Type Package
TLE 4274 V10 PG-TO220-3-1 (RoHS compliant)
TLE 4274 V50 PG-TO220-3-1 (RoHS compliant)
TLE 4274 V85 PG-TO220-3-1 (RoHS compliant)
TLE 4274 DV50 PG-TO252-3-11 (RoHS compliant)
TLE 4274 GV10 PG-TO263-3-1 (RoHS compliant)
TLE 4274 GV50 PG-TO263-3-1 (RoHS compliant)
TLE 4274 GV85 PG-TO263-3-1 (RoHS compliant)
Low Drop Voltage Regulator
TLE 4274
^
P-TO220-3-1
PG-TO220-3-1
P-TO252-3-11
PG-TO252-3-11
P-TO263-3-1
PG-TO263-3-1
Data Sheet 1 Rev. 1.7, 2011-01-20
Features
• Output voltage 5 V, 8.5 V or 10 V
• Output voltage tolerance ≤ ±4%
• Current capability 400 mA
• Low-drop voltage
• Very low current consumption
• Short-circuit proof
• Reverse polarity proof
• Suitable for use in automotive electronics
• Green Product (RoHS compliant) version of TLE 4274
• AEC qualified
Functional Description
The TLE 4274 is a low drop voltage regulator available in
a TO220, TO252 and TO263 package. The IC regulates
an input voltage up to 40 V to VQrated = 5.0 V (V50), 8.5 V
(V85) and 10 V (V10). The maximum output current is
400 mA. The IC is short-circuit proof and incorporates
temperature protection that disables the IC at
overtemperature. A 3.3 V and 2.5 V version is also
available. For information about the low output voltage
types please refer to the data sheet TLE 4274 / 3.3 V;
2.5 V.
Data Sheet 2 Rev. 1.7, 2011-01-20
TLE 4274
Dimensioning Information on External Components
The input capacitor CI is necessary for compensating line influences. Using a resistor of
approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance can
be damped. The output capacitor CQ is necessary for the stability of the regulation circuit.
Stability is guaranteed at values CQ ≥ 22 μF and an ESR of ≤ 3 Ω within the operating
temperature range.
Circuit Description
The control amplifier compares a reference voltage to a voltage that is proportional to the
output voltage and drives the base of the series transistor via a buffer. Saturation control
as a function of the load current prevents any oversaturation of the power element. The
IC also includes a number of internal circuits for protection against:
• Overload
• Overtemperature
• Reverse polarity
PG-TO220-3-1.vsd
123
IGND Q
GND
PG-TO263-3-1.vsd
123
I GND Q
GND
PG-TO252-3-11.vsd
132
I
GND
Q
GND
PG-TO220-3-1 PG-TO252-3-11 PG-TO263-3-1
TLE 4274
Data Sheet 3 Rev. 1.7, 2011-01-20
Figure 1 Pin Configuration (top view)
Table 1 Pin Definitions and Functions
Pin No. Symbol Function
1 I Input; block to ground directly at the IC with a ceramic capacitor.
2 GND Ground
3 Q Output; block to ground with a ≥ 22 μF capacitor, ESR ≤ 3 Ω.
TAB -TAB; connect to heatsink and GND to improve thermal
performance
Ι1
AEB01959
GND
2
Q
3
Bandgap
Reference
Control
Amplifier
Sensor
Temperature
Buffer
Saturation
Control and
Protection
Circuit
Data Sheet 4 Rev. 1.7, 2011-01-20
TLE 4274
Figure 2 Block Diagram
Table 2 Absolute Maximum Ratings
Tj = -40 to 150 °C
Parameter Symbol Limit Values Unit Test Condition
Min. Max.
Input
Voltage VI-42 45 V –
Current II–––Internally limited
Output
Voltage VQ-1.0 40 V –
Current IQ–––Internally limited
Ground
Current IGND –100 mA –
Temperature
Junction temperature Tj–150 °C –
Storage temperature Tstg -50 150 °C –
Table 3 Operating Range
Parameter Symbol Limit Values Unit Remarks
Min. Max.
Input voltage; V50, DV50,
GV50
VI5.5 40 V –
Input voltage, V85, GV85 VI9.0 40 V –
Input voltage, V10, GV10 VI10.5 40 V –
Junction temperature Tj-40 150 °C –
Thermal Resistance
Junction ambient Rthja –65 K/W TO2201)
Junction ambient Rthja –78 K/W TO2521)
1) Worst case; regarding peak temperature, zero airflow mounted on PCB 80 × 80 × 1.5 mm3, 300 mm2 heat sink
area.
Junction ambient Rthja –52 K/W TO2631)
Junction case Rthjc –4K/W –
TLE 4274
Data Sheet 5 Rev. 1.7, 2011-01-20
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Table 4 Characteristics
VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)
Parameter Symbol Limit Values Unit Measuring Conditions
Min. Typ. Max.
Output voltage
V50-Version
VQ4.8 55.2 V5 mA < IQ < 400 mA
6 V < VI < 28 V
Output voltage
V50-Version
VQ4.8 55.2 V5 mA < IQ < 200 mA
6 V < VI < 40 V
Output voltage
V85-Version
VQ8.16 8.5 8.84 V5 mA < IQ < 400 mA
9.5 V < VI < 28 V
Output voltage
V85-Version
VQ8.16 8.5 8.84 V5 mA < IQ < 200 mA
9.5 V < VI < 40 V
Output voltage
V10-Version
VQ9.6 10 10.4 V5 mA < IQ < 400 mA
11 V < VI < 28 V
Output voltage
V10-Version
VQ9.6 10 10.4 V5 mA < IQ < 200 mA
11 V < VI < 40 V
Output current
limitation1)
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
IQ400 600 –mA –
Current
consumption;
Iq = II - IQ
Iq–100 220 μAIQ = 1 mA
Current
consumption;
Iq = II - IQ
Iq
Iq
–
–
8
20
15
30
mA
mA
IQ = 250 mA
IQ = 400 mA
Drop voltage1) Vdr –250 500 mV IQ = 250 mA
Vdr = VI - VQ
Load regulation ΔVQ–20 50 mV IQ = 5 mA to 400 mA
Line regulation ΔVQ–10 25 mV ΔVl = 12 V to 32 V
IQ = 5 mA
Power supply
ripple rejection
PSRR –60 –dB fr = 100 Hz;
Vr = 0.5 Vpp
Temperature
output voltage drift
dVQ/dT–0.5 –mV/K –
Data Sheet 6 Rev. 1.7, 2011-01-20
TLE 4274
TLE 4274
Input
Ι
100 nF
μ
100 F
V
Ι
C
Ι
Ι
2
1
C
22 F
μ
Q
3
Q
Ι
AES01960
V
Q
R
L
Output
TLE 4274
Data Sheet 7 Rev. 1.7, 2011-01-20
Figure 3 Measuring Circuit
TLE 4274
C
Input
Ι
1
2
AES01961
C
3
Q
Output
Figure 4 Application Circuit
Data Sheet 8 Rev. 1.7, 2011-01-20
TLE 4274
Typical Performance Characteristics (V50, V85 and V10)
Drop Voltage Vdr versus
Output Current IQ
AED01962
0
0
dr
V
200
400
600
mV
500
300
100
T
j
= 125 ˚C
Q
I
100 200 300 mA 400
= 25 ˚C
T
j
Current Consumption Iq versus
Output Current IQ (high load)
AED02267
0
0
Q
I
q
I
10
20
30
40
50
60
100 200 300 400 600
mA
I
V
= 13.5 V
mA
= 25 ˚C
T
j
Output Current IQ versus
Input Voltage VI
AED01963
0
0
V
Q
= 0 V
= 25 ˚C
T
j
I
V
Q
I
10 20 30 40 50V
200
400
600
mA
800
Current Consumption Iq versus
Output Current IQ (low load)
AED02268
0
0
Q
I
q
I
0.1
0.2
0.3
0.4
0.5
0.6
10 20 30 40 mA 60
mA
I
V
= 13.5 V
= 25 ˚C
T
j
Data Sheet 9 Rev. 1.7, 2011-01-20
TLE 4274
Typical Performance Characteristics (V50)
Output Voltage VQ versus
Junction Temperature Tj
AED01966
-40 04080120 ˚C 160
4.8
j
T
Q
V
5.2
V
V
I
= 13.5 V
4.9
5.0
5.1
Output Voltage VQ versus
Input Voltage VI
AED01968
02468V10
0
Q
V
2
4
6
V
VI
=
5
3
1
Q
V
T
j
= 25 ˚C
L
R
= 20
Ω
I
V
V
Q
Current Consumption Iq versus
Input Voltage VI
00
20
30
10
mA
50
AED02269
q
Ι
10 20 30 V
R
L
= 20
Ω
V
Ι
T
j
= 25 C
Input Current II versus
Input Voltage VI
AED01977
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 8.2 k
-25 0 25 50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
mA
V
Ω
j
6.8kΩ
Data Sheet 10 Rev. 1.7, 2011-01-20
TLE 4274
Typical Performance Characteristics for V85
Output Voltage VQ versus
Junction Temperature Tj
AED01970
-40 04080120 ˚C 160
j
T
Q
V
8.4
8.6
V
V
I
= 13.5 V
8.3
8.2
8.5
8.7
8.8
Output Voltage VQ versus
Input Voltage VI
6
4
08
0
2
4
R
T
Q
V
Q
V
8
Ι=V
V
10
12
V
16
12 20
VΙ
= 25 C
= 34
L
j
Ω
AED01972
Q
V
Current Consumption Iq versus
Input Voltage VI
00
20
30
10
mA
50
AED02270
q
Ι
10 20 30 V
RL
= 20 Ω
V
Ι
Tj= 25 C
Input Current II versus
Input Voltage VI
AED03051
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 12 k
-25 0 25 50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
mA
V
Ω
j
Data Sheet 11 Rev. 1.7, 2011-01-20
TLE 4274
Typical Performance Characteristics for V10
Output Voltage VQ versus
Junction Temperature Tj
AED01974
-40 04080120 ˚C 160
9.7
j
T
Q
V
9.9
10.1
10.3
V
VI
= 13.5 V
10.2
9.8
10.0
Output Voltage VQ versus
Input Voltage VI
AED01976
0481216 V20
0
Q
V
4
8
12
V
V
I
=
10
6
2
Q
V
T
j
= 25 ˚C
L
R
= 34
Ω
I
V
V
Q
Current Consumption Iq versus
Input Voltage VI
00
20
30
10
mA
50
AED02270
q
Ι
10 20 30 V
RL
= 20 Ω
V
Ι
Tj= 25 C
Input Current II versus
Input Voltage VI
AED03048
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 15 k
-25 0 25 50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
mA
V
Ω
j
Data Sheet 12 Rev. 1.7, 2011-01-20
TLE 4274
Package Outlines
A
BA0.25
M
Typical
9.9
±0.2
2.8
1)
15.65±0.3
12.95
0...0.15
2.54
0.75
±0.1
1.05
±0.1
1.27
4.4
B
9.25 ±0.2
0.05
1)
All metal surfaces tin plated, except area of cut.
C
±0.2
17±0.3
8.5
1)
10
±0.2
3.7
-0.15
C
2.4
0.5
±0.1
±0.24.55
13.5±0.5
3x
Metal surface min. x=7.25, y=12.3
0...0.3
2x
2.4
GPT09361
Figure 5 PG-TO220-3-1 (Plastic Transistor Single Outline)
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
5.4 ±0.1
-0.05
6.5 +0.15
A
±0.5
9.98
6.22
-0.2
1
±0.1
±0.15
0.8
0.15 MAX.
±0.1
per side 0.75
2.28
4.57
+0.08
GPT09277
-0.04
0.5
2.3 -0.10
+0.05
B
0.51 MIN.
+0.08
-0.04
0.5
0...0.15
B
A0.25 M
0.1
All metal surfaces tin plated,
except area of cut.
3x
(5)
(4.24)
-0.01
+0.20
0.9
B
TLE 4274
Data Sheet 13 Rev. 1.7, 2011-01-20
Figure 6 PG-TO252-3-11 (Plastic Transistor Single Outline)
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
MAX.
BA0.25
M
0.1
Typical
±0.2
10
8.5
1)
7.551)
(15)
±0.2
9.25 ±0.3
1
0...0.15
5.08
2.54
0.75
±0.1
1.05
±0.1
1.27
4.4
B
0.5
±0.1
±0.3
2.7
4.7 ±0.5
0.05
1)
0.1
All metal surfaces: tin plated, except area of cut.
2.4
Metal surface min. x=7.25, y=6.9
A
0...0.3
B
˚
8
GPT09362
Data Sheet 14 Rev. 1.7, 2011-01-20
TLE 4274
Figure 7 PG-TO263-3-1 (Plastic Transistor Single Outline)
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
TLE 4274
Data Sheet 15 Rev. 1.7, 2011-01-20
Revision History
Version Date Changes
Rev. 1.6 2007-02-16 Updated Infineon logo
Added “AEC” and “Green” logo
Added “Green Product” and “AEC qualified” to the feature list
Added “Green Product” remark
Updated Package Names to “PG-xxx”
Removed leadframe variant “P-TO-252-1”
Disclaimer Update
Rev. 1.7 2011-01-20 Added TAB potential to the package outline
Edition 2011-01-20
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
