience, C1 and C2 are usually chosen to be the same. The output resistance varies with the oscillator frequency and the capacitors. In Figure 26, the output resistance vs. oscillator frequency curves are drawn for four difference capacitor values. At very low frequency range, capacitance plays the most important role in determining the output resistance. Once the frequency is increased to some point (such as 100 kHz for the 47-F capacitors), the output resistance is dominated by the ON resistance of the internal switches and the ESRs of the external capacitors. A low value, smaller size capacitor usually has a higher ESR compared with a bigger size capacitor of the same type. Ceramic capacitors can be chosen for their lower ESR. As shown in Figure 26, in higher frequency range, the output resistance using the 10-F ceramic capacitors is close to these using higher value tantalum capacitors. 9.2.3.3 Application Curves See Application Curves section. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 17 LM2662, LM2663 SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 www.ti.com 10 Power Supply Recommendations The LM2662/LM2663 is designed to operate from as an inverter over an input voltage supply range between 1.5 V and 5.5 V when the LV pin is grounded. This input supply must be well regulated and capable to supply the required input current. If the input supply is located far from the LM2662/LM2663 additional bulk capacitance may be required in addition to the ceramic bypass capacitors. 11 Layout 11.1 Layout Guidelines The high switching frequency and large switching currents of the LM2662/LM2663 make the choice of layout important. The following steps should be used as a reference to ensure the device is stable and maintains proper LED current regulation across its intended operating voltage and current range * Place CIN on the top layer (same layer as the LM2662/2663) and as close to the device as possible. Connecting the input capacitor through short, wide traces to both the V+ and GND pins reduces the inductive voltage spikes that occur during switching which can corrupt the V+ line. * Place COUT on the top layer (same layer as the LM2662/2663) and as close as possible to the OUT and GND pin. The returns for both CIN and COUT should come together at one point, as close to the GND pin as possible. Connecting COUT through short, wide traces reduce the series inductance on the OUT and GND pins that can corrupt the VOUT and GND lines and cause excessive noise in the device and surrounding circuitry. * Place C1 on the top layer (same layer as the LM2662/2663) and as close to the device as possible. Connect the flying capacitor through short, wide traces to both the CAP+ and CAP- pins. 11.2 Layout Example LM2662 (LM2663) V+ OUT FC(SD) OSCILLATOR OSC Switch Array Switch Drivers LV 18 CAP+ CAPGND Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 LM2662, LM2663 www.ti.com SNVS002E - JANUARY 1999 - REVISED OCTOBER 2014 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Related Links Table 3 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM2662 Click here Click here Click here Click here Click here LM2663 Click here Click here Click here Click here Click here 12.3 Trademarks All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 19 PACKAGE OPTION ADDENDUM www.ti.com 15-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2662M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM26 62M LM2662M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM26 62M LM2662MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM26 62M LM2663M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM26 63M LM2663M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM26 63M LM2663MX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM26 63M LM2663MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM26 63M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Aug-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2662MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2663MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2663MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2662MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2663MX SOIC D 8 2500 367.0 367.0 35.0 LM2663MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2016, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM2662M LM2662M/NOPB LM2662MX LM2662MX/NOPB