LXDC32D series
Micro DCDC converter
1 Feb. 2016
1.Features
Low EMI noise and small footprint using inductor-imbedded ferrite substrate
2ch type DCDC converter
High efficiency using synchronous rectifier technology at 3MHz operation
PFM/PWM automatic mode switching function
Smooth mode transition between PFM mode and PWM mode
with low-ripple-voltage PFM mode
2% DC voltage accuracy over full load current range (Vout=1.2~4V)
Maximum Load Current: 600mA (depends on output voltage)
Fixed output voltage: 0.8V – 4V (factory setting, 50mV step)
Internal soft start, overcurrent protection
2.Description
The LXDC32D series is a low power step-down DC-DC converter suitable for space-limited or noise-sensitive
applications. The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and
conduction noise.
By adding output capacitors, it can be used as an LDO replacement. Its low noise and easy-to-assemble features
assure reliable power supply quality.
The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode
automatically and maintains high efficiency using synchronous rectifying technology.
The device provides good output voltage accuracy even in PFM mode. It maintains 2% DC voltage accuracy over
the full current range (0-600mA, depends on output voltage), and shows very smooth mode transition between
PFM mode and PWM mode.
3. Typical Application Circuit
EN1
Vin
GND
Vout2
Vout1Enable1
Vin Vout2
LXDC32D
Cout2
Vout1
EN2Enable2
Cout1
LXDC32D series
Micro DCDC converter
2 Feb. 2016
4．Mechanical Details
4-1 Outline
Unit: mm
Mark
Dimension
Mark
Dimension
L
3.2 ± 0.2
g
0.5 ± 0.1
W
2.5 ± 0.2
h
0.15 + 0.2 / - 0.15
T
1.2 MAX
i
0.7 ± 0.1
a
0.4 ± 0.1
j
0.3 ± 0.1
b
0.6 ± 0.1
k
0.3 ± 0.1
c
0.4 ± 0.1
l
0.9 ± 0.1
d
0.15 + 0.2/ - 0.15
m
0.4 ± 0.1
e
0.45 ± 0.1
n
1.05 ± 0.1
f
0.4 ± 0.1
Bottom View
Top View
Side View
T
LXDC32D series
Micro DCDC converter
3 Feb. 2016
4-2 Pin Function
Top View Bottom View
Symbol
I/O
Description
Vin
Input
Vin pin supplies current to the LXDC32D internal regulator.
EN1
Input
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
Vout1
Output
Regulated voltage output pin.
Apply output load between this pin and GND.
GND
-
Ground pin
EN2
Input
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
Vout2
Output
Regulated voltage output pin.
Apply output load between this pin and GND.
3 12
8
7
65
4
1 32
4
5
67
8
LXDC32D series
Micro DCDC converter
4 Feb. 2016
4-3. Functional Block Diagram
Clock
Soft Start
EA
Switching
Controller
UVLO
Gate
Driver
EN1 Vin
GND
Vout1
Embedded L
On-board
Cin
Clock
Soft Start
EA
Switching
Controller
UVLO
Gate
Driver
Vout2
Embedded L
EN2
LXDC32D series
Micro DCDC converter
5 Feb. 2016
5.Ordering Information
Part number
Input
Voltage[V]
Output
Voltage[V]
Max Iout[mA]
MOQ
Vout1
Vout2
Iout1
Iout2
LXDC32DAAC-455
2.3 ~ 5.5
1.2
1.3
600
600
T/R, 1000pcs/R
LXDC32DAAC-437
2.8 ~ 5.5
1.1
1.8
600
600
T/R, 1000pcs/R
LXDC32DAAC-440
2.8 ~ 5.5
1.2
1.8
600
600
T/R, 1000pcs/R
LXDC32DAAC-465
2.8 ~ 5.5
1.5
1.8
600
600
T/R, 1000pcs/R
LXDC32DAAC-280
3.5 ~ 5.5
1.2
2.5
600
500
T/R, 1000pcs/R
LXDC32DAAC-439
3.5 ~ 5.5
1.1
2.8
600
450
T/R, 1000pcs/R
LXDC32DAAC-438
3.5 ~ 5.5
1.2
2.8
600
450
T/R, 1000pcs/R
LXDC32DAAC-442
3.7 ~ 5.5
1.1
3.0
600
350
T/R, 1000pcs/R
LXDC32DAAC-145
3.7 ~ 5.5
1.35
3.0
600
350
T/R, 1000pcs/R
LXDC32DAAC-394
3.7 ~ 5.5
1.8
3.0
600
350
T/R, 1000pcs/R
LXDC32DAAC-422
3.8 ~ 5.5
0.9
3.3
600
300
T/R, 1000pcs/R
LXDC32DAAC-398
3.8 ~ 5.5
0.95
3.3
600
300
T/R, 1000pcs/R
LXDC32DAAC-393
3.8 ~ 5.5
1.0
3.3
600
300
T/R, 1000pcs/R
LXDC32DAAC-435
3.8 ~ 5.5
1.8
3.3
600
300
T/R, 1000pcs/R
LXDC32DAAC-459
3.8 ~ 5.5
2.5
3.3
500
300
T/R, 1000pcs/R
# Output voltage can be set 50mV step from 0.8V to 4.0V. Please ask Murata representative.
6.Electrical Specification
6-1Absolute maximum ratings
Parameter
Symbol
rating
Unit
Input voltage
Vin, EN
6.3
V
Operating ambient temperature
Ta
-40 to +85
oC
Operating IC temperature
TIC
-40 to +125
oC
Storage temperature
TSTO
-40 to +85
oC
LXDC32D series
Micro DCDC converter
6 Feb. 2016
6-2 Electrical characteristics (Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input voltage
Vin
2.3
5.0
5.5
V
UVLO
UVLO
1.0
1.4
1.8
V
Input leak
current
Iin-off
Vin=3.7V,EN1=0V,EN2=0V
0
3
μA
Output voltage
accuracy
Vout
Vout=0.9V
Vin-Vout>1.0V
0.876
0.9
0.924
%
Vout=0.95V
0.926
0.95
0.974
Vout=1.0V
0.976
1.0
1.024
Vout=1.1V
1.076
1.1
1.124
Vout=1.2V~2.5V
Vin-Vout>1.0V
-2.0
+2.0
Vout=2.55V~3.25V
Vin-Vout>0.7V
Vout=3.3V
Vin-Vout>0.5V
Load current
range
Iout
Vout=0.9V~1.8V
0
600
mA
Vout=1.85V~2.5V
0
500
Vout=2.55V~2.8V
0
450
Vout=2.85V~3.0V
0
350
Vout=3.05V~3.3V
0
300
Ripple voltage
Vrpl1
Vin=EN1=3.7V,
Iout1=600mA,BW=100MHz, EN2=0V
15
mV
Vrpl2
Vin=EN2=3.7V,
Iout2=300mA,BW=100MHz, EN1=0V
15
LXDC32D series
Micro DCDC converter
7 Feb. 2016
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Efficiency
EFF
Vin=3.7V,
Iout1=Iout2=150mA
LXDC32DAAC-455
TBD
%
LXDC32DAAC-437
TBD
LXDC32DAAC-440
TBD
LXDC32DAAC-465
TBD
LXDC32DAAC-280
83
LXDC32DAAC-439
TBD
LXDC32DAAC-438
TBD
LXDC32DAAC-442
TBD
LXDC32DAAC-145
88
Vin=5.0V,
Iout1=Iout2=150mA
LXDC32DAAC-394
82
LXDC32DAAC-422
81
LXDC32DAAC-398
81
LXDC32DAAC-393
81
LXDC32DAAC-435
84
LXDC32DAAC-459
86
EN control
voltage
VENH
ON ; Enable
1.4
Vin
V
VENL
OFF ; Disable
0
0.25
V
SW Frequency
Fosc
2.5
3.0
3.5
MHｚ
Over current
protection
OCP
Vout=0.9V~1.8V
600
900
1200
mA
Vout=1.85V~2.5V
500
900
1200
Vout=2.55V~2.8V
450
900
1200
Vout=2.85V~3.0V
350
700
1200
Vout=3.05V~3.3V
300
700
1200
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN1 voltage or Vin voltage.
Restart by toggling EN2 voltage or Vin voltage.
Tlatch
Latch-up mask time
20
usec
Start-up time
Ton1
0.9
2.5
msec
Ton2
0.9
2.5
msec
(*1) External capacitors (Cout1: 10uF, Cout2: 10uF) should be placed near the module for proper operation.
(*2) The above characteristics are tested using the test circuit in section 8.
LXDC32D series
Micro DCDC converter
8 Feb. 2016
6-3 Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
The IC temperature of the device must be kept lower than the maximum rating of 125 oC. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
0
50
100
150
200
250
300
350
400
0100 200 300 400 500 600
Power Dissipation (mW)
Io (mA)
Io - Loss Characteristics (Vin=3.6V, Vo=1.8V)
0
5
10
15
20
25
30
35
40
45
50
0100 200 300 400
ΔT (oC）
Power Dissipation (mW)
Loss - ΔT Characteristics (Vin=3.6V, Vo=1.8V)
LXDC32D series
Micro DCDC converter
9 Feb. 2016
The following steps should be taken before the design fix of user’s set for reliable operation.
1. The ambient temperature of the device should be kept below 85 oC
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
0.1
1
10
100
1000
10000
100000
20 40 60 80 100 120
Capacitor B1 Life (Tousand Hours)
Capacitor Case Temprature (oC )
Capacitor B1 Life vs Capacitor Case temperature
Vin=5V
Vin=3.6V
Vin=3.3V
Vin=2.5V
Capacitor Case temperature(℃)
Capacitor B1 Life(Thousand Hours)
LXDC32D series
Micro DCDC converter
10 Feb. 2016
PFM mode at light load PWM mode at heavy load
Nominal output voltage
7.Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load.
The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing the output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate
threshold is about 100-200mA.
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin
levels .
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact a Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light
load but will not work at heavy load.
Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function
when it turns off. If you prefer a discharge function, please contact a Murata representative.
100% Duty Cycle Operation
The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the
nominal switching period and the output voltage ripple may be larger than other conditions. It should be noted that
this condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decreases the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.
After it is shut down, it can be restarted by toggling the Vin or EN voltage.
LXDC32D series
Micro DCDC converter
11 Feb. 2016
8.Test Circuit
Cout1 : 10uF/6.3V (GRM188B30J106M)
Cout2 : 10uF/6.3V (GRM188B30J106M)
LXDC32D series
Micro DCDC converter
12 Feb. 2016
9.Micro DC-DC Converter evaluation board
Measurement setup
GND_s
Vout1_s
Vout1
GND GND
EN1
Vout2_s
Vout2
Vin_s
Vin
EN2
V
A
LOAD LOAD
V
A
V
A
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stops operation and remains in shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin floats and an external voltage can be applied to the
EN terminal pin on the EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to
be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
LXDC32D series
Micro DCDC converter
13 Feb. 2016
10.Reliability Tests
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
1
Vibration
Resistance
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction
Total 6 h.
18
G
(0)
2
Deflection
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
18
G
(0)
3
Soldering strength
(Push Strength)
9.8 N Minimum
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
4
Solderability of
Termination
75% of the
terminations is to be
soldered evenly and
continuously.
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat : 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
18
G
(0)
5
Resistance to
Soldering Heat
(Reflow)
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 sec.
High Temperature : 220 °C
High Temp. Period : 20sec.
Peak Temperature : 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
18
G
(0)
Pushing Direction
Jig
Specimen
LXDC32D series
Micro DCDC converter
14 Feb. 2016
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
6
High Temp.
Exposure
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Temperature：85±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
7
Temperature
Cycle
Condition：100 cycles in the following
table
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
18
G
(0)
8
Humidity
(Steady State)
Temperature：85±2 ℃
Humidity：80～90%RH
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
9
Low Temp.
Exposure
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
10
ESD(Machine
Model)
C：200pF、R：0Ω
TEST Voltage ：+/-100V
Number of electric discharges：1
5
G
(0)
11
ESD(Human
Body Model)
C：100pF、R：1500Ω
TEST Voltage ：+/-1000V
Number of electric discharges：1
5
G
(0)
LXDC32D series
Micro DCDC converter
15 Feb. 2016
Fig.1
Land Pattern
Top View
ac
ba a a b
d
f
d
e
e
h
gi
a
c
hg
Unit:mm
Mark
Dimension
Mark
Dimension
a
0.4
f
0.5
b
0.6
g
0.15
c
0.15
h
0.7
d
0.45
i
1.5
e
0.4
*Reference purposes only
LXDC32D series
Micro DCDC converter
16 Feb. 2016
Fig.2
Testing board
Unit：mm
Mounted situation Unit：mm
Test method Unit：mm
45 45
チップ
■： Land pattern is same as figure1
Glass-fluorine board t＝1.6mm
Copper thickness over 35 m
Device
deflection
R230
50
20
LXDC32D series
Micro DCDC converter
17 Feb. 2016
11. Tape and Reel Packing
1) Dimensions of Tape (Plastic tape) Unit: mm
2）Dimensions of Reel
Unit: mm
15.4±1.0
2±0.5
(13.0)
φ13±0.2
φ60
φ180
Feeding direction
1.75±0.1
(5.5)
12.0±0.2
2.0±0.05
(2.8)
　　1.5+0.1
　　0
(3.6)　
(0.3)
(1.3)
4.0±0.1
8.0±0.1
LXDC32D series
Micro DCDC converter
18 Feb. 2016
3） Packing (Moisture-proof packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity
indicator.
　湿度
インジケ－タ
乾燥剤
表示ラべル
防湿梱包袋
表示ラベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Aluminum foil pack
bag
LXDC32D series
Micro DCDC converter
19 Feb. 2016
4）Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 50um in thickness
[4] Base tape : As specified in (1)
Feeding Hole
Chip
Feeding Direction
[2]
[3]
[4]
[3]
[1]
[3]
[1]
[3]
[2]
[4]
LXDC32D series
Micro DCDC converter
20 Feb. 2016
5）Leader and Tail tape
Symbol
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
6）The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
7）Packaging unit: 1,000pcs/reel
8）Material： Base Tape … Plastic
Reel …Plastic
Antistatic coating for both base tape and reel
9）Peeling of force
10）The number of the omissions is to two, and there is no consecutive missing part.
165 to 180 °
0.7 N max.
ベーステープ
カバーテープ
Components
B
C
A
0.1~1.3N
Cover Tape
Base Tape
LXDC32D series
Micro DCDC converter
21 Feb. 2016
NOTICE
1. Storage Conditions:
・The product shall be stored without opening the packing under the ambient temperature from 5 to 35
deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)
・The product left more than 6 months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object
and dropping the product, shall not be applied in order not to damage the packing materials.
・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be
used within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before
soldering.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
LXDC32D series
Micro DCDC converter
22 Feb. 2016
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating ：△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
Reflow soldering standard conditions (example)
Reflow soldering standard conditions (Example)
LXDC32D series
Micro DCDC converter
23 Feb. 2016
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure.
7.Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range .
LXDC32D series
Micro DCDC converter
24 Feb. 2016
8.Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
!
Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.