LXDC32D series Micro DCDC converter 1. Features Low EMI noise and small footprint using inductor-imbedded ferrite substrate 2ch type DCDC converter High efficiency using synchronous rectifier technology at 3MHz operation PFM/PWM automatic mode switching function Smooth mode transition between PFM mode and PWM mode with low-ripple-voltage PFM mode 2% DC voltage accuracy over full load current range (Vout=1.2~4V) Maximum Load Current: 600mA (depends on output voltage) Fixed output voltage: 0.8V - 4V (factory setting, 50mV step) Internal soft start, overcurrent protection 2. Description The LXDC32D series is a low power step-down DC-DC converter suitable for space-limited or noise-sensitive applications. The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and conduction noise. By adding output capacitors, it can be used as an LDO replacement. Its low noise and easy-to-assemble features assure reliable power supply quality. The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode automatically and maintains high efficiency using synchronous rectifying technology. The device provides good output voltage accuracy even in PFM mode. It maintains 2% DC voltage accuracy over the full current range (0-600mA, depends on output voltage), and shows very smooth mode transition between PFM mode and PWM mode. 3. Typical Application Circuit LXDC32D Enable1 EN1 Enable2 EN2 Vin Vin GND Vout1 Vout1 Vout2 Vout2 Cout1 Cout2 1 Feb. 2016 LXDC32D series Micro DCDC converter 4Mechanical Details 4-1 Outline Top View Bottom View Side View T Unit: mm Mark Dimension Mark Dimension L 3.2 0.2 g 0.5 0.1 W 2.5 0.2 h 0.15 + 0.2 / - 0.15 T 1.2 MAX i 0.7 0.1 a 0.4 0.1 j 0.3 0.1 b 0.6 0.1 k 0.3 0.1 c 0.4 0.1 l 0.9 0.1 d 0.15 + 0.2/ - 0.15 m 0.4 0.1 e 0.45 0.1 n 1.05 0.1 f 0.4 0.1 2 Feb. 2016 LXDC32D series Micro DCDC converter 4-2 Pin Function Top View 3 Bottom View 2 4 1 1 8 8 7 7 5 6 Pin No. Symbol I/O 1, 5 Vin Input 2 EN1 Input Vout1 Output 4,8 GND - 6 EN2 Input Vout2 Output 4 6 5 Vin pin supplies current to the LXDC32D internal regulator. This is the ON/OFF control pin of the device. Connecting this pin to GND keeps the device in shutdown mode. Pulling this pin to Vin enables the device with soft start. This pin must not be left floating and must be terminated. If this pin is left open, the device may be off around 100mA output. EN=L: Device OFF Regulated voltage output pin. Apply output load between this pin and GND. Ground pin This is the ON/OFF control pin of the device. Connecting this pin to GND keeps the device in shutdown mode. Pulling this pin to Vin enables the device with soft start. This pin must not be left floating and must be terminated. If this pin is left open, the device may be off around 100mA output. EN=H: Device ON, 7 3 Description EN=H: Device ON, 3 2 EN=L: Device OFF Regulated voltage output pin. Apply output load between this pin and GND. 3 Feb. 2016 LXDC32D series Micro DCDC converter 4-3. Functional Block Diagram EN1 Clock Soft Start EA Vin On-board Cin UVLO Switching Controller Embedded L Gate Driver Vout1 GND EN2 Clock Soft Start EA UVLO Switching Controller Embedded L Gate Driver Vout2 4 Feb. 2016 LXDC32D series Micro DCDC converter 5. Ordering Information Part number Input Output Voltage[V] Voltage[V] Max Iout[mA] Vout1 Vout2 Iout1 Iout2 MOQ LXDC32DAAC-455 2.3 ~ 5.5 1.2 1.3 600 600 T/R, 1000pcs/R LXDC32DAAC-437 2.8 ~ 5.5 1.1 1.8 600 600 T/R, 1000pcs/R LXDC32DAAC-440 2.8 ~ 5.5 1.2 1.8 600 600 T/R, 1000pcs/R LXDC32DAAC-465 2.8 ~ 5.5 1.5 1.8 600 600 T/R, 1000pcs/R LXDC32DAAC-280 3.5 ~ 5.5 1.2 2.5 600 500 T/R, 1000pcs/R LXDC32DAAC-439 3.5 ~ 5.5 1.1 2.8 600 450 T/R, 1000pcs/R LXDC32DAAC-438 3.5 ~ 5.5 1.2 2.8 600 450 T/R, 1000pcs/R LXDC32DAAC-442 3.7 ~ 5.5 1.1 3.0 600 350 T/R, 1000pcs/R LXDC32DAAC-145 3.7 ~ 5.5 1.35 3.0 600 350 T/R, 1000pcs/R LXDC32DAAC-394 3.7 ~ 5.5 1.8 3.0 600 350 T/R, 1000pcs/R LXDC32DAAC-422 3.8 ~ 5.5 0.9 3.3 600 300 T/R, 1000pcs/R LXDC32DAAC-398 3.8 ~ 5.5 0.95 3.3 600 300 T/R, 1000pcs/R LXDC32DAAC-393 3.8 ~ 5.5 1.0 3.3 600 300 T/R, 1000pcs/R LXDC32DAAC-435 3.8 ~ 5.5 1.8 3.3 600 300 T/R, 1000pcs/R LXDC32DAAC-459 3.8 ~ 5.5 2.5 3.3 500 300 T/R, 1000pcs/R # Output voltage can be set 50mV step from 0.8V to 4.0V. Please ask Murata representative. 6. Electrical Specification 6-1Absolute maximum ratings Parameter Input voltage Symbol rating Vin, EN 6.3 Unit V Operating ambient temperature Ta -40 to +85 o Operating IC temperature TIC -40 to +125 o -40 to +85 o Storage temperature TSTO C C C 5 Feb. 2016 LXDC32D series Micro DCDC converter 6-2 Electrical characteristics (Ta=25) Parameter Input voltage UVLO Input leak current Symbol Min. Typ. Max. Unit Vin 2.3 5.0 5.5 V UVLO 1.0 1.4 1.8 V 0 3 A 0.876 0.9 0.924 0.926 0.95 0.974 Vout=1.0V 0.976 1.0 1.024 Vout=1.1V 1.076 1.1 1.124 Iin-off Condition Vin=3.7V,EN1=0V,EN2=0V Vout=0.9V Vout=0.95V Vin-Vout>1.0V Output voltage accuracy Load current range Vout Iout Vout=1.2V~2.5V Vin-Vout>1.0V Vout=2.55V~3.25V Vin-Vout>0.7V Vout=3.3V Vin-Vout>0.5V -2.0 +2.0 Vout=0.9V~1.8V 0 600 Vout=1.85V~2.5V 0 500 Vout=2.55V~2.8V 0 450 Vout=2.85V~3.0V 0 350 Vout=3.05V~3.3V 0 300 Vrpl1 Vin=EN1=3.7V, Iout1=600mA,BW=100MHz, EN2=0V 15 Vrpl2 Vin=EN2=3.7V, Iout2=300mA,BW=100MHz, EN1=0V 15 Ripple voltage % mA mV 6 Feb. 2016 LXDC32D series Micro DCDC converter Parameter Symbol Condition Vin=3.7V, Iout1=Iout2=150mA Efficiency EFF Vin=5.0V, Iout1=Iout2=150mA EN control voltage SW Frequency Over current protection VENH ON ; Enable VENL OFF ; Disable Typ. LXDC32DAAC-455 TBD LXDC32DAAC-437 TBD LXDC32DAAC-440 TBD LXDC32DAAC-465 TBD LXDC32DAAC-280 83 LXDC32DAAC-439 TBD LXDC32DAAC-438 TBD LXDC32DAAC-442 TBD LXDC32DAAC-145 88 LXDC32DAAC-394 82 LXDC32DAAC-422 81 LXDC32DAAC-398 81 LXDC32DAAC-393 81 LXDC32DAAC-435 84 LXDC32DAAC-459 86 Fosc OCP Min. Max. Unit % 1.4 Vin V 0 0.25 V MH 2.5 3.0 3.5 Vout=0.9V~1.8V 600 900 1200 Vout=1.85V~2.5V 500 900 1200 Vout=2.55V~2.8V 450 900 1200 Vout=2.85V~3.0V 350 700 1200 Vout=3.05V~3.3V 300 700 1200 mA If the over current event continues less than Tlatch, auto-recovery. If the over current event continues more than Tlatch, latch-up. Restart by toggling EN1 voltage or Vin voltage. Restart by toggling EN2 voltage or Vin voltage. Tlatch Start-up time Latch-up mask time 20 usec Ton1 0.9 2.5 msec Ton2 0.9 2.5 msec (*1) External capacitors (Cout1: 10uF, Cout2: 10uF) should be placed near the module for proper operation. (*2) The above characteristics are tested using the test circuit in section 8. 7 Feb. 2016 LXDC32D series Micro DCDC converter 6-3 Thermal and Current De-rating Information The following figures show the power dissipation and temperature rise characteristics. These data are measured on Murata's evaluation board of this device at no air-flow condition. Loss - T Characteristics (Vin=3.6V, Vo=1.8V) 50 350 45 40 300 35 250 T (oC Power Dissipation (mW) Io - Loss Characteristics (Vin=3.6V, Vo=1.8V) 400 200 150 30 25 20 15 100 10 50 5 0 0 0 100 200 300 400 500 600 Io (mA) 0 100 200 300 400 Power Dissipation (mW) The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a continuous power delivering application. The amount of current de-rating is highly dependent on the environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should o especially be taken in applications where the device temperature exceeds 85 C. o The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for the temperature of semiconductor is 80%. MLCC capacitor's reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure shows MLCC's B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in MLCC capacitor is not reversible but cumulative over time. 8 Feb. 2016 LXDC32D series Micro DCDC converter Capacitor B1 Life vs Capacitor Case temperature 100000 Capacitor Life (Tousand Hours) Capacitor B1B1Life(Thousand Hours) Vin=5V Vin=3.6V 10000 Vin=3.3V Vin=2.5V 1000 100 10 1 0.1 20 40 60 80 100 120 (o C Capacitor Case Case Temprature ) Capacitor temperature() The following steps should be taken before the design fix of user's set for reliable operation. o 1. The ambient temperature of the device should be kept below 85 C 2. The IC temperature should be measured on the worst condition of each application. The temperature must be o kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken. 3. The MLCC temperature should be measured on the worst condition of each application. Considering the above figure, it should be checked if the expected B1 life of MLCC is acceptable or not. 9 Feb. 2016 LXDC32D series Micro DCDC converter 7. Detailed Description PFM/PWM Mode If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load. The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just increasing the output capacitor. The transition between PFM and PWM is also seamless and smooth. The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate threshold is about 100-200mA. PFM mode at light load PWM mode at heavy load Nominal output voltage UVLO (Under Voltage Lock Out) The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin levels . Soft Start The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact a Murata representative. Enable The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light load but will not work at heavy load. Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function when it turns off. If you prefer a discharge function, please contact a Murata representative. 100% Duty Cycle Operation The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby providing a low input-to-output voltage difference. When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the nominal switching period and the output voltage ripple may be larger than other conditions. It should be noted that this condition does not mean a failure of the device. Over Current Protection When the output current reaches the OCP threshold, the device narrows the switching duty and decreases the output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the nominal value automatically. If the OCP event continues over the mask time, the device will shutdown. After it is shut down, it can be restarted by toggling the Vin or EN voltage. 10 Feb. 2016 LXDC32D series Micro DCDC converter 8. Test Circuit Cout1 : 10uF/6.3V (GRM188B30J106M) Cout2 : 10uF/6.3V (GRM188B30J106M) 11 Feb. 2016 LXDC32D series Micro DCDC converter 9. Micro DC-DC Converter evaluation board Measurement setup A Vin Vin_s EN1 Vout2_s Vout1_s LOAD V LOAD Vout2 Vout1 A A V GND GND EN2 V GND_s The enable switch has three positions. 1. When it is toggled to "ON" side, the device starts operation. 2. When it is toggled to "OFF" side, the device stops operation and remains in 3. When it is set to middle of "ON" and "OFF", the EN pin floats and shut down status. an external voltage can be applied to the EN terminal pin on the EVB. If you don't apply an external voltage to EN pin, the enable switch should not to be set to the middle position. The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables. 12 Feb. 2016 LXDC32D series Micro DCDC converter 10.Reliability Tests No. 1 2 3 Items Vibration Resistance Result (NG) 18 G (0) Frequency : 10~2000 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection : 1.6mm Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 18 G (0) Pushing Direction 18 G (0) 18 G (0) 18 G (0) Test Methods Appearance : No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection Soldering strength (Push Strength) QTY Specifications 9.8 N Minimum Specimen 4 5 Solderability of Termination Resistance to Soldering Heat (Reflow) 75% of the terminations is to be soldered evenly and continuously. Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 30.5 sec. at 2455 C. Preheat : 150 C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-180 C Preheat Period : 90+/-30 sec. High Temperature : 220 C High Temp. Period : 20sec. Peak Temperature : 260+5/-0 C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. 13 Feb. 2016 LXDC32D series Micro DCDC converter No. 6 7 8 9 Items Specifications Test Methods High Temp. Exposure Temperature852 Period1000+48/-0 h Room Condition224h Temperature Cycle Condition100 cycles in the following table Humidity (Steady State) Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Step Temp(C) Time(min) 1 Min. Operating Temp.+0/-3 303 2 Max. Operating Temp.+3/-0 303 Temperature852 Humidity8090%RH Period1000+48/-0 h Room Condition224h Temperature-402 Period1000+48/-0 h Room Condition224h Low Temp. Exposure QTY Result (NG) 18 G (0) 18 G (0) 18 G (0) 18 G (0) 10 ESD(Machine Model) C200pFR0 TEST Voltage +/-100V Number of electric discharges1 5 G (0) ESD(Human Body Model) C100pFR1500 TEST Voltage +/-1000V Number of electric discharges1 5 G (0) 11 14 Feb. 2016 LXDC32D series Micro DCDC converter Fig.1 Land Pattern Top View a b aa a b a g h i h c d e f e d gc Unit:mm Mark Dimension Mark Dimension a 0.4 f 0.5 b 0.6 g 0.15 c 0.15 h 0.7 d 0.45 i 1.5 e 0.4 *Reference purposes only 15 Feb. 2016 LXDC32D series Micro DCDC converter Fig.2 Testing board Unitmm Land pattern is same as figure1 Glass-fluorine board t1.6mm Copper thickness over 35 m Mounted situation Unitmm Device 45 45 Test method Unitmm 20 50 R230 deflection 16 Feb. 2016 LXDC32D series Micro DCDC converter 11. Tape and Reel Packing 1) Dimensions of Tape (Plastic tape) Unit: mm 1.5+0.1 0 (0.3) 1.750.1 (5.5) 12.00.2 (3.6) (1.3) 2.00.05 4.00.1 (2.8) 8.00.1 Feeding direction 2Dimensions of Reel Unit: mm 20.5 60 180 130.2 (13.0) 15.41.0 17 Feb. 2016 LXDC32D series Micro DCDC converter 3 Packing (Moisture-proof packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Label Desiccant Humidity Indicator Label Anti-humidity Aluminum foil pack bag 18 Feb. 2016 LXDC32D series Micro DCDC converter 4Taping Diagrams [1] Feeding Hole : [2] Hole for chip : As specified in (1) [3] Cover tape : 50um in thickness [4] Base tape : As specified in (1) [3] [3] As specified in (1) [1] [1] [2] [2] [3] [3] [4] [4] Feeding Hole Feeding Direction Chip 19 Feb. 2016 LXDC32D series Micro DCDC converter 5Leader and Tail tape A B Components C Symbol Items Ratings(mm) A No components at trailer min 160 B No components at leader min 100 C Whole leader min 400 6The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 7Packaging unit: 1,000pcs/reel 8Material Base Tape ... Reel ... Plastic Plastic Antistatic coating for both base tape and reel 9Peeling of force 0.70.1~1.3N N max. 165 to 180 Cover Tape Base Tape 10The number of the omissions is to two, and there is no consecutive missing part. 20 Feb. 2016 LXDC32D series Micro DCDC converter NOTICE 1. Storage Conditions: The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40 deg.C.) The product left more than 6 months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be used within 168 hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the product because of the nature of ceramics structure. Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions are shown for a reference purpose only. Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using underfill materials, be sure to check the mechanical characteristics in the actual set. 21 Feb. 2016 LXDC32D series Micro DCDC converter 4. Soldering Conditions: Soldering is allowed up through 2 times. Carefully perform preheating T less than 130 C. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (example) Reflow soldering standard conditions (Example) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 22 Feb. 2016 LXDC32D series Micro DCDC converter 5. Cleaning Conditions: The product is not designed to be cleaned after soldering. 6. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If static electricity is added to this product, degradation and destruction may be produced. Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of an assembly and measurement. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure. 7. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range . 23 Feb. 2016 LXDC32D series Micro DCDC converter 8. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option and dealer-installed option. - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. 24 Feb. 2016