Multilayer Chip Beads
Multilayer Ferrite Beads
sales action desk
sales fax line (01793) 611777
(01793) 611666
e-mail sales@megelec.co.uk
Advantages of using Multi Layer Chips
Common Applications for Impedance Chips
Clock generation circuitry, filtering between analogue and digital circuitry, I/O
interconnectors (e.g. serial, parallel, keyboard, mouse, telecommunications, local
area networks), isolation between RF noisy circuits and logic circuits and logic
devices susceptible to functional degradation, power supply filtering to prevent
conducted RF energy from corrupting the power generation circuitry, high
frequency EMI prevention of computers, VCR's, TV's and portable telephones.
About using Multi Layer Chips
Chip Beads (Impeders), perform the function of removing RF energy that exists
within a transmission line structure (Printed circuit board tracking). This RF
energy is an AC sine wave component that co-exists with the DC voltage level of
the transmitted signal. The DC component is the intended signal of interest
whereas RF energy will propagate down the trace and radiate as E.M.I. Beads
perform the function of being a high frequency resistor (attenuator) allowing DC
energy to pass through whilst removing AC energy. High frequency is generally
considered to be above 30MHz, however, lower frequency signals are affected by
chip impeders.
Chip Beads consist of a soft ferrite material which responds to RF energy. This
material contains high resistivity in monolithic form. Eddy current losses are
inversely proportional to resistivity. These losses increase with the square of the
frequency. The eddy currents are the RF energy that travels through the device.
Hard ferrite is associated with a permanent magnetic field, its polarities become
fixed as North and South. Soft ferrite material will change its impedance value
based on the frequency that the bead presents to the circuit and does not
permanently retain the magnetic field.
Features
1. Small size chips generate high impedance.
2. Minimum floating capacity and excellent high frequency characteristics.
3. Outstanding soldering heat resistance. Both flow and reflow soldering
methods can be used.
4. Perfect shape for automatic mounting, with no directionality.
5. Monolithic inorganic material construction for high reliability.
6 . Closed magnetic circuit avoids crosstalk and is suited to high density
printed circuit boards.
PackagePackage
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Package
SizeSize
SizeSize
Size
06:03
08:05
12:06
12:10
18:06
18:12
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DimensionsDimensions
DimensionsDimensions
Dimensions
( L x W x H x P )
1.6 ± 0.15 x 0.8 ± 0.15 x 0.8 ± 0.15 x 0.3 ± 0.20
2.0 ± 0.20 x 1.2 ± 0.20 x 0.9 ± 0.20 x 0.5 ± 0.30
3.2 ± 0.20 x 1.6 ± 0.20 x 1.6 ± 0.20 x 0.5 ± 0.30
3.2 ± 0.20 x 2.5 ± 0.20 x 1.3 ± 0.20 x 0.5 ± 0.30
4.5 ± 0.20 x 1.6 ± 0.20 x 1.6 ± 0.20 x 0.5 ± 0.30
4.5 ± 0.20 x 3.2 ± 0.20 x 1.5 ± 0.20 x 0.5 ± 0.30
PackagePackage
PackagePackage
Package
CodeCode
CodeCode
Code
1J
2A
2B
2E
2G
2J