MKE06P80M48SF0
KE06 Sub-Family Data Sheet
Supports the following:
MKE06Z64VLD4(R),
MKE06Z128VLD4(R),
MKE06Z64VQH4(R),
MKE06Z128VQH4(R),
MKE06Z64VLH4(R),
MKE06Z128VLH4(R),
MKE06Z64VLK4(R), and
MKE06Z128VLK4(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 48 MHz Arm® Cortex-M0+ core
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 128 KB flash
– Up to 16 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 24 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 37.5 kHz pre-trimmed
internal reference for 48 MHz system clock
– Internal 1 kHz low-power oscillator (LPO)
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Aliased SRAM bitband region (BIT-BAND)
– Bit manipulation engine (BME)
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 71 general-purpose input/output (GPIO)
– Two 32-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One up to 16-channel 12-bit SAR ADC, operation in
Stop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC
and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– Two 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One pulse width timer (PWT)
– One real-time clock (RTC)
• Communication interfaces
– Two SPI modules (SPI)
– Up to three UART modules (UART)
– Two I2C modules (I2C)
– One MSCAN module (MSCAN)
• Package options
– 80-pin LQFP
– 64-pin QFP/LQFP
– 44-pin LQFP
NXP Semiconductors Document Number MKE06P80M48SF0
Data Sheet: Technical Data Rev. 6, 04/2020
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
2 NXP Semiconductors
Table of Contents
1 Ordering parts.......................................................................................4
1.1 Determining valid orderable parts............................................... 4
2 Part identification................................................................................. 4
2.1 Description...................................................................................4
2.2 Format..........................................................................................4
2.3 Fields............................................................................................4
2.4 Example....................................................................................... 5
3 Parameter classification........................................................................5
4 Ratings..................................................................................................6
4.1 Thermal handling ratings.............................................................6
4.2 Moisture handling ratings............................................................ 6
4.3 ESD handling ratings...................................................................6
4.4 Voltage and current operating ratings..........................................7
5 General................................................................................................. 7
5.1 Nonswitching electrical specifications........................................ 7
5.1.1 DC characteristics.......................................................... 7
5.1.2 Supply current characteristics........................................ 14
5.1.3 EMC performance..........................................................15
5.2 Switching specifications.............................................................. 16
5.2.1 Control timing................................................................16
5.2.2 FTM module timing.......................................................17
5.3 Thermal specifications.................................................................18
5.3.1 Thermal operating requirements.................................... 18
5.3.2 Thermal characteristics.................................................. 19
6 Peripheral operating requirements and behaviors................................ 20
6.1 Core modules............................................................................... 20
6.1.1 SWD electricals .............................................................20
6.2 External oscillator (OSC) and ICS characteristics.......................21
6.3 NVM specifications..................................................................... 23
6.4 Analog..........................................................................................24
6.4.1 ADC characteristics....................................................... 24
6.4.2 Analog comparator (ACMP) electricals.........................27
6.5 Communication interfaces........................................................... 27
6.5.1 SPI switching specifications.......................................... 27
6.5.2 MSCAN......................................................................... 30
7 Dimensions...........................................................................................31
7.1 Obtaining package dimensions.................................................... 31
8 Pinout................................................................................................... 31
8.1 Signal multiplexing and pin assignments.................................... 31
8.2 Device pin assignment.................................................................34
9 Revision history....................................................................................37
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 3
Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to nxp.com and perform a part number search for the
following device numbers: KE06Z.
Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q KE## A FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field Description Values
Q Qualification status • M = Fully qualified, general market flow
• P = Prequalification
KE## Kinetis family • KE06
A Key attribute • Z = M0+ core
FFF Program flash memory size • 128 = 128 KB
R Silicon revision • (Blank) = Main
• A = Revision after main
T Temperature range (°C) • V = –40 to 105
PP Package identifier • LD = 44 LQFP (10 mm x 10 mm)
Table continues on the next page...
1
2
Ordering parts
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
4 NXP Semiconductors
Field Description Values
• QH = 64 QFP (14 mm x 14 mm)
• LH = 64 LQFP (10 mm x 10 mm)
• LK = 80 LQFP (14 mm x 14 mm)
CC Maximum CPU frequency (MHz) • 4 = 48 MHz
N Packaging type • R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MKE06Z128VLK4
3Parameter classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter classifications
P Those parameters are guaranteed during production testing on each individual device.
C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
T Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
Parameter classification
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 5
Ratings
4.1 Thermal handling ratings
Symbol Description Min. Max. Unit Notes
TSTG Storage temperature –55 150 °C 1
TSDR Solder temperature, lead-free — 260 °C 2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol Description Min. Max. Unit Notes
MSL Moisture sensitivity level — 3 — 1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol Description Min. Max. Unit Notes
VHBM Electrostatic discharge voltage, human body model –6000 +6000 V 1
VCDM Electrostatic discharge voltage, charged-device model –500 +500 V 2
ILAT Latch-up current at ambient temperature of 125°C –100 +100 mA 3
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test.
• Test was performed at 125 °C case temperature (Class II).
• I/O pins pass ±100 mA I-test with IDD current limit at 400 mA.
• I/O pins pass +50/-100 mA I-test with IDD current limit at 1000 mA.
• Supply groups pass 1.5 Vccmax.
• RESET pin was only tested with negative I-test due to product conditioning requirement.
4
Ratings
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
6 NXP Semiconductors
4.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in the following table may
affect device reliability or cause permanent damage to the device. For functional
operating conditions, refer to the remaining tables in this document.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor
associated with the pin is enabled.
Table 2. Voltage and current operating ratings
Symbol Description Min. Max. Unit
VDD Digital supply voltage –0.3 6.0 V
IDD Maximum current into VDD — 120 mA
VIN Input voltage except true open drain pins –0.3 VDD + 0.31V
Input voltage of true open drain pins –0.3 6 V
IDInstantaneous maximum current single pin limit (applies to all
port pins)
–25 25 mA
VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V
1. Maximum rating of VDD also applies to VIN.
General
Nonswitching electrical specifications
5.1.1 DC characteristics
This section includes information about power supply requirements and I/O pin
characteristics.
Table 3. DC characteristics
Symbol C Descriptions Min Typical1Max Unit
— — Operating voltage2— 2.7 — 5.5 V
Table continues on the next page...
5
5.1
General
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 7
Table 3. DC characteristics (continued)
Symbol C Descriptions Min Typical1Max Unit
VOH P Output
high
voltage
All I/O pins, except PTA2
and PTA3, standard-
drive strength
5 V, Iload = –5 mA VDD – 0.8 — — V
C 3 V, Iload = –2.5 mA VDD – 0.8 — — V
P High current drive pins,
high-drive strength35 V, Iload = –20 mA VDD – 0.8 — — V
C 3 V, Iload = –10 mA VDD – 0.8 — — V
IOHT D Output
high
current
Max total IOH for all ports 5 V — — –100 mA
3 V — — –60
VOL P Output
low
voltage
All I/O pins, standard-
drive strength
5 V, Iload = 5 mA — — 0.8 V
C 3 V, Iload = 2.5 mA — — 0.8 V
P High current drive pins,
high-drive strength35 V, Iload =20 mA — — 0.8 V
C 3 V, Iload = 10 mA — — 0.8 V
IOLT D Output
low
current
Max total IOL for all ports 5 V — — 100 mA
3 V — — 60
VIH P Input
high
voltage
All digital inputs 4.5≤VDD<5.5 V 0.65 × VDD — — V
2.7≤VDD<4.5 V 0.70 × VDD — —
VIL P Input low
voltage
All digital inputs 4.5≤VDD<5.5 V — — 0.35 ×
VDD
V
2.7≤VDD<4.5 V — — 0.30 ×
VDD
Vhys C Input
hysteresi
s
All digital inputs — 0.06 × VDD — — mV
|IIn| P Input
leakage
current
Per pin (pins in high
impedance input mode)
VIN = VDD or VSS — 0.1 1 µA
|IINTOT| C Total
leakage
combine
d for all
port pins
Pins in high impedance
input mode
VIN = VDD or VSS — — 2 µA
RPU P Pullup
resistors
All digital inputs, when
enabled (all I/O pins
other than PTA2 and
PTA3)
— 30.0 — 50.0 kΩ
RPU4P Pullup
resistors
PTA2 and PTA3 pins — 30.0 — 60.0 kΩ
IIC D DC
injection
current5,
6, 7
Single pin limit VIN < VSS, VIN >
VDD
-2 — 2 mA
Total MCU limit, includes
sum of all stressed pins
-5 — 25
CIn C Input capacitance, all pins — — — 7 pF
VRAM C RAM retention voltage — 2.0 — — V
1. Typical values are measured at 25 °C. Characterized, not tested.
2. Maximum power supply VDD ramp-up rate is 70V/ms, characterized on samples of different lots.
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
8 NXP Semiconductors
3. Only PTB4, PTB5, PTD0, PTD1, PTE0, PTE1, PTH0 (64-pin and 80-pin packages only), and PTH1 (64-pin and 80-pin
packages only) support high current output.
4. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured
externally on the pin.
5. All functional non-supply pins, except for PTA2 and PTA3, are internally clamped to VSS and VDD. PTA2 and PTA3 are true
open drain I/O pins that are internally clamped to VSS.
6. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the larger value.
7. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than
maximum injection current when the MCU is not consuming power, such as when no system clock is present, or clock rate
is very low (which would reduce overall power consumption).
Table 4. LVD and POR specification
Symbol C Description Min Typ Max Unit
VPOR D POR re-arm voltage11.5 1.75 2.0 V
VLVDH C Falling low-voltage detect
threshold—high range (LVDV
= 1)2
4.2 4.3 4.4 V
VLVW1H C Falling low-
voltage
warning
threshold—
high range
Level 1 falling
(LVWV = 00)
4.3 4.4 4.5 V
VLVW2H C Level 2 falling
(LVWV = 01)
4.5 4.5 4.6 V
VLVW3H C Level 3 falling
(LVWV = 10)
4.6 4.6 4.7 V
VLVW4H C Level 4 falling
(LVWV = 11)
4.7 4.7 4.8 V
VHYSH C High range low-voltage
detect/warning hysteresis
— 100 — mV
VLVDL C Falling low-voltage detect
threshold—low range (LVDV
= 0)
2.56 2.61 2.66 V
VLVW1L C Falling low-
voltage
warning
threshold—
low range
Level 1 falling
(LVWV = 00)
2.62 2.7 2.78 V
VLVW2L C Level 2 falling
(LVWV = 01)
2.72 2.8 2.88 V
VLVW3L C Level 3 falling
(LVWV = 10)
2.82 2.9 2.98 V
VLVW4L C Level 4 falling
(LVWV = 11)
2.92 3.0 3.08 V
VHYSDL C Low range low-voltage detect
hysteresis
— 40 — mV
VHYSWL C Low range low-voltage
warning hysteresis
— 80 — mV
VBG P Buffered bandgap output 31.14 1.16 1.18 V
1. Maximum is highest voltage that POR is guaranteed.
2. Rising thresholds are falling threshold + hysteresis.
3. voltage Factory trimmed at VDD = 5.0 V, Temp = 25 °C
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 9
IOH(mA)
VDD-VOH(V)
Figure 1. Typical VDD-VOH Vs. IOH (standard drive strength) (VDD = 5 V)
IOH(mA)
VDD-VOH(V)
Figure 2. Typical VDD-VOH Vs. IOH (standard drive strength) (VDD = 3 V)
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
10 NXP Semiconductors
IOH(mA)
VDD-VOH(V)
Figure 3. Typical VDD-VOH Vs. IOH (high drive strength) (VDD = 5 V)
IOH(mA)
VDD-VOH(V)
Figure 4. Typical VDD-VOH Vs. IOH (high drive strength) (VDD = 3 V)
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 11
IOL(mA)
VOL(V)
Figure 5. Typical VOL Vs. IOL (standard drive strength) (VDD = 5 V)
IOL(mA)
VOL(V)
Figure 6. Typical VOL Vs. IOL (standard drive strength) (VDD = 3 V)
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
12 NXP Semiconductors
IOL(mA)
VOL(V)
Figure 7. Typical VOL Vs. IOL (high drive strength) (VDD = 5 V)
IOL(mA)
VOL(V)
Figure 8. Typical VOL Vs. IOL (high drive strength) (VDD = 3 V)
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 13
5.1.2 Supply current characteristics
This section includes information about power supply current in various operating modes.
Table 5. Supply current characteristics
C Parameter Symbol Core/Bus
Freq
VDD (V) Typical1Max2Unit Temp
C Run supply current FEI
mode, all modules clocks
enabled; run from flash
RIDD 48/24 MHz 5 11.1 — mA -40 to 105 °C
C 24/24 MHz 8 —
C 12/12 MHz 5 —
C 1/1 MHz 2.4 —
C 48/24 MHz 3 11 —
C 24/24 MHz 7.9 —
C 12/12 MHz 4.9 —
1/1 MHz 2.3 —
C Run supply current FEI
mode, all modules clocks
disabled and gated; run
from flash
RIDD 48/24 MHz 5 7.8 — mA -40 to 105 °C
C 24/24 MHz 5.5 —
C 12/12 MHz 3.8 —
C 1/1 MHz 2.3 —
C 48/24 MHz 3 7.7 —
C 24/24 MHz 5.4 —
C 12/12 MHz 3.7 —
C 1/1 MHz 2.2 —
C Run supply current FBE
mode, all modules clocks
enabled; run from RAM
RIDD 48/24 MHz 5 14.7 — mA -40 to 105 °C
P 24/24 MHz 9.8 14.9
C 12/12 MHz 6 —
C 1/1 MHz 2.4 —
C 48/24 MHz 3 14.6 —
P 24/24 MHz 9.6 12.8
C 12/12 MHz 5.9 —
C 1/1 MHz 2.3 —
C Run supply current FBE
mode, all modules clocks
disabled and gated; run
from RAM
RIDD 48/24 MHz 5 11.4 — mA -40 to 105 °C
P 24/24 MHz 7.7 12.5
C 12/12 MHz 4.7 —
C 1/1 MHz 2.3 —
C 48/24 MHz 3 11.3 —
P 24/24 MHz 7.6 9.5
C 12/12 MHz 4.6 —
1/1 MHz 2.2 —
Table continues on the next page...
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
14 NXP Semiconductors
Table 5. Supply current characteristics (continued)
C Parameter Symbol Core/Bus
Freq
VDD (V) Typical1Max2Unit Temp
C Wait mode current FEI
mode, all modules clocks
enabled
WIDD 48/24 MHz 5 8.4 — mA -40 to 105 °C
P 24/24 MHz 6.5 7.2
C 12/12 MHz 4.3 —
C 1/1 MHz 2.4 —
C 48/24 MHz 3 8.3 —
P 24/24 MHz 6.4 7
C 12/12 MHz 4.2 —
C 1/1 MHz 2.3 —
P Stop mode supply current
no clocks active (except 1
kHz LPO clock)3
SIDD — 5 2 105 µA -40 to 105 °C
P — 3 1.9 95 -40 to 105 °C
C ADC adder to Stop
ADLPC = 1
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
— — 5 86 — µA -40 to 105 °C
C 3 82 —
C ACMP adder to Stop — — 5 12 — µA -40 to 105 °C
C 3 12 —
C LVD adder to Stop4— — 5 130 — µA -40 to 105 °C
C 3 125 —
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. The Max current is observed at high temperature of 105 °C.
3. RTC adder cause <1 µA IDD increase typically, RTC clock source is 1 kHz LPO clock.
4. LVD is periodically woken up from Stop by 5% duty cycle. The period is equal to or less than 2 ms.
5.1.3 EMC performance
Electromagnetic compatibility (EMC) performance is highly dependent on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components as well as MCU software
operation play a significant role in EMC performance. The system designer must consult
the following applications notes, available on nxp.com for advice and guidance
specifically targeted at optimizing EMC performance.
• AN2321: Designing for Board Level Electromagnetic Compatibility
• AN1050: Designing for Electromagnetic Compatibility (EMC) with HCMOS
Microcontrollers
• AN1263: Designing for Electromagnetic Compatibility with Single-Chip
Microcontrollers
Nonswitching electrical specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 15
• AN2764: Improving the Transient Immunity Performance of Microcontroller-Based
Applications
• AN1259: System Design and Layout Techniques for Noise Reduction in MCU-
Based Systems
5.1.3.1 EMC radiated emissions operating behaviors
Table 6. EMC radiated emissions operating behaviors for 80-pin LQFP package
Symbol Description Frequency
band (MHz)
Typ. Unit Notes
VRE1 Radiated emissions voltage, band 1 0.15–50 6 dBμV 1, 2
VRE2 Radiated emissions voltage, band 2 50–150 6 dBμV
VRE3 Radiated emissions voltage, band 3 150–500 11 dBμV
VRE4 Radiated emissions voltage, band 4 500–1000 5 dBμV
VRE_IEC IEC level 0.15–1000 N3—2, 4
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported
emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the
measured orientations in each frequency range.
2. VDD = 5.0 V, TA = 25 °C, fOSC = 8 MHz (crystal), fSYS = 40 MHz, fBUS = 20 MHz
3. IEC/SAE Level Maximums: N≤12 dBµV, M≤18 dBµV, K≤30 dBµV, I ≤36 dBµV, H≤42 dBµV.
4. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
Switching specifications
5.2.1 Control timing
Table 7. Control timing
Num C Rating Symbol Min Typical1Max Unit
1 D System and core clock fSys DC — 48 MHz
2 P Bus frequency (tcyc = 1/fBus) fBus DC — 24 MHz
3 P Internal low power oscillator frequency fLPO 0.67 1.0 1.25 KHz
4 D External reset pulse width2textrst 1.5 ×
tcyc
— — ns
5 D Reset low drive trstdrv 34 × tcyc — — ns
6 D IRQ pulse width Asynchronous
path2tILIH 100 — — ns
D Synchronous path3tIHIL 1.5 × tcyc — — ns
Table continues on the next page...
5.2
Switching specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
16 NXP Semiconductors
Table 7. Control timing (continued)
Num C Rating Symbol Min Typical1Max Unit
7 D Keyboard interrupt pulse
width
Asynchronous
path2tILIH 100 — — ns
D Synchronous path tIHIL 1.5 × tcyc — — ns
8 C Port rise and fall time -
Normal drive strength
(load = 50 pF)4
— tRise — 10.2 — ns
C tFall — 9.5 — ns
C Port rise and fall time -
high drive strength (load =
50 pF)4
— tRise — 5.4 — ns
C tFall — 4.6 — ns
1. Typical values are based on characterization data at VDD = 5.0 V, 25 °C unless otherwise stated.
2. This is the shortest pulse that is guaranteed to be recognized as a RESET pin request.
3. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized.
4. Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range -40 °C to 105 °C.
Figure 9. Reset timing
tIHIL
KBIPx
tILIH
IRQ/KBIPx
Figure 10. KBIPx timing
5.2.2 FTM module timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the
fastest clock that can be used as the optional external source to the timer counter. These
synchronizers operate from the current bus rate clock.
Table 8. FTM input timing
C Function Symbol Min Max Unit
D Timer clock
frequency
fTimer fBus fSys Hz
D External clock
frequency
fTCLK 0 fTimer/4 Hz
Table continues on the next page...
Switching specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 17
Table 8. FTM input timing (continued)
C Function Symbol Min Max Unit
D External clock
period
tTCLK 4 — tTimer, 1
D External clock high
time
tclkh 1.5 — tTimer1
D External clock low
time
tclkl 1.5 — tTimer1
D Input capture pulse
width
tICPW 1.5 — tTimer1
1. tTimer = 1/fTimer
tTCLK
tclkh
tclkl
TCLK
Figure 11. Timer external clock
tICPW
FTMCHn
tICPW
FTMCHn
Figure 12. Timer input capture pulse
Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol Description Min. Max. Unit Notes
TJDie junction temperature –40 125 °C
TAAmbient temperature –40 105 °C 1
1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed maximum TJ. The simplest method to
determine TJ is: TJ = TA + θJA x chip power dissipation
5.3
Thermal specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
18 NXP Semiconductors
5.3.2 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take PI/O into account in
power calculations, determine the difference between actual pin voltage and VSS or VDD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
Table 10. Thermal attributes
Board type Symbol Description 64
LQFP
64 QFP 44
LQFP
80
LQFP
Unit Notes
Single-layer (1S) RθJA Thermal resistance, junction
to ambient (natural
convection)
71 61 75 57 °C/W 1, 2
Four-layer (2s2p) RθJA Thermal resistance, junction
to ambient (natural
convection)
53 47 53 44 °C/W 1, 3
Single-layer (1S) RθJMA Thermal resistance, junction
to ambient (200 ft./min. air
speed)
59 50 62 47 °C/W 1, 3
Four-layer (2s2p) RθJMA Thermal resistance, junction
to ambient (200 ft./min. air
speed)
46 41 47 38 °C/W 1, 3
— RθJB Thermal resistance, junction
to board
35 32 34 28 °C/W 4
— RθJC Thermal resistance, junction
to case
20 23 20 15 °C/W 5
—ΨJT Thermal characterization
parameter, junction to
package top outside center
(natural convection)
5 8 5 3 °C/W 6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the solder pad on the bottom of the package. Interface resistance is ignored.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Thermal specifications
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 19
Where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts - chip internal power
PI/O = Power dissipation on input and output pins - user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship
between PD and TJ (if PI/O is neglected) is:
PD = K ÷ (TJ + 273 °C)
Solving the equations above for K gives:
K = PD × (TA + 273 °C) + θJA × (PD)2
where K is a constant pertaining to the particular part. K can be determined by measuring
PD (at equilibrium) for an known TA. Using this value of K, the values of PD and TJ can
be obtained by solving the above equations iteratively for any value of TA.
6Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 SWD electricals
Table 11. SWD full voltage range electricals
Symbol Description Min. Max. Unit
Operating voltage 2.7 5.5 V
J1 SWD_CLK frequency of operation
• Serial wire debug
0
24
MHz
J2 SWD_CLK cycle period 1/J1 — ns
J3 SWD_CLK clock pulse width
• Serial wire debug
20
—
ns
J4 SWD_CLK rise and fall times — 3 ns
J9 SWD_DIO input data setup time to SWD_CLK rise 10 — ns
J10 SWD_DIO input data hold time after SWD_CLK rise 3 — ns
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
20 NXP Semiconductors
Table 11. SWD full voltage range electricals (continued)
Symbol Description Min. Max. Unit
J11 SWD_CLK high to SWD_DIO data valid — 35 ns
J12 SWD_CLK high to SWD_DIO high-Z 5 — ns
J2
J3 J3
J4 J4
SWD_CLK (input)
Figure 13. Serial wire clock input timing
J11
J12
J11
J9 J10
Input data valid
Output data valid
Output data valid
SWD_CLK
SWD_DIO
SWD_DIO
SWD_DIO
SWD_DIO
Figure 14. Serial wire data timing
6.2 External oscillator (OSC) and ICS characteristics
Table 12. OSC and ICS specifications (temperature range = -40 to 105 °C ambient)
Num C Characteristic Symbol Min Typical1Max Unit
1 C Crystal or
resonator
frequency
Low range (RANGE = 0) flo 31.25 32.768 39.0625 kHz
C High range (RANGE = 1) fhi 4 — 24 MHz
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 21
Table 12. OSC and ICS specifications (temperature range = -40 to 105 °C ambient)
(continued)
Num C Characteristic Symbol Min Typical1Max Unit
2 D Load capacitors C1, C2 See Note2
3 D Feedback
resistor
Low Frequency, Low-Power
Mode3RF— — — MΩ
Low Frequency, High-Gain
Mode
— 10 — MΩ
High Frequency, Low-
Power Mode
— 1 — MΩ
High Frequency, High-Gain
Mode
— 1 — MΩ
4 D Series resistor -
Low Frequency
Low-Power Mode 3RS2— 0 — kΩ
High-Gain Mode — 200 — kΩ
5 D Series resistor -
High Frequency
Low-Power Mode3RS2— 0 — kΩ
D Series resistor -
High
Frequency,
High-Gain Mode
4 MHz — 0 — kΩ
D 8 MHz — 0 — kΩ
D 16 MHz — 0 — kΩ
6 C Crystal start-up
time low range
= 32.768 kHz
crystal; High
range = 20 MHz
crystal4,5
Low range, low power tCSTL — 1000 — ms
C Low range, high gain — 800 — ms
C High range, low power tCSTH — 3 — ms
C High range, high gain — 1.5 — ms
7 T Internal reference start-up time tIRST — 20 50 µs
8 P Internal reference clock (IRC) frequency trim
range
fint_t 31.25 — 39.0625 kHz
9 P Internal
reference clock
frequency,
factory trimmed,
T = 25 °C, VDD = 5 V fint_ft — 37.5 — kHz
10 P DCO output
frequency range
FLL reference = fint_t, flo,
or fhi/RDIV
fdco 40 — 50 MHz
11 P Factory trimmed
internal
oscillator
accuracy6
T = 25 °C, VDD = 5 V Δfint_ft -0.5 — 0.5 %
12 C Deviation of IRC
over
temperature
when trimmed
at T = 25 °C,
VDD = 5 V
Over temperature range
from -40 °C to 105°C
Δfint_t -1 — 0.5 %
Over temperature range
from 0 °C to 105°C
Δfint_t -0.5 — 0.5
13 C Frequency
accuracy of
DCO output
using factory
trim value
Over temperature range
from -40 °C to 105°C
Δfdco_ft -1.5 — 1 %
Over temperature range
from 0 °C to 105°C
Δfdco_ft -1 — 1
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
22 NXP Semiconductors
Table 12. OSC and ICS specifications (temperature range = -40 to 105 °C ambient)
(continued)
Num C Characteristic Symbol Min Typical1Max Unit
14 C FLL acquisition time4,7tAcquire — — 2 ms
15 C Long term jitter of DCO output clock
(averaged over 2 ms interval)8CJitter — 0.02 0.2 %fdco
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. See crystal or resonator manufacturer's recommendation.
3. Load capacitors (C1,C2), feedback resistor (RF) and series resistor (RS) are incorporated internally when RANGE = HGO =
0.
4. This parameter is characterized and not tested on each device.
5. Proper PC board layout procedures must be followed to achieve specifications.
6. The accuracy is for factory trimmed deviation when performing trim process in NXP, however, the reflow process may
cause an extra 0.5% drift at the room temperature.
7. This specification applies to any time the FLL reference source or reference divider is changed, trim value changed, or
changing from FLL disabled (FBELP, FBILP) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as
the reference, this specification assumes it is already running.
8. Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBus.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage
for a given interval.
OSC
EXTAL
Crystal or Resonator
R
S
C2
RF
C1
XTAL
Figure 15. Typical crystal or resonator circuit
6.3 NVM specifications
This section provides details about program/erase times and program/erase endurance for
the flash memories.
Table 13. Flash characteristics
C Characteristic Symbol Min1Typical2Max3Unit4
D Supply voltage for program/erase –40
°C to 105 °C
Vprog/erase 2.7 — 5.5 V
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 23
Table 13. Flash characteristics (continued)
C Characteristic Symbol Min1Typical2Max3Unit4
D Supply voltage for read operation VRead 2.7 — 5.5 V
D NVM Bus frequency fNVMBUS 1 — 24 MHz
D NVM Operating frequency fNVMOP 0.8 1 1.05 MHz
D Erase Verify All Blocks tVFYALL — — 2605 tcyc
D Erase Verify Flash Block tRD1BLK — — 2579 tcyc
D Erase Verify Flash Section tRD1SEC — — 485 tcyc
D Read Once tRDONCE — — 464 tcyc
D Program Flash (2 word) tPGM2 0.12 0.13 0.31 ms
D Program Flash (4 word) tPGM4 0.21 0.21 0.49 ms
D Program Once tPGMONCE 0.20 0.21 0.21 ms
D Erase All Blocks tERSALL 95.42 100.18 100.30 ms
D Erase Flash Block tERSBLK 95.42 100.18 100.30 ms
D Erase Flash Sector tERSPG 19.10 20.05 20.09 ms
D Unsecure Flash tUNSECU 95.42 100.19 100.31 ms
D Verify Backdoor Access Key tVFYKEY — — 482 tcyc
D Set User Margin Level tMLOADU — — 415 tcyc
C FLASH Program/erase endurance TL to
TH = -40 °C to 105 °C
nFLPE 10 k 100 k — Cycles
C Data retention at an average junction
temperature of TJavg = 85°C after up to
10,000 program/erase cycles
tD_ret 15 100 — years
1. Minimum times are based on maximum fNVMOP and maximum fNVMBUS
2. Typical times are based on typical fNVMOP and maximum fNVMBUS
3. Maximum times are based on typical fNVMOP and typical fNVMBUS plus aging
4. tcyc = 1 / fNVMBUS
Program and erase operations do not require any special power sources other than the
normal VDD supply. For more detailed information about program/erase operations, see
the Flash Memory Module section in the reference manual.
6.4 Analog
6.4.1 ADC characteristics
Table 14. 5 V 12-bit ADC operating conditions
Characteri
stic
Conditions Symbol Min Typ1Max Unit Comment
Reference
potential
• Low
• High
VREFL
VREFH
VSSA
VDDA/2
—
—
VDDA/2
VDDA
V —
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
24 NXP Semiconductors
Table 14. 5 V 12-bit ADC operating conditions (continued)
Characteri
stic
Conditions Symbol Min Typ1Max Unit Comment
Supply
voltage
Absolute VDDA 2.7 — 5.5 V —
Delta to VDD (VDD-VDDA)ΔVDDA -100 0 +100 mV —
Input
voltage
VADIN VREFL — VREFH V —
Input
capacitance
CADIN — 4.5 5.5 pF —
Input
resistance
RADIN — 3 5 kΩ —
Analog
source
resistance
12-bit mode
• fADCK > 4 MHz
• fADCK < 4 MHz
RAS —
—
—
—
2
5
kΩ External to
MCU
10-bit mode
• fADCK > 4 MHz
• fADCK < 4 MHz
—
—
—
—
5
10
8-bit mode
(all valid fADCK)
— — 10
ADC
conversion
clock
frequency
High speed (ADLPC=0) fADCK 0.4 — 8.0 MHz —
Low power (ADLPC=1) 0.4 — 4.0
1. Typical values assume VDDA = 5.0 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
ADC SAR
ENGINE
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Pad
leakage
due to
input
protection
ZAS
R AS
C AS
v ADIN
v AS
z ADIN
R ADIN
R ADIN
R ADIN
R ADIN
INPUT PIN
INPUT PIN
INPUT PIN
C ADIN
Figure 16. ADC input impedance equivalency diagram
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 25
Table 15. 12-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA)
Characteristic Conditions C Symbol Min Typ1Max Unit
Supply current
ADLPC = 1
ADLSMP = 1
ADCO = 1
T IDDA — 133 — µA
Supply current
ADLPC = 1
ADLSMP = 0
ADCO = 1
T IDDA — 218 — µA
Supply current
ADLPC = 0
ADLSMP = 1
ADCO = 1
T IDDA — 327 — µA
Supply current
ADLPC = 0
ADLSMP = 0
ADCO = 1
T IDDA — 582 990 µA
Supply current Stop, reset, module
off
T IDDA — 0.011 1 µA
ADC asynchronous
clock source
High speed (ADLPC
= 0)
P fADACK 2 3.3 5 MHz
Low power (ADLPC
= 1)
1.25 2 3.3
Conversion time
(including sample
time)
Short sample
(ADLSMP = 0)
T tADC — 20 — ADCK
cycles
Long sample
(ADLSMP = 1)
— 40 —
Sample time Short sample
(ADLSMP = 0)
T tADS — 3.5 — ADCK
cycles
Long sample
(ADLSMP = 1)
— 23.5 —
Total unadjusted
Error212-bit mode C ETUE — ±5.0 — LSB3
10-bit mode C — ±1.5 —
8-bit mode C — ±0.8 —
Differential Non-
Liniarity
12-bit mode C DNL — ±1.5 — LSB3
10-bit mode C — ±0.4 —
8-bit mode C — ±0.15 —
Integral Non-Linearity 12-bit mode C INL — ±1.5 — LSB3
10-bit mode C — ±0.4 —
8-bit mode C — ±0.15 —
Zero-scale error412-bit mode C EZS — ±1.0 — LSB3
10-bit mode C — ±0.2 —
Table continues on the next page...
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
26 NXP Semiconductors
Table 15. 12-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Characteristic Conditions C Symbol Min Typ1Max Unit
8-bit mode C — ±0.35 —
Full-scale error512-bit mode C EFS — ±2.5 — LSB3
10-bit mode C — ±0.3 —
8-bit mode C — ±0.25 —
Quantization error ≤12 bit modes D EQ— — ±0.5 LSB3
Input leakage error6all modes D EIL IIn * RAS mV
Temp sensor slope -40 °C–25 °C D m — 3.266 — mV/°C
25 °C–125 °C — 3.638 —
Temp sensor voltage 25 °C D VTEMP25 — 1.396 — V
1. Typical values assume VDDA = 5.0 V, Temp = 25 °C, fADCK=1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. Includes quantization
3. 1 LSB = (VREFH - VREFL)/2N
4. VADIN = VSSA
5. VADIN = VDDA
6. IIn = leakage current (refer to DC characteristics)
6.4.2 Analog comparator (ACMP) electricals
Table 16. Comparator electrical specifications
C Characteristic Symbol Min Typical Max Unit
D Supply voltage VDDA 2.7 — 5.5 V
T Supply current (Operation mode) IDDA — 10 20 µA
D Analog input voltage VAIN VSS - 0.3 — VDDA V
P Analog input offset voltage VAIO — — 40 mV
C Analog comparator hysteresis (HYST=0) VH— 15 20 mV
C Analog comparator hysteresis (HYST=1) VH— 20 30 mV
T Supply current (Off mode) IDDAOFF — 60 — nA
C Propagation Delay tD— 0.4 1 µs
6.5 Communication interfaces
6.5.1 SPI switching specifications
The serial peripheral interface (SPI) provides a synchronous serial bus with master and
slave operations. Many of the transfer attributes are programmable. The following tables
provide timing characteristics for classic SPI timing modes. See the SPI chapter of the
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 27
chip's reference manual for information about the modified transfer formats used for
communicating with slower peripheral devices. All timing is shown with respect to 20%
VDD and 80% VDD, unless noted, and 25 pF load on all SPI pins. All timing assumes
high-drive strength is enabled for SPI output pins.
Table 17. SPI master mode timing
Nu
m.
Symbol Description Min. Max. Unit Comment
1 fop Frequency of operation fBus/2048 fBus/2 Hz fBus is the bus
clock
2 tSPSCK SPSCK period 2 x tBus 2048 x tBus ns tBus = 1/fBus
3 tLead Enable lead time 1/2 — tSPSCK —
4 tLag Enable lag time 1/2 — tSPSCK —
5 tWSPSCK Clock (SPSCK) high or low time tBus – 30 1024 x tBus ns —
6 tSU Data setup time (inputs) 8 — ns —
7 tHI Data hold time (inputs) 8 — ns —
8 tvData valid (after SPSCK edge) — 25 ns —
9 tHO Data hold time (outputs) 20 — ns —
10 tRI Rise time input — tBus – 25 ns —
tFI Fall time input
11 tRO Rise time output — 25 ns —
tFO Fall time output
(OUTPUT)
2
8
6 7
MSB IN2
LSB IN
MSB OUT2 LSB OUT
9
5
5
3
(CPOL=0)
4
11
11
10
10
SPSCK
SPSCK
(CPOL=1)
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
1. If configured as an output.
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) BIT 6 . . . 1
BIT 6 . . . 1
Figure 17. SPI master mode timing (CPHA=0)
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
28 NXP Semiconductors
<<CLASSIFICATION>>
<<NDA MESSAGE>>
38
2
6 7
MSB IN2
BIT 6 . . . 1
MASTER MSB OUT2 MASTER LSB OUT
5
5
8
10 11
PORT DATA PORT DATA
310 11 4
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
9
(OUTPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) LSB IN
BIT 6 . . . 1
Figure 18. SPI master mode timing (CPHA=1)
Table 18. SPI slave mode timing
Nu
m.
Symbol Description Min. Max. Unit Comment
1 fop Frequency of operation 0 fBus/4 Hz fBus is the bus clock as
defined in Control timing.
2 tSPSCK SPSCK period 4 x tBus — ns tBus = 1/fBus
3 tLead Enable lead time 1 — tBus —
4 tLag Enable lag time 1 — tBus —
5 tWSPSCK Clock (SPSCK) high or low time tBus - 30 — ns —
6 tSU Data setup time (inputs) 15 — ns —
7 tHI Data hold time (inputs) 25 — ns —
8 taSlave access time — tBus ns Time to data active from
high-impedance state
9 tdis Slave MISO disable time — tBus ns Hold time to high-
impedance state
10 tvData valid (after SPSCK edge) — 25 ns —
11 tHO Data hold time (outputs) 0 — ns —
12 tRI Rise time input — tBus - 25 ns —
tFI Fall time input
13 tRO Rise time output — 25 ns —
tFO Fall time output
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 29
2
10
6 7
MSB IN
BIT 6 . . . 1
SLAVE MSB SLAVE LSB OUT
11
5
5
3
8
4
13
NOTE: Not defined
12
12
11
SEE
NOTE
13
9
see
note
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
LSB IN
BIT 6 . . . 1
Figure 19. SPI slave mode timing (CPHA = 0)
2
6 7
MSB IN
BIT 6 . . . 1
MSB OUT SLAVE LSB OUT
5
5
10
12 13
312 13
4
SLAVE
8
9
see
note
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
NOTE: Not defined
11
LSB IN
BIT 6 . . . 1
Figure 20. SPI slave mode timing (CPHA=1)
6.5.2 MSCAN
Table 19. MSCAN wake-up pulse characteristics
Parameter Symbol Min Typ Max Unit
MSCAN wakeup dominant pulse filtered tWUP - - 1.5 µs
MSCAN wakeup dominant pulse pass tWUP 5 - - µs
Peripheral operating requirements and behaviors
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
30 NXP Semiconductors
Dimensions
7.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
To find a package drawing, go to nxp.com and perform a keyword search for the
drawing’s document number:
If you want the drawing for this package Then use this document number
44-pin LQFP 98ASS23225W
64-pin QFP 98ASB42844B
64-pin LQFP 98ASS23234W
80-pin LQFP 98ASS23237W
Pinout
8.1 Signal multiplexing and pin assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The Port Control Module is responsible
for selecting which ALT functionality is available on each pin.
NOTE
VSS and VSSA are internally connected.
VREFH and VDDA are internally connected in 64-pin
packages.
PTB4, PTB5, PTD0, PTD1, PTE0, PTE1, PTH0, and PTH1 are
high-current drive pins when operated as output.
PTA2 and PTA3 are true open-drain pins when operated as
output.
80
LQFP
64
LQFP
/QFP
44
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7
1 1 1 PTD1 DISABLED PTD1 KBI0_P25 FTM2_CH3 SPI1_MOSI
7
8
Dimensions
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 31
80
LQFP
64
LQFP
/QFP
44
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7
2 2 2 PTD0 DISABLED PTD0 KBI0_P24 FTM2_CH2 SPI1_SCK
3 3 — PTH7 DISABLED PTH7 KBI1_P31 PWT_IN1
4 4 — PTH6 DISABLED PTH6 KBI1_P30
5 — — PTH5 DISABLED PTH5 KBI1_P29
6 5 3 PTE7 DISABLED PTE7 KBI1_P7 TCLK2 FTM1_CH1 CAN0_TX
7 6 4 PTH2 DISABLED PTH2 KBI1_P26 BUSOUT FTM1_CH0 CAN0_RX
8 7 5 VDD VDD VDD
9 8 6 VDDA VDDA VREFH VDDA
10 — — VREFH VREFH VREFH
11 9 7 VREFL VREFL VREFL
12 10 8 VSS/
VSSA
VSS/
VSSA
VSSA VSS
13 11 9 PTB7 EXTAL PTB7 KBI0_P15 I2C0_SCL EXTAL
14 12 10 PTB6 XTAL PTB6 KBI0_P14 I2C0_SDA XTAL
15 13 11 PTI4 DISABLED PTI4 IRQ
16 — — PTI1 DISABLED PTI1 IRQ UART2_TX
17 — — PTI0 DISABLED PTI0 IRQ UART2_RX
18 14 — PTH1 DISABLED PTH1 KBI1_P25 FTM2_CH1
19 15 — PTH0 DISABLED PTH0 KBI1_P24 FTM2_CH0
20 16 — PTE6 DISABLED PTE6 KBI1_P6
21 17 — PTE5 DISABLED PTE5 KBI1_P5
22 18 12 PTB5 DISABLED PTB5 KBI0_P13 FTM2_CH5 SPI0_PCS ACMP1_OUT
23 19 13 PTB4 NMI_b PTB4 KBI0_P12 FTM2_CH4 SPI0_MISO ACMP1_IN2 NMI_b
24 20 14 PTC3 ADC0_SE11 PTC3 KBI0_P19 FTM2_CH3 ADC0_SE11
25 21 15 PTC2 ADC0_SE10 PTC2 KBI0_P18 FTM2_CH2 ADC0_SE10
26 22 16 PTD7 DISABLED PTD7 KBI0_P31 UART2_TX
27 23 17 PTD6 DISABLED PTD6 KBI0_P30 UART2_RX
28 24 18 PTD5 DISABLED PTD5 KBI0_P29 PWT_IN0
29 — — PTI6 DISABLED PTI6 IRQ
30 — — PTI5 DISABLED PTI5 IRQ
31 25 19 PTC1 ADC0_SE9 PTC1 KBI0_P17 FTM2_CH1 ADC0_SE9
32 26 20 PTC0 ADC0_SE8 PTC0 KBI0_P16 FTM2_CH0 ADC0_SE8
33 — — PTH4 DISABLED PTH4 KBI1_P28 I2C1_SCL
34 — — PTH3 DISABLED PTH3 KBI1_P27 I2C1_SDA
35 27 — PTF7 ADC0_SE15 PTF7 KBI1_P15 ADC0_SE15
36 28 — PTF6 ADC0_SE14 PTF6 KBI1_P14 ADC0_SE14
37 29 — PTF5 ADC0_SE13 PTF5 KBI1_P13 ADC0_SE13
38 30 — PTF4 ADC0_SE12 PTF4 KBI1_P12 ADC0_SE12
39 31 21 PTB3 ADC0_SE7 PTB3 KBI0_P11 SPI0_MOSI FTM0_CH1 ADC0_SE7
40 32 22 PTB2 ADC0_SE6 PTB2 KBI0_P10 SPI0_SCK FTM0_CH0 ADC0_SE6
41 33 23 PTB1 ADC0_SE5 PTB1 KBI0_P9 UART0_TX ADC0_SE5
Pinout
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
32 NXP Semiconductors
80
LQFP
64
LQFP
/QFP
44
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7
42 34 24 PTB0 ADC0_SE4 PTB0 KBI0_P8 UART0_RX PWT_IN1 ADC0_SE4
43 35 — PTF3 DISABLED PTF3 KBI1_P11 UART1_TX
44 36 — PTF2 DISABLED PTF2 KBI1_P10 UART1_RX
45 37 25 PTA7 ADC0_SE3 PTA7 KBI0_P7 FTM2_FLT2 ACMP1_IN1 ADC0_SE3
46 38 26 PTA6 ADC0_SE2 PTA6 KBI0_P6 FTM2_FLT1 ACMP1_IN0 ADC0_SE2
47 39 — PTE4 DISABLED PTE4 KBI1_P4
48 40 27 VSS VSS VSS
49 41 28 VDD VDD VDD
50 — — PTG7 DISABLED PTG7 KBI1_P23 FTM2_CH5 SPI1_PCS
51 — — PTG6 DISABLED PTG6 KBI1_P22 FTM2_CH4 SPI1_MISO
52 — — PTG5 DISABLED PTG5 KBI1_P21 FTM2_CH3 SPI1_MOSI
53 — — PTG4 DISABLED PTG4 KBI1_P20 FTM2_CH2 SPI1_SCK
54 42 — PTF1 DISABLED PTF1 KBI1_P9 FTM2_CH1
55 43 — PTF0 DISABLED PTF0 KBI1_P8 FTM2_CH0
56 44 29 PTD4 DISABLED PTD4 KBI0_P28
57 45 30 PTD3 DISABLED PTD3 KBI0_P27 SPI1_PCS
58 46 31 PTD2 DISABLED PTD2 KBI0_P26 SPI1_MISO
59 47 32 PTA3 DISABLED PTA3 KBI0_P3 UART0_TX I2C0_SCL
60 48 33 PTA2 DISABLED PTA2 KBI0_P2 UART0_RX I2C0_SDA
61 49 34 PTA1 ADC0_SE1 PTA1 KBI0_P1 FTM0_CH1 I2C0_
4WSDAOUT
ACMP0_IN1 ADC0_SE1
62 50 35 PTA0 ADC0_SE0 PTA0 KBI0_P0 FTM0_CH0 I2C0_
4WSCLOUT
ACMP0_IN0 ADC0_SE0
63 51 36 PTC7 DISABLED PTC7 KBI0_P23 UART1_TX CAN0_TX
64 52 37 PTC6 DISABLED PTC6 KBI0_P22 UART1_RX CAN0_RX
65 — — PTI3 DISABLED PTI3 IRQ
66 — — PTI2 DISABLED PTI2 IRQ
67 53 — PTE3 DISABLED PTE3 KBI1_P3 SPI0_PCS
68 54 38 PTE2 DISABLED PTE2 KBI1_P2 SPI0_MISO PWT_IN0
69 — — VSS VSS VSS
70 — — VDD VDD VDD
71 55 — PTG3 DISABLED PTG3 KBI1_P19
72 56 — PTG2 DISABLED PTG2 KBI1_P18
73 57 — PTG1 DISABLED PTG1 KBI1_P17
74 58 — PTG0 DISABLED PTG0 KBI1_P16
75 59 39 PTE1 DISABLED PTE1 KBI1_P1 SPI0_MOSI I2C1_SCL
76 60 40 PTE0 DISABLED PTE0 KBI1_P0 SPI0_SCK TCLK1 I2C1_SDA
77 61 41 PTC5 DISABLED PTC5 KBI0_P21 FTM1_CH1 RTC_
CLKOUT
78 62 42 PTC4 SWD_CLK PTC4 KBI0_P20 RTC_
CLKOUT
FTM1_CH0 ACMP0_IN2 SWD_CLK
Pinout
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 33
80
LQFP
64
LQFP
/QFP
44
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7
79 63 43 PTA5 RESET_b PTA5 KBI0_P5 IRQ TCLK0 RESET_b
80 64 44 PTA4 SWD_DIO PTA4 KBI0_P4 ACMP0_OUT SWD_DIO
8.2 Device pin assignment
Pinout
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
34 NXP Semiconductors
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PTE6
PTH0
PTH1
PTI0
PTI1
PTI4
PTB6
PTB7
VSS/VSSA
VREFL
VREFH
VDDA
VDD
PTH2
PTE7
PTH5
PTH6
PTH7
PTD0
PTD1
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
PTA4
PTA5
PTC4
PTC5
PTE0
PTE1
PTG0
PTG1
PTG2
PTG3
VDD
VSS
PTE2
PTE3
PTI2
PTI3
PTC6
PTC7
PTA0
PTA1
PTA2
PTA3
PTD2
PTD3
PTD4
PTF0
PTF1
PTG4
PTG5
PTG6
PTG7
VDD
VSS
PTE4
PTA6
PTA7
PTF2
PTF3
PTB0
PTB1
PTB2
PTB3
PTF4
PTF5
PTF6
PTF7
PTH3
PTH4
PTC0
PTC1
PTI5
PTI6
PTD5
PTD6
PTD7
PTC2
PTC3
PTB4
PTB5
PTE5
Figure 21. 80-pin LQFP package
Pinout
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 35
PTC3
PTB4
PTB5
PTE5
PTE6
PTH0
PTH1
PTI4
PTB6
PTB7
VSS/VSSA
VREFL
VDDA/VREFH
VDD
PTH2
PTE7
PTH6
PTH7
PTD0
PTD1
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
64
63
62
61
PTA4
PTA5
PTC4
PTC5
PTE0
PTE1
PTG0
PTG1
PTG2
PTG3
PTE2
PTE3
PTC6
PTC7
PTA0
PTA1
PTA2
PTA3
PTD2
PTD3
PTD4
PTF0
PTF1
VDD
VSS
PTE4
PTA6
PTA7
PTF2
PTF3
PTB0
PTB1
PTB2
PTB3
PTF4
PTF5
PTF6
PTF7
PTC0
PTC1
PTD5
PTD6
PTD7
PTC2
Figure 22. 64-pin QFP/LQFP packages
Pinout
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
36 NXP Semiconductors
PTI4
PTB6
PTB7
VSS/VSSA
VREFL
VDDA
VDD
PTH2
PTE7
PTD0
PTD1
11
10
9
8
7
6
5
4
3
2
1
44
43
42
41
40
39
38
37
PTA4
PTA5
PTC4
PTC5
PTE0
PTE1
PTE2
PTC6
36
35
34
PTC7
PTA0
PTA1
33 PTA2
32
31
30
29
28
27
26
25
PTA3
PTD2
PTD3
PTD4
VDD
VSS
PTA6
PTA7
23
24
PTB1
PTB0
PTB5 12
PTC0
PTC1
PTD5
PTD6
22
21
20
19
18
17
PTD7
PTC2
PTC3
PTB4
16
15
14
13
PTB2
PTB3
Figure 23. 44-pin LQFP package
9Revision history
The following table provides a revision history for this document.
Table 20. Revision history
Rev. No. Date Substantial Changes
1 12/2013 Initial NDA release.
2 3/2014 Initial public release.
3 5/2014 • Updated the Max. of SIDD.
• Updated footnote to the VOH.
• Corrected Unit in the FTM input timing table.
4 07/2016 • Added a new section of Thermal operating requirements.
• Corrected pinout diagram for 44-pin LQFP in the Device pin
assignment.
5 01/2019 • Added a footnote of "Max power suppply ramp rate is 500 V/ms." to
Operating voltage in the DC characteristics.
• Added a footnote to the Δfint_ft in the External oscillator (OSC) and
ICS characteristics.
Table continues on the next page...
Revision history
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
NXP Semiconductors 37
Table 20. Revision history (continued)
Rev. No. Date Substantial Changes
6 04/2020 • Updated the footnote to Operating voltage in the DC characteristics.
• Updated the timing assumptions in the SPI switching specifications.
Revision history
KE06 Sub-Family Data Sheet, Rev. 6, 04/2020
38 NXP Semiconductors
How to Reach Us:
Home Page:
nxp.com
Web Support:
nxp.com/support
Information in this document is provided solely to enable system and software implementers to use
NXP products. There are no express or implied copyright licenses granted hereunder to design or
fabricate any integrated circuits based on the information in this document. NXP reserves the right to
make changes without further notice to any products herein.
NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does NXP assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets
and/or specifications can and do vary in different applications, and actual performance may vary over
time. All operating parameters, including "typicals," must be validated for each customer application
by customer's technical experts. NXP does not convey any license under its patent rights nor the
rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be
found at the following address: nxp.com/SalesTermsandConditions.
While NXP has implemented advanced security features, all products may be subject to unidentified
vulnerabilities. Customers are responsible for the design and operation of their applications and
products to reduce the effect of these vulnerabilities on customer's applications and products, and
NXP accepts no liability for any vulnerability that is discovered. Customers should implement
appropriate design and operating safeguards to minimize the risks associated with their applications
and products.
NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER WORLD, COOLFLUX,
EMBRACE, GREENCHIP, HITAG, ICODE, JCOP, LIFE VIBES, MIFARE, MIFARE CLASSIC,
MIFARE DESFire, MIFARE PLUS, MIFARE FLEX, MANTIS, MIFARE ULTRALIGHT,
MIFARE4MOBILE, MIGLO, NTAG, ROADLINK, SMARTLX, SMARTMX, STARPLUG, TOPFET,
TRENCHMOS, UCODE, Freescale, the Freescale logo, AltiVec, CodeWarrior, ColdFire, ColdFire+,
the Energy Efficient Solutions logo, Kinetis, Layerscape, MagniV, mobileGT, PEG, PowerQUICC,
Processor Expert, QorIQ, QorIQ Qonverge, SafeAssure, the SafeAssure logo, StarCore, Symphony,
VortiQa, Vybrid, Airfast, BeeKit, BeeStack, CoreNet, Flexis, MXC, Platform in a Package, QUICC
Engine, Tower, TurboLink, EdgeScale, EdgeLock, eIQ, and Immersive3D are trademarks of NXP
B.V. All other product or service names are the property of their respective owners. AMBA, Arm,
Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex,
DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore,
Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, μVision,
Versatile are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or
elsewhere. The related technology may be protected by any or all of patents, copyrights, designs and
trade secrets. All rights reserved. Oracle and Java are registered trademarks of Oracle and/or its
affiliates. The Power Architecture and Power.org word marks and the Power and Power.org logos
and related marks are trademarks and service marks licensed by Power.org.
©2013-2020 NXP B.V.
Document Number MKE06P80M48SF0
Revision 6, 04/2020