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November 17,2010-REV.00
US1001FL~US1008FL
SMALL SURFACE MOUNT FAST DIODES
VOLTAGE 100 to 800 Volts 1.0 Amperes
CURRENT
MECHANICAL DATA
• Case: SOD-123FL, Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.0006 ounces, 0.0173 grams
• Polarity : Color band cathode
0.115(2.90)
0.106(2.70)
0.044(1.10)
0.031(0.80)
0.043(1.08)
0.038(0.98)
0.008(0.20)
0.004(0.10)
0.145(3.70)
0.137(3.50)
0.030(0.75)
0.017(0.45)
0.075(1.90)
0.067(1.70)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Rating Test condition Symbol US1001FL US1002FL US1004FL US1006FL US1008FL Units
Marking code - U1B U1D U1G U1J U1K -
Maximum repetitve peak reverse voltage V
RRM
100 200 400 600 800 V
Maximum RMS voltage V
RMS
70 140 280 420 560 V
Maximum DC blocking voltage V 100 200 400 600 800 V
Maximum average forward rectified current T
A
=25
O
CI
F(AV)
1A
Peak forward surge current 8.3ms single half sine-wave T
L
=25
O
CI
FSM
30 A
Maximum instantaneous forward voltage 1A V
F
11.41.7V
Maximum DC reverse current at rated DC blocking
voltage T
J
=25
O
CI
R
1μA
Reverse recovery time
I
F
=0.5A
I
R
=1A
I
rr
=0.25A
t
rr
50 100 nS
Typical capacitance 4V,1MHz C
J
9pF
Thermal resistance junction to ambient air R
θJA
180
O
C/W
Operating junction and storage temperature range T
J
,T
STG
-55 to +150
O
C
R
12
Cathode Anode
FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass Passivated Chip Junction
• High temperature soldering : 260oC / 10 seconds at terminals
•
• Green molding compound as per IEC61249 Std. . (Halogen Free)
Lead free in comply with EU RoHS 2002/95/EC directives.