SL2S5302FUD,003 - NXP Semiconductors

1. General description

The ICODE SLIX-S IC is a dedicated chip for smart label applications with the need for a

higher security level, larger memory and/or a product which takes care of the increasing

demand for perfect customer privacy. This IC is the third generation of a product family of

smart label ICs based on the ISO sta ndards ISO/IEC 15693 (Ref. 1) and ISO/IEC 1 8000-3

(Ref. 4), prolonging a successful story of NXP in the field of vicinity identification systems.

The ICODE system offers the possibility of operating labels simultaneously in the field of

the reader antenna (anticollision). It is designed for long range applications.

1.1 Contactless energy and data transfer

Whenever conne cted to a ver y simple and e asy-to-produ ce type of an tenna (as a result of

the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or

punched coil, the ICODE SLIX-S IC can be operated without line o f sight up to a distance

of 1.5 m (gate wid th). No batter y is needed. When the smart label is positioned in the field

of an interrogator anten na, the high speed RF communication interface enable s data to be

transmitted up to 53 kbit/s.

1.2 Anticollision

An intelligent anticollision function enables several tags to operate in the field

simultaneously. The anticollision algorithm selects each tag individually and ensures that

the execution of a transaction with a selected tag is performed correctly without data

corruption resu lting from other tags in the field.

1.3 Security and privacy aspects

•Unique IDentifier (UID):

The UID cannot be altered and guarantees the uniqueness of each label.

•Password protected memory management (Read/Write access):

Pages (1 page = 4 blocks of 4 bytes each) can be protected with a password, which

ensures that only authorized users get read/write a ccess to the protected par ts of the

user memory (anti counterfeiting).

•Password protected Label Destroy:

The 32-bit Destroy pa ssword enables an addressed label to be destroyed with the

DESTROY SLIX-S command. That status is irreversible and the label will never

respond to any command again.

•Password protected Privacy Mode:

SL2S5302; SL2S5402

ICODE SLIX-S

Rev. 3.1 — 1 October 2010

198531 Product short data sheet

PUBLIC

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 2 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

The 32-bit Privacy password enables a label to be set to the Privacy mode with the

ENABLE PRIVACY command. In this mode the label will not respond to any

command except the command GET RANDOM NUMBER, until it next receives the

correct Privacy password. This mode is especially designed to meet the increasing

demand to take care of the customers privacy.

•Password protected EAS and AFI functionality:

The 32-bit EAS/AFI password enables the addressed label to be set in a mode where

the EAS status, the EAS ID and/or the AFI value can only be changed if the correct

EAS/AFI password is transmitted to the label within the mentioned commands.

2. Features and benefits

2.1 ICODE SLIX-S RF interface (ISO/IEC 15693)

Contactless transmission of data and supply energy (no battery needed)

Operating distance: up to 1.5 m (depending on antenna geometry)

Operating frequency: 13.56 MHz (ISM, world-wide licence freely available)

Fast data transfer: up to 53 kbit/s

High data integrity: 16-bit CRC, framing

True anticollision

Electronic Article Surveillance (EAS)

Application Family Identifier (AFI) supported

Data Storage Format Identifier (DSFID)

ENABLE PRIVACY command with 32-bit Privacy password

DESTROY SLIX-S command with 32-bit Destroy password

Additional fast anticollision read

Write distance equal to read distance

2.2 EEPROM

2048 bits (2 KB), organized in 64 blocks of 4 bytes each, 4 blocks are summed up to

1page

50 years data retention

Write endu rance of 100000 cycles

2.3 Security

Unique identifier for each device

Lock mechanism for each user memory block (write protection)

Lock mechanism for DSFID, AFI, EAS

Password (32-bit) protected memory management for Read access

Password (32-bit) protected memory management fo r Write access

Password (32-bit) protected Label Destroy

Password (32-bit) protected Privacy Mode

Password (32-bit) protected EAS and AFI functionality

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 3 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

3. Applications

Libraries

Item level tagging in pharmaceutical supply chains

Counterfeit protection for consumer goods

Industrial applications

Asset and document tracking

4. Quick reference data

[1] Bandwidth limitation (± 7 kHz) according to ISM band regulat ions.

[2] Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.

5. Ordering information

Table 1. Quick reference data

Typical ratings are not guaranteed. The values listed are at room temperature.

Symbol Parameter Conditions Min Typ Max Unit

Wafer EEPROM characteristics

tret retention time Tamb ≤ 55 °C 50 --year

Nendu(W) write endurance 100000 - - cycle

Interface characteristics

fiinput frequency [1] 13.553 13.56 13.567 MHz

Ciinput capacitance between LA and LB [2]

SL2S5302FUD 22.3 23.5 24.7 pF

SL2S5402FUD 92 97 102 pF

Table 2. Ordering i nformation

Type number Package Version

Name Description

SL2S5302FUD wafer sawn, bumped wafer, 120 μm, on film frame carrier,

Cibetween LA and LB = 23.5 pF (typical) -

SL2S5402FUD wafer sawn, bumped wafer, 120 μm, on film frame carrier,

Cibetween LA and LB = 97 pF (typical) -

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 4 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

6. Block diagram

Fig 1. Block diagram of IC ODE SLIX-S

001aam24

MOD

DEMOD

VREG

VDD

Clock

data

out

R/W

ANALOG

RF INTERFACE

PA D

RECT

Cres

DIGITAL CONTROL

ANTENNA

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

EEPROM

MEMORY

SEQUENCER

CHARGE PUMP

CLK

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 5 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

7. Functional description

7.1 Block description

The ICODE SLIX-S IC consists of three major blocks:

•Analog RF interface

•Digital controller

•EEPROM

The analog sect ion pr ovides stable supply voltage and dem odu l at es da ta received fr om

the reader for processing by th e digital section . The analog section’s mo dulation transistor

also transmits data back to the reader.

The digit al section includes the state machines, processes the protocol and handles

communication with the EEPROM.

The label requires no interna l power supply. Its cont actless interfac e generates the p ower

supply and the system clock via the resonant circuitry by inductive coupling to the

interrogator. The interface also demodulates data that are transmitted from the

interrogator to the ICODE L abel, and modulates the electromagnetic field for data

transmission from the ICODE Label to the interrogator.

Data are stored in a non-volatile memory (EEPROM).

7.2 Memory organization

The 2048 bit EEPROM memory is divided into 64 blocks. A block is the smallest access

unit. Each block consist s of 4 bytes (1 block = 32 bits). 4 blocks are summed up to 1 page

for password protection. Bit 0 in each byte represents the least significant bit (LSB) and

bit 7 the most significant bit (MSB), respectively.

The memory is divided into 2 parts:

•Configuration area

–Within this part of the m emory all requir ed information i s stored, such as UID, write

protection, access control information, passwords, AFI and EAS. This memory

area cannot be directly accessed.

•User memory

–Within the 1280 bit memory area the user data are stored. Direct read/write access

to this part of the memory is possible depending on the related security and write

protection conditions.

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 6 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

Blocks 0 to 39 can be addressed with read and write commands only.

7.2.1 Unique identifier

The 64-bit unique identifier (UID) is programmed during the p roduction process accordin g

to ISO/IEC 15693-3 and cannot be changed afterwards.

The 64 bits are numbered according to ISO/IEC 15693-3 starting with LSB 1 and ending

with MSB 64. This is in contrast to the general used bit numbering within a byte.

The TAG type is a part of the UID (bit 41 to 48, next to the manufacturer code which is

“04h” for NXP Semiconductors).

The TAG type of the ICODE SLIX-S IC is “02h”.

Bit 37 is set to logic 1 for the ICODE SLIX-S IC which indicates that this type supp ort s the

password pro tected AFI feature (not supported by ICODE SLI-S with bit 37 set to logic 0).

Table 3. Memory organi zation

Page Block Byte 0 Byte 1 Byte 2 Byte 3 Description

Configuration area for

internal use

0 0 User memory:

10 pages,

4 blocks each,

4 bytes each,

160 bytes in total.

::::::

936

Table 4. Unique identifier

MSB LSB

64:57 56:49 48:41 40:1

“E0” “04” “02” IC manufacturer serial number

UID 7 UID 6 UID 5 UID 4 UID 3 UID 2 UID 1 UID 0

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 7 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

8. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical

characteristics sections of this specification is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive st atic

charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.

[3] The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II).

[4] For ESD measurement, the IC was mounted in a CDIP8 package.

Table 5. Limiting values (Wafer)[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature −55 +125 °C

Ptot total power dissipation - 125 mW

Tjjunction temperature −40 +85 °C

Ii(max) maximum input current LA to LB; peak [3] -±60 mA

IIinput curren t LA to LB; RMS - 30 mA

VESD electrostatic discharge voltage Human body model [4] -±2kV

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 8 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

9. Abbreviations

10. References

[1] ISO Standard — ISO/IEC 15693 - Identification cards - Contactless integrated

circuit cards - Vicinity cards.

[2] ISO Standard — ISO/IEC 15693-2 -Identification cards - Contactless integrated

circuit cards - Vicinity cards - Part 2: Air interface and initialization.

[3] ISO Standard — ISO/IEC 15693-3 -Identification cards - Contactless integrated

circuit cards - Vicinity cards - Part 3: Anticollision and transmission protocol.

[4] ISO Standard — ISO/IEC 18000-3 - Information technology - Radio frequency

identification for item management - Part 3: Parameters for air interface

communications at 13.56 MHz.

[5] ISO Standard — ISO/IEC 7816-6 - Identification cards - Integrated circuit cards -

Part 6: Interindustry data elements for interchange.

[6] General specification for 8” wafer on UV-tape with electronic fail die

marking — Delivery type description – BU-ID document number: 1093**1.

[7] SL2S5302; SL2S5402 — Product data sheet – BU-ID document number: 1921**

Table 6. Abbreviations

Acronym Description

AFI Application Family Identi fier

CRC Cyclic Redundancy Check

DSFID Data Storage Format Identifier

EAS Electronic Article Surveillance

EEPROM Electrically Erasable Programm able Read Only Memory

IC Integrated Circuit

LCR Inductance, Capacitance, Resistance

LSB Least Significant Byte/Bit

MSB Most Significant Byte/Bit

RF Radio Frequency

UID Unique IDentifier

1. ** ... document version number

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 9 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

11. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SL2S5302_SL2S5402_SDS v.3.1 20101001 Product short data sheet - -

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 10 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expect ed

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the appl ication or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property right s.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] data sheet Production This document contains the product specification.

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 11 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed produ ct claims result ing from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

ICODE and I-CODE — are trademarks of NXP B.V.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product short data sheet

PUBLIC Rev. 3.1 — 1 October 2010

198531 12 of 13

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

14. Tables

Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .3

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3

Table 3. Memory organization . . . . . . . . . . . . . . . . . . . . .6

Table 4. Unique identifier . . . . . . . . . . . . . . . . . . . . . . . . .6

Table 5. Limiting values (Wafer)[1][2] . . . . . . . . . . . . . . . . 7

Table 6. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9

15. Figures

Fig 1. Block diagram of ICODE SLIX-S . . . . . . . . . . . . . .4

NXP Semiconductors SL2S5302; SL2S5402

ICODE SLIX-S

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 October 2010

198531

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

16. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.1 Contactless energy and data transfer. . . . . . . . 1

1.2 Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Security and privacy aspects . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2

2.1 ICODE SLIX-S RF interface (ISO/IEC 15693) . 2

2.2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.3 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

7.1 Block description . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Memory organization . . . . . . . . . . . . . . . . . . . . 5

7.2.1 Unique identifier . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information . . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Contact information. . . . . . . . . . . . . . . . . . . . . 11

14 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

15 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13