ECCM1G-20-26.641176MTR - Ecliptek Corporation

RoHS

ECCM1G-20-26.641176M TR

ECCM1 G -20 -26.641176M TR

Series

RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic

SMD Crystal

Frequency Tolerance/Stability

±15ppm at 25°C, ±30ppm over -20°C to +70°C

Mode of Operation

AT-Cut Fundamental

Packaging Options

Tape & Reel

Nominal Frequency

26.641176MHz

Load Capacitance

20pF Parallel Resonant

ELECTRICAL SPECIFICATIONS

Nominal Frequency 26.641176MHz

Frequency Tolerance/Stability ±15ppm at 25°C, ±30ppm over -20°C to +70°C

Aging at 25°C ±3ppm/year Maximum

Load Capacitance 20pF Parallel Resonant

Shunt Capacitance (C0) 7pF Maximum

Equivalent Series Resistance 30 Ohms Maximum

Mode of Operation AT-Cut Fundamental

Drive Level 50µWatts Maximum, 50µWatts Correlation

Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm)

Storage Temperature Range -40°C to +85°C

Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc)

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Flammability UL94-V0

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Mechanical Shock MIL-STD-883, Method 2002, Condition B

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010, Condition B

Vibration MIL-STD-883, Method 2007, Condition A

MECHANICAL DIMENSIONS (all dimensions in millimeters)

MARKING

ORIENTATION

7.00

±0.15

5.00

±0.15

1.3 MAX 1.0 ±0.2

(x4)

Note: Chamfer and index

mark not shown.

4.6

±0.2

1.2 ±0.1

(x4)

2.54 ±0.20

PIN CONNECTION

1 Crystal

2 Cover/Ground

3 Crystal

4 Cover/Ground

LINE MARKING

1E26.64

E=Ecliptek Designator

2XXXXX

XXXXX=Ecliptek

Manufacturing Identifier

www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 1 of 5

ECCM1G-20-26.641176M TR

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

3.6

1.1

1.4 (x4)

2.2 (X4)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 2 of 5

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

ECCM1G-20-26.641176M TR

16.0 ±0.3

7.5 ±0.2

6.75 ±0.20

4.0 ±0.2

2.0 ±0.2

8.0 ±0.2 5.4 ±0.1

DIA 1.5 ±0.1

7.9

±0.1

0.30 ±0.05

1.7 ±0.1

22.4 MAX

360 MAX

Quantity Per Reel: 1,000 units

16.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 3 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

ECCM1G-20-26.641176M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 4 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

ECCM1G-20-26.641176M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 5 of 5